CN101772268A - Technology for aligning circuit board by PIN nail - Google Patents
Technology for aligning circuit board by PIN nail Download PDFInfo
- Publication number
- CN101772268A CN101772268A CN200910189256A CN200910189256A CN101772268A CN 101772268 A CN101772268 A CN 101772268A CN 200910189256 A CN200910189256 A CN 200910189256A CN 200910189256 A CN200910189256 A CN 200910189256A CN 101772268 A CN101772268 A CN 101772268A
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- pin nail
- film
- circuit board
- location hole
- pin
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Abstract
The invention discloses technology for aligning a circuit board by a PIN nail, and belongs to the field of manufacture of circuit boards. The technology comprises the following steps: (A) drawing patterns to be transferred on a film on which a processing line and a molding line are set; (B) forming a PIN nail positioning hole at the corner position of the processing line, wherein one side has 1 to 3 holes more than the other sides; (C) arranging the PIN nail in the PIN nail positioning hole; (D) forming a film window at the edge position of 2 to 5mm of the PIN nail hole and adhering a gummed paper, and sealing the sides of the film; and (E) performing aligned production of the circuit board according to the PIN nail. By adopting the technology, the circuit boards can be directly produced by using a black film without copying the black film into a yellow film and substantial cost can be saved. Due to the adoption of the technology for aligning the circuit board by the PIN nail, the efficiency can be improved to 80 to 90 pnl per hour. Due to the adoption of the PIN nail, the operating difficulty for aligning personnel is reduced greatly.
Description
Technical field
The invention belongs to the wiring board processing technique field, especially relate to the processing technology of the wiring board of a kind of PIN of employing nail contraposition.
Background technology
Multilayer printed circuit board is in the develop rapidly of electron trade, play the important and pivotal role, and when making multilayer circuit board, then need Copper Foil (Copper Foil), core material group after film (Prepreg) and the oxidation processes (Oxidation) is pressed into multilager base plate, its pressing flow process is mainly internal layer oxidation processes, lamination (Lay-up), pressing, reprocessing, and in lamination (Lay-up) process, the contraposition of core material group then is most important.Multilayer printed circuit board is when carrying out multilayer core material group pressing lamination (Lay-up) operation, traditional way is carried out lamination for the edges of boards contraposition of utilization printed substrate core material group, the method contingency often irregular because of edges of boards or operation causes the many groups core material group contraposition on core material group and other each layer steel plate inaccurate, the generation thickness of slab is inconsistent, quality defect problems such as the white angle of white edge.And traditional contraposition mode can only adopt the carrier of the yellow film as figure, with the manual alignment mode with the figure transfer of wiring board to the PCB substrate that light-sensitive surface is arranged, be difficult to accomplish accurate location.And during for the selection of the film, must be copied into the yellow film and carry out just finishing subsequent technique after the pad pasting protection with the black film, operation is more complicated also, and processing cost also can be very high.
Summary of the invention
The object of the present invention is to provide a kind of employing PIN nail contraposition circuit board technique, solve the defective that prior art exists.
For achieving the above object, the present invention adopts following technical scheme:
A kind of PIN nail contraposition circuit board technique comprises the steps:
(A) film that will set processing line and form wire is drawn the good pattern that needs transfer;
(B) make PIN nail location hole at described processing line angle position, wherein have more 1～3 hole than all the other every limits on one side;
(C) the PIN nail is installed to PIN nail location hole;
(D) open film window and rubberizing paper at PIN nail 2～5mm place, bore edges position, the film is carried out edge sealing;
(E) carrying out the wiring board contraposition according to the PIN nail produces.
Preferred scheme is: the described film of described step (A) is the black film, and film medicine face is for anti-literal; The described black film posts film diaphragm.
More preferred scheme is: described step (B) processing line is a rectangle, makes PIN nail location hole at corner location, Yi Bian wherein be 3 PIN nail location holes, its excess-three limit is 2 PIN nail location holes; Described hole internal diameter is 0.8～1.3mm; Described each limit PIN nail location hole is an asymmetric design.
