CN103474409A - Arrangement method designed for high-density lead frames for discrete device - Google Patents
Arrangement method designed for high-density lead frames for discrete device Download PDFInfo
- Publication number
- CN103474409A CN103474409A CN2013104101257A CN201310410125A CN103474409A CN 103474409 A CN103474409 A CN 103474409A CN 2013104101257 A CN2013104101257 A CN 2013104101257A CN 201310410125 A CN201310410125 A CN 201310410125A CN 103474409 A CN103474409 A CN 103474409A
- Authority
- CN
- China
- Prior art keywords
- lead frame
- discrete device
- framework
- highdensity
- bar shaped
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Landscapes
- Cell Electrode Carriers And Collectors (AREA)
Abstract
The invention discloses an arrangement method designed for high-density lead frames for a discrete device. A discrete device body is arranged, the discrete device body is composed of a framework and a plurality of bar-shaped lead frames arranged in the framework, the bar-shaped lead frames are arranged on the framework in a vertical mode and the number of the columns of the frames is an even number, wherein a primary flow channel is arranged between the 2nth column bar-shaped lead frame and the 2n-1th column bar-shaped lead frame. Each bar-shaped lead frame is formed by connecting a plurality of unit lead frames end to end. The arrangement method designed for the lead frames for the high-density discrete device improves production efficiency of products, and reduces production cost.
Description
Technical field
The present invention relates to the discrete device aligning method, be specifically related to the aligning method of a kind of highdensity discrete device by leadframe design.
Background technology
Existing unit lead frame major part is all to stamp out single tape coiling of lead frame from workpiece, by electroplating work procedure, the head zone of single tape coiling of lead frame is electroplated again, then enter separation circuit, tape coiling of lead frame is separated into to single lead frame piece, wherein, each lead frame piece comprises that a plurality of cephalocaudal directions are consistent, the lead frame unit of parallel arranged, the tape coiling of lead frame stamped out due to the method is single, so its production efficiency is lower, each operation manpower and material resources consuming cost are high, and for example have the method for another kind of unit framework arrangement in column now, its discrete device as shown in Figure 1, the unit lead frame 24 that comprises arrangement in a row on framework 20 and framework, shown in the top line of framework be provided with successively the transfer port 21 that transmits lead frame for board, identifying hole 22 for the board upper sensor, the end row of described framework is provided with provides lead frame to locate the location hole 23 used on board, its defect is, adopt arrangement in a row, do not utilize single product introduction material pipe, need be at the inner discharging direction-changing device that increases of cutting forming machine, promoted processing cost, product structure arranges the design difficulty that has increased mould simultaneously.
The Chinese patent that application number is 201210087589.4 discloses name and has been called " manufacture method of lead frame of triode ", its manufacture method comprises the following steps: from same workpiece, stamp out laterally interconnective a plurality of lead frame row, described lead frame row comprise the cross unit of a plurality of longitudinal arrangements, described cross unit by two oppositely, lead frame unit in the cross arrangement of external pin position forms, connecting muscle by pin between described cross unit is connected, head zone to described lead frame unit is electroplated, along reinforcement, cut, obtain a plurality of matrix frame sheets that separate, its method promotes the utilance of workpiece, has also solved the more difficult present situation of product charging material pipe in existing transversely arranged method, but lead frame arranges processing mold is had relatively high expectations, and has promoted production cost.
Summary of the invention
The object of the present invention is to provide the aligning method of a kind of highdensity discrete device by leadframe design, improve the production efficiency of product, reduce production costs.
In order to realize above purpose, the invention provides the aligning method of a kind of highdensity discrete device by leadframe design, comprise a discrete device, described discrete device is comprised of framework and several bar shaped lead frames of being located in framework, described bar shaped lead frame is on described framework that vertical arrangement mode distributes and columns is even column, wherein between 2n row bar shaped lead frame and adjacent 2n-1 row bar shaped lead frame, is connected with a sprue; The unit lead frame is end to end forms by several for described bar shaped lead frame.
Wherein, described unit lead frame comprises zone, Yi Ji island, outer lead angle, and zone, described base island is connected in described unit lead frame by intercell connector, and described outer lead angle is connected in described unit lead frame by a gear glue connecting rod.
