CN201417769Y - Array type high-power integrated circuit lead wire frame - Google Patents
Array type high-power integrated circuit lead wire frame Download PDFInfo
- Publication number
- CN201417769Y CN201417769Y CN 200920172553 CN200920172553U CN201417769Y CN 201417769 Y CN201417769 Y CN 201417769Y CN 200920172553 CN200920172553 CN 200920172553 CN 200920172553 U CN200920172553 U CN 200920172553U CN 201417769 Y CN201417769 Y CN 201417769Y
- Authority
- CN
- China
- Prior art keywords
- lead wire
- wire frame
- line
- integrated circuit
- array type
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Abstract
The present utility model discloses an array type high-power integrated circuit lead wire frame consisting of frames [1] and a plurality of packaging units [2] which are positioned in the frame in anarray distribution with even number of lines, packaging units [2] adjacent to the line of 2n+1 and the line of 2n+2 are connected through art connection parts [4] at the position of heat radiating fins [3], inside and outside lead wires [5, 6] of each packaging unit of the line of 2n+1 and the line of 2n+2 are connected with the frames [1], the lead wire frame is designed in a multiple-row matrixtype arrangement, the number of packaging units on the lead wire frame is multiplied, utilization ratios per unit time of packaging moulds, bar-cutting moulds of post-working procedure, bending mouldsand the like are improved, and production cost is reduced.
Description
Technical field
The utility model relates to the lead frame that is used for semiconductor packages, relates to particularly to use copper or the copper alloy high-power integrated circuit lead frame as basic material.
Background technology
Encapsulation unit on the high-power integrated circuit lead frame is the single file distribution at present, and the inside and outside pin and the fin of each encapsulation unit both sides are connected in respectively on two body side frames.Because the fast development of electronics technology, electronic product want cube littler, with better function, this just requires at the more integrated circuit modules of electronic product internal request design and installation.Because the integrated circuit volume need increase the quantity of integrated circuit modules when reducing, just need further reduce the volume of integrated circuit package module, promptly dwindle the volume of integrated circuit encapsulation.Therefore, the lead frame volume is also dwindling thereupon, and the utilance of sealed in unit is more and more lower.
Summary of the invention
The purpose of this utility model provides a kind of array type high-power integrated circuit lead frame, can improve the utilization rate of equipment and installations of encapsulating mould, increases the product yield of unit interval, reduces packaging cost.
The utility model is achieved in that by framework and several encapsulation units of being located in the framework to be formed, encapsulation unit is array distribution on framework, wherein line number is an even number line, the adjacent encapsulation unit that 2n+1 is capable and 2n+2 is capable connects muscle at the fin place by technology and is connected, and 2n+1 is capable, and interior outer lead with capable each encapsulation unit of 2n+2 is connected with framework.
Though the many more efficient of the encapsulation unit line number on the lead frame are high more, also higher relatively to the sealed in unit required precision, the device fabrication difficulty is big, and a priority scheme of the present utility model is that encapsulation unit has 4 row.
The utility model lead frame has changed the packing forms of the single distribution of encapsulation unit of present the type product, adopt the arrangement design of many rows, matrix form, make the encapsulation unit number on the lead frame be multiplied, improved encapsulating mould, and the back operation cut the muscle mould, the utilance of the unit interval of mould such as bend, reduce production costs, adapt to the demand of existing market this series products.
Description of drawings
Fig. 1 is the utility model structural representation.
Embodiment
As shown in Figure 1, the array type large power circuit lead frame, form by framework 1 and several encapsulation units 2 of being located in the framework 1, encapsulation unit 2 is array distribution on framework 1, wherein line number is 4 row, every row is by several encapsulation units, and the 1st row connects muscle 4 at fin 3 places by technology with the same column encapsulation unit of the 4th row and is connected with the 2nd row, the 3rd row, and the 1st interior outer lead 5,6 that walks to each encapsulation unit of the 4th row is connected with framework 1.
Encapsulation unit line number on the utility model array type large power circuit lead frame also can be 6 row or 8 row.
Claims (2)
1, array type large power circuit lead frame, form by framework [1] and several encapsulation units [2] of being located in the framework, it is characterized in that encapsulation unit [2] is array distribution on framework [1], wherein line number is an even number line, the adjacent encapsulation unit that 2n+1 is capable and 2n+2 is capable is located to connect muscle [4] by technology at fin [3] and is connected, and 2n+1 is capable, and interior outer lead [5,6] with capable each encapsulation unit of 2n+2 is connected with framework [1].
2, array type large power circuit lead frame according to claim 1 is characterized in that encapsulation unit [2] has 4 row.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200920172553 CN201417769Y (en) | 2009-06-09 | 2009-06-09 | Array type high-power integrated circuit lead wire frame |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200920172553 CN201417769Y (en) | 2009-06-09 | 2009-06-09 | Array type high-power integrated circuit lead wire frame |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201417769Y true CN201417769Y (en) | 2010-03-03 |
Family
ID=41794196
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200920172553 Expired - Fee Related CN201417769Y (en) | 2009-06-09 | 2009-06-09 | Array type high-power integrated circuit lead wire frame |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201417769Y (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102593092A (en) * | 2012-03-22 | 2012-07-18 | 天水华天微电子股份有限公司 | Lead frame |
| CN102903695A (en) * | 2012-10-30 | 2013-01-30 | 天水华天科技股份有限公司 | SOT223 matrix lead frame capable of increasing utilization ratio of materials |
| CN103474409A (en) * | 2013-09-11 | 2013-12-25 | 杰群电子科技（东莞）有限公司 | Arrangement method designed for high-density lead frames for discrete device |
| CN107195611A (en) * | 2017-05-27 | 2017-09-22 | 中国电子科技集团公司第十三研究所 | The preparation method of lead frame and shell assembly |
| CN108831873A (en) * | 2018-06-28 | 2018-11-16 | 长电科技（宿迁）有限公司 | A kind of totally enclosed type lead frame and its encapsulating structure |
-
2009
- 2009-06-09 CN CN 200920172553 patent/CN201417769Y/en not_active Expired - Fee Related
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102593092A (en) * | 2012-03-22 | 2012-07-18 | 天水华天微电子股份有限公司 | Lead frame |
| CN102903695A (en) * | 2012-10-30 | 2013-01-30 | 天水华天科技股份有限公司 | SOT223 matrix lead frame capable of increasing utilization ratio of materials |
| CN102903695B (en) * | 2012-10-30 | 2015-06-17 | 天水华天科技股份有限公司 | SOT223 matrix lead frame capable of increasing utilization ratio of materials |
| CN103474409A (en) * | 2013-09-11 | 2013-12-25 | 杰群电子科技（东莞）有限公司 | Arrangement method designed for high-density lead frames for discrete device |
| CN107195611A (en) * | 2017-05-27 | 2017-09-22 | 中国电子科技集团公司第十三研究所 | The preparation method of lead frame and shell assembly |
| CN107195611B (en) * | 2017-05-27 | 2023-06-16 | 中国电子科技集团公司第十三研究所 | Lead frame and manufacturing method of shell assembly |
| CN108831873A (en) * | 2018-06-28 | 2018-11-16 | 长电科技（宿迁）有限公司 | A kind of totally enclosed type lead frame and its encapsulating structure |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20100303 Termination date: 20160609 |