CN105578765A - Secondary-etching double-sided circuit board structure and processing technique thereof - Google Patents
Secondary-etching double-sided circuit board structure and processing technique thereof Download PDFInfo
- Publication number
- CN105578765A CN105578765A CN201410545111.0A CN201410545111A CN105578765A CN 105578765 A CN105578765 A CN 105578765A CN 201410545111 A CN201410545111 A CN 201410545111A CN 105578765 A CN105578765 A CN 105578765A
- Authority
- CN
- China
- Prior art keywords
- circuit
- layer
- line
- gbl
- time
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Manufacturing Of Printed Circuit Boards (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The invention discloses a secondary-etching double-sided circuit board structure and a processing technique thereof. The secondary-etching double-sided circuit board structure comprises a GTL line layer, an insulating PP layer and a GBL stepped surface line layer. The GBL stepped surface line layer is formed by a GBL inner line layer and a GBL outer line layer; the insulating PP layer is arranged between the GTL line layer and the GBL inner line layer; and the GBL outer line layer is arranged on the other surface of the GBL inner line layer. In addition, The processing technique consists of a first line manufacturing process and a secondary line manufacturing process; the first line manufacturing process includes steps of first line graph manufacturing, line development cam compensation, line examination, and etching; and the secondary line manufacturing process includes steps of secondary line graph manufacturing, line development cam compensation, line examination, etching, and electric detection on an open circuit and a short circuit, and a post procedure. According to the invention, only two-times manufacturing is carried out; the investment is low; the production flow is simplified and the working difficulty is reduced; the production efficiency is improved; the production cost is lowered; the reject ratio is reduced; and the product production period is reduced.
Description
Technical field
The present invention relates to a kind of board production technique, be specifically related to a kind of second etch double-sided circuit board production technology.
Background technology
In current board production technique, there is the double-sided PCB of GTL line layer, GBL layer within the circuit and GBL layer outside the circuit, all adopt and make for three times, the circuit that completes successively makes, and the accumulated error of making is very large, product quality can not get management and control, its duty cycle is longer, and the cycle period of production is longer, and the production friendship phase can not get improving, cost drops into also very large simultaneously, can not meet customer requirement; After research, secondary just can fulfil assignment, and its product quality also can obtain control.In order to solve the problem, develop a kind of novel stacked circuit board line and make renewal technology, to improve the unfailing performance of pcb board part, yet reduce PCB cost of manufacture in a large number and the manufacture craft cycle of place short 30% simultaneously, improve the qualification rate of product and meet the demand of numerous clients.
Summary of the invention
The object of the invention is to the above problem overcoming prior art existence, a kind of second etch double-sided circuit plate structure and production technology thereof are provided, the present invention is compensated by cam and the circuit manufacturing method that originally need carry out three etchings subtracts into twice by three times by new etch process, the minimizing that human resources drop into, simplify production procedure and task difficulty greatly, decrease product and cause the generation of defective products because repeatedly etching causes accumulated error to increase, a large amount of minimizing PCB cost of manufacture the manufacture craft cycle of place short 30%, the friendship phase requirement of client can be met better, remarkable in economical benefits.
For realizing above-mentioned technical purpose, reach above-mentioned technique effect, the present invention is achieved through the following technical solutions:
A kind of second etch double-sided circuit plate structure, comprise: GTL line layer, insulation PP layer and GBL step surface line layer, it is characterized in that: described GBL step surface line layer is made up of GBL layer within the circuit and GBL layer outside the circuit, described insulation PP layer is between GTL line layer and GBL layer within the circuit, described GBL layer outside the circuit is positioned on GBL layer within the circuit another side, described GBL layer outside the circuit is similar with the face shaping of GBL layer within the circuit, but GBL layer within the circuit size B1 is larger than GBL layer outside the circuit size B2 size, size relationship is preferably: B1=B2+0.05mm, described a kind of second etch double-sided PCB, its production technology comprises line manufacturing process point flow process and second time line manufacturing process point flow process for the first time.
Further, described first time line manufacturing process divide flow process, comprise the following steps:
Step one, first time line map making;
Step 2, first time circuit development cam compensates, and the circuit that described development cam compensates is GBL layer within the circuit;
Step 3, the inspection of line of developing for the first time;
Step 4, for the first time shaping GTL line layer of acid etching and GBL layer within the circuit;
Step 5, first time circuit etching molded surface reprocessing.
