CN203013527U - Lead welding structure of metallized film capacitor - Google Patents
Lead welding structure of metallized film capacitor Download PDFInfo
- Publication number
- CN203013527U CN203013527U CN 201220716101 CN201220716101U CN203013527U CN 203013527 U CN203013527 U CN 203013527U CN 201220716101 CN201220716101 CN 201220716101 CN 201220716101 U CN201220716101 U CN 201220716101U CN 203013527 U CN203013527 U CN 203013527U
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- lead
- welding
- film capacitor
- wire
- fuse
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Abstract
The utility model discloses a lead welding structure of a metallized film capacitor. The lead welding structure comprises a round lead. The structure is characterized in that the round lead is provided with a flat welding portion. Because the round lead of the lead welding structure is provided with the flat welding portion, the round lead can be conveniently and rapidly welded on an end surface of a core through the flat welding portion of the round lead. A contact area of the flat welding portion and the end surface of the core is large. The welding contact area of the welding structure is large and a welding spot is firm so that an electricity flow capacity and reliability of the metallized film capacitor are increased. Besides, the lead welding structure possesses the following advantages that the structure is simple; the design is reasonable; making is convenient; the structure is easy to popularize and so on.
Description
Technical field
The utility model relates to a kind of wire bonds structure of metallization film capacitor.
Background technology
Metallization film capacitor has that volume is little, capacity is large, nonpolarity, encapsulation is reliable, insulation impedance is high, frequency characteristic is excellent, dielectric loss is very little, electric property is stable, can advantages such as " self-healings ", therefore, metallization film capacitor is widely used in the fields such as electronics, computer, communication, space flight, military affairs.
Existing metallization film capacitor has generally comprised housing, fuse and two lead-in wires, when making metallization film capacitor, at first, two lead-in wires is welded on respectively on two end faces of fuse; Then, the fuse that is welded with lead-in wire is put into housing; Then, pour into encapsulating material in housing; After encapsulation material solidifies, metallization film capacitor just completes.
At present, the lead-in wire of existing metallization film capacitor generally adopts circular lead-in wire, when on the end face of circular wire bonds at fuse, due to the lead-in wire with the fuse end face between formation line contact, so, lead-in wire is solid with the not prison welding of fuse, thereby has influence on galvanization ability and the reliability of metallization film capacitor;
In addition, because the lead-in wire of existing metallization film capacitor generally adopts circular lead-in wire, so, easily encounter the medium of fuse when being welded on the circle lead-in wire pressurized on the fuse end face, so just easily cause loss.
Summary of the invention
Technical problem to be solved in the utility model is to provide a kind of wire bonds structure of metallization film capacitor, and the welding contact area of this wire bonds structure is large, firm welding, thereby has improved galvanization ability and the reliability of metallization film capacitor.
In order to solve the problems of the technologies described above, the technical solution adopted in the utility model is as follows:
A kind of wire bonds structure of metallization film capacitor comprises circular lead-in wire, it is characterized in that: have a flat weld part on above-mentioned circular lead-in wire.
Flat weld part on above-mentioned circular lead-in wire can be flattened by the circle lead-in wire and form, during welding, the flat weld part of above-mentioned circular lead-in wire is attached on the end face of fuse, so just, can be quickly and easily with circular wire bonds on the end face of fuse, and the contact area of above-mentioned flat weld part and fuse end face is large, therefore, the welding contact area of this wire bonds structure is large, solder joint is firm, thereby has improved galvanization ability and the reliability of metallization film capacitor.
Simultaneously, because the contact area of the above-mentioned circular flat weld part that goes between and fuse end face is large, so after welding, circular lead-in wire can not be encountered the medium of fuse when pressurized, thereby has reduced the loss that metallization film capacitor causes because of welding.
As the preferred structure of flat weld part in the utility model, the shape such as described flat weld part is rectangular, circular or oval.
The utility model beneficial effect against existing technologies is:
Has a flat weld part on circle lead-in wire due to this wire bonds structure, so, the flat weld part that goes between by circle, can be quickly and easily with circular wire bonds on the end face of fuse, and the contact area of above-mentioned flat weld part and fuse end face is large, therefore, the welding contact area of this wire bonds structure is large, solder joint is firm, thereby has improved galvanization ability and the reliability of metallization film capacitor.
In addition, this wire bonds structure also have simple in structure, reasonable in design, easy to make, be easy to the advantages such as popularization.
Below in conjunction with the drawings and specific embodiments, the utility model is described further.
Description of drawings
Fig. 1 is the structural representation of the utility model preferred embodiment 1;
Fig. 2 is that the utility model preferred embodiment 1 is welded on the structural representation on the end face of fuse;
Fig. 3 is the structural representation of the utility model preferred embodiment 2;
Fig. 4 is that the utility model preferred embodiment 2 is welded on the structural representation on the end face of fuse.
Embodiment
Embodiment 1
As shown in Figure 1 and Figure 2, the wire bonds structure of the metallization film capacitor in this preferred embodiment comprises circular lead-in wire 1, has a flat weld part 10 on above-mentioned circular lead-in wire 1;
Above-mentioned flat weld part 10 is rectangular, and in this preferred embodiment, above-mentioned flat weld part 10 is rectangle.
And above-mentioned flat weld part 10 is large with the contact area of fuse 2 end faces 20, and therefore, the welding contact area of this wire bonds structure is large, solder joint is firm, thereby has improved galvanization ability and the reliability of metallization film capacitor.
Simultaneously, because the flat weld part 10 of above-mentioned circular lead-in wire 1 is large with the contact area of fuse end face 20, so after welding, circular lead-in wire 1 can not be encountered the medium of fuse 1 when pressurized, thereby has reduced the loss that metallization film capacitor causes because of welding.
As shown in Figure 3, Figure 4, the flat weld part 10 in embodiment 2 is and is similar to ellipse.
The above is only preferred embodiment of the present utility model, is not to limit practical range of the present utility model; Be all equivalents of doing according to claim scope of the present utility model, be claim scope of the present utility model and cover.
Claims (2)
1. the wire bonds structure of a metallization film capacitor, comprise circular lead-in wire, it is characterized in that: have a flat weld part on above-mentioned circular lead-in wire.
2. the wire bonds structure of metallization film capacitor according to claim 1 is characterized in that: described flat weld part is rectangular, circular or oval.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220716101 CN203013527U (en) | 2012-12-21 | 2012-12-21 | Lead welding structure of metallized film capacitor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220716101 CN203013527U (en) | 2012-12-21 | 2012-12-21 | Lead welding structure of metallized film capacitor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203013527U true CN203013527U (en) | 2013-06-19 |
Family
ID=48605094
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201220716101 Expired - Fee Related CN203013527U (en) | 2012-12-21 | 2012-12-21 | Lead welding structure of metallized film capacitor |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203013527U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104377033A (en) * | 2014-10-22 | 2015-02-25 | 厦门法拉电子股份有限公司 | Thin film capacitor surface mounting welding lead-out structure and mounting method thereof |
| CN110896000A (en) * | 2018-08-24 | 2020-03-20 | 东莞市成东电子科技有限公司 | Welding process of thin film capacitor |
-
2012
- 2012-12-21 CN CN 201220716101 patent/CN203013527U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104377033A (en) * | 2014-10-22 | 2015-02-25 | 厦门法拉电子股份有限公司 | Thin film capacitor surface mounting welding lead-out structure and mounting method thereof |
| CN110896000A (en) * | 2018-08-24 | 2020-03-20 | 东莞市成东电子科技有限公司 | Welding process of thin film capacitor |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130619 Termination date: 20201221 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |