CN202633053U

CN202633053U - Multi-core-set ceramic capacitor

Info

Publication number: CN202633053U
Application number: CN 201220161099
Authority: CN
Inventors: 雷财万
Original assignee: FUJIAN TORCH ELECTRON TECHNOLOGY Co Ltd
Current assignee: FUJIAN TORCH ELECTRON TECHNOLOGY Co Ltd
Priority date: 2012-04-17
Filing date: 2012-04-17
Publication date: 2012-12-26
Anticipated expiration: 2022-04-17

Abstract

The utility model relates to a multi-core-set ceramic capacitor, comprising ceramic capacitance chips, an insulation packaging and pins which are welded with the ceramic capacitance chips, wherein the ceramic capacitance chips and the pins are packaged through seal moulding by the insulation packaging; the pin portion is exposed outside the insulation packaging. The multi-core-set ceramic capacitor is characterized in that through holes are formed on the pins; and parts of the through holes are arranged in the insulation packaging, and parts of the through holes are exposed outside the insulation packaging. The multi-core-set ceramic capacitor overcomes the problems that the existing pins are difficult in bending and are easy to be broken off and the capacitor has poor tightness; as the pins are provided with through holes, thus being able to adjust the toughness of the pins according to the size of the opening so as to make the pins be easy to be bended and difficult to be broken off; when the resin integrates the upper and lower layers of insulation packaging into one body through the through holes on the pins during the packaging process, thus guaranteeing the tightness of the capacitor; and the through holes on the pins not only save the materials of the pins, but also can provide reference for process positioning during the production process.

Description

A kind of multicore group ceramic capacitor

Technical field

The utility model relates to field of electrical components, particularly a kind of multicore group ceramic capacitor.

Background technology

Existing ceramic capacitor adopts disk type or SMD sandwich construction usually, and disk type ceramic capacitor is a traditional structure, two elongated pins of welding on ceramic chip, surface coverage one deck insulation-encapsulated.SMD multilayer ceramic capacitor is superimposed as sheet by ceramic membrane; Two ends cover external electrode; He can satisfy the needs of surface mount production technology and process the capacitor of small size, but its process equipment and technology are wanted a lot complicated than the traditional round sheet-type capacitor and cost is high.For solving this type of problem; Chinese patent number is 200420071927.6 to disclose a kind of chip ac ceramic capacitor, comprises silver-colored ceramics, seals and two lead-out wires, is welded with lead-out wire on the tow sides of silver-colored ceramics respectively; Encapsulated layer is wrapped in silver-colored ceramics and is welded on AC capacitor by the lead-out wire on the silver-colored ceramics; It is characterized in that: outside lead-out wire part body is exposed to and seals, be exposed to the outer lead-out wire of encapsulated layer and be flat, and along the encapsulated layer outer surface bending.

There are 2 problems in above-mentioned capacitor, and the one, pin is normally processed by metal material, is not easy bending or alternating bending fractures easily if material hardness is improper, all can influence the useful life of capacitor; The 2nd, by the pin that passes in the insulation-encapsulated insulation-encapsulated is separated into upper and lower two parts, insulation-encapsulated can not be fitted fully, influence the sealing of capacitor.

The utility model content

In order to address the above problem, the utility model provides a kind of multicore group ceramic capacitor.

The multicore group ceramic capacitor that the utility model provides; Comprise ceramic chip capacitor, insulation-encapsulated and the pin that welds with ceramic chip capacitor; Said ceramic chip capacitor and pin are insulated potting mold pressing encapsulation; Pin partly is exposed to outside the insulation-encapsulated, it is characterized in that: on pin, have part and be positioned at insulation-encapsulated, part is exposed to the outer through hole of insulation-encapsulated.

Further, said ceramic chip capacitor has two at least, and two ceramic chip capacitors are through the metal lead wire frame parallel connection or the composition that is connected in series, and said metal lead wire frame and pin are one-body molded.

Further, said metal lead wire frame and pin adopt flat iron nickel material to process.

Further, the through hole on the said pin is a square opening.

Further, said insulation-encapsulated is the epoxy resins insulation encapsulated layer.