More preferred scheme is: the distance between described PIN nail location hole center and the long edge forming line is 4～10mm, near the PIN nail location hole center of minor face form wire and the distance of minor face form wire is 25～35mm, and described PIN nail location hole pitch of holes is 4～8mm.
More preferred scheme is: the device that described step (B) is made PIN nail location hole is the high accuracy target-shooting machine, the target practice deviation is+/-2mil.
More preferred scheme is: described wiring board thickness of slab 〉=1.20mm.
The present invention compared with prior art has following advantage and beneficial effect:
The present invention adopts PIN nail contraposition technology can realize wiring board is precisely located, and is applied in the processing of film transfer printing or multilayer circuit board.Traditional manual alignment needs confirm film location with control board mesopore position, and black-film can't be seen the position, hole, and the pornographic movie color is light slightly and visual stronger, so manual alignment must the yellow film; And adopt PIN of the present invention to follow closely to locate, do not need control board mesopore position to confirm film location, can directly use black film production, need not the black film is copied into the yellow film, can save great amount of cost.Adopt PIN nail contraposition technology of the present invention, efficient can be mentioned to 80～90pnl/h, owing to adopted the PIN nail, reduces contraposition personnel's operation easier greatly.In order to make the film and PCB substrate, perhaps realize precisely location between the multilayer circuit board, distance design by optimizing between PIN location hole of the present invention and the form wire; In order to prevent that PIN nail registration holes from occurring wrong or to instead, process using of the present invention PIN nail registration holes asymmetrical design; In order to prevent coming off of in contraposition process PIN nail, process using of the present invention near PIN nail hole, open fixedly figure of film window rubberizing paper, and, the film has been adopted the edge sealing design to being in the process; In order to realize that height locatees accurately, process using high accuracy target-shooting machine of the present invention punches, and can not cause burr.
Embodiment
Below in conjunction with specific embodiment the present invention is described in further details:
A kind of outer-layer circuit PIN nail contraposition technology:
Instrument/data design
1.PIN nail specification and production capacity
A.PIN follows closely specification:
* 1.2 * 1.0mm (nail column diameter 1.0mm);
The b.PIN nail is produced plate thickness and is required: thickness of slab 〉=1.20mm; Prevent that the following thickness of slab of 1.20mm from easily with reverse side film jack-up, influencing contraposition.
2. drilling data design
A. increase by 9 PIN nail location holes altogether at board-splicing process by using line corner location long side direction, boring and chewing diameter is 1.10mm, and wherein one side is 3, each 2 on other three limit;
Spacing 4mm at least between b.PIN nail location hole center and the long side direction form wire, near the about 30mm of spacing between the PIN nail location hole of minor face form wire and the minor face form wire, PIN follows closely the location hole pitch of holes and is designed to 6mm;
C.PIN nail location hole design section must be avoided other tooling hole, avoids PIN nail location hole and other tooling hole repeated hole or influences the tooling hole function.
3. film design
When a. producing directly with black-film production (film medicine face is for anti-literal);
B. circuit film PIN nail position of positioning hole designs according to the drilling data
Solid target spot, the periphery design external diameter
Internal diameter
Shading ring;
C. egative film useful life: 1400-1800 time, the film is drawn and all need be pasted film diaphragm after the passed examination and handle.
4. production method
A. production procedure: light is painted the rubberizing paper/film edge sealing-contraposition production of windowing of the film-film inspection/pasting protective film-beat PIN nail registration holes-PIN nail installation-film;
B.PIN nail hole requires: to the design of PIN nail, adopt asymmetrical design, selections of must staggering when selecting PIN nail registration holes, prevent because of the symmetrical contraposition of PIN nail registration holes to instead; Beat PIN nail registration holes by the punching of high accuracy target-shooting machine, press during target practice that the film designs
The punching of solid target spot, the precision of described " high accuracy target-shooting machine " roughly require+/-0.025mm; The target practice deviation must be controlled at+/-2mil;
C. production operation requires: for preventing that the PIN nail comes off in the contraposition process, the film must be near PIN follows closely the hole, and (preferred distance is 2～5mm) to window rubberizing paper with fixing figure.