Wherein, a side of described unit lead frame is provided with the rectangle cast gate.
Wherein, the top line of described framework is provided with several transfer ports, the corresponding bar shaped lead frame of each transfer port.
Wherein, be provided with an identifying hole between every two described transfer ports.
Wherein, the end row of described framework is provided with some location holes, the described location hole both sides that are distributed in described strip-shaped frame corresponding to described identifying hole.
Wherein, the upper cloth of described unit framework is equipped with one deck colloid, and described colloid is rectangular-shaped.
The aligning method of leadframe design for a kind of highdensity discrete device provided by the invention has following advantage:
1, many designs are arranged and have been improved production efficiency;
2, the design difficulty that sprue and cast gate reduce injection mold is set, reduced processing cost, and a described sprue can connects the product of a plurality of cast gate symmetries;
3, adopt vertical arrangement mode, facilitate single product automatically to advance feeding pipe, reduced processing cost, having solved product in existing design need be in the inner present situation that increases the product discharge direction-changing device of cutting forming machine;
4, this design has realized that same injection mold can produce different pin and count product, saves the time of mold exchange, enhances productivity, and has solved the present situation that different product in existing design need to produce to avoid to overflow glue with different gear glue tooth moulds.
The accompanying drawing explanation
In order to be illustrated more clearly in this method embodiment or technical scheme of the prior art, below will the accompanying drawing of required use in embodiment or description of the Prior Art be briefly described, apparently, accompanying drawing in the following describes is only some embodiment of this method, for those of ordinary skills, under the prerequisite of not paying creative work, can also obtain according to these accompanying drawings other accompanying drawing.
Fig. 1 is the structural arrangement schematic diagram of existing discrete device;
The structural arrangement schematic diagram that Fig. 2 is discrete device provided by the invention;
The structural representation that Fig. 3 is unit provided by the invention lead frame;
The main TV structure schematic diagram that Fig. 4 is discrete device provided by the invention;
The side-looking structural representation that Fig. 5 is discrete device provided by the invention.
Embodiment
The aligning method of leadframe design for a kind of highdensity discrete device provided by the invention, improved the production efficiency of product, reduced production cost.
Below in conjunction with the accompanying drawing in this method, the technical scheme in this method is clearly and completely described, obviously, described is only this method part embodiment, rather than whole embodiment.Embodiment based in this method, the every other embodiment that those of ordinary skills obtain under the prerequisite of not making creative work, belong to the scope that this method is protected.
Referring to Fig. 2, Fig. 3, Fig. 4, Fig. 5, the aligning method of leadframe design for a kind of highdensity discrete device, comprise a discrete device 1, described discrete device 1 is comprised of framework 2 and several bar shaped lead frames of being located in framework 2, described bar shaped lead frame is vertical arrangement mode distribution on described framework and columns is even column, wherein between 2n row bar shaped lead frame and adjacent 2n-1 row bar shaped lead frame, be connected with a sprue 11, reduced the design difficulty of injection mold, and one sprue can connect the product of a plurality of cast gate symmetries, cut down finished cost, the unit lead frame is end to end forms by several for described bar shaped lead frame, described unit lead frame comprises zone, Yi Ji island 3, outer lead angle 6, zone 3, described base island is connected in described unit lead frame by intercell connector 4, described outer lead angle 6 is connected in described unit lead frame by a gear glue connecting rod, prevent the glue that overflows, having solved existing different product need use different gear glue tooth moulds to produce to avoid the present situation of excessive glue, and design of the present invention has realized that same injection mold can produce different pin and count product, save mould replacing time, thereby reach the purpose of enhancing productivity, one side of described unit lead frame is provided with rectangle cast gate 5, the top line of described framework 2 is provided with several and transmits the transfer port 8 of lead frame for board, the corresponding bar shaped lead frame of each transfer port 8, every two 8 of described transfer ports are provided with an identifying hole for the board upper sensor 9, some location holes 10 that provide lead frame to locate on board and use are provided the end row of described framework, described location hole 8 and the corresponding both sides that are distributed in described strip-shaped frame of described identifying hole 9, the upper cloth of described unit framework is equipped with one deck colloid, described colloid is rectangular-shaped.
