CN108281280A - A kind of polyester film condenser and its installation method with pallet - Google Patents
A kind of polyester film condenser and its installation method with pallet Download PDFInfo
- Publication number
- CN108281280A CN108281280A CN201711395018.6A CN201711395018A CN108281280A CN 108281280 A CN108281280 A CN 108281280A CN 201711395018 A CN201711395018 A CN 201711395018A CN 108281280 A CN108281280 A CN 108281280A
- Authority
- CN
- China
- Prior art keywords
- pallet
- polyester film
- capacitor
- lead
- groove
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229920006267 polyester film Polymers 0.000 title claims abstract description 36
- 238000000034 method Methods 0.000 title claims abstract description 22
- 238000009434 installation Methods 0.000 title claims abstract description 10
- 239000003990 capacitor Substances 0.000 claims abstract description 58
- 239000003989 dielectric material Substances 0.000 claims abstract description 10
- 229910000679 solder Inorganic materials 0.000 claims description 6
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 2
- 239000006071 cream Substances 0.000 claims description 2
- 238000003466 welding Methods 0.000 abstract description 14
- 238000005476 soldering Methods 0.000 abstract description 11
- 239000010408 film Substances 0.000 description 11
- 229920002799 BoPET Polymers 0.000 description 8
- 239000005041 Mylar™ Substances 0.000 description 8
- 238000005516 engineering process Methods 0.000 description 4
- 239000010409 thin film Substances 0.000 description 4
- 238000010586 diagram Methods 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 239000004743 Polypropylene Substances 0.000 description 1
- 150000001336 alkenes Chemical class 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 230000000712 assembly Effects 0.000 description 1
- 239000003985 ceramic capacitor Substances 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000011104 metalized film Substances 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- -1 polypropylene Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/018—Dielectrics
- H01G4/06—Solid dielectrics
- H01G4/14—Organic dielectrics
- H01G4/18—Organic dielectrics of synthetic material, e.g. derivatives of cellulose
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
- H01G2/02—Mountings
- H01G2/06—Mountings specially adapted for mounting on a printed-circuit support
- H01G2/065—Mountings specially adapted for mounting on a printed-circuit support for surface mounting, e.g. chip capacitors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/228—Terminals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/33—Thin- or thick-film capacitors
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Abstract
The invention discloses a kind of polyester film condensers with pallet, and there is capacitor body, capacitor body to be connected to 2 leads, be provided with pallet below the capacitor body, 2 wire jacks are provided on pallet；The position of opening of corresponding 2 wire jacks, tray bottom is provided with corresponding 2 grooves to both sides, wire jack is located in groove, and lead passes through pallet folding to be embedded in the groove of tray bottom by wire jack, and the capacitor is using polyester film as dielectric material；The invention also discloses a kind of methods of polyester film condenser of the installation with pallet.The polyester film condenser of the present invention is by installing pallet additional and being improved to pin configuration, and the dielectric material using polyester film as the capacitor of the present invention, so that capacitor is when carrying out surface erecting and welding, can more stably it adhere on circuit boards, the requirement of Reflow Soldering heatproof is met simultaneously, and the present invention has the advantages that inexpensive, easy to operate, high efficiency, high reliability.
Description
Technical field
The present invention relates to a kind of thin film capacitor and its installation methods, and in particular to a kind of polyester film capacitor with pallet
Device and its installation method.
Background technology
It includes electronic component, assembly equipment, welding method and surface-assembled electricity that surface mounting technique (SMT), which is one,
Base board designs the system integrated technology with manufacture, is the Electronic Assemblies for breaching traditional printed circuit board Through-Hole Technology
Method, and electronic product can effectively realize " light, thin, short, small " from now on, it is multi-functional, highly reliable, high quality, inexpensive
One of main means are now widely used for the industries such as communication, computer, household electrical appliances.
In the prior art, thin film capacitor is installed on surface, is mainly made using metalized film laminated type, then two
Upper welding surface of the solderability metal as product of end spraying；Thin film capacitor is installed when mounted in surface, is by the welding of product
Face is directly welded at as leg on circuit board, that is, existing thin film capacitor is using included welding region or auxiliary welding section
Domain carries out surface soldered attachment with circuit board, and the requirement to welding procedure is high, and it is low to be welded into power.