Adopt above-mentioned material and explained hereafter wiring board as shown in table 1 thereof, the result all finds no off normal and phenomenon such as ill-exposed.
Table 1 is produced follow-up and quality status
| The production model | Quantity | The jigsaw size | Minimum weld-ring | Produce quality status |
| ??191-BH025069B2 | ??84pnl | ??546*475mm | ??0.20mm | Do not find off normal/ill-exposed phenomenon |
| ??663-BE020794B1 | ??71pnl | ??520*400mm | ??0.18mm | Do not find off normal/ill-exposed phenomenon |
| ??166-BC034318A1 | ??54pnl | ??470*300mm | ??0.15mm | Do not find off normal/ill-exposed phenomenon |
| ??309-DL030043C1 | ??100pnl | ??440*415mm | ??0.12mm | Do not find off normal/ill-exposed phenomenon |
| ??802-FL031900A1 | ??264pnl | ??520*415mm | ??0.11mm | Do not find off normal/ill-exposed phenomenon |
| ??663-FL036175A1 | ??59pnl | ??580*520mm | ??0.09mm | Do not find off normal/ill-exposed phenomenon |
| ??970-DC035259A1 | ??60pnl | ??450*249mm | ??0.18mm | Do not find off normal/ill-exposed phenomenon |
| ??309-FC030399A3 | ??28pnl | ??470*395mm | ??0.13mm | Do not find off normal/ill-exposed phenomenon |
| ??700-DL035116A1 | ??49pnl | ??574*440mm | ??0.24mm | Do not find off normal/ill-exposed phenomenon |
| ??159-BL035672A1 | ??85pnl | ??622*347mm | ??0.24mm | Do not find off normal/ill-exposed phenomenon |
| ??309-DH031170A1 | ??33pnl | ??612*501mm | ??0.18mm | Do not find off normal/ill-exposed phenomenon |
| ??663-DC036142A1 | ??86pnl | ??600*500mm | ??0.17mm | Do not find off normal/ill-exposed phenomenon |
| ??668-DH036139A1 | ??26pnl | ??570*520mm | ??0.145mm | Do not find off normal/ill-exposed phenomenon |
| ??929-DC034373A1 | ??77pnl | ??622*313mm | ??0.23mm | Do not find off normal/ill-exposed phenomenon |
| ??800-DS032846A2 | ??36pnl | ??586*446mm | ??0.14mm | Do not find off normal/ill-exposed phenomenon |
Adopt the described technology of present embodiment, as shown in table 2 with the efficient contrast of traditional handicraft, the result shows, adopts the technology of this enforcement, can obviously raise the efficiency, and save cost.
In the present embodiment, Yi Bian wherein be 3 PIN nail location holes, its excess-three limit is that 2 PIN nail location holes help distinguishing the plate direction.Distance between optimal design PIN nail location hole center and the long edge forming line can prevent: the easy perk in film angle influences contraposition when far away excessively, crosses closely easily to overlap with other hole of edges of boards.
Table 2 production operation and cost contrast
| Sequence number | Classification | PIN follows closely contraposition | Manual alignment |
| ??1 | Production efficiency | 80-90pnl/ hour | Average 41pnl/ hour |
| ??2 | The technical ability requirement | Un-skilled requirement only needs during production the PIN nail is pressed in the PIN nail hole; | Production skills requires high, needs during production to help with the auxiliary contraposition of magnifying glass; |
| ??3 | Production cost | Use black-film production, in 20*24 " size, can save about 38 yuan/cover | Produce with the pornographic movie pasting protective film |
Above content be in conjunction with concrete preferred implementation to further describing that the present invention did, can not assert that concrete enforcement of the present invention is confined to these explanations.For the general technical staff of the technical field of the invention, without departing from the inventive concept of the premise, can also make some simple deduction or replace, all should be considered as belonging to protection scope of the present invention.
