CN206541854U - A kind of LED substrates film sticking apparatus - Google Patents
A kind of LED substrates film sticking apparatus Download PDFInfo
- Publication number
- CN206541854U CN206541854U CN201720184250.4U CN201720184250U CN206541854U CN 206541854 U CN206541854 U CN 206541854U CN 201720184250 U CN201720184250 U CN 201720184250U CN 206541854 U CN206541854 U CN 206541854U
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- Prior art keywords
- film sticking
- plate
- pad pasting
- led substrates
- bearing
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Abstract
The utility model discloses a kind of LED substrates film sticking apparatus, it is related to semiconductor packages scribing processing technique field.It includes upper die component, positioning mould component, lower mold assemblies.Some groups of rolling posts for being used to compress pad pasting are evenly arranged with the upper die component, the upper die component both sides are provided with the rolling bearing slided along positioning module slide rail, positioning module both sides are provided with guide rail, the lower mold assemblies are provided with pad pasting bottom plate, pad pasting bottom plate passes through seat supports, optical axis is provided with bearing, positioning module is moved by linear bearing on optical axis.A kind of LED substrates film sticking apparatus of the present utility model, relative to traditional artificial pad pasting, the positioning precision of pad pasting is improved, can fit the high viscosity film in crash with LED substrate membranes uniform firm, bubble-free, improve the degree of accuracy and the scribing quality of follow-up scribing processes image recognition, the apparatus structure is simple, and easy to operate, can place multilayer LED substrate on film sticking plate simultaneously, polydisc pad pasting, pad pasting efficiency high can be carried out.
Description
Technical field：
The utility model is related to semiconductor and LED encapsulation fields, more particularly to a kind of LED substrates film sticking apparatus.
Background technology：
In recent years, LED uses more and more extensive as a kind of green light source product of new energy-saving and environmental protection, necessarily
The trend of future development.LED manufactures mainly have three links：Growth, chip manufacturing and the encapsulation of emitting semiconductor epitaxial wafer.Half
Conductor cutting is to encapsulate one of important procedure in link., it is necessary to first by chip in manufacture semiconductor and the process of LED encapsulation
It is grown on substrate, is then cut again, it is last independently to separate.
Traditional cutting technique flow includes：LED substrates are first subjected to press mold, pressed after then carrying out baking softening with hand
Make its smooth, then patch UV adhesive tapes are carried out to LED substrates, then the substrate for posting UV adhesive tapes is accurately affixed on by craft be provided with
High viscosity film collapses corresponding position on frame, finally the LED substrates for posting film is installed on scribing workbench, then pass through image
Cut after identification alignment.
LED substrates are mounted on the positional accuracy collapsed on frame, and to directly affect follow-up scribing processes image automatic identification accurate
Property, traditional pad pasting is, by one piece of template, LED substrates to be placed in template groove, then will post the crash of high viscosity film by
It is pressed onto in template groove and carries out pad pasting, due to the possible buckling deformation of LED substrates, and notch is placed with LED substrates possible manually than shallower
Generation play, will cause pad pasting position inaccurate, have a strong impact on the efficiency and accuracy of follow-up scribing processes image automatic identification,
Pad pasting efficiency is low simultaneously.Especially it is to be directed to existing Full Auto Dicing Saw operating mode, the accuracy of pad pasting directly affects image knowledge
Do not find the efficiency of cutting-up original position accurately, and then directly affect dicing efficiency, and pad pasting amount is big, labor intensity is big.Therefore urgently
Further improve, design a kind of LED substrates film sticking apparatus, come realize LED substrates efficiently, accurately pad pasting.
Utility model content：
The purpose of this utility model is to provide a kind of LED substrates film sticking apparatus, can effectively avoided because of traditional pad pasting
Position is inaccurate to cause during cutting-up image automatic identification to look for that cutting-up original position efficiency is low, pad pasting labor intensity is big etc. to ask
Topic.
To solve the above problems, the technical solution of the utility model is：
A kind of LED substrates film sticking apparatus, including upper die component, positioning mould component, lower mold assemblies；The upper die component includes
It is connected between roller support, roller support on the outside of rolling post, both sides roller support and rolling member is installed；The positioning module
Part includes location-plate, and location-plate is provided with the guide rail coordinated with rolling member；The lower surface of location-plate is fixed with locating dowel；Location-plate
Upper surface it is convex be formed with crash coordinate posting, location-plate periphery is fixed with linear bearing；The lower mold assemblies bag
Include the film sticking plate that some placement LED substrates are provided with pad pasting bottom plate, pad pasting bottom plate；It is formed with and matches somebody with somebody with locating dowel on pad pasting bottom plate
The positioning hole of conjunction；The light for being fixed with and coordinating with linear bearing on the bearing coordinated with optical axis, bearing is fixed with below pad pasting bottom plate
Spring is arranged with outside axle, optical axis；Posting internal shaping has some positioning chambers coordinated with film sticking plate.
