CN105140040A - Chip solid tantalum capacitor with ceramic packaging structure and packaging method thereof - Google Patents
Chip solid tantalum capacitor with ceramic packaging structure and packaging method thereof Download PDFInfo
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- CN105140040A CN105140040A CN201510619558.2A CN201510619558A CN105140040A CN 105140040 A CN105140040 A CN 105140040A CN 201510619558 A CN201510619558 A CN 201510619558A CN 105140040 A CN105140040 A CN 105140040A
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Abstract
The invention provides a chip solid tantalum capacitor with ceramic packaging structure and a packaging method thereof. With a ceramic packaging structure, a tantalum chip is installed on one side of the inner face bottom of an opened ceramic box body. A negative electroplated layer is plated on the part where the inner face bottom of the opened ceramic box body contacts with the tantalum chip. The tantalum chip is adhered to the negative electroplated layer at the inner face bottom of the opened ceramic box body via the bonding conductive glue. A positive electroplated layer is separately plated on the other side, opposite to the inner face bottom of the opened ceramic box body, of the negative electroplated layer. A positive lead-out piece is welded on the positive electroplated layer and is welded to a tantalum chip positive wire. A welding metallization layer is arranged on the opened part of the opened ceramic box body. The opening of the opened ceramic box body is welded to the welding metallization layer via a metal cover plate so the opened ceramic box body is packaged.
Description
Technical field
The present invention relates to a kind of electronic devices and components and preparation method thereof, be specifically related to a kind of ceramic packaging structure chip tantalum capacitor and preparation method thereof, to solve resin-encapsulated products air tightness problem, improve its reliability, keep chip appearance design to be easy to the characteristic of installing and using simultaneously.Belong to electronic devices and components manufacture technology field.
background technology:
Chip solid tantalum capacitors is a kind of polar component, in microelectronic circuit, utilize the unilateral conduction of its dielectric layer can be used for filtering, AC ripple target signal filter remaining in direct current signal or make its wave amplitude diminish, the feature of chip solid tantalum capacitors is that the life-span is long, high temperature resistant, accuracy is high, filter high-frequency harmonic performance is fabulous, and various informative, and volume efficiency is excellent, have the feature of its uniqueness, its range of application is more and more wider.
The resin-encapsulated mode that current chip solid tantalum capacitors mainly adopts, is applicable to the industrial production of cost degradation, extensive automation, is widely used at territories such as household electrical appliances, communication, medical treatment, computer, automobiles.But resin-encapsulated is non-airtight structure, easily invades by moisture or corrosivity gas-liquid under the environment that high temperature, high humidity etc. are harsh and destroy device inside conducting circuit and fuse, cause properties of product to worsen and even lost efficacy.Resin-encapsulated product is due to the direct product wrapping pellet of resin material, and it produces stress in cure shrinkage has negative effect to product, has destruction to the syndeton, rigid material etc. of each material in inside, properties of product equally also can be caused to worsen and even lost efficacy.Limit the application of conventional resins encapsulation chip tantalum electric capacity, particularly under the complex environment such as space flight, oil field and the application in high reliability request field.Still adopt traditional axis or longitudinal cylindrical metal shell encapsulating products in the occasion of these complex environments and high reliability request, be not easy to install and fix.Therefore be necessary to be improved further.
Do not find that there is the patent literature constructed with the present invention by retrieval, to have the patent of certain relation and paper to mainly contain following with the present invention:
1, the patent No. is CN201520172749, and the utility model patent that name is called " the silver-colored shell of a kind of solid tantalum capacitor ", which discloses the silver-colored shell of a kind of solid tantalum capacitor, and it includes a straight barrel type silver shell and a negative wire; Silver shell is straight tube hat-shaped structure, and its front end has silver-colored faucal, end seal; The end bottom centre of described silver-colored shell is provided with protruding zone center, and zone center is provided with annular ring, and described silver-colored faucal place is provided with embedded step; Described zone center place is welded with negative wire by solder.
2, the patent No. is CN201520171878, name is called " a kind of solid tantalum capacitor copper shell " utility model patent, and which disclose a kind of solid tantalum capacitor copper shell, it includes a straight barrel type copper shell and a negative wire; Copper shell is straight tube hat-shaped structure, and its front end has copper faucal, end seal and center is provided with centre bore; Described copper faucal place is provided with embedded step; Described central hole is provided with negative wire.
3, " organic chip solid tantalum electrolytic capacitor Study on Preparation " author: Ge Meng, Xu Jianhua, Yang Yajie, Jiang Yadong and Chen Guanghua, " material Leader " 12 phases in 2009, this paper studies preparation technology of conducting polymer PEDT as organic chip solid tantalum electrolytic capacitor of cathode material, effectively improves the performance of organic chip solid tantalum capacitors by parameter such as adjustment isolated material, dopant etc.The primary study impact of the parameter such as barrier, dopant content on performances such as organic chip solid tantalum capacitors electric capacity, equivalent series resistance, leakage currents.Result shows, when isolated material volume fraction is 0.5% ~ 1.5%, film has good withstand voltage properties, and the leakage current of capacitor is less (5 μ A); When dopant mass fraction is 1.5% ~ 2%, dopant effectively can enter PEDT main chain and adulterate, and the conductivity of PEDT film is higher, thus makes capacitor obtain lower equivalent series resistance.
Although these patents above-mentioned or paper all relate to solid tantalum capacitor and preparation method thereof, it is also proposed the improvement that some are structural, but all fundamentally do not change existing solid tantalum capacitor resin-encapsulated mode, all still, there is foregoing deficiency, especially easily invade by moisture or corrosivity gas-liquid under the environment that high temperature, high humidity etc. are harsh and destroy device inside conducting circuit and fuse, cause properties of product to worsen the problem even lost efficacy not solve very well, therefore still need to be improved further.
Summary of the invention
The object of the invention is to for the deficiency existing for existing chip solid tantalum capacitors resin-encapsulated mode, a kind of new chip solid tantalum capacitors and preparation method thereof is proposed, this chip solid tantalum capacitors and preparation method thereof effectively can solve chip solid tantalum capacitors and easily invade destruction device inside conducting circuit and fuse by moisture or corrosivity gas-liquid under the environment that high temperature, high humidity etc. are harsh, causes properties of product to worsen the problem even lost efficacy.
In order to reach this purpose, the invention provides a kind of ceramic packaging structure chip tantalum capacitor, adopt ceramic packaging structure, tantalum chip is arranged on the side bottom the inner face of uncovered ceramic boxes, the position contacted with tantalum chip bottom uncovered ceramic boxes inner face, be coated with negative electricity coating, tantalum chip is bonded on uncovered ceramic boxes inner face bottom cathode electrodeposited coating by bonding conducting resinl; Opposite side relative with negative electricity coating bottom uncovered ceramic boxes inner face, is coated with positive pole electrodeposited coating with interval, positive pole electrodeposited coating is welded with positive pole leading-out piece, and positive pole leading-out piece welds together with tantalum chip positive pole tantalum wire again; There is weld metal layer at the uncovered position of uncovered ceramic boxes, and uncovered the welding with weld metal layer by metal cover board of uncovered ceramic boxes is encapsulated.
Further, described negative electricity coating is connected to by the through post of negative conductive running through uncovered ceramic boxes the negative pole pin be positioned at outside ceramic boxes, forms negative pole and draws connector.
Further, described positive pole electrodeposited coating is connected to by the through post of positive conductive running through uncovered ceramic boxes the positive pole pin be positioned at outside ceramic boxes, forms positive pole and draws connector.
Further, the through post of described positive conductive and the through post of negative conductive are take fine and close hole to coordinate with uncovered ceramic boxes, positive pole electrodeposited coating and negative electricity coating place is positioned at uncovered ceramic boxes, have the through hole installing the through post of positive conductive and the through post of negative conductive, the through post of positive conductive and the through post of negative conductive are arranged in through hole respectively, and encapsulated by fluid sealant, in case in the uncovered ceramic boxes of outside dirty infiltration.
Further, the uncovered position of described uncovered ceramic boxes and metal cover board are ladder syndeton, and cover plate is covered and encapsulated by welding after cylindrical shell, and ladder syndeton is easy to securing cover plate position, ensure welded seal.
Further, described positive pole leading-out piece be about one all with " ］ of flanging " shape support, and upper hem is shorter than the flanging of lower hem; Draw positive pole tantalum wire in upper hem and tantalum chip to weld together, form the support to positive pole tantalum wire and connection function; In lower hem and uncovered ceramic boxes, positive pole electrodeposited coating welds together, and tantalum capacitance cathode is connected to by positive pole electrodeposited coating and the through post of positive conductive the positive pole pin be positioned at outside ceramic boxes.
A method for packing for ceramic packaging structure chip tantalum capacitor, is placed in tantalum chip in uncovered ceramic boxes, bottom uncovered ceramic boxes side surface on be attached with negative electricity coating, tantalum chip by bonding conducting resinl be fixed on negative electricity coating; Opposite side relative with negative electricity coating bottom uncovered ceramic boxes inner face, is coated with positive pole electrodeposited coating with interval, positive pole electrodeposited coating is welded with positive pole leading-out piece, and positive pole leading-out piece welds together with tantalum chip positive pole tantalum wire again; There is weld metal layer at the uncovered position of uncovered ceramic boxes, and uncovered the welding with weld metal layer by metal cover board of uncovered ceramic boxes is encapsulated.
Further, described negative electricity coating is connected to by the through post of negative conductive running through uncovered ceramic boxes the negative pole pin be positioned at outside ceramic boxes, forms negative pole and draws connector; Described positive pole electrodeposited coating is connected to by the through post of positive conductive running through uncovered ceramic boxes the positive pole pin be positioned at outside ceramic boxes, forms positive pole and draws connector.
Further, the through post of described positive conductive and the through post of negative conductive are take fine and close hole to coordinate with uncovered ceramic boxes, positive pole electrodeposited coating and negative electricity coating place is positioned at uncovered ceramic boxes, have the through hole installing the through post of positive conductive and the through post of negative conductive, the through post of positive conductive and the through post of negative conductive are arranged in through hole respectively, and encapsulated by fluid sealant, in case in the uncovered ceramic boxes of outside dirty infiltration.
Further, the uncovered position of described uncovered ceramic boxes and metal cover board are ladder syndeton, and cover plate is covered and encapsulated by welding after cylindrical shell, and ladder syndeton is easy to securing cover plate position, ensure welded seal.
The invention has the advantages that:
1, ceramic package employing perfusion electric conducting material carries out conducting negative or positive electrode structure bottom running through, and bottom conducting structure shortens the equivalent series resistance that inner conducting length reduces product;
2, enclosure both positive and negative polarity plating layer of metal material is as fuse syndeton;
3, shell pin plating layer of material is as both positive and negative polarity deriving structure;
4, negative pole adopts silver slurry that electrode in fuse and negative pole is carried out bonding connection;
5, positive pole adopts electrode in welding positive pole supporting spring and positive pole to be welded to connect;
6, fuse positive pole tantalum wire and positive pole supporting spring are welded to connect;
7, the hermetically sealed welding of cover plate of outer casing design ledge structure.
Accompanying drawing explanation
Fig. 1 is general structure principle schematic of the present invention.
Embodiment
The present invention is set forth further below in conjunction with the drawings and specific embodiments.
Embodiment one
Can be found out by accompanying drawing 1, the present invention relates to a kind of ceramic packaging structure chip tantalum capacitor, adopt ceramic packaging structure, tantalum chip 6 is arranged on the side bottom the inner face of uncovered ceramic boxes 1, the position contacted with tantalum chip 6 bottom uncovered ceramic boxes 1 inner face, be coated with negative electricity coating 3, tantalum chip 6 is bonded on uncovered ceramic boxes 1 inner face bottom cathode electrodeposited coating 3 by bonding conducting resinl 2; Opposite side relative with negative electricity coating 3 bottom uncovered ceramic boxes 1 inner face, is coated with positive pole electrodeposited coating 12 with interval, positive pole electrodeposited coating 12 is welded with positive pole leading-out piece 10, and positive pole leading-out piece 10 welds together with tantalum chip positive pole tantalum wire 9 again; There is weld metal layer 7 at the uncovered position of uncovered ceramic boxes 1, and uncovered the welding with weld metal layer 7 by metal cover board 8 of uncovered ceramic boxes 1 is encapsulated.
Further, described negative electricity coating 3 is connected to by the through post 4 of negative conductive running through uncovered ceramic boxes 1 the negative pole pin 5 be positioned at outside ceramic boxes, forms negative pole and draws connector.
Further, described positive pole electrodeposited coating 12 is connected to by the through post 13 of positive conductive running through uncovered ceramic boxes the positive pole pin 14 be positioned at outside ceramic boxes, forms positive pole and draws connector.
Embodiment two
Embodiment two is substantially the same with the structure of embodiment one, the just described through post of positive conductive and the through post of negative conductive are take fine and close hole to coordinate with uncovered ceramic boxes, positive pole electrodeposited coating and negative electricity coating place is positioned at uncovered ceramic boxes, have the through hole installing the through post of positive conductive and the through post of negative conductive, the through post of positive conductive and the through post of negative conductive are arranged in through hole respectively, and encapsulated by fluid sealant, in case in the uncovered ceramic boxes of outside dirty infiltration.
The uncovered position of described uncovered ceramic boxes and metal cover board are ladder syndeton, and cover plate is covered and encapsulated by welding after cylindrical shell, and ladder syndeton is easy to securing cover plate position, ensure welded seal.
Embodiment three
Embodiment three is substantially the same with the structure of embodiment two, just described positive pole leading-out piece be about one all with " ］ of flanging " shape support, and upper hem is shorter than the flanging of lower hem; Draw positive pole tantalum wire in upper hem and tantalum chip to weld together, form the support to positive pole tantalum wire and connection function; In lower hem and uncovered ceramic boxes, positive pole electrodeposited coating welds together, and tantalum capacitance cathode is connected to by positive pole electrodeposited coating and the through post of positive conductive the positive pole pin be positioned at outside ceramic boxes.
Above-mentioned listed embodiment, just carries out clear, complete description to technical scheme of the present invention by reference to the accompanying drawings; Obviously, described embodiment is only a part of embodiment of the present invention, instead of whole embodiments.Based on the embodiment in the present invention, those of ordinary skill in the art, not making other embodiments all obtained under creative work prerequisite, belong to the scope of protection of the invention.
Can be found out by above-described embodiment, the invention still further relates to a kind of method for packing of ceramic packaging structure chip tantalum capacitor, tantalum chip is placed in uncovered ceramic boxes, bottom uncovered ceramic boxes side surface on be attached with negative electricity coating, tantalum chip by bonding conducting resinl be fixed on negative electricity coating; Opposite side relative with negative electricity coating bottom uncovered ceramic boxes inner face, is coated with positive pole electrodeposited coating with interval, positive pole electrodeposited coating is welded with positive pole leading-out piece, and positive pole leading-out piece welds together with tantalum chip positive pole tantalum wire again; There is weld metal layer at the uncovered position of uncovered ceramic boxes, and uncovered the welding with weld metal layer by metal cover board of uncovered ceramic boxes is encapsulated.
Further, described negative electricity coating is connected to by the through post of negative conductive running through uncovered ceramic boxes the negative pole pin be positioned at outside ceramic boxes, forms negative pole and draws connector; Described positive pole electrodeposited coating is connected to by the through post of positive conductive running through uncovered ceramic boxes the positive pole pin be positioned at outside ceramic boxes, forms positive pole and draws connector.
Further, the through post of described positive conductive and the through post of negative conductive are take fine and close hole to coordinate with uncovered ceramic boxes, positive pole electrodeposited coating and negative electricity coating place is positioned at uncovered ceramic boxes, have the through hole installing the through post of positive conductive and the through post of negative conductive, the through post of positive conductive and the through post of negative conductive are arranged in through hole respectively, and encapsulated by fluid sealant, in case in the uncovered ceramic boxes of outside dirty infiltration.
Further, the uncovered position of described uncovered ceramic boxes and metal cover board are ladder syndeton, and cover plate is covered and encapsulated by welding after cylindrical shell, and ladder syndeton is easy to securing cover plate position, ensure welded seal.
The invention has the advantages that:
1, ceramic package employing perfusion electric conducting material carries out conducting negative or positive electrode structure bottom running through, and bottom conducting structure shortens the equivalent series resistance that inner conducting length reduces product;
2, enclosure both positive and negative polarity plating layer of metal material is as fuse syndeton;
3, shell pin plating layer of material is as both positive and negative polarity deriving structure;
4, negative pole adopts silver slurry that electrode in fuse and negative pole is carried out bonding connection;
5, positive pole adopts electrode in welding positive pole supporting spring and positive pole to be welded to connect;
7, fuse positive pole tantalum wire and positive pole supporting spring are welded to connect;
8, the hermetically sealed welding of cover plate of outer casing design ledge structure.
Claims (10)
1. a ceramic packaging structure chip tantalum capacitor, it is characterized in that: adopt ceramic packaging structure, tantalum chip is arranged on the side bottom the inner face of uncovered ceramic boxes, the position contacted with tantalum chip bottom uncovered ceramic boxes inner face, be coated with negative electricity coating, tantalum chip is bonded on uncovered ceramic boxes inner face bottom cathode electrodeposited coating by bonding conducting resinl; Opposite side relative with negative electricity coating bottom uncovered ceramic boxes inner face, is coated with positive pole electrodeposited coating with interval, positive pole electrodeposited coating is welded with positive pole leading-out piece, and positive pole leading-out piece welds together with tantalum chip positive pole tantalum wire again; There is weld metal layer at the uncovered position of uncovered ceramic boxes, and uncovered the welding with weld metal layer by metal cover board of uncovered ceramic boxes is encapsulated.
2. ceramic packaging structure chip tantalum capacitor as claimed in claim 1, it is characterized in that: described negative electricity coating is connected to by the through post of negative conductive running through uncovered ceramic boxes the negative pole pin be positioned at outside ceramic boxes, form negative pole and draw connector.
3. ceramic packaging structure chip tantalum capacitor as claimed in claim 1, it is characterized in that: described positive pole electrodeposited coating is connected to by the through post of positive conductive running through uncovered ceramic boxes the positive pole pin be positioned at outside ceramic boxes, form positive pole and draw connector.
4. ceramic packaging structure chip tantalum capacitor as claimed in claim 2 or claim 3, it is characterized in that: the through post of described positive conductive and the through post of negative conductive are take fine and close hole to coordinate with uncovered ceramic boxes, positive pole electrodeposited coating and negative electricity coating place is positioned at uncovered ceramic boxes, have the through hole installing the through post of positive conductive and the through post of negative conductive, the through post of positive conductive and the through post of negative conductive are arranged in through hole respectively, and encapsulated by fluid sealant, in case in the uncovered ceramic boxes of outside dirty infiltration.
5. ceramic packaging structure chip tantalum capacitor as claimed in claim 4, it is characterized in that: the uncovered position of described uncovered ceramic boxes and metal cover board are ladder syndeton, cover plate is covered and is encapsulated by welding after cylindrical shell, ladder syndeton is easy to securing cover plate position, ensures welded seal.
6. ceramic packaging structure chip tantalum capacitor as claimed in claim 5, is characterized in that: described positive pole leading-out piece be about one all with " ］ of flanging " shape support, and upper hem is shorter than the flanging of lower hem; Draw positive pole tantalum wire in upper hem and tantalum chip to weld together, form the support to positive pole tantalum wire and connection function; In lower hem and uncovered ceramic boxes, positive pole electrodeposited coating welds together, and tantalum capacitance cathode is connected to by positive pole electrodeposited coating and the through post of positive conductive the positive pole pin be positioned at outside ceramic boxes.
7. a method for packing for ceramic packaging structure chip tantalum capacitor, is placed in tantalum chip in uncovered ceramic boxes, bottom uncovered ceramic boxes side surface on be attached with negative electricity coating, tantalum chip by bonding conducting resinl be fixed on negative electricity coating; Opposite side relative with negative electricity coating bottom uncovered ceramic boxes inner face, is coated with positive pole electrodeposited coating with interval, positive pole electrodeposited coating is welded with positive pole leading-out piece, and positive pole leading-out piece welds together with tantalum chip positive pole tantalum wire again; There is weld metal layer at the uncovered position of uncovered ceramic boxes, and uncovered the welding with weld metal layer by metal cover board of uncovered ceramic boxes is encapsulated.
8. the method for packing of ceramic packaging structure chip tantalum capacitor as claimed in claim 7, it is characterized in that: described negative electricity coating is connected to by the through post of negative conductive running through uncovered ceramic boxes the negative pole pin be positioned at outside ceramic boxes, form negative pole and draw connector; Described positive pole electrodeposited coating is connected to by the through post of positive conductive running through uncovered ceramic boxes the positive pole pin be positioned at outside ceramic boxes, forms positive pole and draws connector.