Claims (6)
1. a PIN nail contraposition circuit board technique comprises the steps:
(A) film that will set processing line and form wire is drawn the good pattern that needs transfer;
(B) make PIN nail location hole at described processing line angle position, wherein have more 1～3 hole than all the other every limits on one side;
(C) the PIN nail is installed to PIN nail location hole;
(D) open film window and rubberizing paper at PIN nail 2～5mm place, bore edges position, the film is carried out edge sealing;
(E) carrying out the wiring board contraposition according to the PIN nail produces.
2. PIN nail contraposition circuit board technique as claimed in claim 1 is characterized in that:
The described film of described step (A) is the black film, and film medicine face is for anti-literal; The described black film posts film diaphragm.
3. PIN nail contraposition circuit board technique as claimed in claim 2 is characterized in that:
Described step (B) processing line is a rectangle, makes PIN nail location hole at corner location, Yi Bian wherein be 3 PIN nail location holes, its excess-three limit is 2 PIN nail location holes; Described hole internal diameter is 0.8～1.3mm; Described each limit PIN nail location hole is an asymmetric design.
4. PIN nail contraposition circuit board technique as claimed in claim 3, it is characterized in that: the distance between described PIN nail location hole center and the long edge forming line is 4～10mm, near the PIN nail location hole center of minor face form wire and the distance of minor face form wire is 25～35mm, and described PIN nail location hole pitch of holes is 4～8mm.
5. PIN nail contraposition circuit board technique as claimed in claim 2 is characterized in that:
The device that described step (B) is made PIN nail location hole is the high accuracy target-shooting machine, the target practice deviation is+/-2mil.
6. as each described PIN nail contraposition circuit board technique of claim 1-5, it is characterized in that:
Described wiring board thickness of slab 〉=1.20mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200910189256A CN101772268A (en) | 2009-12-22 | 2009-12-22 | Technology for aligning circuit board by PIN nail |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200910189256A CN101772268A (en) | 2009-12-22 | 2009-12-22 | Technology for aligning circuit board by PIN nail |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101772268A true CN101772268A (en) | 2010-07-07 |
Family
ID=42504725
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN200910189256A Pending CN101772268A (en) | 2009-12-22 | 2009-12-22 | Technology for aligning circuit board by PIN nail |
Country Status (1)
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|---|---|
| CN (1) | CN101772268A (en) |
Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102253612A (en) * | 2011-06-24 | 2011-11-23 | 胜华电子（惠阳）有限公司 | Aligning method for dry films |
| CN102682177A (en) * | 2012-05-17 | 2012-09-19 | 梅州市志浩电子科技有限公司 | System and method for manufacturing printed circuit board |
| CN102686032A (en) * | 2012-06-08 | 2012-09-19 | 镇江华印电路板有限公司 | Method for improving exposure vacuumizing of circuit board |
| CN102724821A (en) * | 2012-06-15 | 2012-10-10 | 高德（无锡）电子有限公司 | Stamping process of halogen-free and lead-free multi-layer precise circuit board for digital camera |
| CN102883557A (en) * | 2012-10-17 | 2013-01-16 | 厦门爱谱生电子科技有限公司 | Production process improvement method of flexible printed circuit board containing welding finger |
