CN105097288A - Metallic packaging structurized chip-type tantalum capacitor and packaging method thereof - Google Patents
Metallic packaging structurized chip-type tantalum capacitor and packaging method thereof Download PDFInfo
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- CN105097288A CN105097288A CN201510619622.7A CN201510619622A CN105097288A CN 105097288 A CN105097288 A CN 105097288A CN 201510619622 A CN201510619622 A CN 201510619622A CN 105097288 A CN105097288 A CN 105097288A
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Abstract
The invention relates to a metallic packaging structurized chip-type tantalum capacitor and a packaging method thereof. With the adoption of a metallic packaging structure, a layer of bonding conductive glue wraps outside a tantalum chip, and then a layer of metal shell wraps outside the bonding conductive glue; and meanwhile, one head of the tantalum chip is connected with a tantalum filament, and the tantalum filament is led out of the metal shell through a tantalum filament leading-out line to form the metallic packaging structurized chip-type tantalum capacitor. The tantalum filament and the tantalum filament leading-out line are connected together by welding, a welding point of the tantalum filament and the tantalum filament leading-out line is arranged on the inner surface of the metal shell, an insulation block sleeves outside the welding point of the tantalum filament and the tantalum filament leading-out line, the bonding conductive glue wraps between the insulation block and the tantalum chip and also wraps outside the insulation block, and thus, the spaces among the tantalum chip, the tantalum filament, the tantalum filament leading-out line and the shell are relatively fixed.
Description
Technical field
The present invention relates to a kind of electronic devices and components and preparation method thereof, be specifically related to a kind of metallic packaging structural sheet type tantalum capacitor and preparation method thereof, to solve resin-encapsulated products air tightness problem, improve its reliability, keep chip appearance design to be easy to the characteristic of installing and using simultaneously.Belong to electronic devices and components manufacture technology field.
background technology:
Chip solid tantalum capacitors is a kind of polar component, in microelectronic circuit, utilize the unilateral conduction of its dielectric layer can be used for filtering, AC ripple target signal filter remaining in direct current signal or make its wave amplitude diminish, the feature of chip solid tantalum capacitors is that the life-span is long, high temperature resistant, accuracy is high, filter high-frequency harmonic performance is fabulous, and various informative, and volume efficiency is excellent, have the feature of its uniqueness, its range of application is more and more wider.
The resin-encapsulated mode that current chip solid tantalum capacitors mainly adopts, is applicable to the industrial production of cost degradation, extensive automation, is widely used at territories such as household electrical appliances, communication, medical treatment, computer, automobiles.But resin-encapsulated is non-airtight structure, easily invade by moisture or corrosivity gas-liquid under the environment that high temperature, high humidity etc. are harsh and destroy device inside conducting circuit and fuse, cause properties of product to worsen even to lose efficacy, also limit it under the complex environment such as space flight, oil field and the use of high reliability request.Still adopt traditional axis or longitudinal cylindrical metal shell encapsulating products in the occasion of these complex environments and high reliability request at present, but being just not easy to like this install fixes.Therefore be necessary to be improved further.
Do not find that there is the patent literature constructed with the present invention by retrieval, to have the patent of certain relation and paper to mainly contain following with the present invention:
1, the patent No. is CN201520172749, and the utility model patent that name is called " the silver-colored shell of a kind of solid tantalum capacitor ", which discloses the silver-colored shell of a kind of solid tantalum capacitor, and it includes a straight barrel type silver shell and a negative wire; Silver shell is straight tube hat-shaped structure, and its front end has silver-colored faucal, end seal; The end bottom centre of described silver-colored shell is provided with protruding zone center, and zone center is provided with annular ring, and described silver-colored faucal place is provided with embedded step; Described zone center place is welded with negative wire by solder.
2, the patent No. is CN201520171878, name is called " a kind of solid tantalum capacitor copper shell " utility model patent, and which disclose a kind of solid tantalum capacitor copper shell, it includes a straight barrel type copper shell and a negative wire; Copper shell is straight tube hat-shaped structure, and its front end has copper faucal, end seal and center is provided with centre bore; Described copper faucal place is provided with embedded step; Described central hole is provided with negative wire.