In addition safety capacitor is installed on current surface, mainly using MLCC (chip ceramic capacitor), but its charge
Capacity is limited, and of high cost；And it is all polypropylene film as dielectric material that other film safety capacitors, which use, poly- third
Alkene film melting points only have 165 DEG C -170 DEG C, cannot meet the reflow soldering process after the installation of surface.
Invention content
The purpose of the present invention is exactly to solve above-mentioned problems of the prior art.
In particular, it is an object that a kind of polyester film condenser with pallet is provided, by capacitance
It installs pallet below device ontology additional and pin configuration is improved by plastic housing structure, increase effectively capacitor body weldering
Connect the contact area of region and circuit board so that capacitor more stably adheres to when carrying out surface erecting and welding (such as Reflow Soldering)
On circuit boards.
It is a further object to provide a kind of polyester film condenser and its installation method with pallet, is carrying out
When surface is installed, in this way, the requirement to welding procedure is low, is easy to weld, and is welded into power height.
A further object of the present invention be additionally provide it is a kind of by polyester film be applied to pallet polyester film electricity
In container, using polyester film as the dielectric material of the present invention so that the present invention can meet the requirement of Reflow Soldering heatproof, have low
The advantages of cost, easy to operate, high efficiency, high reliability.
In order to achieve the above object, the technical solution adopted by the present invention is：
A kind of polyester film condenser with pallet has capacitor body, and capacitor body is connected to 2 leads, described
It is provided with pallet below capacitor body, 2 wire jacks are provided on pallet；The position of opening of corresponding 2 wire jacks, support
Pan bottom is provided with corresponding 2 grooves to both sides, and wire jack is located in groove, and lead is folded by wire jack across pallet
It is embedded in the groove of tray bottom；The capacitor is using polyester film as dielectric material.
The groove is U-shaped groove.
Pallet top both sides are provided with limited step, for being limited to capacitor body.
The width of the groove is 0.5mm~3.2mm, and the depth of groove is 0.3mm~1.0mm.
The outer end of the lead grows tray bottom edge 0.3mm~3.0mm, and the plane of the lead is higher by tray bottom
Plane 0.1mm~0.5mm.
The width of the limited step is 0.1mm~0.15mm, and the height of the limited step is 0.5mm~2.0mm.
The distance between 2 limited step inward flanges are wider 0.1mm~0.15mm than the capacitor body.
2 wire jacks are corresponding with 2 wire locations, and lead passes vertically through wire jack.
A kind of polyester film condenser and its installation method with pallet, this method includes following steps:
Step 1：2 leads 2 of capacitor body 1 are inserted into 2 wire jacks 5 on pallet 4；
Step 2：2 leads 2 are bent along the direction of corresponding 2 grooves 3, and the folding of lead 2 is embedded in groove
In 3；
Step 3：The outer end that the lead 2 of 4 bottom margin of pallet will be grown is cut off along 4 edge of pallet；
Step 4：On circuit boards by 4 bottom of pallet patch, make to be coated with solder(ing) paste on lead 2 and circuit board in groove 3
Pad fit；
Step 5：Solder(ing) paste is melted, capacitor is made securely to weld together with circuit board.
The device have the advantages that：
Pallet is equipped with below the mylar film capacitor device ontology of the present invention, pallet is equipped with 2 wire jacks, 2 corresponding
Wire jack, tray bottom are correspondingly provided with 2 grooves, and wire jack is located in groove, and lead passes through pallet by wire jack,
Folding is embedded in the groove of tray bottom.
On circuit boards by tray bottom patch when surface is installed, make to be coated with scolding tin on the lead and circuit board in groove
The pad of cream makes solder(ing) paste melt to fitting, then using Reflow Soldering, and capacitor is made securely to weld together and realize with circuit board
Electrical connection.