Known by above description, the aligning method of leadframe design for a kind of highdensity discrete device provided by the invention has following advantage:
1, many designs are arranged and have been improved production efficiency;
2, the design difficulty that sprue and cast gate reduce injection mold is set, reduced processing cost, and a described sprue can connects the product of a plurality of cast gate symmetries;
3, adopt vertical arrangement mode, facilitate single product automatically to advance feeding pipe, reduced processing cost, having solved product in existing design need be in the inner present situation that increases the product discharge direction-changing device of cutting forming machine;
4, this design has realized that same injection mold can produce different pin and count product, saves the time of mold exchange, enhances productivity, and has solved the present situation that different product in existing design need to produce to avoid to overflow glue with different gear glue tooth moulds.
Above content is the further description of this method being done in conjunction with concrete preferred implementation, can not assert that the concrete enforcement of this method is confined to these explanations.For this method person of an ordinary skill in the technical field, under the prerequisite that does not break away from this method design, can also make some simple deduction or replace, all should be considered as belonging to the protection range of this method.
Claims (7)
1. the aligning method of leadframe design for a highdensity discrete device, comprise a discrete device, described discrete device is comprised of framework and several bar shaped lead frames of being located in framework, it is characterized in that, described bar shaped lead frame is on described framework that vertical arrangement mode distributes and columns is even column, wherein between 2n row bar shaped lead frame and adjacent 2n-1 row bar shaped lead frame, is connected with a sprue; The unit lead frame is end to end forms by several for described bar shaped lead frame.
2. the aligning method of leadframe design for a kind of highdensity discrete device according to claim 1, it is characterized in that, described unit lead frame comprises zone, Yi Ji island, outer lead angle, zone, described base island is connected in described unit lead frame by intercell connector, and described outer lead angle is connected in described unit lead frame by a gear glue connecting rod.
3. the aligning method of leadframe design for a kind of highdensity discrete device according to claim 1, is characterized in that, a side of described unit lead frame is provided with the rectangle cast gate.
4. the aligning method of leadframe design for a kind of highdensity discrete device according to claim 1, is characterized in that, the top line of described framework is provided with several transfer ports, the corresponding bar shaped lead frame of each transfer port.
5. the aligning method of leadframe design for a kind of highdensity discrete device according to claim 4, is characterized in that, between every two described transfer ports, is provided with an identifying hole.
6. use the aligning method of leadframe design according to the described a kind of highdensity discrete device of claim 1 or 4, it is characterized in that, the end row of described framework is provided with some location holes, the described location hole both sides that are distributed in described strip-shaped frame corresponding to described identifying hole.
7. the aligning method of leadframe design for a kind of highdensity discrete device according to claim 1 and 2, is characterized in that, the upper cloth of described unit framework is equipped with one deck colloid, and described colloid is rectangular-shaped.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2013104101257A CN103474409A (en) | 2013-09-11 | 2013-09-11 | Arrangement method designed for high-density lead frames for discrete device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2013104101257A CN103474409A (en) | 2013-09-11 | 2013-09-11 | Arrangement method designed for high-density lead frames for discrete device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103474409A true CN103474409A (en) | 2013-12-25 |
Family
ID=49799206
