CN105578765B - A kind of second etch double-sided circuit harden structure and its production technology - Google Patents

Abstract

The invention discloses a kind of second etch double-sided circuit harden structure and its production technology, double-sided circuit harden structure of the invention includes：PP layers and GBL GTL line layers, insulation step surface line layers, the GBL step surfaces line layer is made of GBL layers within the circuit and GBL layers outside the circuit, PP layers of the insulation is between GTL line layers and GBL layers within the circuit, the GBL layers outside the circuit are located on GBL layer within the circuit another sides, and a kind of second etch double-sided circuit board production technology includes following operating procedure：First secondary line makes circuit development cam compensated lines inspection etching the second secondary line making circuit development cam compensated lines inspection etching electrical measurement and opens short-circuit later process.The present invention only needs secondary making, and less investment simplifies production procedure and task difficulty, improves production efficiency, reduces production cost, reduce product fraction defective, shorten the production cycle of product.

Description

A kind of second etch double-sided circuit harden structure and its production technology

Technical field

The present invention relates to a kind of board production techniques, and in particular to a kind of second etch double-sided circuit board production technology.

Background technology

In current board production technique, there is the two-sided electricity of GTL line layers, GBL layers within the circuit and GBL layers outside the circuit Road plate, using making three times, completion circuit gradually makes, and the accumulated error of making is very big, and product quality cannot get management and control, Its duty cycle is longer, and the cycle period of production is longer, and the production friendship phase cannot improve, while cost input is also very big, meets Not customer requirement；Secondary with regard to that can fulfil assignment after research, product quality can also obtain control.To solve the above-mentioned problems, It develops a kind of novel stacked circuit board line and makes update method, to improve the unfailing performance of pcb board part, and meanwhile it is yet a large amount of The manufacture craft period of PCB costs of manufacture and place short 30% is reduced, the qualification rate of product is improved and meets numerous clients' Demand.

Invention content

It is an object of the invention to overcome problem above of the existing technology, a kind of second etch double-sided PCB is provided Structure and its production technology, the circuit system that the present invention need to will be etched three times originally by cam compensation and new etch process Make method by subtracting into three times to twice, the reduction of human resources input greatly simplified production procedure and task difficulty, reduce Product leads to the generation of defective products when accumulated error being caused to increase because repeatedly etching, largely reduce PCB costs of manufacture and place is short 30% manufacture craft period, the friendship phase for meeting client that can be preferably require, remarkable in economical benefits.

To realize above-mentioned technical purpose and the technique effect, the invention is realized by the following technical scheme：

A kind of second etch double-sided circuit harden structure, including：PP layers and GBL GTL line layers, insulation step surface line layers, It is characterized in that：The GBL step surfaces line layer is made of GBL layers within the circuit and GBL layers outside the circuit, and PP layers of the insulation is located at Between GTL line layers and GBL layers within the circuit, the GBL layers outside the circuit are located on GBL layer within the circuit another sides, the GBL outside lines Road floor is similar with the face shaping of GBL layers within the circuit, but GBL layer within the circuit size B1 are than GBL layer outside the circuit size B2 sizes Greatly, size relationship is preferably：B1=B2+0.05mm, a kind of second etch double-sided PCB, production technology include first Secondary line manufacture craft split flow and second of line manufacturing process split flow.

Further, the first time line manufacturing process split flow, includes the following steps：

Step 1, first time line map make；

Step 2, the development cam compensation of the first secondary line, the circuit of the development cam compensation is GBL layers within the circuit；

Step 3, the inspection of line of developing for the first time；

Step 4, first time acid etching molding GTL line layers and GBL layers within the circuit；

Step 5, the post processing of first time circuit etching molded surface.

Further, second of line manufacturing process split flow, includes the following steps：

Step 1, second of line map make；

Step 2, the development cam compensation of the second secondary line, the circuit of the development cam compensation include GTL line layers and GBL Layer outside the circuit；

Step 3, the second development inspection of line；

Step 4, second of acid etching molding GBL layers outside the circuit；

Step 5, second of circuit etching molded surface post processing；

Step 6, using jig test circuit plate, amendment does not turn on and short-circuit conditions；

Step 7, into circuit board finished product after process.

Further, when the first secondary line development cam compensation or the second secondary line development cam are compensated, cam compensation Offset is 0.05mm.

The beneficial effects of the invention are as follows:

The present invention is by cam compensation and new etch process by the circuit manufacturing method that need to be etched three times originally by three Secondary to subtract into twice, the reduction of human resources input greatly simplified production procedure and task difficulty, reduce product because more It is secondary to etch the generation that accumulated error is caused to increase and leads to defective products, largely reduce the making of PCB costs of manufacture and place short 30% Process cycle, the friendship phase for meeting client that can be preferably require, remarkable in economical benefits.

Description of the drawings

Fig. 1 is the molding schematic diagram of the first secondary line of circuit board of the present invention.

Fig. 2 is the molding schematic diagram of the second secondary line of circuit board of the present invention.

Fig. 3 is circuit board final structure schematic diagram of the present invention.

Each label and corresponding entitled in figure：1st, GTL line layers, 2, PP layers of insulation, 3, GBL layers within the circuit, 4, outside GBL Line layer.

