CN104377033A - Thin film capacitor surface mounting welding lead-out structure and mounting method thereof - Google Patents
Thin film capacitor surface mounting welding lead-out structure and mounting method thereof Download PDFInfo
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- CN104377033A CN104377033A CN201410566045.5A CN201410566045A CN104377033A CN 104377033 A CN104377033 A CN 104377033A CN 201410566045 A CN201410566045 A CN 201410566045A CN 104377033 A CN104377033 A CN 104377033A
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- boss
- housing
- film capacitor
- caulking groove
- wire
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Abstract
The invention discloses a thin film capacitor surface mounting welding lead-out structure and a mounting method of the thin film capacitor surface mounting welding lead-out structure. The welding lead-out structure comprises a shell and leads led out of an electrode in the shell. The bottom end of the shell protrudes and extends downwards to form bosses of preset height, and the bottom end of the shell can be stably attached to a circuit board through distribution of the bosses in a balanced mode. The leads are bent at the bottom end of the shell and then embedded in the corresponding bosses, and embedding grooves for containing the leads are formed in the bosses. The shell structure and the lead structures of a thin film capacitor are improved, and when the surface of the thin film capacitor is arranged on the circuit board, the thin film capacitor surface mounting welding lead-out structure and the mounting method have the advantages of being low in cost, easy to operate, high in efficiency and high in reliability.
Description
Technical field
The present invention relates to a kind of surface and film capacitor is installed, particularly relate to a kind of film capacitor surface erecting and welding deriving structure and installation method thereof.
Background technology
Capacitor is one of a large amount of electronic component used in electronic equipment, is widely used in, every directly, being coupled, bypass, filtering, resonant tank, power conversion, the aspects such as control circuit.
Surface mounting technology (SMT) is a systemic complex art comprising components and parts, material, equipment, technique and surface-assembled circuit substrate design and manufaction.Be widely used in the industries such as communication, computer, household electrical appliances at present, and to high density, high-performance, high reliability and low cost future development.In actual applications, film capacitor is installed on surface, main adopts that metalized film is stacked to be made, then in the spraying of two ends solderability metal as the solder side of product; Surface mount capacitor when mounted, that the solder side of product is directly welded on circuit boards as leg, namely, general thin capacitor adopts to carry welding region or auxiliary welding region and circuit board and carry out surface mount, and complex process, cost be higher, store transport moisture-sensitive class requirement.
Summary of the invention
The object of the invention is to the deficiency overcoming prior art, a kind of film capacitor surface erecting and welding deriving structure and installation method thereof are provided, by to the shell structure of film capacitor and the improvement of pin configuration, when making film capacitor be surface mounted on circuit board, there is the feature of low cost, easy to operate, high efficiency, high reliability.
The technical solution adopted for the present invention to solve the technical problems is: a kind of film capacitor surface erecting and welding deriving structure, comprise housing and by housing as the lead-in wire that electrode is drawn; The bottom of described housing protrudes out the boss of preset height downwards, and the distribution of described boss is pasted on circuit boards with enabling the bottom balance and stability of housing; Described lead-in wire is embedded in corresponding boss place after the bending of the bottom of housing, and boss is provided with the caulking groove for holding lead-in wire.
The height of described boss is 0.2mm-2.0mm.
Some second boss that described boss is located by first boss of corner of bottom and two relative edges of the bottom of housing that are distributed in housing are formed, to paste on circuit boards with enabling the bottom balance and stability of housing; Described caulking groove is located at the second boss place, and described lead-in wire is embedded in the caulking groove of the second corresponding boss after the bending of the bottom of housing.
3rd boss of the strip that described boss is located by two relative edges of the bottom being distributed in housing is formed, and the length of the 3rd boss is identical with the length of two relative edges of the bottom of described housing, to paste on circuit boards with enabling the bottom balance and stability of housing; Described caulking groove is located at the 3rd boss place, and caulking groove arranges along the length direction of the 3rd boss, and described lead-in wire is embedded in the caulking groove of the 3rd corresponding boss after the bending of the bottom of housing.