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2013104101257A Pending CN103474409A (en) | 2013-09-11 | 2013-09-11 | Arrangement method designed for high-density lead frames for discrete device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103474409A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105552058A (en) * | 2015-12-08 | 2016-05-04 | 广东气派科技有限公司 | SOT23-6 chip packaging technology |
| CN108637084A (en) * | 2018-05-09 | 2018-10-12 | 四川金湾电子有限责任公司 | A kind of processing technology of semiconductor lead frame |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201417769Y (en) * | 2009-06-09 | 2010-03-03 | 铜陵丰山三佳微电子有限公司 | Array type high-power integrated circuit lead wire frame |
| CN201435389Y (en) * | 2009-07-06 | 2010-03-31 | 晶诚（郑州）科技有限公司 | Lead frame for encapsulating semiconductor |
| EP2549531A1 (en) * | 2011-07-21 | 2013-01-23 | Nxp B.V. | Lead frame for semiconductor device |
| CN202816927U (en) * | 2012-08-31 | 2013-03-20 | 杰群电子科技（东莞）有限公司 | Semiconductor lead frame preventing glue-overflow in injection molding |
| CN202816930U (en) * | 2012-09-17 | 2013-03-20 | 深圳市气派科技有限公司 | Lead frame structure of MSOP8 package |
| CN202905705U (en) * | 2012-11-26 | 2013-04-24 | 宁波华龙电子股份有限公司 | High-density-arrangement low-power integrated circuit lead frame member |
| CN202905703U (en) * | 2012-11-26 | 2013-04-24 | 宁波华龙电子股份有限公司 | Combined small-power surface-mount diode lead frame member |
-
2013
- 2013-09-11 CN CN2013104101257A patent/CN103474409A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201417769Y (en) * | 2009-06-09 | 2010-03-03 | 铜陵丰山三佳微电子有限公司 | Array type high-power integrated circuit lead wire frame |
| CN201435389Y (en) * | 2009-07-06 | 2010-03-31 | 晶诚（郑州）科技有限公司 | Lead frame for encapsulating semiconductor |
| EP2549531A1 (en) * | 2011-07-21 | 2013-01-23 | Nxp B.V. | Lead frame for semiconductor device |
| CN202816927U (en) * | 2012-08-31 | 2013-03-20 | 杰群电子科技（东莞）有限公司 | Semiconductor lead frame preventing glue-overflow in injection molding |
| CN202816930U (en) * | 2012-09-17 | 2013-03-20 | 深圳市气派科技有限公司 | Lead frame structure of MSOP8 package |
| CN202905705U (en) * | 2012-11-26 | 2013-04-24 | 宁波华龙电子股份有限公司 | High-density-arrangement low-power integrated circuit lead frame member |
| CN202905703U (en) * | 2012-11-26 | 2013-04-24 | 宁波华龙电子股份有限公司 | Combined small-power surface-mount diode lead frame member |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105552058A (en) * | 2015-12-08 | 2016-05-04 | 广东气派科技有限公司 | SOT23-6 chip packaging technology |
| CN108637084A (en) * | 2018-05-09 | 2018-10-12 | 四川金湾电子有限责任公司 | A kind of processing technology of semiconductor lead frame |
| CN108637084B (en) * | 2018-05-09 | 2019-06-04 | 四川金湾电子有限责任公司 | A kind of processing technology of semiconductor lead frame |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN203992261U (en) | A kind of novel slim cylinder mold | |
| CN110508665A (en) | A kind of grading blanking die and blanking method of stringer upper board | |
| CN103474409A (en) | Arrangement method designed for high-density lead frames for discrete device | |
| CN103121085A (en) | Steel ball casting die | |
| CN101937897A (en) | Triode lead frame and manufacturing method thereof | |
| CN104357813A (en) | Gold immersion hanger of printed circuit board | |
| CN205685781U (en) | A kind of Chinese herbal piece pressing machine | |
| CN209971234U (en) | Mould of rubber sheath | |
| CN202045834U (en) | Mould structure for one-mould eight-products | |
| CN202712475U (en) | Terminal material belt for connector | |
| US20160263797A1 (en) | Injection molding method and injection molding device for transparent resin molded article | |
| CN105364012A (en) | Novel thin type cylinder casting mold | |
| CN202639044U (en) | Improved mold for punching steel band | |
| CN213006412U (en) | Injection mold with long service life | |
| CN202271493U (en) | Improved mould structure | |
| CN205551396U (en) | A pouring mould for connecting block | |
| CN205467130U (en) | Circuit breaker transparency cover injection mold ejection mechanism | |
| CN202921741U (en) | Punching die | |
| CN105364011B (en) | A kind of novel vibrating ring mold | |
| CN103448215A (en) | Latent type pouring gate structure for processing high-intensity plastic product | |
| CN212331550U (en) | Mould with form high strength weld line | |
| CN210617084U (en) | Mould in efficient skinning production of automizing | |
| CN202241888U (en) | Heat insulation strip extrusion moulding system | |
| CN203371730U (en) | Alloy type core injection mould | |
| CN203966821U (en) | A kind of secondary winding in current transformer mounting bracket and mould |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20131225 |