CN105047439A - Method for flattening terminal pins of chip aluminum electrolytic capacitor and application of method - Google Patents
Method for flattening terminal pins of chip aluminum electrolytic capacitor and application of method Download PDFInfo
- Publication number
- CN105047439A CN105047439A CN201510488035.9A CN201510488035A CN105047439A CN 105047439 A CN105047439 A CN 105047439A CN 201510488035 A CN201510488035 A CN 201510488035A CN 105047439 A CN105047439 A CN 105047439A
- Authority
- CN
- China
- Prior art keywords
- pellet
- electrolytic capacitor
- terminal pin
- aluminium electrolytic
- recess
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
The invention discloses a method for flattening terminal pins of a chip aluminum electrolytic capacitor capable of increasing the superficial area of a soldering contact surface of a lead flattening section. The method comprises the following steps: (1), feeding an aluminum electrolytic capacitor which is finished in an assembly step into a terminal pin flattening device, wherein the terminal pin flattening device comprises a pellet and a group of pressure blocks; the pellet is arranged between two terminal pins of the aluminum electrolytic capacitor; the group of pressure blocks corresponds to the pellet; and a pellet bump and a pellet recess are formed in the surface of one side, which contacts the terminal pins, of the pellet; (2) driving the pressure blocks to move towards the pellet by power, flattening the terminal pins in a squeezing process, and by the pellet bump and the pellet recess in the surface of the pellet, forming a terminal pin recess which corresponds to the pellet bump in the pellet and a terminal pin bump which corresponds to the pellet recess in the soldering contact surface; (3), baiting; and (4), repeating the steps (1) to (3). The method is reasonable and simple in technology; the superficial area of the soldering contact surface can be increased by over 10%; the adhesive force between the terminal pins and soldering tin can be increased by over 10%; the problem of stock fall in a reflow soldering process is improved; and the reject ratio is reduced to below 0.1%.
Description
Technical field
The present invention relates to a kind of production method of SMD aluminium electrolytic capacitor, specifically SMD aluminium electrolytic capacitor lead pin flattens a method, particularly relates to a kind of SMD aluminium electrolytic capacitor lead pin increasing the lead-in wire section of flattening scolding tin contact-making surface surface area and flattens method and application.
Background technology
In electronic product is produced, high for realizing packaging density, reduce volume, the weight of electronic product, normal use surface installation technique (SMT), it requires that electronic component is surface mount elements, and after general employing SMT, electronic product reliability is high, vibration resistance is strong, welding point defect rate is low, high frequency characteristics is good, decreases electromagnetism and radio frequency interference, easily is automated, enhance productivity, save material, the energy, equipment, manpower, time etc.
At present, in paster electrolytic capacitor is produced, after terminal pin is flattened, the maximum face of two areas is seat board contact-making surface and scolding tin contact-making surface.In reflow soldering process, due to its scolding tin contact-making surface smooth surface and surface area is little, thus lead-in wire is also corresponding little to the contact-making surface of scolding tin, when running into high vibration or abnormal external force, or when there is failure welding, capacitor can be made to drop from circuit board, fraction defective is 5 ﹪ ~ 10 ﹪.
Summary of the invention
The object of this invention is to provide a kind of SMD aluminium electrolytic capacitor lead pin increasing the lead-in wire section of flattening scolding tin contact-making surface surface area and flatten method and application.
The present invention adopts following technical scheme to realize its goal of the invention, and a kind of SMD aluminium electrolytic capacitor lead pin flattens method, and it comprises the following steps:
(1) the aluminium electrolytic capacitor completing the vertical step of group is clamped feeding terminal pin by feeding manipulator and flatten device, described terminal pin is flattened device and is comprised and be arranged on the pellet between aluminium electrolytic capacitor two terminal pin, corresponding with pellet one group of briquetting, and it is protruding with pellet recess that described pellet contacts side surface with terminal pin is provided with pellet;
(2) power drives one group of briquetting to move to pellet, in extrusion process, terminal pin is flattened, the face flattening on rear terminal pin two areas maximum is seat board contact-making surface and scolding tin contact-making surface, utilize pellet projection and the pellet recess on pellet surface, make scolding tin contact-making surface have corresponding terminal pin recess protruding with the pellet on pellet and the terminal pin projection corresponding with pellet recess;
(3) the aluminium electrolytic capacitor after flattening is removed by blanking mechanical hand;
Repeat step (1) ~ (3).
