CN108637084B - A kind of processing technology of semiconductor lead frame - Google Patents
A kind of processing technology of semiconductor lead frame Download PDFInfo
- Publication number
- CN108637084B CN108637084B CN201810437977.8A CN201810437977A CN108637084B CN 108637084 B CN108637084 B CN 108637084B CN 201810437977 A CN201810437977 A CN 201810437977A CN 108637084 B CN108637084 B CN 108637084B
- Authority
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- China
- Prior art keywords
- lead
- metal material
- material belt
- blanking die
- advance
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 22
- 238000005516 engineering process Methods 0.000 title claims abstract description 11
- 239000007769 metal material Substances 0.000 claims abstract description 38
- 238000005192 partition Methods 0.000 claims abstract description 21
- 238000000465 moulding Methods 0.000 claims abstract description 18
- 238000005520 cutting process Methods 0.000 claims abstract description 15
- 239000003292 glue Substances 0.000 claims abstract description 5
- 238000009966 trimming Methods 0.000 claims description 9
- 239000000463 material Substances 0.000 claims description 5
- 238000007689 inspection Methods 0.000 claims description 4
- 230000002146 bilateral effect Effects 0.000 claims description 3
- 238000004140 cleaning Methods 0.000 claims description 3
- 238000007493 shaping process Methods 0.000 claims description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 2
- 239000010931 gold Substances 0.000 claims description 2
- 229910052737 gold Inorganic materials 0.000 claims description 2
- 238000000034 method Methods 0.000 abstract description 14
- 238000004806 packaging method and process Methods 0.000 abstract description 5
- 238000004080 punching Methods 0.000 description 25
- 238000004519 manufacturing process Methods 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000011031 large-scale manufacturing process Methods 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 238000001459 lithography Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 230000001360 synchronised effect Effects 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21D—WORKING OR PROCESSING OF SHEET METAL OR METAL TUBES, RODS OR PROFILES WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21D35/00—Combined processes according to or processes combined with methods covered by groups B21D1/00 - B21D31/00
- B21D35/001—Shaping combined with punching, e.g. stamping and perforating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21D—WORKING OR PROCESSING OF SHEET METAL OR METAL TUBES, RODS OR PROFILES WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21D35/00—Combined processes according to or processes combined with methods covered by groups B21D1/00 - B21D31/00
- B21D35/002—Processes combined with methods covered by groups B21D1/00 - B21D31/00
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Lead Frames For Integrated Circuits (AREA)
Abstract
The invention discloses a kind of processing technologys of semiconductor lead frame, are related to semiconductor power device lead frame processing technique field, specifically comprise the following steps: that (1) rushes outer lead, location hole and partition wall on metal material belt with blanking die in advance；(2) glue hole, molding dovetail one, molding dovetail two are successively gone out on metal material belt with blanking die；(3) cut-parts, square hole and cutting item are rushed in advance on metal material belt with blanking die；(4) lead one, lead two, lead three are gone out on metal material belt with blanking die, and fine is carried out to location hole, partition wall simultaneously；(5) fine is carried out to the outer lead rushed in advance in step S2 on metal material belt with blanking die.The present invention can not only prevent from causing outer lead to distort in outer lead blanking process, and can prevent the both sides flash of semiconductor lead frame partition wall after plastic packaging.
Description
Technical field
The present invention relates to semiconductor power device lead frame processing technique fields, in particular to a kind of semiconductor
The processing technology of lead frame.
Background technique
Half guiding wire frame refers to the contact point for connecting semiconductor integrated block inside chip and the thin plate of outer lead
Metal framework, its raw materials for production are mainly copper volume.There are mainly two types of manufacture craft, Yi Zhongshi for conventional semiconductor lead frame
Lithography, one is mould punching methods.Etching method is to fall a part of material with chemical etches and product is made, and is suitable for more
Small-scale production；Mould punching method is to be made up of the light sheet material of the stamping press punching press indexing transfer of mold, is suitable for more
Large-scale production.Mould punching method generally has following processing step: punching press, surface treatment, cutting molding and inspection piece packaging, punching press
It is exactly that copper sheet strikes out lead frame under the punching press of mold.But existing semiconductor lead frame is carrying out this process of punching press
In, due to the presence in punching press gap, being easy to make punching press to generate in punching course, lead generates distortion, slide surface collapses angle
Problem, and since the distortion of lead, slide surface angle problem of collapsing are easy to influence the use of plastic packaging and lead frame below, so solution
Certainly lead distortion, slide surface angle problem of collapsing is necessary.
Summary of the invention
The purpose of the present invention is to provide a kind of processing technologys of semiconductor lead frame, can not only prevent metal material belt from existing
It carries out in blanking process that lead is distorted, slide surface collapses angle problem, while preventing the prefabricated component after punching there are burrs.
Purpose to realize the present invention, the technical solution of use are as follows: a kind of processing technology of semiconductor lead frame is specific to wrap
Include following steps:
S1: suitable metal material belt is selected according to required product prefabricated component obtained, and by blanking die in metal charge
It takes and goes out identifying hole；
S2: on the basis of step S1, outer lead, location hole and partition wall are carried out in advance on metal material belt with blanking die
Punching；
S3: according to the positioning of location hole, successively gone out on metal material belt with blanking die glue hole, molding dovetail one,
Dovetail two is formed, and pre- trimming is carried out to metal material belt after machine-shaping dovetail two；
S4: on the basis of step S3, cut-parts, square hole and cutting item are carried out in advance on metal material belt with blanking die
Punching；
S5: on the basis of step S4, lead one is gone out on metal material belt with blanking die, lead two, interior is drawn
Line three, and fine is carried out to location hole, partition wall simultaneously；
S6: on the basis of step S5, the outer lead rushed in advance in step S2 is carried out on metal material belt with blanking die
Fine；
S7: on the basis of step S6, with blanking die on metal material belt to the square hole and cut-parts rushed in advance in step S4
Carry out fine；
S8: on the basis of step S7, the cutting item rushed in advance in step S4 is carried out on metal material belt with blanking die
Fine.
Further, the metal material belt width in the above-mentioned steps S1 is greater than twice of product prefabricated component width.
Further, above-mentioned steps 1 in step 7 identifying hole, outer lead, location hole, partition wall, molding dovetail one, at
Type dovetail two, trimming, cut-parts, square hole, cutting item, lead one, lead two, lead three are that bilateral symmetry is arranged.
Further, the product prefabricated component made from the above-mentioned S1-S8 step is placed on production after carrying out cleaning inspection
It is packed and stored on product conveyer belt.
The beneficial effects of the invention are as follows,
By being rushed in advance to outer lead, punching amount of outer lead during fine can not only be effectively reduced, and can have
Effect prevents from causing outer lead to distort in outer lead blanking process；Meanwhile by being rushed in advance to partition wall, make final partition wall in essence
Punching amount during punching is reduced, and the rectangular shape of partition edge after making fine effectively prevent semiconductor lead frame in plastic packaging
The both sides flash of partition wall afterwards.
Detailed description of the invention
Fig. 1 is the material-strap structure schematic diagram of product of the present invention prefabricated component.
Label and corresponding parts title in attached drawing:
1, identifying hole, 2, outer lead, 3, location hole, 4, partition wall, 5, rush glue hole, 6, molding dovetail one, 7, molding dovetail
Two, 8, pre- trimming, 9, cut-parts, 10, square hole, 11, cutting item, 12, lead one, 13, lead two, 14, lead three.
Specific embodiment
The present invention is described in further detail below through specific implementation examples and in conjunction with the accompanying drawings.
