CN107871612A - A kind of Metal Packaging structural sheet type tantalum capacitor and its method for packing - Google Patents
A kind of Metal Packaging structural sheet type tantalum capacitor and its method for packing Download PDFInfo
- Publication number
- CN107871612A CN107871612A CN201610857265.2A CN201610857265A CN107871612A CN 107871612 A CN107871612 A CN 107871612A CN 201610857265 A CN201610857265 A CN 201610857265A CN 107871612 A CN107871612 A CN 107871612A
- Authority
- CN
- China
- Prior art keywords
- tantalum
- wire
- tantalum wire
- lead
- chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 title claims abstract description 126
- 229910052751 metal Inorganic materials 0.000 title claims abstract description 57
- 239000002184 metal Substances 0.000 title claims abstract description 57
- 229910052715 tantalum Inorganic materials 0.000 title claims abstract description 44
- 239000003990 capacitor Substances 0.000 title claims abstract description 23
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 19
- 238000000034 method Methods 0.000 title abstract description 5
- 238000012856 packing Methods 0.000 title abstract description 5
- 238000003466 welding Methods 0.000 claims description 8
- 239000011521 glass Substances 0.000 claims description 4
- 239000012212 insulator Substances 0.000 claims description 4
- 239000007787 solid Substances 0.000 description 7
- 238000002360 preparation method Methods 0.000 description 4
- 238000009413 insulation Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 239000008188 pellet Substances 0.000 description 2
- 230000015556 catabolic process Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 230000003292 diminished effect Effects 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000009776 industrial production Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000004021 metal welding Methods 0.000 description 1
- 238000004377 microelectronic Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
- H01G9/004—Details
- H01G9/008—Terminals
- H01G9/012—Terminals specially adapted for solid capacitors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
- H01G9/004—Details
- H01G9/02—Diaphragms; Separators
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
- H01G9/004—Details
- H01G9/08—Housing; Encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
- H01G9/004—Details
- H01G9/08—Housing; Encapsulation
- H01G9/10—Sealing, e.g. of lead-in wires
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Abstract
A kind of Metal Packaging structural sheet type tantalum capacitor and its method for packing, using Metal Packaging structure, in one layer of cohesive conducting resinl of tantalum chip outer wrapping, then bonding conducting resinl outer wrapping layer of metal shell；Meanwhile one in tantalum chip is connected with tantalum wire, tantalum wire is drawn out to outside metal shell further through tantalum wire lead-out wire, forms Metal Packaging structural sheet type tantalum capacitor.Described tantalum wire is with tantalum wire lead-out wire by being welded to connect, and the pad of tantalum wire and tantalum wire lead-out wire is located at the inner face of metal shell, collets are cased with outside the pad of tantalum wire and tantalum wire lead-out wire, between collets and tantalum chip, and cohesive conducting resinl is also all enclosed with outside collets, so that tantalum chip and tantalum wire and tantalum wire lead-out wire, and space between shell is relatively fixed.
Description
Technical field
The present invention relates to a kind of electronic component and preparation method thereof, and in particular to a kind of Metal Packaging structural sheet type tantalum
Capacitor and preparation method thereof, to solve the problems, such as resin-encapsulated products air tightness, its reliability is improved, while keep chip outward appearance
Design the characteristic for being easily installed and using.Belong to electronic component manufacture technology field.
Background technology：
Chip solid tantalum capacitors are a kind of polar components, and in microelectronic circuit, unidirectional using its dielectric layer is led
It can electrically be used for filtering, AC ripple target signal filter remaining in direct current signal or its wave amplitude is diminished, chip-type solid tantalum
The characteristics of capacitor is long lifespan, high temperature resistant, the degree of accuracy is high, filter high-frequency harmonic performance is fabulous and various informative, volume efficiency
It is excellent, there is its unique feature, its application is more and more wider.
The resin-encapsulated mode that chip solid tantalum capacitors mainly use at present, suitable for cost degradation, extensive automatic
The industrial production of change, it is widely used in territories such as household electrical appliances, communication, medical treatment, computer, automobiles.But resin-encapsulated is non-
Air tight structure, easily device inside is destroyed by moisture or the intrusion of corrosivity gas-liquid under the harsh environment such as high temperature, high humidity
Turn on circuit and fuse, cause properties of product to deteriorate or even fail, also limit its under the complex environments such as space flight, oil field and
The use of high reliability request.At present in the occasion of these complex environments and high reliability request still using traditional axial direction or vertical
To cylindrical metal shell encapsulating products, but thus it is not easy to installation and fixes.It is therefore desirable to further improved.
The content of the invention
It is an object of the invention to the deficiency present in for existing chip solid tantalum capacitors resin-encapsulated mode, proposes
A kind of new chip solid tantalum capacitors and preparation method thereof, the chip solid tantalum capacitors and preparation method thereof can be solved effectively
Certainly chip solid tantalum capacitors are easily invaded destructor under the harsh environment such as high temperature, high humidity by moisture or corrosivity gas-liquid
Conducting circuit and fuse inside part, cause properties of product to deteriorate the problem of even failing.
In order to reach this purpose, the invention provides a kind of Metal Packaging structural sheet type tantalum capacitor, sealed using metal
Assembling structure, in one layer of cohesive conducting resinl of tantalum chip outer wrapping, then bonding conducting resinl outer wrapping layer of metal shell；Meanwhile
One of tantalum chip is connected with tantalum wire, and tantalum wire is drawn out to outside metal shell further through tantalum wire lead-out wire, forms Metal Packaging structure
Chip tantalum capacitor.
Further, described tantalum wire and tantalum wire lead-out wire are by being welded to connect, and tantalum wire is drawn with tantalum wire
The pad of line is located at the inner face of metal shell, is cased with collets outside the pad of tantalum wire and tantalum wire lead-out wire, collets with
Between tantalum chip, and cohesive conducting resinl is also all enclosed with outside collets so that tantalum chip and tantalum wire and tantalum wire lead-out wire, with
And the space between shell is relatively fixed.
Further, there is annular space between described collets and tantalum wire and tantalum wire lead-out wire, further improves exhausted
Edge performance, while prevent that tantalum wire, tantalum wire lead-out wire and pad are collided contact.
Further, described metal shell includes a cylinder and a cover plate, lead of the tantalum wire lead-out wire from cover plate
Hole passes, between the fairlead and tantalum wire lead-out wire of cover plate by glass insulator with can valve pipe sealed and insulated.
Further, the cylinder of described metal shell and cover plate link position use ladder attachment structure, and cover plate lid exists
It is packaged after cylinder by welding, ladder attachment structure is easy to securing cover plate position, ensures welded seal.
Further, the cylinder of described metal shell and cover plate are connected to the positive pole pin and " L " shape of " L " shape outside
Negative pin；Wherein, the positive pole pin of " L " shape is connected on the tantalum wire lead-out wire stretched out from cover plate, the negative pin of " L " shape
The bottom of the cylinder of metal shell, and two tiptoe arranged opposites of positive pole pin and negative pin are connected to, it is convenient and outside
Connection.
Further, the insulation of " L " shape is also cased with the tantalum wire lead-out wire between described positive pole pin and cover plate
Piece, the top of the flanging of insulating trip " L " shape are extend between negative pin and the cylinder of metal shell, prevent both positive and negative polarity short circuit.
A kind of method for packing of Metal Packaging structural sheet type tantalum capacitor, tantalum chip is wrapped up using conducting resinl is bonded
Come, and reserve tantalum wire on head and welded with tantalum wire lead-out wire, then the tantalum chip for wrapping up bonding conducting resinl is positioned over one
In the cylinder of metal shell, it is packaged by metal cover board；
Further, with being cased with collets outside tantalum wire lead-out wire position, collets draw described tantalum wire with tantalum wire and tantalum wire
Gap is left between outlet, prevents making contact；And the cylinder and cover plate link position of metal shell use ladder attachment structure,
Cover plate lid is packaged after cylinder by welding, and ladder attachment structure is easy to securing cover plate position, ensures welded seal.
Further, the cylinder of described metal shell has the positive pole pin of " L " shape and the negative pin of " L " shape；Wherein,
The positive pole pin of " L " shape is connected on the tantalum wire lead-out wire stretched out from cover plate, and the negative pin of " L " shape is connected to metal shell
The bottom of cylinder, and two tiptoe arranged opposites of positive pole pin and negative pin, the convenient connection with outside.
Further, the insulation of " L " shape is also cased with the tantalum wire lead-out wire between described positive pole pin and cover plate
Piece, the top of the flanging of insulating trip " L " shape are extend between negative pin and the cylinder of metal shell, prevent both positive and negative polarity short circuit.
The advantage of the invention is that：
1) pellet anode tantalum wire draws the new extraction metal wire of welding one, and it is easy to welding welding；
2) the space increase collets between pellet and shell fix product and prevent making contact；
3) through hole of cover plate of outer casing using glass insulator with can valve pipe design, with casing insulation；
4) shell uses stepped design with cover plate link position, and ladder attachment structure is easy to securing cover plate position, ensures weldering
Connect sealing；
5) one piece of insulating trip is socketed between positive pole pin and shell, prevents both positive and negative polarity short circuit；
6) cathode metal lead-out wire with can valve pipe in the melting welding of metal pins position.