3, " organic chip solid tantalum electrolytic capacitor Study on Preparation " author: Ge Meng, Xu Jianhua, Yang Yajie, Jiang Yadong and Chen Guanghua, " material Leader " 12 phases in 2009, this paper studies preparation technology of conducting polymer PEDT as organic chip solid tantalum electrolytic capacitor of cathode material, effectively improves the performance of organic chip solid tantalum capacitors by parameter such as adjustment isolated material, dopant etc.The primary study impact of the parameter such as barrier, dopant content on performances such as organic chip solid tantalum capacitors electric capacity, equivalent series resistance, leakage currents.Result shows, when isolated material volume fraction is 0.5% ~ 1.5%, film has good withstand voltage properties, and the leakage current of capacitor is less (5 μ A); When dopant mass fraction is 1.5% ~ 2%, dopant effectively can enter PEDT main chain and adulterate, and the conductivity of PEDT film is higher, thus makes capacitor obtain lower equivalent series resistance.
Although these patents above-mentioned or paper all relate to solid tantalum capacitor and preparation method thereof, it is also proposed the improvement that some are structural, but all fundamentally do not change existing solid tantalum capacitor resin-encapsulated mode, all still, there is foregoing deficiency, especially easily invade by moisture or corrosivity gas-liquid under the environment that high temperature, high humidity etc. are harsh and destroy device inside conducting circuit and fuse, cause properties of product to worsen the problem even lost efficacy not solve very well, therefore still need to be improved further.
Summary of the invention
The object of the invention is to for the deficiency existing for existing chip solid tantalum capacitors resin-encapsulated mode, a kind of new chip solid tantalum capacitors and preparation method thereof is proposed, this chip solid tantalum capacitors and preparation method thereof effectively can solve chip solid tantalum capacitors and easily invade destruction device inside conducting circuit and fuse by moisture or corrosivity gas-liquid under the environment that high temperature, high humidity etc. are harsh, causes properties of product to worsen the problem even lost efficacy.
In order to reach this purpose, the invention provides a kind of metallic packaging structural sheet type tantalum capacitor, adopting metallic packaging structure, at tantalum chip outer wrapping one deck bonding conducting resinl, then at bonding conducting resinl outer wrapping layer of metal shell; Meanwhile, one at tantalum chip is connected with tantalum wire, and tantalum wire is drawn out to outside metal shell by tantalum wire lead-out wire again, forms metallic packaging structural sheet type tantalum capacitor.
Further, described tantalum wire and tantalum wire lead-out wire are by being welded to connect, and the pad of tantalum wire and tantalum wire lead-out wire is positioned at the inner face of metal shell, collets are had at the pad overcoat of tantalum wire and tantalum wire lead-out wire, between collets and tantalum chip, and collets outside is also all enclosed with bonding conducting resinl, make tantalum chip and tantalum wire and tantalum wire lead-out wire, and space between shell is relatively fixing.
Further, described collets and have annular space between tantalum wire and tantalum wire lead-out wire, improve insulation property further, prevent tantalum wire, tantalum wire lead-out wire and pad to be collided contact simultaneously.
Further, described metal shell comprises a cylindrical shell and a cover plate, and tantalum wire lead-out wire passes from the fairlead of cover plate, between the fairlead and tantalum wire lead-out wire of cover plate by glass insulator with can carry out seal and insulate by valve pipe.
Further, the cylindrical shell of described metal shell and cover plate link position adopt ladder syndeton, and cover plate is covered and encapsulated by welding after cylindrical shell, and ladder syndeton is easy to securing cover plate position, ensure welded seal.
Further, the positive pole pin of " L " shape and the negative pole pin of " L " shape is connected to outside the cylindrical shell of described metal shell and cover plate; Wherein, the positive pole pin of " L " shape is connected to the tantalum wire lead-out wire that stretches out from cover plate, and the negative pole pin of " L " shape is connected to the bottom of the cylindrical shell of metal shell, and two tiptoe arranged opposite of positive pole pin and negative pole pin, convenient with outside connection.
Further, the tantalum wire lead-out wire between described positive pole pin and cover plate also overlaps the insulating trip having " L " shape, the top of the flanging of insulating trip " L " shape extend between negative pole pin and the cylindrical shell of metal shell, prevents both positive and negative polarity short circuit.
A kind of method for packing of metallic packaging structural sheet type tantalum capacitor, bonding conducting resinl is adopted by tantalum chip to wrap up, and reserve tantalum wire and tantalum wire lead-out wire welds at head, again the tantalum chip of parcel bonding conducting resinl is positioned in the cylindrical shell of a metal shell, is encapsulated by metal cover board;
Further, described tantalum wire and tantalum wire lead-out wire position overcoat have collets, collets and leave gap between tantalum wire and tantalum wire lead-out wire, prevent making contact; And the cylindrical shell of metal shell and cover plate link position adopt ladder syndeton, cover plate is covered and is encapsulated by welding after cylindrical shell, and ladder syndeton is easy to securing cover plate position, ensures welded seal.
Further, the cylindrical shell of described metal shell has the positive pole pin of " L " shape and the negative pole pin of " L " shape; Wherein, the positive pole pin of " L " shape is connected to the tantalum wire lead-out wire that stretches out from cover plate, and the negative pole pin of " L " shape is connected to the bottom of the cylindrical shell of metal shell, and two tiptoe arranged opposite of positive pole pin and negative pole pin, convenient with outside connection.
Further, the tantalum wire lead-out wire between described positive pole pin and cover plate also overlaps the insulating trip having " L " shape, the top of the flanging of insulating trip " L " shape extend between negative pole pin and the cylindrical shell of metal shell, prevents both positive and negative polarity short circuit.
The invention has the advantages that:
1) pellet anode tantalum wire is drawn welding one and is newly drawn metal wire, and it is easy to welding welding;
2) space between pellet and shell increases collets fixed product and prevents making contact;
3) through hole of cover plate of outer casing adopts glass insulator and can design by valve pipe, with casing insulation;
4) shell and cover plate link position adopt stepped design, and ladder syndeton is easy to securing cover plate position, ensure welded seal;
5) be socketed one piece of insulating trip between positive pole pin and shell, prevent both positive and negative polarity short circuit;
6) cathode metal lead-out wire with can valve pipe in the melting welding of metal pins position.
Accompanying drawing explanation
Fig. 1 is general structure principle schematic of the present invention.
Embodiment
The present invention is set forth further below in conjunction with the drawings and specific embodiments.
Embodiment one
Can be found out by accompanying drawing 1, the present invention relates to a kind of metallic packaging structural sheet type tantalum capacitor, adopt metallic packaging structure, at tantalum chip 2 outer wrapping one deck bonding conducting resinl 1, then at bonding conducting resinl 1 outer wrapping layer of metal shell 11; Meanwhile, one at tantalum chip 2 is connected with tantalum wire 3, and tantalum wire 3 is drawn out to outside metal shell 11 by tantalum wire lead-out wire 5 again, forms metallic packaging structural sheet type tantalum capacitor.
Described tantalum wire 3 and tantalum wire lead-out wire 5 are by being welded to connect, and tantalum wire 3 is positioned at the inner face of metal shell 11 with the pad 4 of tantalum wire lead-out wire 5, collets 12 are had at tantalum wire 3 and pad 4 overcoat of tantalum wire lead-out wire 5, between collets 12 and tantalum chip 2, and collets 12 outside is also all enclosed with bonding conducting resinl, make tantalum chip 2 and tantalum wire 3 and tantalum wire lead-out wire 5, and space between shell 11 is relatively fixing.
Described collets 12 and have annular space between tantalum wire 3 and tantalum wire lead-out wire 5, improve insulation property further, prevent tantalum wire 3, tantalum wire lead-out wire 5 and pad 4 to be collided contact simultaneously.
Described metal shell 11 comprises a cylindrical shell 15 and a cover plate 9, tantalum wire lead-out wire 5 passes from the fairlead of cover plate 9, can carrying out sealing and insulate by valve pipe 7 of making of valve material by glass insulator 6 and metal between the fairlead and tantalum wire lead-out wire 5 of cover plate 9.
The cylindrical shell 15 of described metal shell 11 and cover plate 9 link position adopt ladder syndeton, and cover plate is covered and encapsulated by welding after cylindrical shell, and ladder syndeton is easy to securing cover plate position, ensure welded seal.
Embodiment two
Embodiment two is substantially the same with the structure of embodiment one, is connected to the positive pole pin 13 of " L " shape and the negative pole pin 14 of " L " shape outside the cylindrical shell of just described metal shell and cover plate; Wherein, the positive pole pin 13 of " L " shape is connected to the tantalum wire lead-out wire that stretches out from cover plate, and the negative pole pin 14 of " L " shape is connected to the bottom of the cylindrical shell of metal shell, and two tiptoe arranged opposite of positive pole pin and negative pole pin, convenient with outside connection.
Embodiment three
Embodiment three is substantially the same with the structure of embodiment two, tantalum wire lead-out wire between just described positive pole pin and cover plate also overlaps the insulating trip 10 having " L " shape, the top of the flanging of insulating trip 10 " L " shape extend between negative pole pin and the cylindrical shell of metal shell, prevents both positive and negative polarity short circuit.
Above-mentioned listed embodiment, just carries out clear, complete description to technical scheme of the present invention by reference to the accompanying drawings; Obviously, described embodiment is only a part of embodiment of the present invention, instead of whole embodiments.Based on the embodiment in the present invention, those of ordinary skill in the art, not making other embodiments all obtained under creative work prerequisite, belong to the scope of protection of the invention.
Can be found out by above-described embodiment, the invention still further relates to a kind of method for packing of metallic packaging structural sheet type tantalum capacitor, bonding conducting resinl is adopted by tantalum chip to wrap up, and reserve tantalum wire and tantalum wire lead-out wire welds at head, again the tantalum chip of parcel bonding conducting resinl is positioned in the cylindrical shell of a metal shell, is encapsulated by metal cover board;
Further, described tantalum wire and tantalum wire lead-out wire position overcoat have collets, collets and leave gap between tantalum wire and tantalum wire lead-out wire, prevent making contact; And the cylindrical shell of metal shell and cover plate link position adopt ladder syndeton, cover plate is covered and is encapsulated by welding after cylindrical shell, and ladder syndeton is easy to securing cover plate position, ensures welded seal.
Further, the cylindrical shell of described metal shell has the positive pole pin of " L " shape and the negative pole pin of " L " shape; Wherein, the positive pole pin of " L " shape is connected to the tantalum wire lead-out wire that stretches out from cover plate, and the negative pole pin of " L " shape is connected to the bottom of the cylindrical shell of metal shell, and two tiptoe arranged opposite of positive pole pin and negative pole pin, convenient with outside connection.
Further, the tantalum wire lead-out wire between described positive pole pin and cover plate also overlaps the insulating trip having " L " shape, the top of the flanging of insulating trip " L " shape extend between negative pole pin and the cylindrical shell of metal shell, prevents both positive and negative polarity short circuit.
The invention has the advantages that:
1) pellet anode tantalum wire is drawn welding one and is newly drawn metal wire, and it is easy to welding welding;
2) space between pellet and shell increases collets fixed product and prevents making contact;
3) through hole of cover plate of outer casing adopts glass insulator and can design by valve pipe, with casing insulation;
4) shell and cover plate link position adopt stepped design, and ladder syndeton is easy to securing cover plate position, ensure welded seal;
5) be socketed one piece of insulating trip between positive pole pin and shell, prevent both positive and negative polarity short circuit;
Cathode metal lead-out wire with can valve pipe in the melting welding of metal pins position.
Claims (10)
1. a metallic packaging structural sheet type tantalum capacitor, adopts metallic packaging structure, it is characterized in that: at tantalum chip outer wrapping one deck bonding conducting resinl, then at bonding conducting resinl outer wrapping layer of metal shell; Meanwhile, one at tantalum chip is connected with tantalum wire, and tantalum wire is drawn out to outside metal shell by tantalum wire lead-out wire again, forms metallic packaging structural sheet type tantalum capacitor.
2. metallic packaging structural sheet type tantalum capacitor as claimed in claim 1, it is characterized in that: described tantalum wire and tantalum wire lead-out wire are by being welded to connect, and the pad of tantalum wire and tantalum wire lead-out wire is positioned at the inner face of metal shell, collets are had at the pad overcoat of tantalum wire and tantalum wire lead-out wire, between collets and tantalum chip, and collets outside is also all enclosed with bonding conducting resinl, make tantalum chip and tantalum wire and tantalum wire lead-out wire, and space between shell is relatively fixing.