A kind of processing technology of semiconductor lead frame provided by the invention, specifically comprises the following steps:
S1: suitable metal material belt is selected according to required product prefabricated component obtained, and by blanking die in metal charge
It takes and goes out identifying hole 1；
S2: on the basis of step S1, with blanking die on metal material belt to outer lead 2, location hole 3 and partition wall 4 into
The pre- punching of row, by being rushed in advance to location hole 3, make the later period to metal material belt can pass through in blanking process location hole 3 into
Row positioning, to keep the punching in later period more accurate, and by the pre- punching to outer lead 2 and partition wall 4, not only can be reduced metal charge
Punching amount of the band in blanking process, and keep the size of prefabricated component more accurate, it prevents after being punched to outer lead 2 and partition wall 4
Metal material belt generates angle of collapsing；By rushing outer lead 2 in advance, effectively prevent outer lead 2 in blanking process due to outer lead 2 it is relatively thin compared with
Outer lead 2 is carefully set to generate distortion, 2 size of outer lead finally gone out is more accurate, and the partition wall 4 rushed in advance can make final molding
Partition wall 4 the rectangular shape in both sides, effectively prevent semiconductor lead frame to generate flash after plastic packaging；
S3: according to the positioning of location hole 3, glue hole 5, molding dovetail one are successively gone out on metal material belt with blanking die
6, dovetail 27 is formed, and pre- trimming 8 is carried out to metal material belt after machine-shaping dovetail 27, by the way that one 6 He of dovetail will be formed
Progresss is opened in 27 points of dovetail of molding, and will form dovetail 1 when going out before molding dovetail 1 and dovetail two be located at pre- trimming 8
After molding dovetail 27, the pre- trimming 8 that the width of metal material belt can become larger, and carry out at this time is according to the metal charge after broadening
On the basis of band, keep subsequent punching more accurate；
S4: on the basis of step S3, with blanking die on metal material belt to cut-parts 9, square hole 10 and cutting item 11 into
The pre- punching of row, enables a step to be completed at the same time the pre- punching to cut-parts 9, square hole 10, cutting item 11, to make entire semiconductor leads
The blank operation of frame is reduced；
S5: on the basis of step S4, gone out on metal material belt with blanking die lead 1, lead 2 13,
Lead 3 14, and fine is carried out to location hole 3, partition wall 4 simultaneously, by by lead 1, lead 2 13, lead three
14 are put into the same step and carry out operation, it is ensured that lead 1, lead 2 13, lead 3 14 width one
It causes, keeps lead 1, lead 2 13, the precision of lead 3 14 higher；
S6: on the basis of step S5, the outer lead 2 rushed in advance in step S2 is carried out on metal material belt with blanking die
Fine enables outer lead 2 while accurately going out, moreover it is possible to make outer lead 2 subsequent to square hole 10, cut-parts 9, cutting item 11
It is flattened during fine, finally makes the outer lead 2 on semiconductor lead frame more smooth；
S7: on the basis of step S6, with blanking die to the square hole 10 that is rushed in advance in step S4 and being cut out on metal material belt
Piece 9 carries out fine；
S8: on the basis of step S7, with blanking die on metal material belt to the cutting item 11 rushed in advance in step S4 into
Row fine, by carrying out fine to cutting item 11.
Fig. 1 is the material-strap structure schematic diagram of the product prefabricated component processed through the above steps, the gold in above-mentioned steps S1
Belong to material strip width to be greater than, and above-mentioned steps 1 are to the identifying hole 1 in step 7, outer lead 2, positioning twice of product prefabricated component width
It is hole 3, partition wall 4, molding dovetail 1, molding dovetail 27, pre- trimming 8, cut-parts 9, square hole 10, cutting item 11, lead 1, interior
Lead 2 13, lead 3 14 are that bilateral symmetry is arranged, and two same material strips for completing entire step are realized disposable
Punching is synchronized to two semiconductor lead frames, greatly improves processing efficiency.It is described to be made by above-mentioned S1-S8 step
Product prefabricated component be placed on product conveyor after cleaning inspection being packed and stored, according to demand, can also clean
After test or be electroplated, keep the product processed more preferable.
The foregoing is only a preferred embodiment of the present invention, is not intended to restrict the invention, for the skill of this field
For art personnel, the invention may be variously modified and varied.All within the spirits and principles of the present invention, made any to repair
Change, equivalent replacement, improvement etc., should all be included in the protection scope of the present invention.
