CN203826353U - Semiconductor lead frame production line - Google Patents
Semiconductor lead frame production line Download PDFInfo
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- CN203826353U CN203826353U CN201420209020.5U CN201420209020U CN203826353U CN 203826353 U CN203826353 U CN 203826353U CN 201420209020 U CN201420209020 U CN 201420209020U CN 203826353 U CN203826353 U CN 203826353U
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Abstract
The utility model relates to a semiconductor lead frame production line which includes a first feeder, a first punch, a second feeder, a surface treatment bed, a third feeder and a second punch which are disposed in sequence. A forming mold is installed on the first punch. A cut-off forming mold is installed on the second punch. The surface treatment bed comprises a bracket and a bed body. The bed body is disposed on the bracket. An electrolytic degreasing area, a three-level washing area, an acid activation area, a four-level washing area, a nickel plating area, a three-level washing area, an alkaline copper plating area, a three-level washing area, an acid copper plating area, a three-level washing area, a pre-silver plating area, a three-level washing area, a silver plating area, a three-level washing area, a silver retreat area, a three-level washing area, a protection solution plating area, a three-level washing area and a drying area are disposed in sequence from left to right on the bed body. According to the utility model, the semiconductor lead frame is strong in plating adhesion force, difficult to fall and long in service life.
Description
Technical field
The utility model relates to a kind of semiconductor lead frame manufacturing equipment, especially utilizes the production line of mould punching legal system manufacturing semiconductor lead frame.
Background technology
Half guide wire framework refers to for connecting the contact point of semiconductor integrated block inside chip and the thin-sheet metal framework of outer lead, and its raw materials for production are mainly copper volumes.Conventional semiconductor lead frame mainly contains two kinds of manufacture crafts, a kind of etching method, and a kind of is mould punching method.Etching method is to etch away a part for material and make product by chemical substance, is applicable to small-scale production more; Mould punching method, is that the light sheet material of the stamping press punching press indexing transfer by mould is made, and is applicable to large-scale production more.Mould punching method generally has following processing step: punching press, surface treatment, cut-out moulding and inspection sheet packing, and punching press is exactly that copper sheet strikes out lead frame under the punching press of mould; Surface treatment is the lead frame of moulding to be carried out to the techniques such as silver-plated copper facing; Cutting off moulding is that the lead frame linking together is cut into single lead frame, and these lead frames are smoothed; Inspection sheet packing is tested to the complete lead frame of each moulding exactly, removes defect ware, and qualified product is packed and deposited.
Publication number is CN101314832, semiconductor lead frame that the Chinese utility model patent application that open day is on December 3rd, 2008 discloses a kind of ferroalloy materials, made by ferroalloy materials and preparation method thereof, comprises the steps: to provide the plate body of being made by ferroalloy materials; Plate body is processed as to semiconductor lead frame; Copper electroplating processes is carried out in the surface of semiconductor lead frame; Nickel electroplating processes is carried out in the surface of semiconductor lead frame; Copper plating treatment the utility model is carried out in the surface of semiconductor lead frame and solved the easy diastrophic problem of semiconductor lead frame, reduce semiconductor lead frame prepared by the use amount of precious metal and possess the combination properties such as high strength, high conduction, high heat conduction and good solderability, corrosion resistance, plastic packaging, non-oxidizability.But the production technology that this utility model provides is when carrying out surface treatment to semiconductor lead frame, in nickel plating, copper facing with when silver-plated, treatment process is fairly simple, the copper plating, nickel and silver are due to the existence of impurity, adhesive force is poor, during use, may occur that coating drops, produced semiconductor lead frame quality is not fine, and useful life is not long.
Publication number is CN102392280A, the Chinese invention patent application that open day is on March 28th, 2012 discloses a kind of Full-automatic electroplating production line for semi-conductor lead frames, comprise automatic feed mechanism, transport sector, pre-treatment part, electroplating bath, reprocessing part and automatic material blanking mechanism, automatically feeding, discharge mechanism relies on pneumatic actuation, the cell wall of each treatment trough of each treatment trough of pre-treatment part, electroplating bath and reprocessing part is connecting side by side and is arranging mutually, and transport sector is chain type transport sector.When the production line providing with this invention is electroplated lead frame, equally due to thorough not to the surface treatment of lead frame when electroplating, there are some impurity, cause coating adhesion poor, during use, may occur that coating drops, produced semiconductor lead frame is second-rate, and useful life is not long.This production line is larger to the use amount of precious metal, and production cost is high, and because the content of the heavy metal in waste water of discharging is high, after discharge, to surrounding environment, pollutes larger.This is produced needs a large amount of water when electroplating, large to the consumption of water.
Utility model content
Large in order to overcome above-mentioned precious metal use amount, the defect that produced lead frame is second-rate, the invention provides a kind of semiconductor lead frame manufacturing process, and produced lead frame quality is good, long service life.
In order to solve the problems of the technologies described above, the technical solution adopted in the utility model is:
A kind of semiconductor lead frame production line, it is characterized in that: comprise the first discharger setting gradually, the first punch press, the second discharger, surface treatment bed, the 3rd discharger and the second punch press, on described the first punch press, mould is installed, on described the second punch press, be provided with and cut into mould, described surface treatment bed comprises support and bed body, bed body is arranged on support, on bed body, from left to right set gradually as electrolytic degreasing district, three grades of water wash zones, acid activation district, level Four water wash zone, nickel plating district, three grades of water wash zones, Du Jiantong district, three grades of water wash zones, acid coppering district, three grades of water wash zones, pre-silver-plated district, three grades of water wash zones, silver-plated district, three grades of water wash zones, Tui Yin district, three grades of water wash zones, plating protection liquid zone, three grades of water wash zones and baking zone.