Described boss is made up of the 4th boss of V-arrangement shape of the bottom being distributed in housing, and the 4th boss is crossed between two relative edges of the bottom of housing, to paste on circuit boards with enabling the bottom balance and stability of housing; Described caulking groove is located at the 4th boss place, and caulking groove arranges along the V-arrangement shape of the 4th boss, and described lead-in wire is embedded in the caulking groove of the 4th corresponding boss after the bending of the bottom of housing.
Described boss is made up of the 5th boss of circle-arc profile of the bottom being distributed in housing, and the 5th boss is located at the centre of the bottom of housing, to paste on circuit boards with enabling the bottom balance and stability of housing; Described caulking groove is located at the 5th boss place, and caulking groove arranges along the circle-arc profile of the 5th boss, and described lead-in wire is embedded in the caulking groove of the 5th corresponding boss after the bending of the bottom of housing.
A kind of film capacitor method of surface mounting, comprising:
The preset boss protruding out certain altitude downwards in the bottom of housing, the distribution of described boss is pasted on circuit boards with enabling the bottom balance and stability of housing;
Lead-in wire is embedded in corresponding boss place after the bending of the bottom of housing;
By paste application on the pad of circuit board;
The bottom of housing is pasted on circuit boards, and the lead-in wire at boss place is reclined mutually with the pad of circuit board;
Adopt Reflow Soldering that soldering paste is melted, film capacitor and circuit board are firmly welded together and realizes being electrically connected.
A kind of film capacitor surface erecting and welding deriving structure of the present invention and installation method thereof arrange auxiliary boss in the bottom of housing, and the bending that will go between, be close to part boss.The distribution of boss can have various ways, and paste just passable on circuit boards with enabling the bottom balance and stability of housing as long as can support housing, and the requirement for height of boss is between 0.2mm-2.0mm.Lead-in wire needs bending, and will be close to part boss, can realize being electrically connected with circuit board when film capacitor surface is installed.During surface mount, be that film capacitor is accurately installed to pad locations by paste application on the pad of circuit board, Reflow Soldering makes soldering paste melt, and film capacitor and circuit board are firmly welded together.
Compared with prior art, the invention has the beneficial effects as follows:
Owing to have employed the boss protruding out preset height in the bottom of housing downwards, the distribution of described boss is pasted on circuit boards with enabling the bottom balance and stability of housing; Described lead-in wire is embedded in corresponding boss place after the bending of the bottom of housing, boss is provided with the caulking groove for holding lead-in wire, when this structure of the present invention makes film capacitor be surface mounted on circuit board, there is the advantage of low cost, easy to operate, high efficiency, high reliability.
Below in conjunction with drawings and Examples, the present invention is described in further detail; But a kind of film capacitor surface erecting and welding deriving structure of the present invention and installation method thereof are not limited to embodiment.
Accompanying drawing explanation
Fig. 1 is embodiment one D structure schematic diagram of the present invention;
Fig. 2 is embodiment one front view of the present invention;
Fig. 3 is embodiment one end view of the present invention;
Fig. 4 is embodiment one upward view of the present invention;
Fig. 5 is embodiment two D structure schematic diagram of the present invention;
Fig. 6 is embodiment two front view of the present invention;
Fig. 7 is embodiment two end view of the present invention;
Fig. 8 is embodiment two upward view of the present invention.
Embodiment
Embodiment one
See shown in Fig. 1 to Fig. 4, a kind of film capacitor surface of the present invention erecting and welding deriving structure, comprise housing 1 and by housing as the lead-in wire 2 that electrode is drawn; The bottom of described housing 1 protrudes out the boss of preset height downwards, and the distribution of described boss is pasted on circuit boards with enabling the bottom balance and stability of housing; Described lead-in wire 2 is embedded in corresponding boss place after the bending of the bottom of housing, and lead-in wire 2 has kink 21, and boss is provided with the caulking groove for holding lead-in wire.
The height of described boss is 0.2mm-2.0mm.
Some second boss 12 that described boss is located by first boss 11 of corner of bottom and two relative edges of the bottom of housing that are distributed in housing are formed, to paste on circuit boards with enabling the bottom balance and stability of housing 1; Described caulking groove 121 is located at the second boss 12 place, and described lead-in wire 2 is embedded in the caulking groove 121 of the second corresponding boss after the bending of the bottom of housing.