The mylar film capacitor device of the present invention increases effectively capacitor body weldering when surface is installed, by support holder structure
Connect the contact area of region and circuit board so that capacitor more stably adheres to when carrying out surface erecting and welding (such as Reflow Soldering)
On circuit boards, low to the requirement of welding procedure, it is easy to weld, is welded into power height.
In the present invention, the position of opening of corresponding 2 wire jacks, tray bottom both sides are correspondingly provided with 2 U-shaped grooves；It is recessed
Lead outer end in slot grows tray bottom edge 0.3mm~3.0mm, and the lead plane in groove is higher by tray bottom plane
0.1mm~0.5mm further ensures the contact area of lead and circuit board, and realization is facilitated to weld.
In addition the present invention by using polyester film as capacitor dielectric material so that it is resistance to that capacitor can meet Reflow Soldering
Temperature requires so that the present invention has the advantages that inexpensive, easy to operate, high efficiency, high reliability.
Description of the drawings
The present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments.
Fig. 1 is a kind of D structure schematic diagram of polyester film condenser with pallet of the present invention；
Fig. 2 is the stereoscopic schematic diagram of the mylar film capacitor device ontology of the present invention；
Fig. 3 is the pallet stereogram of the mylar film capacitor device of the present invention；
Fig. 4 is the front view of the mylar film capacitor device of the present invention；
Fig. 5 is the side view of the mylar film capacitor device of the present invention；
Fig. 6 is the vertical view of the mylar film capacitor device of the present invention；
Fig. 7 is the upward view of the mylar film capacitor device of the present invention；
Fig. 8 is a kind of flow chart of polyester film condenser method of installation with pallet of the present invention.
In figure：1 is capacitor body；2 be lead；3 be groove；4 be pallet；5 be wire jack；6 be limited step.
Specific implementation mode
It is described below for the open present invention so that those skilled in the art can realize the present invention.It is excellent in being described below
Embodiment is selected to be only used as illustrating, it may occur to persons skilled in the art that other obvious deformations.It defines in the following description
The present invention basic principle can be applied to other embodiments, deformation scheme, improvement project, equivalent program and do not carry on the back
Other technologies scheme from the spirit and scope of the present invention.
It is understood that term " one " is interpreted as " at least one " or " one or more ", i.e., in one embodiment,
The quantity of one element can be one, and in a further embodiment, the quantity of the element can be multiple, and term " one " is no
It can be interpreted as the limitation to quantity.
Term used herein is only used for describing the purpose of various embodiments and is not intended to limit.As used herein,
Singulative is intended to also include plural form, makes an exception unless the context clearly dictates.Will further be understood that term " comprising " and/or
" having " specifies depositing for the feature, number, step, operation, component, element or combinations thereof when being used in this specification
, and it is not excluded for the presence or additional of one or more of the other feature, number, step, operation, component, element or its group.
As shown in Fig. 1-Fig. 7, in the present embodiment, in a kind of polyester film condenser with pallet, capacitor body 1 is connected to
2 leads 2,1 lower section of the capacitor body are provided with pallet 4,2 wire jacks 5 are provided on pallet 4；Corresponding 2 leads
The position of opening of jack 5,4 bottom of pallet are provided with corresponding 2 grooves 3 to both sides, and wire jack 5 is located in groove 3, lead 2
It passes through the folding of pallet 4 to be embedded in the groove 3 of 4 bottom of pallet by wire jack 5, is bent along 3 direction of groove；The capacitor
Using polyester film as dielectric material.
In the present embodiment, corresponding 2 wire jacks 5,4 bottom of the pallet is correspondingly provided with 2 U-shaped grooves 3；The pallet
4 tops both sides are provided with limited step 6, for being limited to capacitor body 1；The width of the groove 3 is 0.5mm~3.2mm,
The depth of groove 3 is 0.3mm~1.0mm；Preferably, the width of the present embodiment groove 3 is 1.0mm, and the depth of groove 3 is
0.5mm。
2 outer end of lead being embedded in groove 3 that folds grows 4 bottom margin 0.3mm~3.0mm of pallet, folds embedding
2 plane of lead being put in groove 3 is higher by 4 bottom plane 0.1mm~0.5mm of pallet, further ensures lead and circuit board
Contact area, facilitate realization weld；Preferably, the outer end of the lead 2 of 3 interior folding of groove of the present embodiment grows 4 bottom of pallet
The bottom surface of portion edge 0.5mm, the lead 2 of 3 interior folding of groove are higher than 2 bottom surface 0.2mm of pallet.
