CN206293270U - Two-side film membrane inductor - Google Patents
Two-side film membrane inductor Download PDFInfo
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- CN206293270U CN206293270U CN201621378420.4U CN201621378420U CN206293270U CN 206293270 U CN206293270 U CN 206293270U CN 201621378420 U CN201621378420 U CN 201621378420U CN 206293270 U CN206293270 U CN 206293270U
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Abstract
The utility model discloses a kind of two-side film membrane inductor, inductive circuit has been made in insulated substrate front and the back side, and front inductive circuit is connected with back side inductive circuit by the conductive through hole in insertion insulated substrate front and the back side, so, the making (upper and lower inductive circuit is completed simultaneously) of insulated substrate front inductive circuit and back side inductive circuit can be simultaneously completed using gold-tinted processing procedure, substantially increase producing efficiency, middle making inductive circuit compared to existing technology, producing efficiency is doubled, and on, the structure that be clipped in the middle for insulated substrate by lower two-layer inductive circuit, expand the scope of inductive circuit application, the inductive circuit on substrate two sides only can more improve inductance value than tradition in the making inductive circuit of insulated substrate one side.Conductive through hole is radium-shine by optical fiber and printing filling perforation is on insulated substrate, because the aperture area that can be used is big, and makes easy, and yield can improve many.
Description
Technical field
The utility model is related to inductors technique field, more particularly, to a kind of two-side film membrane inductor.
Background technology
With developing rapidly for Information technology, people increase day by day for the dependence of science and technology, and field of radio frequency communication is also sent out
Earth-shaking change is given birth to, ideal market prospects are brought because it is widely applied scope, be constantly subjected to people
Favor.Thin film inductor is of common occurrence in module in circuit as a kind of passive device widely, in radio frequency
With especially prominent in the circuit modules such as circuit, amplifier.How core inductor quality factor and self-resonant frequency are solved
Problem, while the need for ensureing that inductance value meets side circuit, a new inductor product need to be designed to meet this city
Field demand.Existing general thin inductance is usually by the way of lamination, also to be existed in its structure and manufacturing process following
Shortcoming：
Firstth, the processing procedure of conventional films inductor be all one time one layer, it is progressively complete by lower floor's line conduction upper layer circuit
Into manufacturing process is tediously long, inefficient.
The logical layer in the road of the secondth, upper and lower sandwich circuit must be made using gold-tinted processing procedure, easily because levels drop, Huo Zhexian
Shadow is unclean to cause the electrode to have residue and cause poor flow or open circuit, thus influence yield.
The content of the invention
In order to solve the above-mentioned technical problem, the utility model proposes a kind of two-side film membrane inductor, except traditional system can be improved
Make outside the efficiency of thin film inductor, the structure that be clipped in the middle for insulated substrate by upper and lower sandwich circuit expands the model of line applications
Enclose, the circuit on substrate two sides only can more improve inductance value than tradition in the circuit of substrate one side.
What the technical solution of the utility model was realized in：
A kind of two-side film membrane inductor, including a square block insulated substrate, the insulated substrate have front and the back of the body
Face, is formed with the front electrode extended along X-direction, the insulated substrate on the front of the insulated substrate left and right sides
Positive Middle face is formed with front inductive circuit, and the front inductive circuit is electrically connected with the front electrode；
The backplate extended along X-direction is formed with the back side of the insulated substrate left and right sides, it is described exhausted
Edge substrate back middle part is formed with back side inductive circuit, and the back side inductive circuit is electrically connected with the backplate；
By connecting the insulated substrate front and the back side between the front inductive circuit and the back side inductive circuit
An at least conductive through hole be connected；
The front inductive circuit and the back side inductive circuit are cladded with and are stamped insulating protective layer；
Side electrode, the side are respectively formed with two side elevations on the insulated substrate along X-direction extension
Electrode is overlapped on the backplate edge to insulated substrate back side extension, and the side electrode is to the insulated substrate
Front extension is overlapped on the front electrode edge；
Plating is provided with copper plate outside the side electrode, and plating is provided with nickel coating outside the copper plate, and the nickel coating extension is covered
The front electrode and the backplate are covered, is formed with the nickel coating and is covered all the tin plating of the nickel coating
Layer, and the tin coating connects with the end face of the insulating protective layer.
Further, it is printed with label layer on the positive insulating protective layer of the insulated substrate.
Further, the conductive through hole includes the through hole at the connection insulated substrate front and the back side, in the through hole
Printing is filled with silver paste.
Further, the front inductive circuit, the back side inductive circuit, the front electrode and the backplate
Include one layer of splash-proofing sputtering metal layer and rack plating in splash-proofing sputtering metal layer last layer rack plating metal level.
Further, the insulating protective layer is the photosensitive type paste resin bed of material.
Further, the front inductive circuit and the back side inductive circuit are arranged into snail wire.
The beneficial effects of the utility model are：
Compared with thin film inductor of the prior art, a kind of two-side film membrane inductor and system made by the utility model
Had the following advantages that as method：1. by insulated substrate, using the radium-shine punching of optical fiber, form conducting insulated substrate and just carry on the back
The path in face；2. there is corresponding inductive circuit at the positive back side of insulated substrate, can improve inductance value；3. inductive circuit is to use
The mode of rack plating is formed, it is ensured that the precision of inductance value；A kind of two-side film membrane inductor made by the utility model can be extensive
In making using various circuits.
Brief description of the drawings
Fig. 1 is the structural representation of the insulated substrate after the utility model is processed through step a, b；
Fig. 2 is the structural representation of the insulated substrate after the utility model is processed through step c；
Fig. 3 is the structural representation of the insulated substrate after the utility model is processed through step d；
Fig. 4 is the structural representation of the insulated substrate after the utility model is processed through step e；
Fig. 5 is the structural representation of the insulated substrate after the utility model is processed through step f；
Fig. 6 is the structural representation of the insulated substrate after the utility model is processed through step g；
Fig. 7 is the structural representation of the insulated substrate after the utility model is processed through step h；
Fig. 8 is the structural representation of the insulated substrate after the utility model is processed through step i；
Fig. 9 is the structural representation of the insulated substrate after the utility model is processed through step j；
Figure 10 is the structural representation of the insulated substrate after the utility model is processed through step k, l；
Figure 11 is the positive structural representation of insulated substrate after the utility model is processed through step m；
Figure 12 is the structural representation that the strip semi-finished product are obtained after the utility model is processed through step n；
Figure 13 is the structural representation that the block semi-finished product are obtained after the utility model is processed through step o；
Figure 14 is the structural representation that a kind of two-side film membrane inductor is obtained after the utility model is processed through step p, q
Figure；
Figure 15 is the cross-sectional view of the utility model two-side film membrane inductor.
Specific embodiment
In order to be more clearly understood that technology contents of the present utility model, described in detail especially exemplified by following examples, its mesh
Be only that and be best understood from content of the present utility model and unrestricted protection domain of the present utility model.
As shown in figure 15, a kind of two-side film membrane inductor, including a square block insulated substrate 1, the insulated substrate
With front and back, the front electrode extended along X-direction is formed with the front of the insulated substrate left and right sides
2, the positive Middle face of insulated substrate is formed with front inductive circuit 3, and the front inductive circuit is electrically connected with the front electrode；
The backplate 4 extended along X-direction is formed with the back side of the insulated substrate left and right sides, it is described exhausted
Edge substrate back middle part is formed with back side inductive circuit 5, and the back side inductive circuit is electrically connected with the backplate；
By connecting the insulated substrate front and the back side between the front inductive circuit and the back side inductive circuit
An at least conductive through hole 6 be connected.
The front inductive circuit and the back side inductive circuit are cladded with and are stamped insulating protective layer 7.
Side electrode 8, the side are respectively formed with two side elevations on the insulated substrate along X-direction extension
Electrode is overlapped on the backplate edge to insulated substrate back side extension, and the side electrode is to the insulated substrate
Front extension is overlapped on the front electrode edge.
Plating is provided with copper plate 9 outside the side electrode, and plating is provided with nickel coating 10 outside the copper plate, and the nickel coating extends
The front electrode and the backplate are covered, is formed with the nickel coating and is covered all the tin plating of the nickel coating
Layer 11, and the tin coating connects with the end face of the insulating protective layer.