A kind of film capacitor method of surface mounting of the present invention, comprising:
The preset boss (comprising the first boss 11 and the second boss 12) protruding out certain altitude downwards in the bottom of housing, the distribution of described boss is pasted on circuit boards with enabling the bottom balance and stability of housing;
Lead-in wire is embedded in corresponding boss (i.e. the second boss 12) place after the bending of the bottom of housing;
By paste application on the pad of circuit board;
The bottom of housing is pasted on circuit boards, and the lead-in wire at boss place is reclined mutually with the pad of circuit board;
Adopt Reflow Soldering that soldering paste is melted, film capacitor and circuit board are firmly welded together and realizes being electrically connected.
Embodiment two
See shown in Fig. 5 to Fig. 8, a kind of film capacitor surface of the present invention erecting and welding deriving structure, be with the difference of embodiment one, 3rd boss 13 of the strip that described boss is located by two relative edges of the bottom being distributed in housing is formed, and the length of the 3rd boss 13 is identical with the length of two relative edges of the bottom of described housing 1, to paste on circuit boards with enabling the bottom balance and stability of housing 1; Described caulking groove 131 is located at the 3rd boss 13 place, and caulking groove 131 arranges along the length direction of the 3rd boss 13, and described lead-in wire 2 is embedded in the caulking groove 131 of the 3rd corresponding boss after the bending of the bottom of housing.
A kind of film capacitor surface erecting and welding deriving structure of the present invention and installation method thereof arrange auxiliary boss in the bottom of housing, and the bending that will go between, be close to part boss.The distribution of boss can have various ways, as long as can to housing support paste with enabling the bottom balance and stability of housing just passable on circuit boards, such as, described boss is made up of the 4th boss of V-arrangement shape of the bottom being distributed in housing, and the 4th boss is crossed between two relative edges of the bottom of housing, to paste on circuit boards with enabling the bottom balance and stability of housing; Described caulking groove is located at the 4th boss place, and caulking groove arranges along the V-arrangement shape of the 4th boss, and described lead-in wire is embedded in the caulking groove of the 4th corresponding boss after the bending of the bottom of housing; For another example, described boss is made up of the 5th boss of circle-arc profile of the bottom being distributed in housing, and the 5th boss is located at the centre of the bottom of housing, to paste on circuit boards with enabling the bottom balance and stability of housing; Described caulking groove is located at the 5th boss place, and caulking groove arranges along the circle-arc profile of the 5th boss, and described lead-in wire is embedded in the caulking groove of the 5th corresponding boss after the bending of the bottom of housing.Certainly, some distribution cannot, be such as only provided with the first boss at two angles place of the bottom of housing, like this, the bottom of housing just can not the subsides of balance and stability ground on circuit boards, the bottom of housing can tilt, and cannot carry out surface mount.In addition, the requirement for height of boss is between 0.2mm-2.0mm.Lead-in wire needs bending, and will be close to part boss, can realize being electrically connected with circuit board when film capacitor surface is installed.During surface mount, be that film capacitor is accurately installed to pad locations by paste application on the pad of circuit board, Reflow Soldering makes soldering paste melt, and film capacitor and circuit board are firmly welded together.Feature of the present invention is that housing mounting surface protrudes out any shape of certain altitude, " boss " of quantity downwards.
Above-described embodiment is only used for further illustrating a kind of film capacitor surface erecting and welding deriving structure of the present invention and installation method thereof; but the present invention is not limited to embodiment; every above embodiment is done according to technical spirit of the present invention any simple modification, equivalent variations and modification, all fall in the protection range of technical solution of the present invention.
Claims (7)
1. a film capacitor surface erecting and welding deriving structure, comprise housing and by housing as the lead-in wire that electrode is drawn; It is characterized in that: the bottom of described housing protrudes out the boss of preset height downwards, the distribution of described boss is pasted on circuit boards with enabling the bottom balance and stability of housing; Described lead-in wire is embedded in corresponding boss place after the bending of the bottom of housing, and boss is provided with the caulking groove for holding lead-in wire.