The width of the limited step 6 is 0.1mm~0.15mm, and the height of the limited step 6 is 0.5mm~2.0mm；
The distance between 26 inward flanges of the limited step are than 1 wide 0.1mm~0.15mm of the capacitor body；Preferably, this reality
The width for applying the limited step 6 of example is 0.1mm, and the height of limited step 6 is 1.0mm.
2 wire jacks 5 are corresponding with 22 positions of lead, and lead 2 passes vertically through wire jack 5.
As shown in figure 8, a kind of method for installing polyester film condenser described above, this method includes following step
Suddenly:
Step 1：It is inserted into 2 wire jacks 5 on pallet 4 after 2 leads 2 of capacitor body 1 are flattened；
Step 2：2 leads 2 are bent along the direction of corresponding 2 grooves 3, and the folding of lead 2 is embedded in groove
In 3；
Step 3：The outer end that the lead 2 of 4 bottom margin of pallet will be grown is cut off along 4 edge of pallet；
Step 4：On circuit boards by 4 bottom of pallet patch, make to be coated with solder(ing) paste on lead 2 and circuit board in groove 3
Pad fit so that capacitor can be smoothly bonded on circuit boards by the bottom of pallet 4；
Step 5：Reflow soldering process is finally used, solder(ing) paste is melted, capacitor is made securely to be welded on one with circuit board
It rises.
In the present embodiment, it is 265 DEG C of -270 DEG C of polyester films that the polyester film condenser with pallet, which uses fusing point,
As dielectric material so that capacitor can meet the requirement of Reflow Soldering heatproof.
The polyester film condenser of the present invention increases effectively capacitor body 1 when surface is installed by support holder structure
The contact area of welding region and circuit board so that capacitor is more stably attached when carrying out surface erecting and welding (such as Reflow Soldering)
It on circuit boards, the requirement to welding procedure is low, is easy to weld, and is welded into power height.
In addition the present invention by using polyester film as capacitor dielectric material so that it is resistance to that capacitor can meet Reflow Soldering
Temperature requires so that the present invention has the advantages that inexpensive, easy to operate, high efficiency, high reliability.
Certainly, the invention may also have other embodiments, without deviating from the spirit and substance of the present invention, ripe
It knows those skilled in the art and makes various corresponding change and deformations, but these corresponding changes and change in accordance with the present invention
Shape should all belong to the protection domain of appended claims of the invention.
Claims (9)
1. there is a kind of polyester film condenser with pallet capacitor body (1), capacitor body (1) to be connected to 2 leads
(2), it is characterised in that：It is provided with pallet (4) below the capacitor body (1), 2 wire jacks are provided on pallet (4)
(5)；The position of opening of corresponding 2 wire jacks (5), pallet (4) bottom are provided with corresponding 2 grooves (3) to both sides, and lead is inserted
Hole (5) is located in groove (3), and lead (2) passes through pallet (4) folding to be embedded in the recessed of pallet (4) bottom by wire jack (5)
In slot (3)；The capacitor is using polyester film as dielectric material.
2. polyester film condenser according to claim 1, it is characterised in that：The groove (3) is U-shaped groove.
3. polyester film condenser according to claim 1, it is characterised in that：Pallet (4) the top both sides are provided with
Limited step (6), for being limited to capacitor body (1).
4. polyester film condenser according to claim 1, it is characterised in that：The width of the groove (3) be 0.5mm~
The depth of 3.2mm, groove (3) are 0.3mm~1.0mm.