Embodiment
A kind of Metal Packaging structural sheet type tantalum capacitor, using Metal Packaging structure, in one layer of bonding of tantalum chip outer wrapping
Conducting resinl, then bonding conducting resinl outer wrapping layer of metal shell；Meanwhile one in tantalum chip is connected with tantalum wire, tantalum wire is again
It is drawn out to by tantalum wire lead-out wire outside metal shell, forms Metal Packaging structural sheet type tantalum capacitor.
Described tantalum wire and tantalum wire lead-out wire are by being welded to connect, and the pad of tantalum wire and tantalum wire lead-out wire
Positioned at the inner face of metal shell, collets are cased with outside the pad of tantalum wire and tantalum wire lead-out wire, between collets and tantalum chip,
And cohesive conducting resinl is also all enclosed with outside collets so that tantalum chip and tantalum wire and tantalum wire lead-out wire, and between shell
Space be relatively fixed.
There is annular space between described collets and tantalum wire and tantalum wire lead-out wire, further improves insulating properties, together
When prevent that tantalum wire, tantalum wire lead-out wire and pad are collided contact.
Described metal shell includes a cylinder and a cover plate, tantalum wire lead-out wire pass from the fairlead of cover plate,
Between the fairlead and tantalum wire lead-out wire of cover plate by glass insulator with can valve pipe sealed and insulated.
The cylinder and cover plate link position of described metal shell use ladder attachment structure, and cover plate lid passes through after cylinder
Welding is packaged, and ladder attachment structure is easy to securing cover plate position, ensures welded seal.
The positive pole pin of " L " shape is connected to outside the cylinder and cover plate of described metal shell and the negative pole of " L " shape draws
Pin；Wherein, the positive pole pin of " L " shape is connected on the tantalum wire lead-out wire stretched out from cover plate, and the negative pin of " L " shape is connected to gold
Belong to the bottom of the cylinder of shell, and two tiptoe arranged opposites of positive pole pin and negative pin, the convenient connection with outside.
The insulating trip of " L " shape, insulating trip are also cased with tantalum wire lead-out wire between described positive pole pin and cover plate
The top of the flanging of " L " shape is extend between negative pin and the cylinder of metal shell, prevents both positive and negative polarity short circuit.
A kind of method for packing of Metal Packaging structural sheet type tantalum capacitor, tantalum chip is wrapped up using conducting resinl is bonded
Come, and reserve tantalum wire on head and welded with tantalum wire lead-out wire, then the tantalum chip for wrapping up bonding conducting resinl is positioned over one
In the cylinder of metal shell, it is packaged by metal cover board；
Described tantalum wire outside tantalum wire lead-out wire position with being cased with staying between collets, collets and tantalum wire and tantalum wire lead-out wire
There is gap, prevent making contact；And the cylinder and cover plate link position of metal shell use ladder attachment structure, cover plate lid is in cylinder
It is packaged after body by welding, ladder attachment structure is easy to securing cover plate position, ensures welded seal.
The cylinder of described metal shell has the positive pole pin of " L " shape and the negative pin of " L " shape；Wherein, " L " shape is being just
Pole pin is connected on the tantalum wire lead-out wire stretched out from cover plate, and the negative pin of " L " shape is connected to the bottom of the cylinder of metal shell
Portion, and two tiptoe arranged opposites of positive pole pin and negative pin, the convenient connection with outside.
The insulating trip of " L " shape, insulating trip are also cased with tantalum wire lead-out wire between described positive pole pin and cover plate
The top of the flanging of " L " shape is extend between negative pin and the cylinder of metal shell, prevents both positive and negative polarity short circuit.
Claims (4)
- A kind of 1. Metal Packaging structural sheet type tantalum capacitor, using Metal Packaging structure, it is characterised in that：In tantalum chip outer wrapping One layer of cohesive conducting resinl, then bonding conducting resinl outer wrapping layer of metal shell；Meanwhile one in tantalum chip is connected with tantalum Silk, tantalum wire are drawn out to outside metal shell further through tantalum wire lead-out wire, form Metal Packaging structural sheet type tantalum capacitor.