Claims (4)
1. a kind of processing technology of semiconductor lead frame, which is characterized in that specifically comprise the following steps:
S1: suitable metal material belt is selected according to required product prefabricated component obtained, and through blanking die on metal material belt
Go out identifying hole；
S2: on the basis of step S1, outer lead, location hole and partition wall are rushed in advance on metal material belt with blanking die；
S3: according to the positioning of location hole, glue hole, molding dovetail one, molding are successively gone out on metal material belt with blanking die
Dovetail two, and pre- trimming is carried out to metal material belt after machine-shaping dovetail two；
S4: on the basis of step S3, cut-parts, square hole and cutting item are rushed in advance on metal material belt with blanking die；
S5: on the basis of step S4, lead one, lead two, lead three are gone out with blanking die on metal material belt,
And fine is carried out to location hole, partition wall simultaneously；
S6: on the basis of step S5, fine is carried out to the outer lead rushed in advance in step S2 on metal material belt with blanking die；
S7: on the basis of step S6, the square hole and cut-parts that rush in advance in step S4 are carried out on metal material belt with blanking die
Fine；
S8: on the basis of step S7, fine is carried out to the cutting item rushed in advance in step S4 on metal material belt with blanking die.
2. the processing technology of semiconductor lead frame according to claim 1, which is characterized in that the gold in the step S1
Belong to twice that material strip width is greater than product prefabricated component width.
3. the processing technology of semiconductor lead frame according to claim 1, which is characterized in that the step 1 to step 7
In identifying hole, outer lead, location hole, partition wall, molding dovetail one, molding dovetail two, trimming, cut-parts, square hole, cutting item, interior
Lead one, lead two, lead three are that bilateral symmetry is arranged.
4. the processing technology of semiconductor lead frame according to claim 1, which is characterized in that walked by above-mentioned S1-S8
Rapid obtained product prefabricated component be placed on product conveyor after cleaning inspection being packed and stored.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810437977.8A CN108637084B (en) | 2018-05-09 | 2018-05-09 | A kind of processing technology of semiconductor lead frame |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810437977.8A CN108637084B (en) | 2018-05-09 | 2018-05-09 | A kind of processing technology of semiconductor lead frame |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN108637084A CN108637084A (en) | 2018-10-12 |
| CN108637084B true CN108637084B (en) | 2019-06-04 |
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| CN201810437977.8A Active CN108637084B (en) | 2018-05-09 | 2018-05-09 | A kind of processing technology of semiconductor lead frame |
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Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110120378B (en) * | 2019-05-16 | 2020-08-25 | 宁波港波电子有限公司 | Material-saving lead frame and manufacturing method thereof |
| CN110277319B (en) * | 2019-06-19 | 2022-04-19 | 泰州东田电子有限公司 | Manufacturing method of lead frame of profiled bar |
| CN110465587B (en) * | 2019-08-21 | 2020-10-30 | 四川金湾电子有限责任公司 | Power device double-strip stamping die sample arrangement method |
| CN113967692A (en) * | 2021-10-22 | 2022-01-25 | 吴江翔实模具有限公司 | Stamping manufacturing process of SMA-400 lead frame |
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| US8716069B2 (en) * | 2012-09-28 | 2014-05-06 | Alpha & Omega Semiconductor, Inc. | Semiconductor device employing aluminum alloy lead-frame with anodized aluminum |
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| CN101294694A (en) * | 2008-05-13 | 2008-10-29 | 济南晶恒山田电子精密科技有限公司 | Power type LED lead frame piece and process technique thereof |
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| CN108637084A (en) | 2018-10-12 |
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Denomination of invention: Processing technology of a semiconductor lead frame Effective date of registration: 20230216 Granted publication date: 20190604 Pledgee: Chengdu SME financing Company Limited by Guarantee Pledgor: SICHUAN JINWAN ELECTRONIC Co.,Ltd. Registration number: Y2023980032666 |