Further, described second time line manufacturing process divides flow process, comprises the following steps:
Step one, second time line map makes;
Step 2, second time circuit development cam compensates, and the circuit that described development cam compensates comprises GTL line layer and GBL layer outside the circuit;
Step 3, the second development inspection of line;
Step 4, the shaping GBL layer outside the circuit of second time acid etching;
Step 5, the reprocessing of second time circuit etching molded surface;
Step 6, adopts tool testing circuit board, revises non-conducting and short-circuit conditions;
Step 7, enters operation after circuit board finished product.
Further, when described first time circuit development cam compensates or second time circuit development cam compensates, the offset that cam compensates is 0.05mm.
The invention has the beneficial effects as follows:
The present invention is compensated by cam and the circuit manufacturing method that originally need carry out three etchings subtracts into twice by three times by new etch process, the minimizing that human resources drop into, simplify production procedure and task difficulty greatly, decrease product and cause the generation of defective products because repeatedly etching causes accumulated error to increase, a large amount of minimizing PCB cost of manufacture the manufacture craft cycle of place short 30%, the friendship phase requirement of client can be met better, remarkable in economical benefits.
Accompanying drawing explanation
Fig. 1 is the circuit board of the present invention schematic diagram that circuit is shaping for the first time.
Fig. 2 is the circuit board of the present invention schematic diagram that circuit is shaping for the second time.
Fig. 3 is circuit board final structure schematic diagram of the present invention.
In figure, each label and corresponding name are called: 1, GTL line layer, 2, insulation PP layer, 3, GBL layer within the circuit, 4, GBL layer outside the circuit.
Embodiment
Below in conjunction with drawings and Examples, the present invention is described in further details:
As shown in Figure 3, a kind of second etch double-sided circuit plate structure, comprise: GTL line layer 1, insulation PP layer 2 and GBL step surface line layer, it is characterized in that: described GBL step surface line layer is made up of GBL layer within the circuit 3 and GBL layer outside the circuit 4, described insulation PP layer 2 is between GTL line layer 1 and GBL layer within the circuit 3, described GBL layer outside the circuit 4 is positioned on GBL layer within the circuit 3 another side, described GBL layer outside the circuit 4 is similar with the face shaping of GBL layer within the circuit 3, but GBL layer within the circuit 3 size B1 is larger than GBL layer outside the circuit 4 size B2 size, size relationship is preferably: B1=B2+0.05mm, described a kind of second etch double-sided PCB, its production technology comprises line manufacturing process point flow process and second time line manufacturing process point flow process for the first time.
As shown in Figure 1, described first time line manufacturing process divide flow process, comprise the following steps:
Step one, first time line map making;
Step 2, first time circuit development cam compensates, and the circuit that described development cam compensates is GBL layer within the circuit 3;
Step 3, the inspection of line of developing for the first time;
Step 4, for the first time shaping GTL line layer 1 of acid etching and GBL layer within the circuit 3;
Step 5, first time circuit etching molded surface reprocessing.
As shown in Figure 2, described second time line manufacturing process divides flow process, comprises the following steps:
Step one, second time line map makes;
Step 2, second time circuit development cam compensates, and the circuit that described development cam compensates comprises GTL line layer 1 and GBL layer outside the circuit 4;
Step 3, the second development inspection of line;
Step 4, the shaping GBL layer outside the circuit 4 of second time acid etching;
Step 5, the reprocessing of second time circuit etching molded surface;
Step 6, adopts tool testing circuit board, revises non-conducting and short-circuit conditions;
Step 7, enters operation after circuit board finished product.
When described first time circuit development cam compensates or second time circuit development cam compensates, the offset that cam compensates is 0.05mm.
The operation principle of the present embodiment is as follows:
As Fig. 1, shown in Fig. 2, first first time line map making is done to GBL layer within the circuit 3, then development and first time development cam compensation are carried out to GBL layer within the circuit 3 circuit, free size value is 0.05mm, checks the development quality of the circuit that develops, carries out acid etching shaping to the GBL layer within the circuit 3 after inspection OK, namely first time acid etching is shaping, completes first time circuit etching and shapingly carries out etching reprocessing to PCB surface afterwards, then the line map of GTL line layer 1 and GBL layer outside the circuit 4 is made, GTL line layer 1 and GBL layer outside the circuit 4 to be developed and second development cam compensates, second development cam free size value is also 0.05mm, check the development quality of the circuit that develops, acid etching is carried out to the GTL line layer 1 after inspection OK and GBL layer outside the circuit 4 shaping, namely second time acid etching is shaping, etching reprocessing is carried out to the surface of the shaping rear circuit board of second time circuit etching, and adopt testing jig special testing circuit plate, revise non-conducting and produce short circuit problem point, circuit board is made finished product, enter non-defective unit shipment later process.
