CN202905703U - Combined small-power surface-mount diode lead frame member - Google Patents
Combined small-power surface-mount diode lead frame member Download PDFInfo
- Publication number
- CN202905703U CN202905703U CN2012206789722U CN201220678972U CN202905703U CN 202905703 U CN202905703 U CN 202905703U CN 2012206789722 U CN2012206789722 U CN 2012206789722U CN 201220678972 U CN201220678972 U CN 201220678972U CN 202905703 U CN202905703 U CN 202905703U
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- lead frame
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- combined small
- diode lead
- frame member
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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Abstract
The utility model discloses a combined small-power surface-mount diode lead frame member. With the combined small-power surface-mount diode lead frame member adopted, the defects of complexity process and low efficiency of subsequent encapsulation process can be eliminated. The combined small-power surface-mount diode lead frame member comprises an upper material sheet and a lower material sheet; the upper material sheet comprises parallel upper and lower edge strips and a plurality of longitudinal connecting strips connected between the upper and lower edge strips, wherein both sides of each connecting strip are provided with a plurality of rows of pins; the lower material sheet comprises parallel upper and lower edge bars and a plurality of longitudinal connecting bars connected between the upper and lower edge bars, wherein both sides of each connecting bar are provided with a plurality of rows of chip carriers; the pins are connected to both sides of each connecting strip through welding feet, and the chip carriers are connected to both sides of each connecting bar through guide feet; the pins horizontally move downwards and are dislocated with respect to the welding feet; and the chip carriers horizontally move downwards and are dislocated with respect to the guide feet. According to the combined small-power surface-mount diode lead frame member of the utility model, soldering and brazing process in jumper encapsulation is omitted, such that encapsulation efficiency and reliability of finished products can be greatly improved, and the combined small-power surface-mount-type diode lead frame member is widely used in high-end electronic products such as smart phones, palmtops, and LED display screens.
Description
Technical field
The utility model relates to semi-conductor discrete device manufacturing technology field, especially refers to the SMD diode lead frame spare manufacturing technology that a kind of microelectronic is used.
Background technology
The diode product that microelectronic is used is different according to plugging mode, can be divided into direct insertion and SMD two classes.It is early stage direct insertion that our common product mostly is, and its profile is larger, and the cylinder conductor that extends two sub-threads at cylindrical two ends is as pin, and the resistance to shock of this series products and humidity resistance are generally relatively poor, at present only in the low side electronics applications.Along with current mobile phone, palmtop PC, iphone, network wireless communication, the fast development of the microelectric technique such as automotive electronics, LED display, the range of application of small-power paster diode and the hurried growth of quantity required drive the rapid growth with small-power paster diode lead frame demand thus.This type of comparatively typical product such as State Intellectual Property Office are that the ZL200920118672.7 name is called the utility model patent of " lead frame and the chip connecting structure of Miniature surface mount diode encapsulation " in the patent No. of Granted publication on the 27th April in 2009, it " comprises for the chip microscope carrier and the distribution that carry chip; its chips microscope carrier and distribution are high-density matrix and arrange; two ends of wire jumper form respectively ... the first protuberance fixedly is welded in the chip upper end, and the second protuberance fixedly is welded in the end of distribution ".But, this product is owing to the overall structure reason in the design, two pins of diode are located in the same lead frame, so when encapsulation, must use the operations such as wire jumper, soldering, because small-power diode lead frame base material thickness only has 0.1～0.2 millimeter, and its surperficial smoother, welding sequence is not only time-consuming, and qualification rate is low; Its profile is the chip microscope carrier of simple rectangle, easily produces the loosening phenomenon of layering after the encapsulation, and water resistance is relatively poor, has a strong impact on the reliability that product uses.
The utility model content
The technical problems to be solved in the utility model is that to overcome the follow-up welded encapsulation operation that existing like product exists time-consuming, and the easy loosening phenomenon of layering that produces after the encapsulation, defective and deficiency that water resistance is relatively poor, have a strong impact on the product dependability, to society provide that a kind of follow-up packaging process is easy, firm welding, humidity resistance are high, the combined small-power paster of service-strong diode lead frame spare, to satisfy smart mobile phone, palmtop PC, wireless communication, the high-end electronic product development requirement of the microelectronics such as automotive electronics, LED display.
The technical scheme that its technical problem that solves the utility model adopts is: combined small-power paster diode lead frame spare, comprise tablet and lower tablet, described upper tablet comprises that parallel upper lower sideband and many of being connected between the described upper lower sideband are vertical related, and described related both sides are provided with many row's pins; Described lower tablet comprises parallel upper lower sid strip and is connected in many vertical latticings between the described upper lower sid strip, and the both sides of described latticing are provided with many row's chip microscope carriers; Described pin is connected in described related both sides by leg, and described chip microscope carrier is connected in described latticing both sides by lead foot.