2. film capacitor surface according to claim 1 erecting and welding deriving structure, is characterized in that: the height of described boss is 0.2mm-2.0mm.
3. film capacitor surface according to claim 1 erecting and welding deriving structure, it is characterized in that: some second boss that described boss is located by first boss of corner of bottom and two relative edges of the bottom of housing that are distributed in housing are formed, to paste on circuit boards with enabling the bottom balance and stability of housing; Described caulking groove is located at the second boss place, and described lead-in wire is embedded in the caulking groove of the second corresponding boss after the bending of the bottom of housing.
4. film capacitor surface according to claim 1 erecting and welding deriving structure, it is characterized in that: the 3rd boss of the strip that described boss is located by two relative edges of the bottom being distributed in housing is formed, and the length of the 3rd boss is identical with the length of two relative edges of the bottom of described housing, to paste on circuit boards with enabling the bottom balance and stability of housing; Described caulking groove is located at the 3rd boss place, and caulking groove arranges along the length direction of the 3rd boss, and described lead-in wire is embedded in the caulking groove of the 3rd corresponding boss after the bending of the bottom of housing.
5. film capacitor surface according to claim 1 erecting and welding deriving structure, it is characterized in that: described boss is made up of the 4th boss of V-arrangement shape of the bottom being distributed in housing, and the 4th boss is crossed between two relative edges of the bottom of housing, to paste on circuit boards with enabling the bottom balance and stability of housing; Described caulking groove is located at the 4th boss place, and caulking groove arranges along the V-arrangement shape of the 4th boss, and described lead-in wire is embedded in the caulking groove of the 4th corresponding boss after the bending of the bottom of housing.
6. film capacitor surface according to claim 1 erecting and welding deriving structure, it is characterized in that: described boss is made up of the 5th boss of circle-arc profile of the bottom being distributed in housing, and the 5th boss is located at the centre of the bottom of housing, to paste on circuit boards with enabling the bottom balance and stability of housing; Described caulking groove is located at the 5th boss place, and caulking groove arranges along the circle-arc profile of the 5th boss, and described lead-in wire is embedded in the caulking groove of the 5th corresponding boss after the bending of the bottom of housing.
7. a film capacitor method of surface mounting, is characterized in that: comprising:
The preset boss protruding out certain altitude downwards in the bottom of housing, the distribution of described boss is pasted on circuit boards with enabling the bottom balance and stability of housing;
Lead-in wire is embedded in corresponding boss place after the bending of the bottom of housing;
By paste application on the pad of circuit board;
The bottom of housing is pasted on circuit boards, and the lead-in wire at boss place is reclined mutually with the pad of circuit board;
Adopt Reflow Soldering that soldering paste is melted, film capacitor and circuit board are firmly welded together and realizes being electrically connected.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410566045.5A CN104377033A (en) | 2014-10-22 | 2014-10-22 | Thin film capacitor surface mounting welding lead-out structure and mounting method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410566045.5A CN104377033A (en) | 2014-10-22 | 2014-10-22 | Thin film capacitor surface mounting welding lead-out structure and mounting method thereof |