9. the method for packing of ceramic packaging structure chip tantalum capacitor as claimed in claim 8, it is characterized in that: the through post of described positive conductive and the through post of negative conductive are take fine and close hole to coordinate with uncovered ceramic boxes, positive pole electrodeposited coating and negative electricity coating place is positioned at uncovered ceramic boxes, have the through hole installing the through post of positive conductive and the through post of negative conductive, the through post of positive conductive and the through post of negative conductive are arranged in through hole respectively, and encapsulated by fluid sealant, in case in the uncovered ceramic boxes of outside dirty infiltration.
10. the method for packing of ceramic packaging structure chip tantalum capacitor as claimed in claim 9, it is characterized in that: the uncovered position of described uncovered ceramic boxes and metal cover board are ladder syndeton, cover plate is covered and is encapsulated by welding after cylindrical shell, ladder syndeton is easy to securing cover plate position, ensures welded seal.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510619558.2A CN105140040A (en) | 2015-09-25 | 2015-09-25 | Chip solid tantalum capacitor with ceramic packaging structure and packaging method thereof |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510619558.2A CN105140040A (en) | 2015-09-25 | 2015-09-25 | Chip solid tantalum capacitor with ceramic packaging structure and packaging method thereof |
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| CN105140040A true CN105140040A (en) | 2015-12-09 |
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| CN201510619558.2A Pending CN105140040A (en) | 2015-09-25 | 2015-09-25 | Chip solid tantalum capacitor with ceramic packaging structure and packaging method thereof |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108550463A (en) * | 2018-05-23 | 2018-09-18 | 苏州宏泉高压电容器有限公司 | A kind of high voltage ceramic capacitor insulation suit shell |
| CN111599689A (en) * | 2020-05-27 | 2020-08-28 | 上海芯波电子科技有限公司 | Double-sided cavity digging ceramic packaging process based on WB chip |
| CN112349656A (en) * | 2020-09-28 | 2021-02-09 | 中国电子科技集团公司第二十九研究所 | System-in-package structure and manufacturing method thereof |
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| US20070138606A1 (en) * | 2005-12-08 | 2007-06-21 | Paul Brailey | Semiconductor package |
| CN101009160A (en) * | 2006-01-23 | 2007-08-01 | 富士通媒体部品株式会社 | Laminated solid electrolytic condenser |
| CN102751103A (en) * | 2011-04-07 | 2012-10-24 | Avx公司 | Hermetically sealed electrolytic capacitor with enhanced mechanical stability |
| CN205194523U (en) * | 2015-09-25 | 2016-04-27 | 株洲宏达电子股份有限公司 | Pottery packaging structure piece formula solid tantalum capacitor |
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- 2015-09-25 CN CN201510619558.2A patent/CN105140040A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
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| US20070138606A1 (en) * | 2005-12-08 | 2007-06-21 | Paul Brailey | Semiconductor package |
| CN101009160A (en) * | 2006-01-23 | 2007-08-01 | 富士通媒体部品株式会社 | Laminated solid electrolytic condenser |
| CN102751103A (en) * | 2011-04-07 | 2012-10-24 | Avx公司 | Hermetically sealed electrolytic capacitor with enhanced mechanical stability |
| CN205194523U (en) * | 2015-09-25 | 2016-04-27 | 株洲宏达电子股份有限公司 | Pottery packaging structure piece formula solid tantalum capacitor |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108550463A (en) * | 2018-05-23 | 2018-09-18 | 苏州宏泉高压电容器有限公司 | A kind of high voltage ceramic capacitor insulation suit shell |
| CN111599689A (en) * | 2020-05-27 | 2020-08-28 | 上海芯波电子科技有限公司 | Double-sided cavity digging ceramic packaging process based on WB chip |
| CN112349656A (en) * | 2020-09-28 | 2021-02-09 | 中国电子科技集团公司第二十九研究所 | System-in-package structure and manufacturing method thereof |
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Address after: 412011 Zhuzhou, Jiangsu Province, South China Road, East District, No. 1297 Applicant after: ZHUZHOU HONGDA ELECTRONICS CO.RP., LTD. Address before: 412011 Zhuzhou, Jiangsu Province, South China Road, East District, No. 1297 Applicant before: Zhuzhou Hongda Electronics Co., Ltd. |
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Application publication date: 20151209 |