- 2. Metal Packaging structural sheet type tantalum capacitor as claimed in claim 1, it is characterised in that：Described tantalum wire draws with tantalum wire Outlet is by being welded to connect, and the pad of tantalum wire and tantalum wire lead-out wire is located at the inner face of metal shell, in tantalum wire With being cased with collets outside the pad of tantalum wire lead-out wire, between collets and tantalum chip, and also all it is enclosed with outside collets Bond conducting resinl so that tantalum chip and tantalum wire and tantalum wire lead-out wire, and space between shell are relatively fixed.
- 3. Metal Packaging structural sheet type tantalum capacitor as claimed in claim 2, it is characterised in that：Described collets and tantalum wire There is annular space between tantalum wire lead-out wire, further improves insulating properties, while prevent tantalum wire, tantalum wire lead-out wire and welding Put the contact that is collided.
- 4. Metal Packaging structural sheet type tantalum capacitor as claimed in claim 3, it is characterised in that：Described metal shell includes One cylinder and a cover plate, tantalum wire lead-out wire pass from the fairlead of cover plate, cover plate fairlead and tantalum wire lead-out wire it Between by glass insulator with can valve pipe sealed and insulated.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610857265.2A CN107871612A (en) | 2016-09-27 | 2016-09-27 | A kind of Metal Packaging structural sheet type tantalum capacitor and its method for packing |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610857265.2A CN107871612A (en) | 2016-09-27 | 2016-09-27 | A kind of Metal Packaging structural sheet type tantalum capacitor and its method for packing |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107871612A true CN107871612A (en) | 2018-04-03 |
Family
ID=61761699
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610857265.2A Pending CN107871612A (en) | 2016-09-27 | 2016-09-27 | A kind of Metal Packaging structural sheet type tantalum capacitor and its method for packing |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107871612A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111508900A (en) * | 2020-04-20 | 2020-08-07 | 成都华微电子科技有限公司 | Integrated circuit chip |
| WO2022228353A1 (en) * | 2021-04-27 | 2022-11-03 | 华为技术有限公司 | Packaging assembly, capacitor, and electrical device |
-
2016
- 2016-09-27 CN CN201610857265.2A patent/CN107871612A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111508900A (en) * | 2020-04-20 | 2020-08-07 | 成都华微电子科技有限公司 | Integrated circuit chip |
| WO2022228353A1 (en) * | 2021-04-27 | 2022-11-03 | 华为技术有限公司 | Packaging assembly, capacitor, and electrical device |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN105097288B (en) | A kind of Metal Packaging structural sheet type tantalum capacitor and its packaging method | |
| CN107871612A (en) | A kind of Metal Packaging structural sheet type tantalum capacitor and its method for packing | |
| JP2011071179A (en) | Metallized film capacitor | |
| CN205016388U (en) | Metal packaging structure piece formula tantalum capacitor | |
| TWI478188B (en) | Stacked-type solid electrolytic capacitor package structure having a plurality of negative lead pins and method of manufacturing the same | |
| CN105140040A (en) | Chip solid tantalum capacitor with ceramic packaging structure and packaging method thereof | |
| CN2911911Y (en) | Drying and self-healing capacitor element having double protections | |
| CN204792462U (en) | Welding formula cylindricality farad electric capacity | |
| CN106876142A (en) | A kind of Metal Packaging structural sheet type tantalum capacitor and its method for packing | |
| CN202633053U (en) | Multi-core-set ceramic capacitor | |
| CN104966613A (en) | Microwave oven capacitor | |
| CN205194523U (en) | Pottery packaging structure piece formula solid tantalum capacitor | |
| CN101964253A (en) | Unthreaded terminal mechanical explosion-proof dry type capacitor | |
| CN203895272U (en) | Tantalum capacitor | |
| CN101364481B (en) | High-voltage capacitor having rectifying apparatus | |
| US20180100625A1 (en) | Led light bulb and fabrication method thereof | |
| CN208507473U (en) | A kind of high self resonant frequency thin film capacitor | |
| CN207781408U (en) | A kind of water proof type capacitor | |
| CN108022757A (en) | Capacitor packaging structure and its wound-type module with non-wide conductive foil | |
| CN205845703U (en) | A kind of capacitor terminal of quick spot welding crimping lead-in wire | |
| CN204706465U (en) | Combined type energetic compound tantalum capacitor | |
| CN206210620U (en) | A kind of aluminum hull of electrolytic capacitor | |
| CN201066629Y (en) | A metal thin film capacitor | |
| US10079114B2 (en) | Stacked-type solid electrolytic capacitor capable of increasing welding effect and manufacturing method of the same | |
| CN104916442B (en) | The compound tantalum capacitor of Combined type energetic and its manufacture method |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20180403 |
|
| WD01 | Invention patent application deemed withdrawn after publication |