3. metallic packaging structural sheet type tantalum capacitor as claimed in claim 2, it is characterized in that: described collets and have annular space between tantalum wire and tantalum wire lead-out wire, further raising insulation property, prevent tantalum wire, tantalum wire lead-out wire and pad to be collided contact simultaneously.
4. metallic packaging structural sheet type tantalum capacitor as claimed in claim 3, it is characterized in that: described metal shell comprises a cylindrical shell and a cover plate, tantalum wire lead-out wire passes from the fairlead of cover plate, between the fairlead and tantalum wire lead-out wire of cover plate by glass insulator with can carry out seal and insulate by valve pipe.
5. metallic packaging structural sheet type tantalum capacitor as claimed in claim 4, it is characterized in that: the cylindrical shell of described metal shell and cover plate link position adopt ladder syndeton, cover plate is covered and is encapsulated by welding after cylindrical shell, ladder syndeton is easy to securing cover plate position, ensures welded seal.
6. metallic packaging structural sheet type tantalum capacitor as claimed in claim 1, is characterized in that: be connected to the positive pole pin of " L " shape and the negative pole pin of " L " shape outside the cylindrical shell of described metal shell and cover plate; Wherein, the positive pole pin of " L " shape is connected to the tantalum wire lead-out wire that stretches out from cover plate, and the negative pole pin of " L " shape is connected to the bottom of the cylindrical shell of metal shell, and two tiptoe arranged opposite of positive pole pin and negative pole pin, convenient with outside connection; Tantalum wire lead-out wire between described positive pole pin and cover plate also overlaps the insulating trip having " L " shape, the top of the flanging of insulating trip " L " shape extend between negative pole pin and the cylindrical shell of metal shell, prevents both positive and negative polarity short circuit.
7. the method for packing of a metallic packaging structural sheet type tantalum capacitor, it is characterized in that: adopted by tantalum chip bonding conducting resinl to wrap up, and reserve tantalum wire and tantalum wire lead-out wire welds at head, again the tantalum chip of parcel bonding conducting resinl is positioned in the cylindrical shell of a metal shell, is encapsulated by metal cover board.
8. the method for packing of metallic packaging structural sheet type tantalum capacitor as claimed in claim 7, is characterized in that: described tantalum wire and tantalum wire lead-out wire position overcoat have collets, collets and leave gap between tantalum wire and tantalum wire lead-out wire, prevents making contact; And the cylindrical shell of metal shell and cover plate link position adopt ladder syndeton, cover plate is covered and is encapsulated by welding after cylindrical shell, and ladder syndeton is easy to securing cover plate position, ensures welded seal.
9. the method for packing of metallic packaging structural sheet type tantalum capacitor as claimed in claim 8, is characterized in that: the cylindrical shell of described metal shell has the positive pole pin of " L " shape and the negative pole pin of " L " shape; Wherein, the positive pole pin of " L " shape is connected to the tantalum wire lead-out wire that stretches out from cover plate, and the negative pole pin of " L " shape is connected to the bottom of the cylindrical shell of metal shell, and two tiptoe arranged opposite of positive pole pin and negative pole pin, convenient with outside connection.
10. the method for packing of metallic packaging structural sheet type tantalum capacitor as claimed in claim 9, it is characterized in that: the tantalum wire lead-out wire between described positive pole pin and cover plate also overlaps the insulating trip having " L " shape, the top of the flanging of insulating trip " L " shape extend between negative pole pin and the cylindrical shell of metal shell, prevents both positive and negative polarity short circuit.
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| CN107481857A (en) * | 2017-08-18 | 2017-12-15 | 欧阳凤 | A kind of tantalum electric capacity |
| CN113725007A (en) * | 2020-05-26 | 2021-11-30 | 至美电器股份有限公司 | Electrolytic capacitor |
| JP2021535602A (en) * | 2018-08-28 | 2021-12-16 | ヴィシャイ イスラエル リミテッド | Airtight seal type surface mount polymer capacitor |
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Address after: 412011 Zhuzhou, Jiangsu Province, South China Road, East District, No. 1297 Applicant after: ZHUZHOU HONGDA ELECTRONICS CO.RP., LTD. Address before: 412011 Zhuzhou, Jiangsu Province, South China Road, East District, No. 1297 Applicant before: Zhuzhou Hongda Electronics Co., Ltd. |
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