Described pin is with respect to the downward translation dislocation of described leg, and described pin upper surface is provided with pit and forms salient point at the corresponding back side; Described chip microscope carrier is with respect to the downward translation of described lead foot dislocation, is provided with aperture at described chip microscope carrier and described lead foot connecting portion, both sides are provided with breach; Described pin and described leg connecting portion are provided with through hole, both sides are provided with projection; Two described related centres be provided with positioning strip be connected in described on lower sideband.
The combined small-power paster of the utility model diode lead frame spare, with all-in-one-piece diode lead frame product be improved to upper tablet, lower tablet is combined, lay small-power diode chip at corresponding chip microscope carrier during encapsulation, then be pressed into the positioning strip of upper tablet and the latticing centrally aligned of lower tablet fixing, small-power diode die bottom surface and chip microscope carrier surface fit, the surface fits with the pin back side, because the pin back side is provided with salient point, can guarantee the good contact of small-power diode chip and pin.After the encapsulation, envelope material is filled in fixing anti-skidding, the dash position such as aperture between through hole, projection and chip microscope carrier and the lead foot between pin surface crater, pin and the leg, breach, both greatly strengthened the adhesion of envelope material with chip microscope carrier and pin matrix, can prevent effectively that the envelope material from producing relative slippage, be conducive to improve the anti-mechanical shock of finished product and heat-resistant anti-fatigue performance, can stop again the intrusion of aqueous vapor, Effective Raise the semiconductor components and devices operational reliability.Use the art of this patent, omit the prior art products encapsulation and must use wire jumper soldering operation, can greatly improve packaging efficiency and improve the finished product dependability, be widely used in smart mobile phone, palmtop PC, wireless communication, the high-end electronic product of the microelectronics such as automotive electronics, LED display is made the field.
Description of drawings
Fig. 1 is the utility model product structure schematic diagram.
Fig. 2 is the material loading chip part plan structure schematic diagram among Fig. 1.
Fig. 3 is the blanking chip part plan structure schematic diagram among Fig. 1.
Fig. 4 is the A section structure for amplifying schematic diagram of Fig. 1.
Fig. 5 is the B section structure for amplifying schematic diagram of Fig. 1.
Fig. 6 is the C section structure for amplifying schematic diagram of Fig. 2.
Fig. 7 is the D section structure for amplifying schematic diagram of Fig. 3.
Embodiment
As shown in Figure 1 to Figure 3, the combined small-power paster of the utility model diode lead frame spare, comprise tablet 1 and lower tablet 2, described upper tablet 1 comprises parallel upper lower sideband 4 and is connected between the described upper lower sideband 4 many vertical related 5, and described related 5 both sides are provided with many row's pins 6; For improving described upper tablet 1 intensity and be convenient to encapsulation location, two described centres of related 5 be provided with positioning strip 11 be connected in described on lower sideband 4; Described lower tablet 2 comprises parallel upper lower sid strip 8 and is connected in many vertical latticings 9 between the described upper lower sid strip 8, and the both sides of described latticing 9 are provided with many row's chip microscope carriers 10.
Such as Fig. 4 and shown in Figure 6, described pin 6 is connected in described related 5 both sides by leg 7, described pin 6 is with respect to described leg 7 downward translation dislocation, described pin 6 upper surfaces are provided with pit 14 and form salient point 15 at the corresponding back side, are provided with through hole 13 at described pin 6 and described leg 7 connecting portion centers, both sides are provided with projection 16.
Such as Fig. 5 and shown in Figure 7, described chip microscope carrier 10 is connected in described latticing 9 both sides by lead foot 12, described chip microscope carrier 10 is with respect to the 12 downward translations dislocation of described lead foot, is provided with aperture 3 at described chip microscope carrier 10 with described lead foot 12 connecting portion centers, both sides are provided with breach 17.