Described bed body is tribed body, and described electrolytic degreasing district, three grades of water wash zones, acid activation district, level Four water wash zone, nickel plating district and three grades of water wash zones are arranged on one deck above, and from left to right set gradually; One deck in the middle of described Du Jiantong district, three grades of water wash zones, acid coppering district, three grades of water wash zones, pre-silver-plated district and three grades of water wash zones are arranged on, and set gradually from right to left; Described silver-plated district, three grades of water wash zones, Tui Yin district, three grades of water wash zones, plating protection liquid zone, three grades of water wash zones and baking zone are arranged on one deck below, and from left to right set gradually.
Place, three grades of water wash zones between electrolytic degreasing district and acid activation district is provided with water pump, and water pump is pumped into the water lotion of front two-stage in electrolytic degreasing district;
Place, level Four water wash zone between acid activation district and nickel plating district is provided with water pump, and water pump is pumped into the water lotion of front two-stage in acid activation district;
Place, three grades of water wash zones between Yu Dujiantong district, nickel plating district is provided with water pump, and water pump is pumped into the water lotion of front two-stage in nickel plating district;
Place, three grades of water wash zones between Du Jiantong district and acid coppering district is provided with water pump, and water pump is pumped into the water lotion of front two-stage in Du Jiantong district;
Place, three grades of water wash zones between acid coppering district and pre-silver-plated district is provided with water pump, and water pump is pumped into the water lotion of front two-stage in acid coppering district;
Place, three grades of water wash zones between pre-silver-plated district and silver-plated district is provided with water pump, and water pump is pumped into the water lotion of front two-stage in pre-silver-plated district;
Place, three grades of water wash zones between Yu Tuiyin district, silver-plated district is provided with water pump, and water pump is pumped into the water lotion of three grades in silver-plated district;
Place, three grades of water wash zones between Tui Yin district and plating protection liquid zone is provided with water pump, and water pump is pumped into the water lotion of front two-stage in Tui Yin district;
Place, three grades of water wash zones between plating protection liquid zone and baking zone is provided with water pump, and water pump is pumped into the water lotion of front two-stage in plating protection liquid zone.
The described mould that cuts into comprises patrix, counterdie, cut off punch and forming convax mould, patrix comprises fixedly backing plate and fixed head, fixedly backing plate is positioned at fixed head top, counterdie comprises discharging backing plate and stripper, discharging backing plate is positioned at stripper top, it is characterized in that: also comprise top shoe, sliding block, left pushing block, right pushing block and resetting device, described forming convax mould afterbody is arranged on fixed head, the head of forming convax mould is through discharging backing plate and stripper, on forming convax mould, be provided with cannelure, cutting off punch is arranged in cannelure, and can in cannelure, move up and down, cut off the head installation that nose of punch protrudes from forming convax mould, sliding block is arranged in cannelure, top shoe is arranged on fixedly in backing plate, described top shoe and sliding block contact, and in contact position, be provided with groove and the projection of mutual coupling, described left pushing block and right pushing block are fixed on stripper by discharging backing plate, left pushing block and right pushing block are all through fixed head and fixing backing plate, and can be at fixed head and fixedly in backing plate, move up and down, left pushing block and right pushing block contact with top shoe, and can promote top shoe side-to-side movement in fixing backing plate, resetting device is arranged in cannelure, and can allow cut-out punch afterbody be close on sliding block.
Described resetting device is back-moving spring or reseting shrapnel, and one end of resetting device is against in the cannelure of forming convax mould, and the other end is against and cuts off on punch.
Also comprise forming convax mould briquetting, forming convax mould briquetting is fixed by screws on fixed head, and forming convax mould briquetting is spacing on fixed head by forming convax mould.
Also comprise and cut off punch briquetting, cut off punch briquetting and be fixed on forming convax mould by lock-screw, cut-out punch briquetting is spacing in the cannelure of forming convax mould by cutting off punch.
Described cut-out punch is provided with the screw hole passing for lock-screw and the mounting groove of installing for cut-out punch briquetting, and the diameter of screw hole is greater than the diameter of lock screw, and the notch area of mounting groove is greater than the area that cuts off punch briquetting.
Described right pushing block is " T " font pushing block, comprise head, neck, body portion and afterbody, described head width is less than neck width, neck width is less than body portion width, and body portion width is less than tail width, and afterbody and body portion are perpendicular, neck and body portion joint are provided with an inclined-plane, the angle of inclined-plane and body portion center line is between 30 ° to 55 °, and described left pushing block comprises " T " font pushing block body, should on " T " font pushing block body, be provided with trapezoidal notch.
The concrete technology step that semiconductor lead frame carries out successively on surface treatment bed is: electrolytic degreasing, washing, acid activation, washing, nickel plating, washing, plating alkali copper, washing, acid coppering, washing, silver-plated, washing in advance, silver-plated, wash, move back silver, washing, plating protection liquid, washing and oven dry.
Water-washing step between electrolytic degreasing step and activation step is three grades of washings, and front two-stage washing is back to electrolytic degreasing step;
Water-washing step between activation step and nickel plating step is level Four washing, and front two-stage washing is back to activation step;
Water-washing step between nickel plating step and plating alkali copper step is three grades of washings, and front two-stage washing is back to nickel plating step;
Water-washing step between plating alkali copper step and acid coppering is three grades of washings, and front two-stage washing is back to plating alkali copper step;
Water-washing step between acid coppering step and pre-silver-plated step is three grades of washings, and front two-stage washing is back to acid coppering step;
Water-washing step between pre-silver-plated step and silver-plated step is three grades of washings, and front two-stage washing is back to pre-silver-plated step;
Silver-plated step and the water-washing step moving back between silver-colored step are three grades of washings, and three grades of washings are back to silver-plated step;
The water-washing step moving back between silver-colored step and plating protection liquid step is three grades of washings, and front two-stage washing is back to moves back silver-colored step;
Water-washing step between plating protection liquid step and baking step is three grades of washings, and front two-stage washing is back to plating protection liquid step.
