CN105097288B - A kind of Metal Packaging structural sheet type tantalum capacitor and its packaging method - Google Patents
A kind of Metal Packaging structural sheet type tantalum capacitor and its packaging method Download PDFInfo
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- CN105097288B CN105097288B CN201510619622.7A CN201510619622A CN105097288B CN 105097288 B CN105097288 B CN 105097288B CN 201510619622 A CN201510619622 A CN 201510619622A CN 105097288 B CN105097288 B CN 105097288B
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Abstract
A kind of Metal Packaging structural sheet type tantalum capacitor and its packaging method using Metal Packaging structure, in one layer of cohesive conducting resinl of tantalum chip outer wrapping, then are bonding one layer of metal shell of conducting resinl outer wrapping；Meanwhile one in tantalum chip is connected with tantalum wire, tantalum wire is drawn out to further through tantalum wire lead-out wire outside metal shell, forms Metal Packaging structural sheet type tantalum capacitor.The tantalum wire is with tantalum wire lead-out wire by being welded to connect, and the pad of tantalum wire and tantalum wire lead-out wire is located at the inner face of metal shell, collets are cased with outside the pad of tantalum wire and tantalum wire lead-out wire, between collets and tantalum chip, and cohesive conducting resinl is also all enclosed with outside collets, so that the space between tantalum chip and tantalum wire and tantalum wire lead-out wire and shell is relatively fixed.
Description
Technical field
The present invention relates to a kind of electronic components and preparation method thereof, and in particular to a kind of Metal Packaging structural sheet type tantalum
Capacitor and preparation method thereof to solve the problems, such as resin-encapsulated products air tightness, improves its reliability, while keeps chip appearance
Design the characteristic for being easily installed and using.Belong to electronic component manufacture technology field.
Background technology：
Chip solid tantalum capacitors are a kind of polar components, and in microelectronic circuit, unidirectional using its dielectric layer is led
It can electrically be used for filtering, AC ripple target signal filter remaining in direct current signal or its wave amplitude be made to become smaller, chip-type solid tantalum
The characteristics of capacitor is long lifespan, high temperature resistant, accuracy is high, filter high-frequency harmonic performance is fabulous and various informative, volume efficiency
It is excellent, there is its unique feature, application range is more and more wider.
The resin-encapsulated mode that chip solid tantalum capacitors mainly use at present, suitable for cost effective, extensive automatic
The industrial production of change is widely used in territories such as household electrical appliances, communication, medical treatment, computer, automobiles.But resin-encapsulated is non-
Air tight structure is easily destroyed device inside under the harsh environment such as high temperature, high humidity by moisture or the intrusion of corrosivity gas-liquid
Circuit and fuse is connected, properties of product is caused to deteriorate and are even failed, also limit its under the complex environments such as space flight, oil field and
The use of high reliability request.It still using traditional axial direction or is indulged in the occasion of these complex environments and high reliability request at present
To cylindrical metal shell encapsulating products, but thus it is not easy to installation and fixes.It is therefore desirable to further be improved.
By retrieval do not find to have with the patent literature of same technique of the present invention, have the special of certain relationship with of the invention
Profit and paper mainly have following：
1st, Patent No. CN201520172749, the utility model of entitled " a kind of silver-colored shell of solid tantalum capacitor "
Patent, which disclose a kind of silver-colored shells of solid tantalum capacitor, it includes a straight barrel type silver shell and a cathode draws
Line；Silver-colored shell is straight tube hat-shaped structure, and front end is provided with silver-colored faucal, end seal；The end bottom centre of the silver shell is provided with
The zone center of protrusion is provided with annular ring around zone center, embedded step is equipped at the silver faucal；Lead at the zone center
It crosses solder and is welded with negative wire.
2nd, Patent No. CN201520171878, entitled " a kind of solid tantalum capacitor copper shell " utility model are special
Profit, which disclose a kind of solid tantalum capacitor copper shells, it includes a straight barrel type copper shell and a negative wire；
Copper shell is straight tube hat-shaped structure, and front end is provided with copper faucal, end seal and is provided centrally with centre bore；It is set at the copper faucal
There is embedded step；The central hole is equipped with negative wire.
3、《Organic chip solid tantalum electrolytic capacitor Study on Preparation》Author：Ge Meng, Xu Jianhua, Yang Yajie, Jiang Ya
East and Chen Guanghua,《Material Leader》12 phases in 2009, paper studies conducting polymer PEDT is as the organic of cathode material
The preparation process of chip-type solid tantalum electrolytic capacitor effectively improves biochip by adjusting parameters such as isolated material, dopants
The performance of formula solid tantalum capacitor.The parameters such as primary study barrier, dopant content are to organic chip solid tantalum capacitors
The influence of the performances such as capacitance, equivalent series resistance, leakage current.The result shows that when isolated material volume fraction is 0.5%~1.5%
When, film has preferable pressure-resistant performance, and the leakage current of capacitor is smaller (5 μ A);When dopant mass fraction is 1.5%~2%
When, dopant can effectively enter PEDT main chains and be doped, and the conductivity of PEDT films is higher, so as to obtain capacitor
Relatively low equivalent series resistance.
Although these above-mentioned patents or paper be directed to solid tantalum capacitor and preparation method thereof, it was also proposed that some knots
The improvement of structure, but all do not change existing solid tantalum capacitor resin-encapsulated mode fundamentally, all still there are fronts
The deficiency is easily invaded destructor especially under the harsh environment such as high temperature, high humidity by moisture or corrosivity gas-liquid
Conducting circuit and fuse inside part cause properties of product to deteriorate the problem of even failing and do not solve very well, therefore still need
Further improved.
Invention content
It is an object of the invention to the deficiencies present in for existing chip solid tantalum capacitors resin-encapsulated mode, propose
A kind of new chip solid tantalum capacitors and preparation method thereof, the chip solid tantalum capacitors and preparation method thereof can be solved effectively
Certainly chip solid tantalum capacitors are easily invaded destructor under the harsh environment such as high temperature, high humidity by moisture or corrosivity gas-liquid
Conducting circuit and fuse inside part, cause properties of product to deteriorate the problem of even failing.
In order to reach this purpose, the present invention provides a kind of Metal Packaging structural sheet type tantalum capacitors, are sealed using metal
Assembling structure in one layer of cohesive conducting resinl of tantalum chip outer wrapping, then is bonding one layer of metal shell of conducting resinl outer wrapping；Meanwhile
One of tantalum chip is connected with tantalum wire, and tantalum wire is drawn out to further through tantalum wire lead-out wire outside metal shell, forms Metal Packaging structure
Chip tantalum capacitor.
Further, the tantalum wire and tantalum wire lead-out wire are by being welded to connect, and tantalum wire is drawn with tantalum wire
The pad of line is located at the inner face of metal shell, is cased with collets outside the pad of tantalum wire and tantalum wire lead-out wire, collets with
Also cohesive conducting resinl is all enclosed between tantalum chip and outside collets so that tantalum chip and tantalum wire and tantalum wire lead-out wire, with
And the space between shell is relatively fixed.
Further, there is annular space between the collets and tantalum wire and tantalum wire lead-out wire, further improves absolutely
Edge performance, while tantalum wire, tantalum wire lead-out wire and pad is prevented to be collided contact.
Further, the metal shell includes a cylinder and a cover board, and tantalum wire lead-out wire is from the lead of cover board
Hole is pierced by, between the fairlead of cover board and tantalum wire lead-out wire by glass insulator with can valve pipe be sealed and insulate.
Further, using ladder connection structure, cover plate lid exists for the cylinder of the metal shell and cover board link position
It is packaged after cylinder by welding, ladder connection structure is easy to fixed cap locations, ensures welded seal.
Further, the anode pin of " L " shape and " L " shape are connected separately with outside the cylinder of the metal shell and cover board
Negative pin；Wherein, the anode pin of " L " shape is connected to from the tantalum wire lead-out wire that cover board stretches out, the negative pin of " L " shape
The bottom of the cylinder of metal shell, and two tiptoe arranged opposites of anode pin and negative pin are connected to, it is convenient and outside
Connection.
Further, also there are one the insulation of " L " shape for set on the tantalum wire lead-out wire between the anode pin and cover board
Piece, the top of the flanging of insulating trip " L " shape are extend between negative pin and the cylinder of metal shell, prevent positive and negative anodes short circuit.
A kind of packaging method of Metal Packaging structural sheet type tantalum capacitor wraps up tantalum chip using conducting resinl is bonded
Come, and reserve tantalum wire on head and welded with tantalum wire lead-out wire, then the tantalum chip for wrapping up bonding conducting resinl is positioned over one
In the cylinder of metal shell, it is packaged by metal cover board；
Further, collets are cased with outside the tantalum wire and tantalum wire lead-out wire position, collets draw with tantalum wire and tantalum wire
There are gaps between outlet, prevent making contact；And the cylinder and cover board link position of metal shell use ladder connection structure,
Cover plate lid is packaged after cylinder by welding, and ladder connection structure is easy to fixed cap locations, ensures welded seal.
Further, the cylinder of the metal shell has the anode pin of " L " shape and the negative pin of " L " shape；Wherein,
The anode pin of " L " shape is connected to from the tantalum wire lead-out wire that cover board stretches out, and the negative pin of " L " shape is connected to metal shell
The bottom of cylinder, and two tiptoe arranged opposites of anode pin and negative pin, the convenient connection with outside.
Further, also there are one the insulation of " L " shape for set on the tantalum wire lead-out wire between the anode pin and cover board
Piece, the top of the flanging of insulating trip " L " shape are extend between negative pin and the cylinder of metal shell, prevent positive and negative anodes short circuit.
The advantage of the invention is that：
1）Pellet anode tantalum wire draws the new extraction metal wire of welding one, is easy to welding welding；
2）Space between pellet and shell increases collets and fixes product and prevent making contact；
3）The through-hole of cover plate of outer casing using glass insulator with can valve pipe design, with casing insulation；
4）For shell with cover board link position using stepped design, ladder connection structure is easy to fixed cap locations, ensures weldering
Connect leakproofness；
5）One piece of insulating trip is socketed between anode pin and shell, prevents positive and negative anodes short circuit；
6）Cathode metal lead-out wire with can valve pipe in the melting welding of metal pins position.
Description of the drawings
Fig. 1 is overall structure principle schematic of the present invention.
Specific embodiment
It is next in the following with reference to the drawings and specific embodiments that the present invention is further explained.
Embodiment one
By attached drawing 1 as can be seen that the present invention relates to a kind of Metal Packaging structural sheet type tantalum capacitor, using Metal Packaging
Structure in 2 outer wrapping of tantalum chip, one layer of cohesive conducting resinl 1, then is bonding conducting resinl 1 outer wrapping, one layer of metal shell 11；Meanwhile
One in tantalum chip 2 is connected with tantalum wire 3, and tantalum wire 3 is drawn out to further through tantalum wire lead-out wire 5 outside metal shell 11, forms metal
Encapsulating structure chip tantalum capacitor.
The tantalum wire 3 and tantalum wire lead-out wire 5 are by being welded to connect, and the weldering of tantalum wire 3 and tantalum wire lead-out wire 5
Contact 4 is located at the inner face of metal shell 11, and collets 12, collets are cased with outside the pad 4 of tantalum wire 3 and tantalum wire lead-out wire 5
Also cohesive conducting resinl is all enclosed between 12 and tantalum chip 2 and outside collets 12 so that tantalum chip 2 and tantalum wire 3 and tantalum wire
Space between lead-out wire 5 and shell 11 is relatively fixed.
There is annular space between the collets 12 and tantalum wire 3 and tantalum wire lead-out wire 5, further improves insulating properties
Can, while tantalum wire 3, tantalum wire lead-out wire 5 and pad 4 is prevented to be collided contact.
The metal shell 11 includes a cylinder 15 and a cover board 9, and tantalum wire lead-out wire 5 is from the fairlead of cover board 9
Be pierced by, between the fairlead of cover board 9 and tantalum wire lead-out wire 5 by glass insulator 6 and metal can valve material make can valve
Pipe 7 is sealed and insulate.
The cylinder 15 and 9 link position of cover board of the metal shell 11 use ladder connection structure, and cover plate lid is in cylinder
It is packaged afterwards by welding, ladder connection structure is easy to fixed cap locations, ensures welded seal.