For easy to process, the present invention step (1) in, described pellet projection is pellet raised line, and described pellet recess is pellet groove, and pellet raised line is alternate with pellet groove to be arranged on pellet into strips.
For easy to process, pellet raised line of the present invention and pellet groove are arranged along the radial direction of pellet.
The radial cross-sectional shape of pellet groove of the present invention be square or trapezoidal or triangle semicircle or fan-shaped.
For the terminal pin of positioning aluminium electrolytic capacitor, the present invention step (2) in, briquetting is provided with terminal pin locating piece.
SMD aluminium electrolytic capacitor lead pin flattens an application for method, and it is produced to flatten in terminal pin step at SMD aluminium electrolytic capacitor and applies.
Owing to adopting technique scheme, the present invention achieves goal of the invention preferably, its rational technology, simple, projection and recess is provided with at SMD aluminium electrolytic capacitor lead pin scolding tin contact-making surface, the surface area of scolding tin contact-making surface can increase by 10 more than ﹪, adhesive force between terminal pin and scolding tin increases 10 more than ﹪, improves to fall material problem in reflow soldering process, makes fraction defective be reduced to below one thousandth.
Accompanying drawing explanation
Fig. 1 is the structural representation of prior art;
Fig. 2 is the A place enlarged diagram of Fig. 1;
Fig. 3 is the structural representation of the embodiment of the present invention 1;
Fig. 4 is the B place enlarged diagram of Fig. 3;
Fig. 5 is the structural representation that the embodiment of the present invention 1 flattens device;
Fig. 6 is the part enlarged diagram of pellet 9 in Fig. 5;
Fig. 7 is the structural representation of the embodiment of the present invention 2;
Fig. 8 is the C place enlarged diagram of Fig. 7;
Fig. 9 is the structural representation that the embodiment of the present invention 2 flattens device;
Figure 10 is the part enlarged diagram of pellet 9 in Fig. 9;
Figure 11 is the structural representation of the embodiment of the present invention 3;
Figure 12 is the D place enlarged diagram of Figure 11;
Figure 13 is the structural representation that the embodiment of the present invention 3 flattens device;
Figure 14 is the part enlarged diagram of pellet 9 in Figure 13;
Figure 15 is the structural representation of the embodiment of the present invention 4;
Figure 16 is the E place enlarged diagram of Figure 15;
Figure 17 is the structural representation that the embodiment of the present invention 4 flattens device;
Figure 18 is the part enlarged diagram of pellet 9 in Figure 17.
Embodiment
Below in conjunction with drawings and Examples, the invention will be further described.
As seen from Figure 1, Figure 2, a kind of terminal pin 2(of SMD aluminium electrolytic capacitor 1 and positive guide pin, negative guide pin) flatten after be flat, the face that wherein two areas are maximum is seat board contact-making surface 5 and scolding tin contact-making surface 4, be assemblied on seat board 3, as shown in Figure 2, its scolding tin contact-making surface 4 smooth surface.In reflow soldering process, due to its scolding tin contact-making surface 4 smooth surface and surface area is little, thus terminal pin 2 is also corresponding little to the contact-making surface of scolding tin, when running into high vibration or abnormal external force, or when there is failure welding, aluminium electrolytic capacitor 1 can be made to drop from circuit board, and fraction defective is 5 ﹪ ~ 10 ﹪.
Embodiment 1:
From Fig. 3, Fig. 4, Fig. 5, Fig. 6, a kind of SMD aluminium electrolytic capacitor lead pin flattens method, and it comprises the following steps:
(1) the aluminium electrolytic capacitor 1 completing the vertical step of group is clamped feeding terminal pin by feeding manipulator and flatten device, described terminal pin is flattened device and is comprised and be arranged on the pellet 9 between aluminium electrolytic capacitor 1 liang of terminal pin 2, corresponding with pellet 9 one group of briquetting 8, and it is protruding with pellet recess that described pellet 9 contacts side surface with terminal pin 2 is provided with pellet;
For easy to process, the present invention step (1) in, described pellet projection is pellet raised line 11, and described pellet recess is pellet groove 12, and pellet raised line 11 is alternate with pellet groove 12 to be arranged on pellet 9 into strips.
For easy to process, pellet raised line 11 of the present invention is arranged along the radial direction of pellet 9 with pellet groove 12.