The material that electrolytic degreasing step adds has alkaline degreasing powder; the material that activation step adds has acidic activator; the material that nickel plating step adds has nickel plate and nickel sulfamic acid; the material that plating alkali copper step adds has copper coin and cuprous cyanide; the material that acid coppering step adds has copper coin and cuprous sulfate; the material that pre-silver-plated step adds has silver plate and potassium cyanide; the material that silver-plated step adds has potassium cyanide and silver cyanide; move back the material that silver-colored step adds and move back silver-colored agent, the protection liquid in plating protection liquid step be the protection liquid of silver-colored and copper.
Cutting into the action relationships of mould when work is:
When semiconductor lead frame enters this mould, fixedly backing plate and fixed head move downward, forming convax mould and cut-out punch move downward thereupon, owing to cutting off punch, protrude from forming convax mould, cutting off punch contacts with semiconductor lead frame, when fixedly backing plate and fixed head move downward, fixedly backing plate and fixed head also move downward with respect to left pushing block and right pushing block, now right pushing block will promote top shoe in fixing backing plate to left movement, when cutting off punch, complete after cut-out action, under the effect of back-moving spring, the projection of upper sliding block and groove just in time embed mutually, the sliding block certain displacement that moves upward now, cut off the punch same displacement that also moves upward, cut off punch and no longer protrude from forming convax mould, during forming convax mould work, cutting off punch does not contact with semiconductor lead frame.After moulding, fixed head and fixedly backing plate move upward, left pushing block promotes top shoe to the right, top shoe is separated with groove with the projection of sliding block, top shoe promotes sliding block downwards, and sliding block promotes certain displacement downwards cut-out punch and makes to cut off punch and protrude from forming convax mould and complete homing action.So circulate down to complete to complete on a mould and cut off and two operations of moulding.
The utlity model has following advantage:
1, the utility model comprises the first discharger setting gradually, the first punch press, the second discharger, surface treatment bed, the 3rd discharger and the second punch press, on described the first punch press, mould is installed, on described the second punch press, be provided with and cut into mould, described surface treatment bed comprises support and bed body, bed body is arranged on support, on bed body, from left to right set gradually as electrolytic degreasing district, three grades of water wash zones, acid activation district, level Four water wash zone, nickel plating district, three grades of water wash zones, Du Jiantong district, three grades of water wash zones, acid coppering district, three grades of water wash zones, pre-silver-plated district, three grades of water wash zones, silver-plated district, three grades of water wash zones, Tui Yin district, three grades of water wash zones, plating protection liquid zone, three grades of water wash zones and baking zone.Semiconductor lead frame surface through overmolding exists more oil and dust, through electrolytic degreasing, remove oil and the dust on its surface, then through the effect of washing, wash off except oil substances and there is no the dust of Ex-all, be convenient to normally carrying out of activation procedure, guarantee lead frame activation effect.Semiconductor lead frame is carried out nickel plating, plating alkali copper, acid coppering, in advance silver-plated, silver-plated, while moving back silver, plating protection liquid; before and after these processing steps, be all provided with water-washing step; guarantee that each technique obtains good effect; produced like this lead frame quality is higher; each processing step arrangement is reasonable; through repeatedly washing; when carrying out above-mentioned each processing step; there is no impurity; coating adhesion is strong; can not drop, long-term use can not affect the result of use of lead frame, thereby has extended the useful life of lead frame.The utility model after semiconductor lead frame is carried out to electrolytic degreasing and acid activation just to semiconductor lead frame carry out successively nickel plating, plating alkali copper, acid coppering, in advance silver-plated, silver-plated, move back silver and plating protection liquid; processing step arrangement is reasonable; coating is orderly; strong adhesion; be difficult for dropping; such coating arrangement is strong to semiconductor leads frame protection dynamics, and quality is good, long service life.
2, the utility model surface treatment bed comprises tribed body; topmost one deck is from left to right followed successively by the middle of electrolytic degreasing district, three grades of water wash zones, acid activation district, level Four water wash zone, nickel plating district and three grades of water wash zones one deck and is followed successively by from right to left Du Jiantong district, three grades of water wash zones, acid coppering district, three grades of water wash zones, pre-silver-plated district and three grades of water wash zones, and bottom one deck is from left to right followed successively by silver-plated district, three grades of water wash zones, Tui Yin district, three grades of water wash zones, plating protection liquid zone, three grades of water wash zones and baking zone.The utility model is owing to being provided with the bed body of three-decker, lead frame enters from the top one deck when carrying out surface treatment, from bottom one deck, draw, like this with respect to the structure of existing one deck bed body, greatly saved the length of surface treatment bed, reduce its floor space, so just can reduce the plant area of using, reduced the cost that enterprise drops into.Semiconductor lead frame completes electrolytic degreasing operation in electrolytic degreasing district, then entering three grades of water wash zones washes, wash away degreasing powder and the various impurity on semiconductor lead frame surface, after washing, enter acid activation district and carry out acid activation processing, then enter the washing of level Four water wash zone, wash away surperficial acid-wash activation agent, enter nickel plating district and carry out nickel plating process, plated after nickel, entering three grades of water wash zones washes, wash away the nickel that surface is not adhered to, then enter Du Jiantong district and plate alkali copper process, after entering three grades of water wash zone washings, enter acid coppering district acid coppering, after washing, enter preplating silver district silver-plated in advance, to enter silver-plated district silver-plated in washing again, water wash zone washing enters Tui Yin district and moves back silver, after washing, enter plating protection liquid zone plating protection liquid, washing post-drying completes surface treatment procedure.Total arrangement is reasonable, completes accurately each processing step of surface-treated.