Specific embodiment

The present invention is described in further details with reference to the accompanying drawings and examples：

As shown in figure 3, a kind of second etch double-sided circuit harden structure, including：GTL line layers 1, insulation PP layers 2 and GBL platforms Terrace line layer, it is characterised in that：The GBL step surfaces line layer is made of GBL layers within the circuit 3 and GBL layers outside the circuit 4, institute Insulation PP layers 2 are stated between GTL line layers 1 and GBL layers within the circuit 3, the GBL layers outside the circuit 4 are located at GBL layers within the circuit 3 On another side, the GBL layers outside the circuit 4 are similar with the face shaping of GBL layers within the circuit 3, but 3 size B1 ratios of GBL layers within the circuit 4 size B2 sizes of GBL layers outside the circuit are big, and size relationship is preferably：B1=B2+0.05mm, a kind of second etch are two-sided Circuit board, production technology include first time line manufacturing process split flow and second of line manufacturing process split flow.

As shown in Figure 1, the first time line manufacturing process split flow, includes the following steps：

Step 1, first time line map make；

Step 2, the development cam compensation of the first secondary line, the circuit of the development cam compensation is GBL layers within the circuit 3；

Step 3, the inspection of line of developing for the first time；

Step 4, first time acid etching molding GTL line layers 1 and GBL layers within the circuit 3；

Step 5, the post processing of first time circuit etching molded surface.

As shown in Fig. 2, second of line manufacturing process split flow, includes the following steps：

Step 1, second of line map make；

Step 2, the development cam compensation of the second secondary line, the circuit of the development cam compensation include GTL line layers 1 and GBL Layer outside the circuit 4；

Step 3, the second development inspection of line；

Step 4, second of acid etching molding GBL layers outside the circuit 4；

Step 5, second of circuit etching molded surface post processing；

Step 6, using jig test circuit plate, amendment does not turn on and short-circuit conditions；

Step 7, into circuit board finished product after process.

When the first secondary line development cam compensation or the development cam compensation of the second secondary line, the offset of cam compensation is 0.05mm。

The operation principle of the present embodiment is as follows：

Such as Fig. 1, shown in Fig. 2, the making of first time line map is done to GBL layers within the circuit 3 first, then to GBL layers within the circuit 3 Circuit carries out development and development cam compensation, compensation size value are 0.05mm for the first time, checks the development matter for the circuit that develops Amount, to checking that the GBL layers within the circuit 3 after OK carry out acid etching molding, i.e. first time acid etching is molded, and completes first time line Post processing is etched after the etch-forming of road to PCB surface；Then the circuit of GTL line layers 1 and GBL layers outside the circuit 4 is made Figure, develops to GTL line layers 1 and GBL layers outside the circuit 4 and second development cam compensation, second development cam compensate ruler Very little value is also 0.05mm, checks the development quality for the circuit that develops, to the GTL line layers 1 and GBL layers outside the circuit after inspection OK 4 carry out acid etching molding, i.e. second of acid etching molding, the surface of circuit board carries out after being molded to second of circuit etching Etching post processing, and testing jig special detection circuit plate is used, amendment does not turn on and generates short circuit problem point, by circuit board system Into finished product, into non-defective unit shipment later process.

The foregoing is only a preferred embodiment of the present invention, is not intended to restrict the invention, for the skill of this field For art personnel, the invention may be variously modified and varied.All within the spirits and principles of the present invention, that is made any repaiies Change, equivalent replacement, improvement etc., should all be included in the protection scope of the present invention.

Claims (1)

1. a kind of production technology of second etch double-sided circuit harden structure, it is characterised in that：The second etch being prepared is two-sided Board structure of circuit includes PP layers and GBL GTL line layers, insulation step surface line layers, and the GBL step surfaces line layer is by GBL Line layer and GBL layers outside the circuit are formed, and PP layers of the insulation is between GTL line layers and GBL layers within the circuit, outside the GBL Line layer is located on GBL layer within the circuit another sides, and the GBL layers outside the circuit are similar with the face shaping of GBL layers within the circuit, but GBL layer within the circuit size B1 are bigger than GBL layer outside the circuit size B2 sizes, and size relationship is：B1=B2+0.05mm produces work Skill includes first time line manufacturing process split flow and second of line manufacturing process split flow；

The first time line manufacturing process split flow, includes the following steps：

Step 1, first time line map make；

Step 2, the development cam compensation of the first secondary line, the circuit of the first time development cam compensation is GBL layers within the circuit (3)；

Step 3, the inspection of line of developing for the first time；

Step 4, first time acid etching molding GBL layers within the circuit；

Step 5, the post processing of first time circuit etching molded surface；

Second of line manufacturing process split flow, includes the following steps：

Step 1, second of line map make；

Step 2, the development cam compensation of the second secondary line, the circuit of second development cam compensation include GTL line layers and GBL layers outside the circuit；

Step 3, the second development inspection of line；

Step 4, second of acid etching molding GTL line layers and GBL layers outside the circuit；

Step 5, second of circuit etching molded surface post processing；

Step 6, using jig test circuit plate, amendment does not turn on and short-circuit conditions；

Step 7, into circuit board finished product after process；

When the first secondary line development cam compensation or the development cam compensation of the second secondary line, the offset of cam compensation is 0.05mm。