Embodiment two
Embodiment two and the structure of embodiment one are essentially the same, only distinguish outside the cylinder of the metal shell and cover board
It is connected with the anode pin 13 of " L " shape and the negative pin 14 of " L " shape；Wherein, the anode pin 13 of " L " shape is connected to from cover board
On the tantalum wire lead-out wire of stretching, the negative pin 14 of " L " shape is connected to the bottom of the cylinder of metal shell, and anode pin and negative
Two tiptoe arranged opposites of pole pin, the convenient connection with outside.
Embodiment three
Embodiment three and the structure of embodiment two are essentially the same, and only the tantalum wire between the anode pin and cover board draws
Also for set there are one the insulating trip 10 of " L " shape, the top of the flanging of insulating trip 10 " L " shape extend into negative pin and metal in outlet
Between the cylinder of shell, positive and negative anodes short circuit is prevented.
Above-mentioned listed embodiment, only carries out technical scheme of the present invention clear, complete description with reference to attached drawing；It is aobvious
So, described embodiment is only the part of the embodiment of the present invention, instead of all the embodiments.Based in the present invention
Embodiment, all other embodiment that those of ordinary skill in the art are obtained without making creative work, all
Belong to the scope of protection of the invention.
It can be seen from above-described embodiment that the invention further relates to a kind of encapsulation of Metal Packaging structural sheet type tantalum capacitor
Method wraps up tantalum chip, and reserve tantalum wire on head and welded with tantalum wire lead-out wire using conducting resinl is bonded, then will
The tantalum chip that package bonds conducting resinl is positioned in the cylinder of a metal shell, is packaged by metal cover board；
Further, collets are cased with outside the tantalum wire and tantalum wire lead-out wire position, collets draw with tantalum wire and tantalum wire
There are gaps between outlet, prevent making contact；And the cylinder and cover board link position of metal shell use ladder connection structure,
Cover plate lid is packaged after cylinder by welding, and ladder connection structure is easy to fixed cap locations, ensures welded seal.
Further, the cylinder of the metal shell has the anode pin of " L " shape and the negative pin of " L " shape；Wherein,
The anode pin of " L " shape is connected to from the tantalum wire lead-out wire that cover board stretches out, and the negative pin of " L " shape is connected to metal shell
The bottom of cylinder, and two tiptoe arranged opposites of anode pin and negative pin, the convenient connection with outside.
Further, also there are one the insulation of " L " shape for set on the tantalum wire lead-out wire between the anode pin and cover board
Piece, the top of the flanging of insulating trip " L " shape are extend between negative pin and the cylinder of metal shell, prevent positive and negative anodes short circuit.
The advantage of the invention is that：
1）Pellet anode tantalum wire draws the new extraction metal wire of welding one, is easy to welding welding；
2）Space between pellet and shell increases collets and fixes product and prevent making contact；
3）The through-hole of cover plate of outer casing using glass insulator with can valve pipe design, with casing insulation；
4）For shell with cover board link position using stepped design, ladder connection structure is easy to fixed cap locations, ensures weldering
Connect leakproofness；
5）One piece of insulating trip is socketed between anode pin and shell, prevents positive and negative anodes short circuit；
Cathode metal lead-out wire with can valve pipe in the melting welding of metal pins position.
Claims (5)
1. a kind of Metal Packaging structural sheet type tantalum capacitor, using Metal Packaging structure, it is characterised in that：In tantalum chip outer wrapping
One layer of cohesive conducting resinl, then bonding one layer of metal shell of conducting resinl outer wrapping；Meanwhile one in tantalum chip is connected with tantalum
Silk, tantalum wire are drawn out to further through tantalum wire lead-out wire outside metal shell, form Metal Packaging structural sheet type tantalum capacitor；The tantalum
Silk is with tantalum wire lead-out wire by being welded to connect, and the pad of tantalum wire and tantalum wire lead-out wire is located at the interior of metal shell
Face is cased with collets, between collets and tantalum chip and outside collets outside the pad of tantalum wire and tantalum wire lead-out wire
All it is enclosed with cohesive conducting resinl so that the space between tantalum chip and tantalum wire and tantalum wire lead-out wire and shell is relatively fixed；Institute
Have annular space between the collets and tantalum wire and tantalum wire lead-out wire stated, further improve insulation performance, at the same prevent tantalum wire,
Tantalum wire lead-out wire and pad are collided contact；The metal shell includes a cylinder and a cover board, and tantalum wire is drawn
Line is pierced by from the fairlead of cover board, between the fairlead of cover board and tantalum wire lead-out wire by glass insulator with can valve pipe carry out
Sealing and insulation；The tantalum chip that package bonds conducting resinl is positioned in the cylinder of metal shell, is packaged by metal cover board；
The cylinder and cover board link position of the metal shell use ladder connection structure, and cover plate lid is carried out after cylinder by welding
Encapsulation, ladder connection structure are easy to fixed cap locations, ensure welded seal.
2. Metal Packaging structural sheet type tantalum capacitor as described in claim 1, it is characterised in that：The cylinder of the metal shell
The anode pin of " L " shape and the negative pin of " L " shape are connected separately with outside body and cover board；Wherein, the anode pin connection of " L " shape
On the tantalum wire lead-out wire stretched out from cover board, the negative pin of " L " shape is connected to the bottom of the cylinder of metal shell, and anode draws
Two tiptoe arranged opposites of foot and negative pin, the convenient connection with outside；Tantalum wire between the anode pin and cover board
Also there are one the insulating trip of " L " shape, the top of the flanging of insulating trip " L " shape is extend into outside negative pin and metal set on lead-out wire
Between the cylinder of shell, positive and negative anodes short circuit is prevented.
3. a kind of packaging method of Metal Packaging structural sheet type tantalum capacitor as described in claim 1, it is characterised in that：By tantalum core
Piece is wrapped up, and reserve tantalum wire on head and welded with tantalum wire lead-out wire using conducting resinl is bonded, then package bonding is led
The tantalum chip of electric glue is positioned in the cylinder of a metal shell, is packaged by metal cover board；The tantalum wire and tantalum wire
It is cased between collets, collets and tantalum wire and tantalum wire lead-out wire that there are gaps outside lead-out wire position, prevents making contact；And gold
Belong to the cylinder of shell and cover board link position uses ladder connection structure, cover plate lid is packaged after cylinder by welding, rank
Terraced connection structure is easy to fixed cap locations, ensures welded seal；The metal shell includes a cylinder and a lid
Plate, tantalum wire lead-out wire are pierced by from the fairlead of cover board, pass through glass insulator between the fairlead of cover board and tantalum wire lead-out wire
With can valve pipe be sealed and insulate；The cylinder and cover board link position of the metal shell use ladder connection structure, lid
Plate is covered to be packaged after cylinder by welding, and ladder connection structure is easy to fixed cap locations, ensures welded seal.
4. the packaging method of Metal Packaging structural sheet type tantalum capacitor as claimed in claim 3, it is characterised in that：The gold
The cylinder for belonging to shell has the anode pin of " L " shape and the negative pin of " L " shape；Wherein, the anode pin of " L " shape is connected to from lid
On the tantalum wire lead-out wire that plate stretches out, the negative pin of " L " shape is connected to the bottom of the cylinder of metal shell, and anode pin and negative
Two tiptoe arranged opposites of pole pin, the convenient connection with outside.
5. the packaging method of Metal Packaging structural sheet type tantalum capacitor as claimed in claim 4, it is characterised in that：It is described just
Also there are one the insulating trip of " L " shape, the tops of the flanging of insulating trip " L " shape for set on tantalum wire lead-out wire between pole pin and cover board
It extend between negative pin and the cylinder of metal shell, prevents positive and negative anodes short circuit.
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| CN105621344B (en) * | 2016-03-04 | 2018-06-26 | 华天科技（昆山）电子有限公司 | MEMS air-tight packagings structure and packaging method |
| CN105977028B (en) * | 2016-07-06 | 2018-05-15 | 株洲日望电子科技股份有限公司 | A kind of assembly technology of high-energy tantalum mixed capacitor and capacitor |
| CN107481857A (en) * | 2017-08-18 | 2017-12-15 | 欧阳凤 | A kind of tantalum electric capacity |
| US11024464B2 (en) * | 2018-08-28 | 2021-06-01 | Vishay Israel Ltd. | Hermetically sealed surface mount polymer capacitor |
| CN113725007B (en) * | 2020-05-26 | 2023-03-24 | 至美电器股份有限公司 | Electrolytic capacitor |
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| GR01 | Patent grant | ||
| GR01 | Patent grant |