3, the three grade water wash zones of the utility model between electrolytic degreasing district and acid activation district go out to be provided with water pump, and water pump is pumped into the water lotion of front two-stage in electrolytic degreasing district; Place, level Four water wash zone between acid activation district and nickel plating district is provided with water pump, and water pump is pumped into the water lotion of front two-stage in acid activation district; Place, three grades of water wash zones between Yu Dujiantong district, nickel plating district is provided with water pump, and water pump is pumped into the water lotion of front two-stage in nickel plating district; Place, three grades of water wash zones between Du Jiantong district and acid coppering district is provided with water pump, and water pump is pumped into the water lotion of front two-stage in Du Jiantong district; Place, three grades of water wash zones between acid coppering district and pre-silver-plated district is provided with water pump, and water pump is pumped into the water lotion of front two-stage in acid coppering district; Place, three grades of water wash zones between pre-silver-plated district and silver-plated district is provided with water pump, and water pump is pumped into the water lotion of front two-stage in pre-silver-plated district; Place, three grades of water wash zones between Yu Tuiyin district, silver-plated district is provided with water pump, and water pump is pumped into the water lotion of three grades in silver-plated district; Place, three grades of water wash zones between Tui Yin district and plating protection liquid zone is provided with water pump, and water pump is pumped into the water lotion of front two-stage in Tui Yin district; Place, three grades of water wash zones between plating protection liquid zone and baking zone is provided with water pump, and water pump is pumped into the water lotion of front two-stage in plating protection liquid zone.Effect by each water pump is the various raw materials of recycling again, have also reduced the use amount of water simultaneously, and the amount of various raw materials in waste water, reduce the pollution to surrounding environment after discharge of wastewater.
4, the utility model comprises patrix, counterdie, cut off punch and forming convax mould, patrix comprises fixedly backing plate and fixed head, fixedly backing plate is positioned at fixed head top, counterdie comprises discharging backing plate and stripper, discharging backing plate is positioned at stripper top, it is characterized in that: also comprise top shoe, sliding block, left pushing block, right pushing block and resetting device, described forming convax mould afterbody is arranged on fixed head, the head of forming convax mould is through discharging backing plate and stripper, on forming convax mould, be provided with cannelure, cutting off punch is arranged in cannelure, and can in cannelure, move up and down, cut off the head installation that nose of punch protrudes from forming convax mould, sliding block is arranged in cannelure, top shoe is arranged on fixedly in backing plate, described top shoe and sliding block contact, and in contact position, be provided with groove and the projection of mutual coupling, described left pushing block and right pushing block are fixed on stripper by discharging backing plate, left pushing block and right pushing block are all through fixed head and fixing backing plate, and can be at fixed head and fixedly in backing plate, move up and down, left pushing block and right pushing block contact with top shoe, and can promote top shoe side-to-side movement in fixing backing plate, resetting device is arranged in cannelure, and can allow cut-out punch afterbody be close on sliding block.When semiconductor lead frame enters this mould, fixedly backing plate and fixed head move downward, forming convax mould and cut-out punch move downward thereupon, owing to cutting off punch, protrude from forming convax mould, cutting off punch contacts with semiconductor lead frame, when fixedly backing plate and fixed head move downward, fixedly backing plate and fixed head also move downward with respect to left pushing block and right pushing block, now right pushing block will promote top shoe in fixing backing plate to left movement, when cutting off punch, complete after cut-out action, under the effect of back-moving spring, the projection of upper sliding block and groove just in time embed mutually, the sliding block certain displacement that moves upward now, cut off the punch same displacement that also moves upward, cut off punch and no longer protrude from forming convax mould, during forming convax mould work, cutting off punch does not contact with semiconductor lead frame, so just can not be because cut-out punch exceeds forming convax mould the compressive strain of semiconductor lead frame band.After moulding, fixed head and fixedly backing plate move upward, left pushing block promotes top shoe to the right, top shoe is separated with groove with the projection of sliding block, top shoe promotes sliding block downwards, and sliding block promotes certain displacement downwards cut-out punch and makes to cut off punch and protrude from forming convax mould and complete homing action.So circulate down to complete to complete on a mould and cut off and two operations of moulding.The moulding that the utility model provides is cut off mould and is arranged on punch press, can on a punch press, complete and cut off and two techniques of moulding, the size of mould has been dwindled in the merging of two operations greatly, after merging, two operations reduced operation, reduced the management cost in operation, can also improve the precision of processing and the assembling of mould simultaneously.A mould completes two operations, mutually can not interfere, and cuts off punch and also can not pull semiconductor lead frame, can not produce and pull stress, and semiconductor lead frame can not cause distortion due to the merging of two operations, affects the quality of lead frame.
5, the utility model resetting device is back-moving spring or reseting shrapnel, and one end of resetting device is against in the cannelure of forming convax mould, and the other end is against and cuts off on punch.By the effect of back-moving spring or reseting shrapnel, make to cut off punch being attached on sliding block tightly all the time, while moving on sliding block, effect due to back-moving spring or reseting shrapnel, cut off punch and also can move up, make to cut off punch concordant with forming convax mould, when forming convax mould is worked like this, cut off punch and can not pull semiconductor lead frame, can not produce distortion and overproof.Use back-moving spring or reseting shrapnel to make return unit, be convenient to install.
6, forming convax mould briquetting of the present utility model is fixed by screws on fixed head, and forming convax mould briquetting is spacing on fixed head by forming convax mould.By forming convax mould briquetting, forming convax mould is spacing on fixed head, avoid forming convax mould to drop from fixed head, be beneficial to the stability of forming convax mould work.
7, cut-out punch briquetting of the present utility model, is fixed on forming convax mould by lock-screw, and cut-out punch briquetting is spacing in the cannelure of forming convax mould by cutting off punch.By cutting off punch briquetting, by cutting off, punch is spacing prevents that in the cannelure of forming convax mould cut off punch drops in the cannelure of forming convax mould, is beneficial to the stability of cutting off punch work.
8, the utility model cuts off punch and is provided with the screw hole passing for lock-screw and the mounting groove of installing for cut-out punch briquetting, and the diameter of screw hole is greater than the diameter of lock screw, and the notch area of mounting groove is greater than the area that cuts off punch briquetting.By such, arrange can be effectively spacingly in cannelure by cutting off punch, can also allow and cut off punch longitudinal sliding motion in cannelure simultaneously.