Further, be provided with the resilient coating of one deck silicone, bonder or red glue between said ceramic chip capacitor and the insulating sealed layer.

The utlity model has following beneficial effect:

According to the multicore group ceramic capacitor that the utility model provides, it has overcome existing pin and has been not easy bending, fractures and the problem of capacitor sealing difference easily.The place is provided with through hole at pin, and the one, the toughness of size adjustment pin that can be through opening makes its crooked easily and frangible not; The 2nd, resin is combined into one upper and lower two-layer insulation-encapsulated through the through hole on the pin closely when encapsulation, has guaranteed the sealing of capacitor; The 3rd, the material that the through hole of on pin, offering not only can have been saved pin can also provide reference for the location of the technology in the production process.

Description of drawings

Below in conjunction with accompanying drawing the utility model is done further detailed explanation.

Fig. 1 is the sketch map of present embodiment multicore group ceramic capacitor.

Sketch map when Fig. 2 is not encapsulating fully of present embodiment multicore group ceramic capacitor.

Fig. 3 is the metal lead wire frame that is used for fixing chip of present embodiment multicore group ceramic capacitor.

Embodiment

In order better to understand the technical scheme of the utility model, describe the embodiment that the utility model provides in detail below in conjunction with accompanying drawing.

With reference to Fig. 1, Fig. 2, shown in, a kind of multicore group ceramic capacitor comprises ceramic chip capacitor 1, insulation-encapsulated 2, metal lead wire frame 3 and resilient coating 4.The ceramic chip capacitor 1 of this ceramic capacitor has 12, is stacked as two-layerly, and every layer of triplex row two row laterally arrange, and two external electrodes of these 12 ceramic chip capacitors 1 are welded on respectively on the metal lead wire frame 3.

With reference to Fig. 2, shown in Figure 3; This metal lead wire frame 3 comprises first metal lead wire frame 31 and second metal lead wire frame 32; First metal lead wire frame 31 and second metal lead wire frame 32 adopt flat iron nickel material to process with pin 33, on the junction of metal lead wire frame frame and pin 33, have a square through hole 34.Insulation-encapsulated 2 is processed by epoxide resin material.When making capacitor, the metal lead wire frame 3 that is welded with ceramic chip capacitor 1 is by epoxy sealing mold pressing encapsulation, and resin links into an integrated entity upper and lower two-layer insulation-encapsulated 2 through square through hole 34.Between ceramic chip 1 and insulation-encapsulated 2, be provided with the resilient coating 4 that one deck is processed by silicone, bonder or red glue.

The above; Be merely the utility model preferred embodiment; So can not limit the scope that the utility model is implemented with this, the equivalence of promptly doing according to the utility model claim and description changes and modifies, and all should still belong in the scope that the utility model patent contains.

Claims

1. multicore group ceramic capacitor; Comprise ceramic chip capacitor, insulation-encapsulated and the pin that welds with ceramic chip capacitor; Said ceramic chip capacitor and pin are insulated potting mold pressing encapsulation; Pin partly is exposed to outside the insulation-encapsulated, it is characterized in that: on pin, have part and be positioned at insulation-encapsulated, part is exposed to the outer through hole of insulation-encapsulated.

2. multicore group ceramic capacitor according to claim 1 is characterized in that: said ceramic chip capacitor has two at least, and two ceramic chip capacitors are through the metal lead wire frame parallel connection or the composition that is connected in series, and said metal lead wire frame and pin are one-body molded.

3. multicore group ceramic capacitor according to claim 2 is characterized in that: said metal lead wire frame and pin adopt flat iron nickel material to process.

4. multicore group ceramic capacitor according to claim 1 is characterized in that: the through hole on the said pin is a square opening.

5. multicore group ceramic capacitor according to claim 1 is characterized in that: said insulation-encapsulated is the epoxy resins insulation encapsulated layer.

6. multicore group ceramic capacitor according to claim 1 is characterized in that: the resilient coating that is provided with one deck silicone, bonder or red glue between said ceramic chip capacitor and the insulating sealed layer.