The below continues by reference to the accompanying drawings, the operation principle of summary the utility model product.During encapsulation, first lower tablet 2 is placed special tooling, lay small-power diode chip at corresponding chip microscope carrier 10, then be pressed into the positioning strip 11 of upper tablet 1 and latticing 9 centrally aligneds of lower tablet 2 fixing, this moment, small-power diode die bottom surface and chip microscope carrier 10 surfaces fitted, the surface fits with pin 6 back sides, because pin 6 back sides are provided with salient point 15, can guarantee the good contact of small-power diode chip and pin 6.After the encapsulation, envelope material is filled in aperture 3 between through hole 13, projection 16 and chip microscope carrier 10 and the lead foot 12 between pin 6 surface craters 14, pin 6 and the leg 7, breach 17 etc. and fixes in anti-skidding, the dash position, both greatly strengthened the adhesion of envelope material with chip microscope carrier 10 and pin 6 matrixes, can prevent effectively that the envelope material from producing relative slippage, be conducive to improve the anti-mechanical shock of finished product and heat-resistant anti-fatigue performance, can stop again the intrusion of aqueous vapor, Effective Raise the semiconductor components and devices operational reliability.Use the art of this patent, omit the prior art products encapsulation and must use wire jumper soldering operation, can greatly improve packaging efficiency and improve the finished product dependability, be widely used in mobile phone, palmtop PC, iphone, network wireless communication, the high-end electronic product of the microelectronics such as automotive electronics, LED display is made the field.
Claims (5)
1. combined small-power paster diode lead frame spare, comprise tablet (1) and lower tablet (2), it is characterized in that: described upper tablet (1) comprises parallel upper lower sideband (4) and is connected in many vertical related (5) between the described upper lower sideband (4), and the both sides of described related (5) are provided with many row's pins (6); Described lower tablet (2) comprises parallel upper lower sid strip (8) and is connected in many vertical latticings (9) between the described upper lower sid strip (8), and the both sides of described latticing (9) are provided with many row's chip microscope carriers (10); Described pin (6) is connected in described related (5) both sides by leg (7), and described chip microscope carrier (10) is connected in described latticing (9) both sides by lead foot (12).
2. combined small-power paster diode lead frame spare as claimed in claim 1, it is characterized in that: described pin (6) is with respect to the downward translation dislocation of described leg (7), and described pin (6) upper surface is provided with pit (14) and forms salient point (15) at the corresponding back side.
3. combined small-power paster diode lead frame spare as claimed in claim 2, it is characterized in that: described chip microscope carrier (10) is with respect to the downward translation of described lead foot (12) dislocation, is provided with aperture (3) at described chip microscope carrier (10) and described lead foot (12) connecting portion, both sides are provided with breach (17).
4. such as combined small-power paster diode lead frame spare as described in each claim of claims 1 to 3, it is characterized in that: described pin (6) is provided with through hole (13) with described leg (7) connecting portion, both sides are provided with projection (16).
5. combined small-power paster diode lead frame spare as claimed in claim 5 is characterized in that: be provided with positioning strip (11) in the centre of two described related (5) and be connected in described upper lower sideband (4).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012206789722U CN202905703U (en) | 2012-11-26 | 2012-11-26 | Combined small-power surface-mount diode lead frame member |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012206789722U CN202905703U (en) | 2012-11-26 | 2012-11-26 | Combined small-power surface-mount diode lead frame member |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202905703U true CN202905703U (en) | 2013-04-24 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2012206789722U Expired - Lifetime CN202905703U (en) | 2012-11-26 | 2012-11-26 | Combined small-power surface-mount diode lead frame member |
Country Status (1)
| Country | Link |
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| CN (1) | CN202905703U (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103474409A (en) * | 2013-09-11 | 2013-12-25 | 杰群电子科技（东莞）有限公司 | Arrangement method designed for high-density lead frames for discrete device |
| CN105047439A (en) * | 2015-08-11 | 2015-11-11 | 湖南艾华集团股份有限公司 | Method for flattening terminal pins of chip aluminum electrolytic capacitor and application of method |
| CN105336721A (en) * | 2015-10-26 | 2016-02-17 | 杨海林 | Material sheet for ultrathin SOD123FL encapsulation diode |
| CN110164844A (en) * | 2019-05-27 | 2019-08-23 | 四川晶辉半导体有限公司 | A kind of plastic package process not weighing pin wounded |
-
2012
- 2012-11-26 CN CN2012206789722U patent/CN202905703U/en not_active Expired - Lifetime
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103474409A (en) * | 2013-09-11 | 2013-12-25 | 杰群电子科技（东莞）有限公司 | Arrangement method designed for high-density lead frames for discrete device |
| CN105047439A (en) * | 2015-08-11 | 2015-11-11 | 湖南艾华集团股份有限公司 | Method for flattening terminal pins of chip aluminum electrolytic capacitor and application of method |
| CN105336721A (en) * | 2015-10-26 | 2016-02-17 | 杨海林 | Material sheet for ultrathin SOD123FL encapsulation diode |
| CN110164844A (en) * | 2019-05-27 | 2019-08-23 | 四川晶辉半导体有限公司 | A kind of plastic package process not weighing pin wounded |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20130424 |