In said structure, inductive circuit, and front inductive circuit and the back side are made in insulated substrate front and the back side
Inductive circuit is connected by the conductive through hole in insertion insulated substrate front and the back side, so, can be simultaneously complete using gold-tinted processing procedure
Into the making (upper and lower inductive circuit is completed) of insulated substrate front inductive circuit and back side inductive circuit simultaneously, system is substantially increased
Make efficiency, compared to existing technology middle making inductive circuit, producing efficiency is doubled, and on, lower two-layer inductive circuit will be exhausted
The structure that edge substrate is clipped in the middle, expands the scope of inductive circuit application, and the inductive circuit on substrate two sides is than tradition only exhausted
The making inductive circuit of edge substrate one side can more improve inductance value.Conductive through hole is radium-shine by optical fiber and printing filling perforation is in insulation base
On plate, because the aperture area that can be used is big, and make easy, yield can improve many.
Further, it is printed with label layer 12 on the positive insulating protective layer of the insulated substrate.So, insulated substrate is being just
Print product label layer on face, it is easy to recognize.
Further, the conductive through hole includes the through hole 23 at the connection insulated substrate front and the back side, the through hole
Interior printing is filled with silver paste 24.
Further, the front inductive circuit, the back side inductive circuit, the front electrode and the backplate
Include one layer of splash-proofing sputtering metal layer 25 and rack plating in splash-proofing sputtering metal layer last layer rack plating metal level 26.So, one layer is first sputtered
Metal forms splash-proofing sputtering metal layer, then is plating layer of metal using rack plating mode on splash-proofing sputtering metal layer, forms rack plating metal level
(inductive circuit), it can be ensured that the stability of inductance value.
Further, the insulating protective layer is the photosensitive type paste resin bed of material.
Further, the front inductive circuit and the back side inductive circuit are arranged into snail wire.
A kind of preparation method of two-side film membrane inductor, comprises the following steps：
A, referring to Fig. 1, cut out a bulk of insulated substrate 1 by design, in the insulated substrate on the front and back, point
The frame line 21 extended along X-direction and the frame line 22 extended along Y direction are not cut out, by the insulated substrate just
Face and the back side are divided into square grid；Preferably, above-mentioned frame line 21,22 can be formed by the radium-shine mode of optical fiber.
B, referring to Fig. 1, the square grid on the insulated substrate is divided into some inductor units in advance by the arrangement of rule,
Go out the through hole 23 for connecting the insulated substrate front and the back side in each inductor unit internal cutting；Preferably, optical fiber can be used
Radium-shine mode cuts out through hole 23, and so, usable aperture area is big, and makes easy.
C, referring to Fig. 2, silver paste 24 is printed on the insulated substrate, it is filled up the through hole, form conductive through hole 6；
Preferably, silver paste can be printed onto in the through hole on insulated substrate by the way of filling perforation is printed, due to the aperture that can be used
Area is big, and makes easy, and yield can improve many.During specific implementation, silver paste material may be selected resin silver, fill up resin silver
Through hole, and grinding technique is used, the resin silver grinding in silver-colored hole outer peripheral areas is clean.
D, referring to Fig. 3, behind insulated substrate front and backside cleaning, using the method for vacuum sputtering, in the insulated substrate
Splash-proofing sputtering metal material, forms one layer of splash-proofing sputtering metal layer 25 on the front and back；Preferably, the metal material of sputtering be Titanium and
The sputtering target material of copper, i.e. splash-proofing sputtering metal layer is Titanium and metallic copper.
E, referring to Fig. 4, cover one layer of light-sensitive surface on the insulated substrate front and the back side after through step a~d treatment；Exist
The front of insulated substrate and the back side apply last layer photoresistance, it is preferred that can use photosensitive resin.