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| CN104377033A true CN104377033A (en) | 2015-02-25 |
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| CN201410566045.5A Pending CN104377033A (en) | 2014-10-22 | 2014-10-22 | Thin film capacitor surface mounting welding lead-out structure and mounting method thereof |
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105047439A (en) * | 2015-08-11 | 2015-11-11 | 湖南艾华集团股份有限公司 | Method for flattening terminal pins of chip aluminum electrolytic capacitor and application of method |
| CN108281280A (en) * | 2017-07-28 | 2018-07-13 | 六和电子（江西）有限公司 | A kind of polyester film condenser and its installation method with pallet |
| CN108320909A (en) * | 2018-01-15 | 2018-07-24 | 六和电子（江西）有限公司 | A kind of thin film capacitor and its installation method of surface installation |
| CN108550463A (en) * | 2018-05-23 | 2018-09-18 | 苏州宏泉高压电容器有限公司 | A kind of high voltage ceramic capacitor insulation suit shell |
| CN110944463A (en) * | 2019-12-10 | 2020-03-31 | 安徽华东光电技术研究所有限公司 | Manufacturing method of grid-control gun power supply cathode voltage doubling module |
| CN111863459A (en) * | 2020-06-28 | 2020-10-30 | 华中科技大学 | Preparation method and application of patch type micro filter capacitor |
Citations (21)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11214249A (en) * | 1998-01-29 | 1999-08-06 | Kyocera Corp | Thin film capacitor |
| JPH11297569A (en) * | 1998-04-15 | 1999-10-29 | Elna Co Ltd | Electronic component |
| CN1283138A (en) * | 1997-11-24 | 2001-02-07 | 阿维科斯公司 | Improved miniature surface mount capacitor and method of making the same |
| CN2479616Y (en) * | 2001-03-19 | 2002-02-27 | 赖素琴 | Improved structure of capacitor pin |
| CN1707709A (en) * | 2004-06-04 | 2005-12-14 | 禾伸堂企业股份有限公司 | Chip capacitor with elastic damping conductive pin |
| CN1988083A (en) * | 2005-12-20 | 2007-06-27 | 富士通株式会社 | Thin-film capacitor and method for fabricating the same, electronic device and circuit board |
| CN101030546A (en) * | 2006-02-28 | 2007-09-05 | 飞思卡尔半导体公司 | Capacitor attachment method |
| US20070279836A1 (en) * | 2004-12-24 | 2007-12-06 | Murata Manufacturing Co., Ltd. | Monolithic capacitor and mounting structure thereof |
| JP2010245486A (en) * | 2009-04-03 | 2010-10-28 | Far East Engineering Co Ltd | Vertical chip capacitor |
| CN201638684U (en) * | 2010-04-06 | 2010-11-17 | 镇江冈山电子有限公司 | Base of chip capacitor |
| CN201638690U (en) * | 2010-04-06 | 2010-11-17 | 镇江冈山电子有限公司 | Base of chip aluminum electrolytic capacitor |
| CN201812679U (en) * | 2010-08-26 | 2011-04-27 | 佛山市顺德区丰明电子科技有限公司 | Novel capacitor outer casing |
| CN202076136U (en) * | 2011-04-22 | 2011-12-14 | 宁波新容电器科技有限公司 | Lead capacitor |
| CN202084438U (en) * | 2011-06-18 | 2011-12-21 | 汕头高新区松田实业有限公司 | Film capacitor applicable to surface mounting |
| CN102683011A (en) * | 2012-04-10 | 2012-09-19 | 安徽鑫阳电子有限公司 | Variable-frequency power electronic capacitor |
| CN202585131U (en) * | 2012-05-23 | 2012-12-05 | 邱宗清 | Supercapacitor casing |
| CN202855552U (en) * | 2012-07-16 | 2013-04-03 | 佛山市意壳电容器有限公司 | Metallized film capacitor with multiple lead welding terminals |
| CN202930238U (en) * | 2012-11-19 | 2013-05-08 | 铜陵市新洲电子科技有限责任公司 | Capacitor housing edging seat fixing structure |
| CN203013527U (en) * | 2012-12-21 | 2013-06-19 | 汕头高新区松田实业有限公司 | Lead welding structure of metallized film capacitor |
| CN203232801U (en) * | 2013-03-18 | 2013-10-09 | 南通新联电子有限公司 | Super-thin capacitor base seat |