The foregoing is only the preferred embodiments of the present invention, be not limited to the present invention, for a person skilled in the art, the present invention can have various modifications and variations.Within the spirit and principles in the present invention all, any amendment done, equivalent replacement, improvement etc., all should be included within protection scope of the present invention.
Claims (4)
1. a second etch double-sided circuit plate structure, comprise: GTL line layer, insulation PP layer and GBL step surface line layer, it is characterized in that: described GBL step surface line layer is made up of GBL layer within the circuit and GBL layer outside the circuit, described insulation PP layer is between GTL line layer and GBL layer within the circuit, described GBL layer outside the circuit is positioned on GBL layer within the circuit another side, described GBL layer outside the circuit is similar with the face shaping of GBL layer within the circuit, but GBL layer within the circuit size B1 is larger than GBL layer outside the circuit size B2 size, size relationship is preferably: B1=B2+0.05mm, described a kind of second etch double-sided PCB, its production technology comprises line manufacturing process point flow process and second time line manufacturing process point flow process for the first time.
2. the production technology of a kind of second etch double-sided PCB according to claim 1, is characterized in that: described first time line manufacturing process point flow process, comprise the following steps:
Step one, first time line map making;
Step 2, first time circuit development cam compensates, and the circuit that described first time development cam compensates is GBL layer within the circuit (3);
Step 3, the inspection of line of developing for the first time;
Step 4, the shaping GBL layer within the circuit of first time acid etching;
Step 5, first time circuit etching molded surface reprocessing.
3. the production technology of a kind of second etch double-sided PCB according to claim 2, is characterized in that: described second time line manufacturing process point flow process, comprises the following steps:
Step one, second time line map makes;
Step 2, second time circuit development cam compensates, and the circuit that described second development cam compensates comprises GTL line layer and GBL layer outside the circuit;
Step 3, the second development inspection of line;
Step 4, the second time shaping GTL line layer of acid etching and GBL layer outside the circuit;
Step 5, the reprocessing of second time circuit etching molded surface;
Step 6, adopts tool testing circuit board, revises non-conducting and short-circuit conditions;
Step 7, enters operation after circuit board finished product.
4. the production technology of a kind of second etch double-sided PCB according to claim 3, is characterized in that: when described first time circuit development cam compensates or second time circuit development cam compensates, the offset that cam compensates is 0.05mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410545111.0A CN105578765B (en) | 2014-10-15 | 2014-10-15 | A kind of second etch double-sided circuit harden structure and its production technology |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410545111.0A CN105578765B (en) | 2014-10-15 | 2014-10-15 | A kind of second etch double-sided circuit harden structure and its production technology |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105578765A true CN105578765A (en) | 2016-05-11 |
| CN105578765B CN105578765B (en) | 2018-07-10 |
Family
ID=55888268
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410545111.0A Active CN105578765B (en) | 2014-10-15 | 2014-10-15 | A kind of second etch double-sided circuit harden structure and its production technology |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105578765B (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104589897A (en) * | 2014-12-31 | 2015-05-06 | 苏州征之魂专利技术服务有限公司 | Double-sided textured multilayer metal texture interlaced decorative sheet and production process thereof |
| CN104589893A (en) * | 2014-12-31 | 2015-05-06 | 苏州征之魂专利技术服务有限公司 | Double-sided textured multilayer metal texture interlaced decorative sheet and production process thereof |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07335999A (en) * | 1994-06-15 | 1995-12-22 | Yazaki Corp | Production process of composite circuit board |
| CN1634713A (en) * | 2003-12-26 | 2005-07-06 | 技嘉科技股份有限公司 | Method for forming multilayered patterns on aluminium composite board surface |