Further to improve, the roller support is connected by connecting rod of support.
Further to improve, the rolling member is to be fixed with bearing rod on the outside of rolling bearing, both sides roller support；Roll
Bearing is fixed on bearing rod.
Further to improve, the rolling bearing is fixed on roller support by jump ring.
It is further to improve, locating piece is fixed with the location-plate, locating piece is on the outside of posting；Posting is with determining
Position block coordinates to be positioned to crash.
It is further to improve, it is provided with guide rail step on the guide rail；The guide rail includes right rail and left rail；
Right rail and left rail are bolted on location-plate；Linear bearing and locating dowel threaded connection are fixed on location-plate
On.
Further to improve, the positioning hole is arranged on the corner on the outside of film sticking plate.
Further to improve, the film sticking plate is rubber blanket；Rubber blanket is bolted on pad pasting bottom plate；Bearing spiral shell
Line is fixed on pad pasting bottom plate；Optical axis is threadedly secured on bearing.
Further to improve, the crash includes high viscosity film, and high viscosity film upper surface is adhesive with steel ring.
Further to improve, the film sticking plate is fixed in the locating slot that locating dowel is surrounded, it is ensured that accurate positioning.
Advantage of the present utility model and effective rights and interests are：A kind of LED substrates film sticking apparatus of the present utility model, relative to
Traditional artificial pad pasting, improves the positioning precision of pad pasting, and the high viscosity film in crash can be fitted uniformly with LED substrate membranes
Firmly, bubble-free, improves the accuracy and scribing quality of follow-up scribing processes image recognition, and the apparatus structure is simple, and behaviour
Facilitate, multilayer LED substrate can be placed on film sticking plate simultaneously, polydisc pad pasting, pad pasting efficiency high can be carried out.And be finally reached and carry
High product yields, reduces the purpose of production cost.
Brief description of the drawings：
Fig. 1 device dimensional structure diagrams of the present utility model；
Fig. 2 upper die component structural representations of the present utility model；
Fig. 3 is positioning mould component structural representation of the present utility model；
Fig. 4 is lower mold assemblies structural representation of the present utility model；
In figure：
1- upper die components；
101- roller supports；102- support head rods；The connecting rod of 103- supports second；104- rolls post；105- axles
Hold bar；106- rolling bearings；107- jump rings；
2- positioning mould components；
201- location-plates；202- right rails；203- left rails；204- locating dowels；205- linear bearings；206- bullets
Spring；207- locating pieces；208- postings；209- positioning chambers；210- guide rail steps；
3- lower mold assemblies；301- pad pasting bottom plates；302- rubber blankets；303- positioning holes；
4-LED substrates；5- optical axises；6- bearings；7- crashes.
Embodiment：
A kind of LED substrates film sticking apparatus, as shown in Figures 1 to 4, it includes upper die component, positioning mould component, lower module
Part.Some groups of rolling posts for being used to compress pad pasting are evenly arranged with the upper die component, rolling post passes through spiral shell with roller support
Line is connected；The upper die component both sides are provided with the rolling bearing slided along positioning module slide rail, and rolling bearing passes through jump ring end
Face is positioned on bearing rod.The roller support of upper die component is connected by connecting rod of support；Connecting rod of support includes support
Head rod and the connecting rod of support second；Connecting rod of support one end is internal thread, and the other end is external screw thread；Connecting rod of support with
Roller support is threadedly coupled.
The positioning module both sides are provided with guide rail, the upper die component can by rolling bearing leading on positioning module
Moved back and forth on rail, the lower mold assemblies are provided with film sticking plate, the film sticking plate is used to place LED substrates, and it is fixed that LED substrates pass through
The locating dowel set on the downside of the plate of position is positioned with film sticking plate entirely accurate, and film sticking plate downside surrounding passes through four bearing branch
Optical axis is provided with support, bearing, the positioning module can be moved by linear bearing on optical axis.
Specific pad pasting process：The LED substrates after press mold are positioned on the film sticking plate of lower module first, by location-plate
Some locating dowels set are accurately positioned, and the rolling bearing of upper die component are pushed on guide rail step, then will post high viscosity film
Crash be positioned on the location-plate on positioning module, positioned by locating piece and posting, then by upper module rolling bearing
It is pushed on guide rail horizontal stand, passes through the rolling for controlling the positioning module for being loaded with upper die component to be moved downwardly until on upper module manually
Post touches the LED substrates on film sticking plate, and positioning module is pressed down on a hand, then promotes upper mould with the pressing of another hand
Group makes it be moved back and forth on two side rails horizontal segments of positioning module, and upper module rolling bearing is pushed into by return rolling afterwards several times
On guide rail step,
The crash for posting film is taken out, then again alveolate place is disposed by scraper plate, one piece of crash 8 is completed
The pad pasting of LED substrates, takes out the crash for having pasted film, second crash pad pasting can be carried out according still further to above-mentioned steps.