F, referring to Fig. 5, the light shield with certain line pattern is set on insulated substrate, exposed by source of parallel light exposure machine
The mode of light, the line pattern is stayed on the light-sensitive surface of insulated substrate front and back, and the line pattern is by some electricity of correspondence
Some unit figures composition of sensor cell, each unit figure includes the default front inductive circuit of correspondence positioned at positive Middle face
Front inductive graph, positioned at the front inductive graph left and right sides along the default front electrode of correspondence that X-direction extends just
Face electrode pattern, and front inductive graph is connected with default front electrode figure；Also include that the correspondence in the middle part of the back side is pre-
If the back side inductive graph of back side inductive circuit, the correspondence along X-direction extension positioned at the back side inductive graph left and right sides are pre-
If the backplate figure of backplate, and back side inductive graph is connected with backplate figure；Front inductive graph and the back of the body
Face inductive graph is connected to the conductive through hole；
G, referring to Fig. 6, by the unwanted light-sensitive surface of developing away, expose insulated substrate front and back line pattern pair
The splash-proofing sputtering metal layer answered；During specific implementation, can will be rinsed in developer solution through the insulated substrate after step a~f treatment, exposed
The corresponding splash-proofing sputtering metal layer of insulated substrate front and back line pattern.
H, referring to Fig. 7, using rack plating technology on above-mentioned splash-proofing sputtering metal layer one layer of rack plating metal level 26 of rack plating, then adopt again
Membrane technology is spent to remove the light-sensitive surface of line pattern exterior domain；Circuit is being plated using rack plating mode, it can be ensured that inductance value
Stability.Preferably, the material of rack plating metal level is fine copper.
I, referring to Fig. 8, using the method for chemical etching, the splash-proofing sputtering metal layer of line pattern exterior domain is etched away, formed
Front inductive circuit 3 and front electrode 2, back side inductive circuit 5 and backplate 4；That is positive inductance circuit and back side inductive circuit
It has been connected that, formd inductance value.
J, referring to Fig. 9, using radium-shine technology to carrying out groove through the insulated substrate after step a~l treatment, cut out some
The folding bar line 27 extended along X-direction and the folding grain line 28 extended along Y direction, the folding bar line are mutual with the folding grain line
Intersecting vertical, insulated substrate is divided into some square grid of some inductor units of correspondence；The folding bar line of X-direction, Y-direction
Folding grain line granulates inductance separation in can ensure that successive process；And after inductive circuit completes, then carried out using laser machine
Particle line groove, it is ensured that the precision of particle.
K, referring to Figure 10, print one layer of photosensitive-ink on the front and the back side of the insulated substrate after through step a~i treatment
As insulating protective layer 7；One layer of photosensitive-ink is printed on rack plating metal level i.e. after treatment, and according to design requirement photosensitive
An I-shaped exposure area is set in each square grid area corresponding to film；The material of photosensitive-ink is photosensitive type paste resin
Material；
L, referring to Figure 10, by way of exposure imaging, expose front electrode and backplate, leave covering front electricity
The region of sense circuit and back side inductive circuit；I.e. using the method for development, unnecessary photosensitive-ink development is fallen, leaving covering just
The region of face inductive circuit and back side inductive circuit.
M, referring to Figure 11, print one layer of label layer 12 on the insulating protective layer after through step a~k treatment, and done
Dry and sintering.The material of label layer is resin slurry.
N, referring to Figure 12, the folding bar line along the insulated substrate will successively be rolled over by the insulated substrate after step a~m treatment
Into multiple strip semi-finished product；Then recycle vacuum sputtering machines is carried out to each strip semi-finished product through the side that folding bar is formed
Sputtering, forms side electrode 8, and the side electrode is overlapped on the front electrode and the backplate；
O, referring to Figure 13, along the strip semi-finished product folding grain line by by the strip semi-finished product after step a~n treatment according to
It is secondary to be converted into multiple bulk semi-finished product；Then barrel plating mode is recycled to be plated on the side electrode of each block semi-finished product
Layer of metal copper, forms copper plate 9；The copper plate is taken and is put on the front electrode and backplate；
P, referring to Figure 14, last layer is plated outside the copper plate and front electrode and backplate using barrel plating mode
Metallic nickel, forms one layer of nickel coating 10, and the nickel coating can cover all the copper plate, front electrode and back electrode；
Q, referring to Figure 14, layer of metal tin is plated outside the nickel coating using barrel plating mode, form one layer of tin coating 11,
The tin coating can cover all the nickel coating.
Above example is referring to the drawings, preferred embodiment of the present utility model to be described in detail.The skill of this area
Art personnel by carrying out to above-described embodiment modification or change on various forms, but without departing substantially from substantive feelings of the present utility model
Under condition, all fall within protection domain of the present utility model.