| CN103025069A (en) * | 2012-11-21 | 2013-04-03 | 广东依顿电子科技股份有限公司 | Method for improving outer pattern layer contraposition precision by virtue of exposure PIN pins |
| CN103096645A (en) * | 2011-10-27 | 2013-05-08 | 深南电路有限公司 | Lamination positioning method of multilayer circuit board |
| CN103220889A (en) * | 2013-04-15 | 2013-07-24 | 深圳崇达多层线路板有限公司 | Method for manufacturing oversize printed circuit board (PCB) back plate inner layer |
| CN103345132A (en) * | 2013-06-25 | 2013-10-09 | 惠州中京电子科技股份有限公司 | Method for aligning outer layer film PIN nails |
| CN105392298A (en) * | 2015-11-09 | 2016-03-09 | 四川普瑞森电子有限公司 | Manufacturing method using black film to align film directly |
| CN105792529A (en) * | 2016-04-08 | 2016-07-20 | 梅州市中联精密电子有限公司 | Loose-leaf type circuit board Pin nail counterpoint technology |
| CN106659109A (en) * | 2017-01-13 | 2017-05-10 | 尹乐琼 | Combining arrangement device for multiple kinds of boards |
| CN113836860A (en) * | 2021-09-23 | 2021-12-24 | 苏州悦谱半导体有限公司 | Drilling data analysis method for industrial graphic computer-aided manufacturing |
-
2009
- 2009-12-22 CN CN200910189256A patent/CN101772268A/en active Pending
Cited By (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102253612A (en) * | 2011-06-24 | 2011-11-23 | 胜华电子（惠阳）有限公司 | Aligning method for dry films |
| CN103096645A (en) * | 2011-10-27 | 2013-05-08 | 深南电路有限公司 | Lamination positioning method of multilayer circuit board |
| CN102682177A (en) * | 2012-05-17 | 2012-09-19 | 梅州市志浩电子科技有限公司 | System and method for manufacturing printed circuit board |
| CN102686032A (en) * | 2012-06-08 | 2012-09-19 | 镇江华印电路板有限公司 | Method for improving exposure vacuumizing of circuit board |
| CN102724821B (en) * | 2012-06-15 | 2014-10-01 | 高德（无锡）电子有限公司 | Stamping process of halogen-free and lead-free multi-layer precise circuit board for digital camera |
| CN102724821A (en) * | 2012-06-15 | 2012-10-10 | 高德（无锡）电子有限公司 | Stamping process of halogen-free and lead-free multi-layer precise circuit board for digital camera |
| CN102883557A (en) * | 2012-10-17 | 2013-01-16 | 厦门爱谱生电子科技有限公司 | Production process improvement method of flexible printed circuit board containing welding finger |
| CN102883557B (en) * | 2012-10-17 | 2015-06-03 | 厦门爱谱生电子科技有限公司 | Production process improvement method of flexible printed circuit board containing welding finger |
| CN103025069A (en) * | 2012-11-21 | 2013-04-03 | 广东依顿电子科技股份有限公司 | Method for improving outer pattern layer contraposition precision by virtue of exposure PIN pins |
| CN103220889B (en) * | 2013-04-15 | 2016-01-20 | 深圳崇达多层线路板有限公司 | Layer manufacturing method thereof in a kind of oversize PCB backboard |
| CN103220889A (en) * | 2013-04-15 | 2013-07-24 | 深圳崇达多层线路板有限公司 | Method for manufacturing oversize printed circuit board (PCB) back plate inner layer |
| CN103345132A (en) * | 2013-06-25 | 2013-10-09 | 惠州中京电子科技股份有限公司 | Method for aligning outer layer film PIN nails |
| CN103345132B (en) * | 2013-06-25 | 2016-01-20 | 惠州中京电子科技股份有限公司 | A kind of outer film PIN follows closely the method for contraposition |
| CN105392298A (en) * | 2015-11-09 | 2016-03-09 | 四川普瑞森电子有限公司 | Manufacturing method using black film to align film directly |
| CN105792529A (en) * | 2016-04-08 | 2016-07-20 | 梅州市中联精密电子有限公司 | Loose-leaf type circuit board Pin nail counterpoint technology |
| CN106659109A (en) * | 2017-01-13 | 2017-05-10 | 尹乐琼 | Combining arrangement device for multiple kinds of boards |
| CN113836860A (en) * | 2021-09-23 | 2021-12-24 | 苏州悦谱半导体有限公司 | Drilling data analysis method for industrial graphic computer-aided manufacturing |
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Application publication date: 20100707 |