The radial cross-sectional shape of pellet groove 12 of the present invention be square or trapezoidal or triangle semicircle or fan-shaped.
(2) power drives one group of briquetting 8 to move to pellet 9, in extrusion process, terminal pin 2 is flattened, the face flattening on rear terminal pin 2 two areas maximum is seat board contact-making surface 5 and scolding tin contact-making surface 4, utilize pellet projection and the pellet recess on pellet 9 surface, make scolding tin contact-making surface 4 have corresponding terminal pin recess protruding with the pellet on pellet 9 and the terminal pin projection corresponding with pellet recess;
For the terminal pin 2 of positioning aluminium electrolytic capacitor 1, the present invention step (2) in, briquetting 8 is provided with terminal pin locating piece 10.
(3) the aluminium electrolytic capacitor 1 after flattening is removed by blanking mechanical hand;
Repeat step (1) ~ (3).
SMD aluminium electrolytic capacitor lead pin flattens an application for method, and it is produced to flatten in terminal pin step at SMD aluminium electrolytic capacitor and applies.
The radial cross-sectional shape of the present embodiment pellet groove 12 is square, and the radial cross-sectional shape of pellet raised line 11 is also square, and the length that terminal pin 2 is flattened is 5 more than ㎜.Power drives one group of briquetting 8 to move to pellet 9, by the terminal pin 2 of the terminal pin locating piece 10 positioning aluminium electrolytic capacitor 1 on briquetting 8, in extrusion process, terminal pin 2 is flattened, the face flattening on rear terminal pin 2 two areas maximum is seat board contact-making surface 5 and scolding tin contact-making surface 4, described scolding tin contact-making surface 4 there are the terminal pin groove 7 corresponding with the pellet raised line 11 on pellet 9 and the terminal pin raised line 6 corresponding with pellet groove 12, the radial cross-sectional shape of terminal pin raised line 6 is square, and the radial cross-sectional shape of terminal pin groove 7 is also square.
Present invention process rationally, simply, terminal pin raised line 6 and terminal pin groove 7 is processed with at the scolding tin contact-making surface 4 of SMD aluminium electrolytic capacitor lead pin 2, the surface area of scolding tin contact-making surface 4 can increase by 40 ﹪ ~ 80 ﹪, adhesive force between terminal pin 2 and scolding tin increases 15 ﹪ ~ 20 ﹪, improve and fall material problem in reflow soldering process, make fraction defective be reduced to below one thousandth.
Embodiment 2:
From Fig. 7, Fig. 8, Fig. 9, Figure 10, the radial cross-sectional shape of the present embodiment pellet groove 12 is trapezoidal, the radial cross-sectional shape of pellet raised line 11 is also trapezoidal, the radial cross-sectional shape that terminal pin 2 flattens the terminal pin raised line 6 of rear correspondence is trapezoidal, and the radial cross-sectional shape of terminal pin groove 7 is also trapezoidal; The surface area of scolding tin contact-making surface 4 can increase by 30 ﹪ ~ 60 ﹪, and the adhesive force between terminal pin 2 and scolding tin increases 15 ﹪ ~ 20 ﹪.
Remaining with embodiment 1.
Embodiment 3:
From Figure 11, Figure 12, Figure 13, Figure 14, the radial cross-sectional shape of the present embodiment pellet groove 12 is triangle, the radial cross-sectional shape of pellet raised line 11 is trapezoidal, the section shape that terminal pin 2 flattens the terminal pin raised line 6 of rear correspondence is triangle, the section shape of terminal pin groove 7 is trapezoidal, the surface area of scolding tin contact-making surface 4 can increase by 10 ﹪ ~ 20 ﹪, and the adhesive force between terminal pin and scolding tin increases 10 ﹪ ~ 15 ﹪.
Remaining with embodiment 1.
Embodiment 4:
From Figure 15, Figure 16, Figure 17, Figure 18, the radial cross-sectional shape of the present embodiment pellet groove 12 is semicircle, terminal pin 2 flattens the section shape of the terminal pin raised line 6 of rear correspondence also for semicircle, the surface area of scolding tin contact-making surface 4 can increase by 25 ﹪ ~ 55 ﹪, and the adhesive force between terminal pin 2 and scolding tin increases 15 ﹪ ~ 20 ﹪.