Claims (6)
1. a kind of two-side film membrane inductor, it is characterised in that：Including a square block insulated substrate (1), the insulated substrate
With front and back, the front electrode extended along X-direction is formed with the front of the insulated substrate left and right sides
(2), the positive Middle face of the insulated substrate is formed with front inductive circuit (3), and the front inductive circuit and the front electrode are electric
Connection；
The backplate (4) extended along X-direction, the insulation are formed with the back side of the insulated substrate left and right sides
Substrate back middle part is formed with back side inductive circuit (5), and the back side inductive circuit is electrically connected with the backplate；
By connecting the insulated substrate front and the back side extremely between the front inductive circuit and the back side inductive circuit
A few conductive through hole (6) is connected；
The front inductive circuit and the back side inductive circuit are cladded with and are stamped insulating protective layer (7)；
Side electrode (8), the side electricity are respectively formed with two side elevations on the insulated substrate along X-direction extension
Pole to the insulated substrate back side extend be overlapped on the backplate edge, the side electrode to the insulated substrate just
Face extension is overlapped on the front electrode edge；
Plating is provided with copper plate (9) outside the side electrode, and plating is provided with nickel coating (10) outside the copper plate, and the nickel coating extends
The front electrode and the backplate are covered, is formed with the nickel coating and is covered all the tin plating of the nickel coating
Layer (11), and the tin coating connects with the end face of the insulating protective layer.
2. two-side film membrane inductor according to claim 1, it is characterised in that：The positive insulation protection of insulated substrate
Label layer (12) is printed with layer.
3. two-side film membrane inductor according to claim 1, it is characterised in that：The conductive through hole includes that connection is described absolutely
Printing is filled with silver paste (24) in the through hole (23) at edge substrate front side and the back side, the through hole.
4. two-side film membrane inductor according to claim 1, it is characterised in that：The front inductive circuit, the back side
Inductive circuit, the front electrode and the backplate include one layer of splash-proofing sputtering metal layer (25) and rack plating in the splash-proofing sputtering metal
Layer last layer rack plating metal level (26).
5. two-side film membrane inductor according to claim 1, it is characterised in that：The insulating protective layer is photosensitive type resin
Pulp layer.
6. two-side film membrane inductor according to claim 1, it is characterised in that：The front inductive circuit and the back side
Inductive circuit is arranged into snail wire.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621378420.4U CN206293270U (en) | 2016-12-15 | 2016-12-15 | Two-side film membrane inductor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621378420.4U CN206293270U (en) | 2016-12-15 | 2016-12-15 | Two-side film membrane inductor |
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| Publication Number | Publication Date |
|---|---|
| CN206293270U true CN206293270U (en) | 2017-06-30 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201621378420.4U Active CN206293270U (en) | 2016-12-15 | 2016-12-15 | Two-side film membrane inductor |
Country Status (1)
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| CN (1) | CN206293270U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108231371A (en) * | 2016-12-15 | 2018-06-29 | 昆山福仕电子材料工业有限公司 | Two-side film membrane inductor and preparation method thereof |
| CN109346255A (en) * | 2018-11-29 | 2019-02-15 | 昆山厚声电子工业有限公司 | A kind of low resistivity value resistor and its manufacture craft |
-
2016
- 2016-12-15 CN CN201621378420.4U patent/CN206293270U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108231371A (en) * | 2016-12-15 | 2018-06-29 | 昆山福仕电子材料工业有限公司 | Two-side film membrane inductor and preparation method thereof |
| CN109346255A (en) * | 2018-11-29 | 2019-02-15 | 昆山厚声电子工业有限公司 | A kind of low resistivity value resistor and its manufacture craft |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20190422 Address after: 223001 No. 88 Shanyang Avenue, Huai'an District, Huai'an City, Jiangsu Province Patentee after: Jiequn Electronic Technology (Huaian) Co., Ltd. Address before: 215300 Huanlou Road 288, Kunshan Development Zone, Suzhou City, Jiangsu Province Patentee before: Kunshan Fu Shi Electronic Materials Industry Co., Ltd. |
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| TR01 | Transfer of patent right |