Preferred embodiment of the present utility model is the foregoing is only, it is all at this not to limit the utility model
Any modifications, equivalent substitutions and improvements made within the spirit and principle of utility model etc., should be included in the utility model
Protection domain within.
Claims (10)
1. a kind of LED substrates film sticking apparatus, it is characterised in that including upper die component (1), positioning mould component (2), lower mold assemblies
(3)；The upper die component includes being connected with rolling post (104), both sides roller bearing between roller support (101), roller support (101)
Support is provided with rolling member on the outside of (101)；The positioning mould component (2) includes location-plate (201), and location-plate is set on (201)
There is the guide rail coordinated with rolling member；The lower surface of location-plate (201) is fixed with locating dowel (204)；The upper surface of location-plate (201)
Convex to be formed with the posting (208) coordinated with crash (7), location-plate (201) periphery is fixed with linear bearing (205)；It is described
Lower mold assemblies (3) include the film sticking plate that some placement LED substrates (4) are provided with pad pasting bottom plate (301), pad pasting bottom plate (301)；
The positioning hole (303) coordinated with locating dowel (204) is formed with pad pasting bottom plate (301)；Be fixed with below pad pasting bottom plate (301) with
The optical axis (5) coordinated with linear bearing (205), optical axis (5) overcoat are fixed with the bearing (6) that optical axis (5) coordinates, bearing (6)
Provided with spring (206)；Posting (208) internal shaping has some positioning chambers (209) coordinated with film sticking plate.
2. LED substrates film sticking apparatus as claimed in claim 1, it is characterised in that the roller support (101) is connected by support
Extension bar is connected.
3. LED substrates film sticking apparatus as claimed in claim 1, it is characterised in that the rolling member is rolling bearing (106),
Bearing rod (105) is fixed with the outside of both sides roller support (101)；Rolling bearing (106) is fixed on bearing rod (105).
4. LED substrates film sticking apparatus as claimed in claim 3, it is characterised in that the rolling bearing (106) passes through jump ring
(107) it is fixed on roller support (101).
5. LED substrates film sticking apparatus as claimed in claim 1, it is characterised in that be fixed with positioning on the location-plate (201)
Block (207), locating piece (207) is on the outside of posting (208)；Posting (208) coordinates to crash (7) with locating piece (207)
Positioned.
6. LED substrates film sticking apparatus as claimed in claim 1, it is characterised in that guide rail step is provided with the guide rail
(210)；The guide rail includes right rail (202) and left rail (203)；Right rail (202) and left rail (203)
It is bolted on location-plate (201)；Linear bearing (205) and locating dowel (204) threaded connection are fixed on location-plate
(201) on.
7. LED substrates film sticking apparatus as claimed in claim 1, it is characterised in that the positioning hole (303) is arranged on film sticking plate
The corner in outside.
8. LED substrates film sticking apparatus as claimed in claim 1, it is characterised in that the film sticking plate is rubber blanket (302)；Rubber
Rubber cushion (302) is bolted on pad pasting bottom plate (301)；Bearing (6) is threadedly secured on pad pasting bottom plate (301)；Optical axis
(5) it is threadedly secured on bearing (6).
9. LED substrates film sticking apparatus as claimed in claim 1, it is characterised in that the crash (7) includes high viscosity film, high
Adhesive film upper surface is adhesive with steel ring.
10. LED substrates film sticking apparatus as claimed in claim 1, it is characterised in that the film sticking plate is fixed on locating dowel
(204) in the locating slot surrounded.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720184250.4U CN206541854U (en) | 2017-02-28 | 2017-02-28 | A kind of LED substrates film sticking apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720184250.4U CN206541854U (en) | 2017-02-28 | 2017-02-28 | A kind of LED substrates film sticking apparatus |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206541854U true CN206541854U (en) | 2017-10-03 |
Family
ID=59949474
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720184250.4U Active CN206541854U (en) | 2017-02-28 | 2017-02-28 | A kind of LED substrates film sticking apparatus |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206541854U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106856219A (en) * | 2017-02-28 | 2017-06-16 | 长沙华腾智能装备有限公司 | A kind of LED substrates film sticking apparatus |
-
2017
- 2017-02-28 CN CN201720184250.4U patent/CN206541854U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106856219A (en) * | 2017-02-28 | 2017-06-16 | 长沙华腾智能装备有限公司 | A kind of LED substrates film sticking apparatus |
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