Remaining with embodiment 1.
Claims (6)
1. SMD aluminium electrolytic capacitor lead pin flattens a method, it is characterized in that it comprises the following steps:
(1) the aluminium electrolytic capacitor completing the vertical step of group is clamped feeding terminal pin by feeding manipulator and flatten device, described terminal pin is flattened device and is comprised and be arranged on the pellet between aluminium electrolytic capacitor two terminal pin, corresponding with pellet one group of briquetting, and it is protruding with pellet recess that described pellet contacts side surface with terminal pin is provided with pellet;
(2) power drives one group of briquetting to move to pellet, in extrusion process, terminal pin is flattened, the face flattening on rear terminal pin two areas maximum is seat board contact-making surface and scolding tin contact-making surface, utilize pellet projection and the pellet recess on pellet surface, make scolding tin contact-making surface have corresponding terminal pin recess protruding with the pellet on pellet and the terminal pin projection corresponding with pellet recess;
(3) the aluminium electrolytic capacitor after flattening is removed by blanking mechanical hand;
Repeat step (1) ~ (3).
2. SMD aluminium electrolytic capacitor lead pin according to claim 1 flattens method, it is characterized in that step (1) in, described pellet projection is pellet raised line, and described pellet recess is pellet groove, and pellet raised line is alternate with pellet groove to be arranged on pellet into strips.
3. SMD aluminium electrolytic capacitor lead pin according to claim 2 flattens method, it is characterized in that described pellet raised line and pellet groove are arranged along the radial direction of pellet.
4. SMD aluminium electrolytic capacitor lead pin according to claim 3 flattens method, it is characterized in that the radial cross-sectional shape of described pellet groove be square or trapezoidal or triangle semicircle or fan-shaped.
5. the SMD aluminium electrolytic capacitor lead pin according to claim 1 or 2 or 3 or 4 flattens method, it is characterized in that step (2) in, briquetting is provided with terminal pin locating piece.
6. SMD aluminium electrolytic capacitor lead pin flattens an application for method, it is characterized in that it produces to flatten in terminal pin step at SMD aluminium electrolytic capacitor and applies.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510488035.9A CN105047439A (en) | 2015-08-11 | 2015-08-11 | Method for flattening terminal pins of chip aluminum electrolytic capacitor and application of method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510488035.9A CN105047439A (en) | 2015-08-11 | 2015-08-11 | Method for flattening terminal pins of chip aluminum electrolytic capacitor and application of method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105047439A true CN105047439A (en) | 2015-11-11 |
Family
ID=54453902
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510488035.9A Pending CN105047439A (en) | 2015-08-11 | 2015-08-11 | Method for flattening terminal pins of chip aluminum electrolytic capacitor and application of method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105047439A (en) |
Citations (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1961624A (en) * | 2004-06-03 | 2007-05-09 | 松下电器产业株式会社 | Electronic component |
| CN201402746Y (en) * | 2009-04-22 | 2010-02-10 | 珠海华冠电容器有限公司 | Flattening device for plate seating machine |
| CN201638690U (en) * | 2010-04-06 | 2010-11-17 | 镇江冈山电子有限公司 | Base of chip aluminum electrolytic capacitor |
| CN102347134A (en) * | 2011-05-19 | 2012-02-08 | 湖南艾华集团股份有限公司 | Method for producing paster electrolytic capacitor |
| CN102637521A (en) * | 2012-04-06 | 2012-08-15 | 珠海华冠电容器有限公司 | Surface-mounted aluminum electrolytic capacitor and manufacturing method thereof |
| CN202905703U (en) * | 2012-11-26 | 2013-04-24 | 宁波华龙电子股份有限公司 | Combined small-power surface-mount diode lead frame member |
| CN203826369U (en) * | 2014-04-28 | 2014-09-10 | 四川金湾电子有限责任公司 | Semiconductor lead frame |