| CN204144060U (en) * | 2014-10-22 | 2015-02-04 | 厦门法拉电子股份有限公司 | A kind of film capacitor surface erecting and welding deriving structure |
-
2014
- 2014-10-22 CN CN201410566045.5A patent/CN104377033A/en active Pending
Patent Citations (21)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1283138A (en) * | 1997-11-24 | 2001-02-07 | 阿维科斯公司 | Improved miniature surface mount capacitor and method of making the same |
| JPH11214249A (en) * | 1998-01-29 | 1999-08-06 | Kyocera Corp | Thin film capacitor |
| JPH11297569A (en) * | 1998-04-15 | 1999-10-29 | Elna Co Ltd | Electronic component |
| CN2479616Y (en) * | 2001-03-19 | 2002-02-27 | 赖素琴 | Improved structure of capacitor pin |
| CN1707709A (en) * | 2004-06-04 | 2005-12-14 | 禾伸堂企业股份有限公司 | Chip capacitor with elastic damping conductive pin |
| US20070279836A1 (en) * | 2004-12-24 | 2007-12-06 | Murata Manufacturing Co., Ltd. | Monolithic capacitor and mounting structure thereof |
| CN1988083A (en) * | 2005-12-20 | 2007-06-27 | 富士通株式会社 | Thin-film capacitor and method for fabricating the same, electronic device and circuit board |
| CN101030546A (en) * | 2006-02-28 | 2007-09-05 | 飞思卡尔半导体公司 | Capacitor attachment method |
| JP2010245486A (en) * | 2009-04-03 | 2010-10-28 | Far East Engineering Co Ltd | Vertical chip capacitor |
| CN201638690U (en) * | 2010-04-06 | 2010-11-17 | 镇江冈山电子有限公司 | Base of chip aluminum electrolytic capacitor |
| CN201638684U (en) * | 2010-04-06 | 2010-11-17 | 镇江冈山电子有限公司 | Base of chip capacitor |
| CN201812679U (en) * | 2010-08-26 | 2011-04-27 | 佛山市顺德区丰明电子科技有限公司 | Novel capacitor outer casing |
| CN202076136U (en) * | 2011-04-22 | 2011-12-14 | 宁波新容电器科技有限公司 | Lead capacitor |
| CN202084438U (en) * | 2011-06-18 | 2011-12-21 | 汕头高新区松田实业有限公司 | Film capacitor applicable to surface mounting |
| CN102683011A (en) * | 2012-04-10 | 2012-09-19 | 安徽鑫阳电子有限公司 | Variable-frequency power electronic capacitor |
| CN202585131U (en) * | 2012-05-23 | 2012-12-05 | 邱宗清 | Supercapacitor casing |
| CN202855552U (en) * | 2012-07-16 | 2013-04-03 | 佛山市意壳电容器有限公司 | Metallized film capacitor with multiple lead welding terminals |
| CN202930238U (en) * | 2012-11-19 | 2013-05-08 | 铜陵市新洲电子科技有限责任公司 | Capacitor housing edging seat fixing structure |
| CN203013527U (en) * | 2012-12-21 | 2013-06-19 | 汕头高新区松田实业有限公司 | Lead welding structure of metallized film capacitor |
| CN203232801U (en) * | 2013-03-18 | 2013-10-09 | 南通新联电子有限公司 | Super-thin capacitor base seat |
| CN204144060U (en) * | 2014-10-22 | 2015-02-04 | 厦门法拉电子股份有限公司 | A kind of film capacitor surface erecting and welding deriving structure |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105047439A (en) * | 2015-08-11 | 2015-11-11 | 湖南艾华集团股份有限公司 | Method for flattening terminal pins of chip aluminum electrolytic capacitor and application of method |
| CN108281280A (en) * | 2017-07-28 | 2018-07-13 | 六和电子（江西）有限公司 | A kind of polyester film condenser and its installation method with pallet |
| CN108320909A (en) * | 2018-01-15 | 2018-07-24 | 六和电子（江西）有限公司 | A kind of thin film capacitor and its installation method of surface installation |
| CN108320909B (en) * | 2018-01-15 | 2023-07-04 | 六和电子（江西）有限公司 | Surface-mounted film capacitor and mounting method thereof |
| CN108550463A (en) * | 2018-05-23 | 2018-09-18 | 苏州宏泉高压电容器有限公司 | A kind of high voltage ceramic capacitor insulation suit shell |
| CN110944463A (en) * | 2019-12-10 | 2020-03-31 | 安徽华东光电技术研究所有限公司 | Manufacturing method of grid-control gun power supply cathode voltage doubling module |
| CN111863459A (en) * | 2020-06-28 | 2020-10-30 | 华中科技大学 | Preparation method and application of patch type micro filter capacitor |
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