9, the right pushing block of the utility model is " T " font pushing block, comprise head, neck, body portion and afterbody, described head width is less than neck width, neck width is less than body portion width, and body portion width is less than tail width, and afterbody and body portion are perpendicular, neck and body portion joint are provided with an inclined-plane, the angle of inclined-plane and body portion center line is between 30 ° to 55 °, and described left pushing block comprises " T " font pushing block body, should on " T " font pushing block body, be provided with trapezoidal notch.This structure of left and right pushing block guarantee to promote top shoe follow fixed head and fixedly backing plate when moving up and down, move left and right, that realize to cut off punch can complete the action of protruding forming convax mould and concordant forming convax mould.
Accompanying drawing explanation
Fig. 1 is the utility model overall structure schematic diagram;
Fig. 2 is the utility model process flow for carrying out surface treatment figure;
Fig. 3 is the structural representation of surface treatment bed;
Fig. 4 is the newly section of structure when cutting off semiconductor lead frame of this practicality;
Fig. 5 is the new section of structure when moulding semiconductor lead frame of this practicality;
Fig. 6 is for cutting off the assembling schematic diagram of punch and forming convax mould;
Fig. 7 is the enlarged drawing at A place in Fig. 6;
Fig. 8 is the vertical view of Fig. 3;
Fig. 9 is the end view of Fig. 3;
Figure 10 is left pushing block structural representation;
Figure 11 is right pushing block structural representation.
In figure, mark 1, electrolytic degreasing district, 2, three grades of water wash zones, 3, acid activation district, 4, level Four water wash zone, 5, nickel plating district, 6, plating alkali copper, 7, acid coppering district, 8, pre-silver-plated district, 9, silver-plated district, 10, Tui Yin district, 11, plating protection liquid zone, 12, baking zone, 13, semiconductor lead frame, 14, fixing backing plate, 15, fixed head 16, discharging backing plate, 17, stripper, 18, right pushing block, 19, left pushing block, 20, top shoe, 21, sliding block, 22, screw, 23, forming convax mould briquetting, 24, cannelure, 25, cut off punch, 26, forming convax mould, 27, back-moving spring, 28, cut off punch briquetting, 29, lock-screw, 30, " T " font pushing block body, 31, trapezoidal notch, 32, the first discharger, 33, the first punch press, 34, the second discharger, 35, surface treatment bed, 36, the 3rd discharger, 37, the second punch press.
Embodiment
Embodiment 1
As shown in Figure 1, the present embodiment, comprise the first discharger 32, the first punch press 33, the second discharger 34, surface treatment bed 35, the 3rd discharger 36, the second punch press 37 and leveller (not shown), on described the first punch press 33, mould is installed, on described the second punch press 37, is provided with and cuts into mould.
When with diel legal system manufacturing semiconductor lead frame, its processing step comprises punching press, surface treatment, cut-out moulding and inspection sheet packing, therefore when arranging its production line, also according to its production technology, design, with thin plate copper strips, the effect through the first discharger is sent on the first punch press in production, through the effect of the first punch press, dress mould is in the above gone out the structure of semiconductor lead frame on copper strips; Semiconductor lead frame is sent to and on surface treatment bed, carries out surface treatment through the effect of the second discharger.As shown in Figure 2; on surface treatment bed, complete successively electrolytic degreasing, washing, acid activation, washing, nickel plating, washing, plating alkali copper, washing, acid coppering, washing, silver-plated, washing in advance, silver-plated, wash, move back silver, washing, plating protection liquid, washing and baking step; the 3rd discharger is sent to semiconductor lead frame on the second punch press; through the second punch press, cutting into mould cuts off after moulding; be sent to leveller and carry out leveling, after leveling, examine sheet packing.
The material that electrolytic degreasing step adds has alkaline degreasing powder; the material that activation step adds has acidic activator; the material that nickel plating step adds has nickel plate and nickel sulfamic acid; the material that plating alkali copper step adds has copper coin and cuprous cyanide; the material that acid coppering step adds has copper coin and cuprous sulfate; the material that pre-silver-plated step adds has silver plate and potassium cyanide; the material that silver-plated step adds has potassium cyanide and silver cyanide; move back the material that silver-colored step adds and move back silver-colored agent, the protection liquid in plating protection liquid step be the protection liquid of silver-colored and copper.
As shown in Figure 3; this surface treatment bed comprises tribed body in the present embodiment; topmost one deck is from left to right followed successively by the middle of electrolytic degreasing district 1, three grades of water wash zones 2, acid activation district 3, level Four water wash zone 4, nickel plating district 5 and three grades of water wash zones 2 one decks and is followed successively by from right to left Du Jiantong district 6, three grades of water wash zones 2, acid coppering district 7, three grades of water wash zones 2, pre-silver-plated district 8 and three grades of water wash zones 2, and bottom one deck is from left to right followed successively by silver-plated district 9, three grades of water wash zones 2, Tui Yin district 10, three grades of water wash zones 2, plating protection liquid zone 11, three grades of water wash zones 2 and baking zones 12.Semiconductor lead frame 13, from bed body, topmost introduce on one deck left side, enter electrolytic degreasing district 1 electrolytic degreasing, three grades of water wash zone 2 washings, 3 activation of acid activation district, 4 washings of level Four water wash zone, 5 nickel plating of nickel plating district, after three grades of water wash zone 2 washings, from middle one deck the right, enter Du Jiantong district 6 plating alkali copper, three grades of water wash zone 2 washings, acid coppering district 7 acid copperings, three grades of water wash zone 2 washings, pre-silver-plated district 8 is silver-plated in advance, after three grades of water wash zone 2 washings, from the left side of bottom one deck, enter silver-plated district 9 silver-plated, three grades of water wash zone 2 washings, silver is moved back in Tui Yin district 10, three grades of water wash zone 2 washings, plating protection liquid zone 11 plating protection liquid, three grades of water wash zone 2 washings, baking zone 12 is dried.
Three grades of water wash zones 2 between electrolytic degreasing district 1 and acid activation district 3 go out to be provided with water pump, and water pump is pumped into the water lotion of front two-stage in electrolytic degreasing district 1;
4 places, level Four water wash zone between acid activation district 3 and nickel plating district 5 are provided with water pump, and water pump is pumped into the water lotion of front two-stage in acid activation district 3;
2 places, three grades of water wash zones between 5 Yu Dujiantong districts 6, nickel plating district are provided with water pump, and water pump is pumped into the water lotion of front two-stage in nickel plating district 5;
2 places, three grades of water wash zones between Du Jiantong district 6 and acid coppering 7th district are provided with water pump, and water pump is pumped into the water lotion of front two-stage in Du Jiantong 6th district;
2 places, three grades of water wash zones between acid coppering district 7 and pre-silver-plated district 8 are provided with water pump, and water pump is pumped into the water lotion of front two-stage in acid coppering 7th district;
2 places, three grades of water wash zones between pre-silver-plated district 8 and silver-plated district 9 are provided with water pump, and water pump is pumped into the water lotion of front two-stage in pre-silver-plated district 8;
2 places, three grades of water wash zones between 9 Yu Tuiyin districts 10, silver-plated district are provided with water pump, and water pump is pumped into the water lotion of three grades in silver-plated district 9;
2 places, three grades of water wash zones between Tui Yin district 10 and plating protection liquid zone 11 are provided with water pump, and water pump is pumped into the water lotion of front two-stage in Tui Yin district 10;
Place, three grades of water wash zones 2 between plating protection liquid zone 11 and baking zone 12 is provided with water pump, and water pump is pumped into the water lotion of front two-stage in plating protection liquid zone 11.
In the present embodiment, the equipment of other process and use is the same with prior art, does not repeat them here.
Embodiment 2
If Fig. 4 is to as shown in Figure 11, the present embodiment provides the mould that cuts into for the manufacture of semiconductor lead frame, this cuts into mould cut-out and two operations of moulding is united two into one, on a mould, realize this two operations, also can not cause semiconductor lead frame distortion, there will not be the size of the semiconductor lead frame error that is above standard is overproof defect simultaneously.The present embodiment comprises the first discharger 32, the first punch press 33, the second discharger 34, surface treatment bed 35, the 3rd discharger 36, the second punch press 37 and leveller (not shown), on described the first punch press 33, mould is installed, on described the second punch press 37, is provided with and cuts into mould.
This cuts into mould and comprises patrix, counterdie, cut off punch 25 and protruding 26 moulds of moulding, patrix comprises fixedly backing plate 14 and fixed head 15, fixedly backing plate 14 is positioned at fixed head 15 tops, counterdie comprises discharging backing plate 16 and stripper 17, discharging backing plate 16 is positioned at stripper 17 tops, it is characterized in that: also comprise top shoe 20, sliding block 21, left pushing block 19, right pushing block 18 and resetting device, described forming convax mould 26 afterbodys are arranged on fixed head 15, the head of forming convax mould 26 is through discharging backing plate 16 and stripper 17, on forming convax mould 26, be provided with cannelure 24, cutting off punch 25 is arranged in cannelure 24, and can in cannelure 24, move up and down, cut off the head installation that punch 25 heads protrude from forming convax mould 26, sliding block 21 is arranged in cannelure 24, top shoe 20 is arranged on fixedly in backing plate 14, described top shoe 20 and sliding block 21 contact, and in contact position, be provided with groove and the projection of mutual coupling, described left pushing block 19 and right pushing block 18 are fixed on stripper 17 by discharging backing plate 16, left pushing block 19 and right pushing block 18 are all through fixed head 15 and fixing backing plate 14, and can be at fixed head 15 and fixedly in backing plate 14, move up and down, left pushing block 19 and right pushing block 18 contact with top shoe 20, and can promote top shoe 20 in the fixedly interior side-to-side movement of backing plate 14, resetting device is arranged in cannelure 24, and can allow cut-out punch 25 afterbodys be close on sliding block 21.
When semiconductor lead frame enters this mould, fixedly backing plate and fixed head move downward, forming convax mould and cut-out punch move downward thereupon, owing to cutting off punch, protrude from forming convax mould, cutting off punch contacts with semiconductor lead frame, when fixedly backing plate and fixed head move downward, fixedly backing plate and fixed head also move downward with respect to left pushing block and right pushing block, now right pushing block will promote top shoe in fixing backing plate to left movement, when cutting off punch, complete after cut-out action, under the effect of back-moving spring, the projection of upper sliding block and groove just in time embed mutually, the sliding block certain displacement that moves upward now, cut off the punch same displacement that also moves upward, cut off punch and no longer protrude from forming convax mould, during forming convax mould work, cutting off punch does not contact with semiconductor lead frame.After moulding, fixed head and fixedly backing plate move upward, left pushing block promotes top shoe to the right, top shoe is separated with groove with the projection of sliding block, top shoe promotes sliding block downwards, and sliding block promotes certain displacement downwards cut-out punch and makes to cut off punch and protrude from forming convax mould and complete homing action.So circulate down to complete to complete on a mould and cut off and two operations of moulding.The size of mould has been dwindled in the merging of two operations greatly, after two operations merge, has reduced operation, has reduced the management cost in operation, can also improve the precision of processing and the assembling of mould simultaneously.A mould completes two operations, mutually can not interfere, and cuts off punch and also can not pull semiconductor lead frame, can not produce and pull stress, and semiconductor lead frame can not cause distortion due to the merging of two operations, affects the quality of semiconductor lead frame.
As for resetting device, can select back-moving spring 27 or reseting shrapnel, the gap of its installation site between the cannelure 24 cutting off on punch 25 and forming convax mould 26, one end of back-moving spring 27 or reseting shrapnel is against and cuts off on punch 25, the other end is against in the cannelure 24 of forming convax mould 26, the effect of back-moving spring 27 or reseting shrapnel is to cutting off 25 1 elastic force that make progress at any time of punch, the afterbody that guarantee to cut off punch 25 being attached on sliding block 21 tightly, while moving on sliding block 21 like this, cut off punch 25 also can with on move.
In order to limit forming convax mould 26 in the position of fixed head 16, we are fixed on fixed head 15 by screw 22 with forming convax mould briquetting 23.
For cut-out punch 25 is spacing in the cannelure 24 of forming convax mould 26, we,, with cutting off punch briquetting 28, are fixed on forming convax mould 26 by lock-screw 29, and cut-out punch 25 can be moved up and down, and but can in cannelure 24, not come off.
Cut off punch 25 and be provided with the screw hole B passing for lock-screw 29 and the mounting groove C installing for cut-out punch briquetting 28, the diameter of screw hole B is greater than the diameter of lock screw 29, and the notch area of mounting groove C is greater than the area that cuts off punch briquetting 28.By such, arrange can be effectively spacingly in cannelure by cutting off punch, can also allow and cut off punch longitudinal sliding motion in cannelure simultaneously.
The concrete structure of the right pushing block 18 of the utility model is: be shaped as " T " font pushing block, comprise head 13, neck 12, body portion 11 and afterbody 10, described head 13 width are less than neck 12 width, neck 12 width are less than body portion 11 width, body portion 11 width are less than afterbody 10 width, afterbody 10 is perpendicular with body portion 11, and neck 12 is provided with an inclined-plane with body portion 11 joints, and the angle of inclined-plane and body portion center line is between 30 ° to 55 °.
The left pushing block 19 of the utility model comprises " T " font pushing block body 30, should on " T " font pushing block body 30, be provided with 31 mouthfuls of dovetail grooves.
This structure of left and right pushing block guarantee to promote top shoe follow fixed head and fixedly backing plate when moving up and down, move left and right, realize to cut off punch and complete the action of protruding forming convax mould and concordant forming convax mould.
Cut off molding procedure and adopt the mould that cuts into that this embodiment provides to implement, and equipment and method that other operations adopt are same as the prior art, the present embodiment repeats no more.
Embodiment 3
In the present embodiment, comprise the first discharger 32, the first punch press 33, the second discharger 34, surface treatment bed 35, the 3rd discharger 36, the second punch press 37 and leveller (not shown), on described the first punch press 33, mould is installed, on described the second punch press 37, is provided with and cuts into mould.The surface treatment bed of surface treatment bed for providing in embodiment, cuts into mould and cuts into mould for what embodiment 2 provided, and other place is same as the prior art, does not repeat them here.
Claims (9)
1. a semiconductor lead frame production line, it is characterized in that: comprise the first discharger setting gradually, the first punch press, the second discharger, surface treatment bed, the 3rd discharger and the second punch press, on described the first punch press, mould is installed, on described the second punch press, be provided with and cut into mould, described surface treatment bed comprises support and bed body, bed body is arranged on support, on bed body, from left to right set gradually as electrolytic degreasing district, three grades of water wash zones, acid activation district, level Four water wash zone, nickel plating district, three grades of water wash zones, Du Jiantong district, three grades of water wash zones, acid coppering district, three grades of water wash zones, pre-silver-plated district, three grades of water wash zones, silver-plated district, three grades of water wash zones, Tui Yin district, three grades of water wash zones, plating protection liquid zone, three grades of water wash zones and baking zone.
2. a kind of semiconductor lead frame production line according to claim 1, it is characterized in that: described bed body is tribed body, described electrolytic degreasing district, three grades of water wash zones, acid activation district, level Four water wash zone, nickel plating district and three grades of water wash zones are arranged on one deck above, and from left to right set gradually; One deck in the middle of described Du Jiantong district, three grades of water wash zones, acid coppering district, three grades of water wash zones, pre-silver-plated district and three grades of water wash zones are arranged on, and set gradually from right to left; Described silver-plated district, three grades of water wash zones, Tui Yin district, three grades of water wash zones, plating protection liquid zone, three grades of water wash zones and baking zone are arranged on one deck below, and from left to right set gradually.
3. a kind of semiconductor lead frame production line according to claim 1 and 2, is characterized in that: the place, three grades of water wash zones between electrolytic degreasing district and acid activation district is provided with water pump, and water pump is pumped into the water lotion of front two-stage in electrolytic degreasing district; Place, level Four water wash zone between acid activation district and nickel plating district is provided with water pump, and water pump is pumped into the water lotion of front two-stage in acid activation district; Place, three grades of water wash zones between Yu Dujiantong district, nickel plating district is provided with water pump, and water pump is pumped into the water lotion of front two-stage in nickel plating district; Place, three grades of water wash zones between Du Jiantong district and acid coppering district is provided with water pump, and water pump is pumped into the water lotion of front two-stage in Du Jiantong district; Place, three grades of water wash zones between acid coppering district and pre-silver-plated district is provided with water pump, and water pump is pumped into the water lotion of front two-stage in acid coppering district; Place, three grades of water wash zones between pre-silver-plated district and silver-plated district is provided with water pump, and water pump is pumped into the water lotion of front two-stage in pre-silver-plated district; Place, three grades of water wash zones between Yu Tuiyin district, silver-plated district is provided with water pump, and water pump is pumped into the water lotion of three grades in silver-plated district; Place, three grades of water wash zones between Tui Yin district and plating protection liquid zone is provided with water pump, and water pump is pumped into the water lotion of front two-stage in Tui Yin district; Place, three grades of water wash zones between plating protection liquid zone and baking zone is provided with water pump, and water pump is pumped into the water lotion of front two-stage in plating protection liquid zone.
4. a kind of semiconductor lead frame production line according to claim 1, it is characterized in that: described in cut into mould and comprise patrix, counterdie, cut off punch and forming convax mould, patrix comprises fixedly backing plate and fixed head, fixedly backing plate is positioned at fixed head top, counterdie comprises discharging backing plate and stripper, discharging backing plate is positioned at stripper top, it is characterized in that: also comprise top shoe, sliding block, left pushing block, right pushing block and resetting device, described forming convax mould afterbody is arranged on fixed head, the head of forming convax mould is through discharging backing plate and stripper, on forming convax mould, be provided with cannelure, cutting off punch is arranged in cannelure, and can in cannelure, move up and down, cut off the head installation that nose of punch protrudes from forming convax mould, sliding block is arranged in cannelure, top shoe is arranged on fixedly in backing plate, described top shoe and sliding block contact, and in contact position, be provided with groove and the projection of mutual coupling, described left pushing block and right pushing block are fixed on stripper by discharging backing plate, left pushing block and right pushing block are all through fixed head and fixing backing plate, and can be at fixed head and fixedly in backing plate, move up and down, left pushing block and right pushing block contact with top shoe, and can promote top shoe side-to-side movement in fixing backing plate, resetting device is arranged in cannelure, and can allow cut-out punch afterbody be close on sliding block.
5. a kind of semiconductor lead frame production line according to claim 4, is characterized in that: described resetting device is back-moving spring or reseting shrapnel, and one end of resetting device is against in the cannelure of forming convax mould, and the other end is against and cuts off on punch.
6. a kind of semiconductor lead frame production line according to claim 4, is characterized in that: also comprise forming convax mould briquetting, forming convax mould briquetting is fixed by screws on fixed head, and forming convax mould briquetting is spacing on fixed head by forming convax mould.
7. according to a kind of semiconductor lead frame production line described in claim 4,5 or 6, it is characterized in that: also comprise and cut off punch briquetting, cut off punch briquetting and be fixed on forming convax mould by lock-screw, cut-out punch briquetting is spacing in the cannelure of forming convax mould by cutting off punch.
8. a kind of semiconductor lead frame production line according to claim 7, it is characterized in that: described cut-out punch is provided with the screw hole passing for lock-screw and the mounting groove of installing for cut-out punch briquetting, the diameter of screw hole is greater than the diameter of lock screw, and the notch area of mounting groove is greater than the area that cuts off punch briquetting.
9. a kind of semiconductor lead frame production line according to claim 4, it is characterized in that: described right pushing block is " T " font pushing block, comprise head, neck, body portion and afterbody, described head width is less than neck width, neck width is less than body portion width, body portion width is less than tail width, afterbody and body portion are perpendicular, neck and body portion joint are provided with an inclined-plane, the angle of inclined-plane and body portion center line is between 30 ° to 55 °, described left pushing block comprises " T " font pushing block body, should on " T " font pushing block body, be provided with trapezoidal notch.
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| CN201420209020.5U CN203826353U (en) | 2014-04-28 | 2014-04-28 | Semiconductor lead frame production line |
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| CN201420209020.5U CN203826353U (en) | 2014-04-28 | 2014-04-28 | Semiconductor lead frame production line |
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN105751427A (en) * | 2016-03-10 | 2016-07-13 | 高铭电子（惠州）有限公司 | Hardware injection molded switch preparation method |
| CN107170873A (en) * | 2017-04-26 | 2017-09-15 | 安徽欧瑞特照明有限公司 | A kind of LED support cleaning |
| CN108188237A (en) * | 2018-02-05 | 2018-06-22 | 江阴康强电子有限公司 | A kind of 100mm wide row lead frames and its production line |
| CN108637084A (en) * | 2018-05-09 | 2018-10-12 | 四川金湾电子有限责任公司 | A kind of processing technology of semiconductor lead frame |
| CN110190000A (en) * | 2019-05-27 | 2019-08-30 | 山东新恒汇电子科技有限公司 | A kind of production system of lead frame |
| CN110391144A (en) * | 2019-07-31 | 2019-10-29 | 江阴康强电子有限公司 | A kind of lead frame production line |
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2014
- 2014-04-28 CN CN201420209020.5U patent/CN203826353U/en not_active Expired - Fee Related
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN105751427A (en) * | 2016-03-10 | 2016-07-13 | 高铭电子（惠州）有限公司 | Hardware injection molded switch preparation method |
| CN107170873A (en) * | 2017-04-26 | 2017-09-15 | 安徽欧瑞特照明有限公司 | A kind of LED support cleaning |
| CN107170873B (en) * | 2017-04-26 | 2018-11-13 | 安徽欧瑞特照明有限公司 | A kind of LED support cleaning |
| CN108188237A (en) * | 2018-02-05 | 2018-06-22 | 江阴康强电子有限公司 | A kind of 100mm wide row lead frames and its production line |
| CN108188237B (en) * | 2018-02-05 | 2024-01-09 | 江阴康强电子有限公司 | 100mm wide-row lead frame and production line thereof |
| CN108637084A (en) * | 2018-05-09 | 2018-10-12 | 四川金湾电子有限责任公司 | A kind of processing technology of semiconductor lead frame |
| CN108637084B (en) * | 2018-05-09 | 2019-06-04 | 四川金湾电子有限责任公司 | A kind of processing technology of semiconductor lead frame |
| CN110190000A (en) * | 2019-05-27 | 2019-08-30 | 山东新恒汇电子科技有限公司 | A kind of production system of lead frame |
| CN110391144A (en) * | 2019-07-31 | 2019-10-29 | 江阴康强电子有限公司 | A kind of lead frame production line |
| CN110391144B (en) * | 2019-07-31 | 2024-03-19 | 江阴康强电子有限公司 | Lead frame production line |
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| C14 | Grant of patent or utility model | ||
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| CF01 | Termination of patent right due to non-payment of annual fee | ||
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Granted publication date: 20140910 Termination date: 20190428 |