| CN204144060U (en) * | 2014-10-22 | 2015-02-04 | 厦门法拉电子股份有限公司 | A kind of film capacitor surface erecting and welding deriving structure |
| CN104377033A (en) * | 2014-10-22 | 2015-02-25 | 厦门法拉电子股份有限公司 | Thin film capacitor surface mounting welding lead-out structure and mounting method thereof |
| CN204348529U (en) * | 2014-11-12 | 2015-05-20 | 洛阳隆盛科技有限责任公司 | A kind of capacitor pin former |
| CN104795242A (en) * | 2015-04-13 | 2015-07-22 | 湖南艾华集团股份有限公司 | Aluminum electrolytic capacitor and its production method and application |
-
2015
- 2015-08-11 CN CN201510488035.9A patent/CN105047439A/en active Pending
Patent Citations (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1961624A (en) * | 2004-06-03 | 2007-05-09 | 松下电器产业株式会社 | Electronic component |
| CN201402746Y (en) * | 2009-04-22 | 2010-02-10 | 珠海华冠电容器有限公司 | Flattening device for plate seating machine |
| CN201638690U (en) * | 2010-04-06 | 2010-11-17 | 镇江冈山电子有限公司 | Base of chip aluminum electrolytic capacitor |
| CN102347134A (en) * | 2011-05-19 | 2012-02-08 | 湖南艾华集团股份有限公司 | Method for producing paster electrolytic capacitor |
| CN102637521A (en) * | 2012-04-06 | 2012-08-15 | 珠海华冠电容器有限公司 | Surface-mounted aluminum electrolytic capacitor and manufacturing method thereof |
| CN202905703U (en) * | 2012-11-26 | 2013-04-24 | 宁波华龙电子股份有限公司 | Combined small-power surface-mount diode lead frame member |
| CN203826369U (en) * | 2014-04-28 | 2014-09-10 | 四川金湾电子有限责任公司 | Semiconductor lead frame |
| CN204144060U (en) * | 2014-10-22 | 2015-02-04 | 厦门法拉电子股份有限公司 | A kind of film capacitor surface erecting and welding deriving structure |
| CN104377033A (en) * | 2014-10-22 | 2015-02-25 | 厦门法拉电子股份有限公司 | Thin film capacitor surface mounting welding lead-out structure and mounting method thereof |
| CN204348529U (en) * | 2014-11-12 | 2015-05-20 | 洛阳隆盛科技有限责任公司 | A kind of capacitor pin former |
| CN104795242A (en) * | 2015-04-13 | 2015-07-22 | 湖南艾华集团股份有限公司 | Aluminum electrolytic capacitor and its production method and application |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR102330402B1 (en) | Semiconductor device and method of manufacturing the same | |
| CN102938512A (en) | Impact-resistant two-way connector | |
| US20190148869A1 (en) | Terminal and manufacturing method thereof | |
| CN105047413A (en) | Chip aluminum electrolytic capacitor and production method | |
| US20190140382A1 (en) | Terminal and manufacturing method thereof | |
| CN103177880A (en) | Solid electrolytic capacitor and method for producing the same | |
| CN105047414A (en) | Method for producing chip aluminum electrolytic capacitor | |
| US20190140383A1 (en) | Terminal and manufacturing method thereof | |
| CN203367022U (en) | Chip-type solid electrolytic tantalum capacitor | |
| CN204834364U (en) | Device is flattened to SMD aluminium electrolytic capacitor lead wire foot | |
| US9576741B2 (en) | Solid electrolytic capacitor and production method thereof | |
| CN105047440A (en) | Terminal pin flattening device for chip aluminum electrolytic capacitor and production method of capacitor | |
| CN204834355U (en) | SMD aluminium electrolytic capacitor | |
| CN105047439A (en) | Method for flattening terminal pins of chip aluminum electrolytic capacitor and application of method | |
| CN102347134B (en) | Method for producing paster electrolytic capacitor | |
| CN102157810A (en) | Socket connector having contact terminal tail with split solder ball retained thereon and method fabricating the same | |
| US9711294B2 (en) | Tantalum capacitor and method of manufacturing the same | |
| JP2007043197A (en) | Stacked capacitor | |
| CN106876140A (en) | A kind of SMD production method of aluminum electrolytic capacitor | |
| CN201986265U (en) | Flexible circuit board | |
| RU166712U1 (en) | ANTENNA WITH RADIO FREQUENCY IDENTIFICATION, INCLUDED IN THE COMPOSITION OF AN ELECTRONIC INFORMATION UNIT | |
| CN108010975B (en) | Bypass diode for solar power generation assembly | |
| CN203746833U (en) | Signal lead for welding used in power semiconductor package | |
| CN204167311U (en) | Lead frame circuit | |
| CN206194548U (en) | Lead frame with fusing function |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20151111 |