5. polyester film condenser according to claim 1, it is characterised in that：The outer end of the lead (2) grows pallet
(4) plane of bottom margin 0.3mm~3.0mm, the lead (2) are higher by pallet (4) bottom plane 0.1mm~0.5mm.
6. polyester film condenser according to claim 3, it is characterised in that：The width of the limited step (6) is
The height of 0.1mm~0.15mm, the limited step (6) are 0.5mm~2.0mm.
7. polyester film condenser according to claim 3, it is characterised in that：2 limited step (6) inward flanges it
Between distance than the capacitor body (1) width 0.1mm~0.15mm.
8. according to the polyester film condenser described in claim 1 to 7 any one, it is characterised in that：2 wire jacks (5)
Corresponding with the position of 2 leads (2), lead (2) passes vertically through wire jack (5).
9. a kind of method of the polyester film condenser described in installation claim 1-7 any one, this method includes following several
A step:
Step 1：2 leads (2) of capacitor body (1) are inserted into 2 wire jacks (5) on pallet (4)；
Step 2：By 2 leads (2) along corresponding 2 grooves (3) direction bend, and by lead (2) folding be embedded in it is recessed
In slot (3)；
Step 3：The outer end that the lead (2) of pallet (4) bottom margin will be grown is cut off along pallet (4) edge；
Step 4：On circuit boards by pallet (4) bottom patch, make to be coated with scolding tin on lead (2) and circuit board in groove (3)
The pad of cream fits；
Step 5：Solder(ing) paste is melted, capacitor is made securely to weld together with circuit board.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720926730 | 2017-07-28 | ||
| CN2017209267303 | 2017-07-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108281280A true CN108281280A (en) | 2018-07-13 |
Family
ID=62801922
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721805673.XU Active CN207663933U (en) | 2017-07-28 | 2017-12-21 | A kind of capacitor with pallet |
| CN201711395018.6A Pending CN108281280A (en) | 2017-07-28 | 2017-12-21 | A kind of polyester film condenser and its installation method with pallet |
Family Applications Before (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721805673.XU Active CN207663933U (en) | 2017-07-28 | 2017-12-21 | A kind of capacitor with pallet |
Country Status (1)
| Country | Link |
|---|---|
| CN (2) | CN207663933U (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1841607A (en) * | 2005-03-25 | 2006-10-04 | 松下电器产业株式会社 | Tray for production of chip type capacitor and method and device for fabricating chip type capacitor |
| JP2008041681A (en) * | 2006-08-01 | 2008-02-21 | Matsushita Electric Ind Co Ltd | Film capacitor |
| CN101176173A (en) * | 2005-05-17 | 2008-05-07 | 维莎斯普拉格公司 | Surface mount capacitor and method of making the same |
| JP2015026663A (en) * | 2013-07-25 | 2015-02-05 | 日立エーアイシー株式会社 | Film capacitor |
| CN104377033A (en) * | 2014-10-22 | 2015-02-25 | 厦门法拉电子股份有限公司 | Thin film capacitor surface mounting welding lead-out structure and mounting method thereof |
-
2017
- 2017-12-21 CN CN201721805673.XU patent/CN207663933U/en active Active
- 2017-12-21 CN CN201711395018.6A patent/CN108281280A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1841607A (en) * | 2005-03-25 | 2006-10-04 | 松下电器产业株式会社 | Tray for production of chip type capacitor and method and device for fabricating chip type capacitor |
| CN101176173A (en) * | 2005-05-17 | 2008-05-07 | 维莎斯普拉格公司 | Surface mount capacitor and method of making the same |
| JP2008041681A (en) * | 2006-08-01 | 2008-02-21 | Matsushita Electric Ind Co Ltd | Film capacitor |
| JP2015026663A (en) * | 2013-07-25 | 2015-02-05 | 日立エーアイシー株式会社 | Film capacitor |
| CN104377033A (en) * | 2014-10-22 | 2015-02-25 | 厦门法拉电子股份有限公司 | Thin film capacitor surface mounting welding lead-out structure and mounting method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| CN207663933U (en) | 2018-07-27 |
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| PB01 | Publication | ||
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Application publication date: 20180713 |