| CN101166392A (en) * | 2006-10-18 | 2008-04-23 | 比亚迪股份有限公司 | A laminated multi-layer flexible printed circuit board and its making method |
| CN101242710A (en) * | 2007-02-08 | 2008-08-13 | 富港电子（东莞）有限公司 | Multilayer circuit board and its making method |
| CN103052253A (en) * | 2011-10-12 | 2013-04-17 | 旭德科技股份有限公司 | Circuit board structure and manufacturing method thereof |
| CN103130417A (en) * | 2011-11-29 | 2013-06-05 | 昆山汉白精密设备有限公司 | Manufacture technology of glass panel of electronic product |
-
2014
- 2014-10-15 CN CN201410545111.0A patent/CN105578765B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07335999A (en) * | 1994-06-15 | 1995-12-22 | Yazaki Corp | Production process of composite circuit board |
| CN1634713A (en) * | 2003-12-26 | 2005-07-06 | 技嘉科技股份有限公司 | Method for forming multilayered patterns on aluminium composite board surface |
| CN101166392A (en) * | 2006-10-18 | 2008-04-23 | 比亚迪股份有限公司 | A laminated multi-layer flexible printed circuit board and its making method |
| CN101242710A (en) * | 2007-02-08 | 2008-08-13 | 富港电子（东莞）有限公司 | Multilayer circuit board and its making method |
| CN103052253A (en) * | 2011-10-12 | 2013-04-17 | 旭德科技股份有限公司 | Circuit board structure and manufacturing method thereof |
| CN103130417A (en) * | 2011-11-29 | 2013-06-05 | 昆山汉白精密设备有限公司 | Manufacture technology of glass panel of electronic product |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104589897A (en) * | 2014-12-31 | 2015-05-06 | 苏州征之魂专利技术服务有限公司 | Double-sided textured multilayer metal texture interlaced decorative sheet and production process thereof |
| CN104589893A (en) * | 2014-12-31 | 2015-05-06 | 苏州征之魂专利技术服务有限公司 | Double-sided textured multilayer metal texture interlaced decorative sheet and production process thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| CN105578765B (en) | 2018-07-10 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN109301004A (en) | A kind of imbrication photovoltaic module and manufacturing method | |
| CN204090267U (en) | A kind of second etch double-sided PCB | |
| CN102364999A (en) | Manufacturing method of mechanical conduction hole circuit board without holes on surface | |
| CN108461577A (en) | A kind of production method of photovoltaic module | |
| CN105578765A (en) | Secondary-etching double-sided circuit board structure and processing technique thereof | |
| CN103648236A (en) | Method for improving PCB (Printed Circuit Board) metal binding local windowing | |
| CN105578707A (en) | Secondary-etching double-sided circuit board and processing technology thereof | |
| CN108637084A (en) | A kind of processing technology of semiconductor lead frame | |
| CN204774335U (en) | Two -sided line multilayer metal texture decorative board that interweaves that loses | |
| CN204622978U (en) | A kind of two-sided erosion line multiple layer metal texture intertexture decorative panel | |
| CN104589885A (en) | Double-sided textured multilayer metal texture interlaced decorative sheet and production process thereof | |
| CN105578705A (en) | Secondary-etching double-sided circuit board and processing technique thereof | |
| CN204774337U (en) | Two -sided line multilayer metal texture decorative board that interweaves that loses | |
| CN219180507U (en) | Rectifier module packaging structure | |
| CN204774336U (en) | Two -sided line multilayer metal texture decorative board that interweaves that loses | |
| CN206293270U (en) | Two-side film membrane inductor | |
| CN105517319A (en) | Secondary etching double-face circuit board structure and production technology thereof | |
| CN104589893A (en) | Double-sided textured multilayer metal texture interlaced decorative sheet and production process thereof | |
| CN104589894A (en) | Double-sided textured multilayer metal texture interlaced decorative sheet and production process thereof | |
| CN104589895A (en) | Double-sided textured multilayer metal texture interlaced decorative sheet and production process thereof | |
| CN104589896A (en) | Double-sided textured multilayer metal texture interlaced decorative sheet and production process thereof | |
| CN204774334U (en) | Two -sided line multilayer metal texture decorative board that interweaves that loses | |
| CN204774314U (en) | Two -sided line multilayer metal texture decorative board that interweaves that loses | |
| CN105140346A (en) | Method for recycling and reusing a transparent conducting glass substrate of a thin-film solar cell | |
| CN105575759A (en) | PECVD rework cell processing method |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |