CN202259261U - Lead frame with a heat sink - Google Patents
Lead frame with a heat sink Download PDFInfo
- Publication number
- CN202259261U CN202259261U CN2011203174416U CN201120317441U CN202259261U CN 202259261 U CN202259261 U CN 202259261U CN 2011203174416 U CN2011203174416 U CN 2011203174416U CN 201120317441 U CN201120317441 U CN 201120317441U CN 202259261 U CN202259261 U CN 202259261U
- Authority
- CN
- China
- Prior art keywords
- heat sink
- lead frame
- trapezoidal groove
- wafer
- plastic packaging
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The utility model discloses a lead frame with a heat sink, characterized in that: the lead frame comprises a plastic packaged colloid and its semiconductor wafer, wherein the semiconductor wafer is arranged in the plastic packaged colloid, the wafer is connected with a pipe foot outside an integrated circuit wafer by a conductor, a trapezoidal groove is opened in the center of the upper part of the plastic packaged colloid, a molded lead frame is mounted in the trapezoidal groove and connected with the integrated circuit wafer by a conductive material on the lower part and a heat sink device is arranged in the trapezoidal groove by a heat sing slice bottom seat.
Description
Technical field
The utility model relates to a kind of semiconductor lead frame, specifically is to contain heat sink lead frame.
Background technology
The encapsulation of semiconductor integrated circuit is owing to depend on the restriction of encapsulation at present, and heat dissipation problem can not effectively solve, and general integrated circuit can only be a low-power device.So in the middle of circuit application; The integrated circuit controller spares that adopt remove to control powerful discrete device more, and get on to load heat abstractor reaching the heat radiation requirement at discrete device, thisly on each element, install heat abstractor additional; The structure more complicated also expends cost, and circuit footprint is bigger.Traditional discrete device often need require customization different radiating device with heat radiation according to the different installation dimension of device, makes design and production process need to increase extraly the buying lead time
The utility model content
The utility model technical issues that need to address just are to overcome the defective of prior art, and a kind of heat sink lead frame that contains is provided, and it can be conveniently detachable and can reaches the semiconductor lead frame of the high-cooling property of high efficiency and heat radiation
For addressing the above problem, the utility model adopts following technical scheme:
The utility model with the bottom design of lead frame card slot type structure in echelon, solves the complexity when after encapsulation is accomplished, adding heat abstractor before encapsulation; Again trapezoidal shape is also made in the heat abstractor bottom, match with the bottom of lead frame.Heat abstractor is realized standard modular, and the trapezoidal slot of integrated circuit package body side is inserted into device top, and the device that reduces different pins and size need customize the heat abstractor link of all size, has so just reduced cost and has shortened the production cycle; Specifically, a kind ofly contain heat sink lead frame, it is characterized in that; Comprise plastic packaging colloid and semiconductor wafer thereof, semiconductor wafer places in the plastic packaging colloid, and said wafer links to each other with the pin outside the IC wafer through lead; Plastic packaging colloid central upper portion place has trapezoidal groove; The formed lead framework is housed in the trapezoidal groove, and the formed lead framework links to each other with the integrated semiconductor wafer through the electric conducting material of its underpart, through heat sink base heat sink device is housed in the trapezoidal groove.
The utility model novel structure is unique, and heat abstractor is reassembling type, can satisfy the needs of different radiating; Have good heat dispersion, can improve the loaded current and the power of device greatly, can realize that control device and discrete device are integrated in the same integrated circuit; Thereby improve the integrated level of circuit; Make circuit structure simpler, small product size is littler, and has directly reduced circuit materials cost.
Description of drawings
Fig. 1 is the utility model structural representation.
Embodiment
As shown in Figure 1; Comprise plastic packaging material adhesive body and IC chip thereof, IC wafer places in the plastic packaging material adhesive body 1, and IC chip links to each other with the pin outside the IC wafer through lead; Plastic packaging material adhesive body 1 central upper portion place has trapezoidal groove; The formed lead framework is housed in the trapezoidal groove, and the formed lead framework links to each other with IC wafer through the electric conducting material of its underpart, through heat sink base 3 heat sink device 2 is housed in the trapezoidal groove.
In order to guarantee result of use; Said heat sink device 2 has one group or two groups of many groups of above heat sink formations at least, can make different size, shape and area, to satisfy the radiating requirements of different IC chips and packing forms; Like plough groove type, provide tangible groove structure among Fig. 1; Said heat sink device 2 is in heat sink base 3 is the movable trapezoidal groove that is inserted into plastic packaging material adhesive body 1 central upper portion place.
Lead frame adopts heat conduction good metal material; Said lead frame impacts and is cut into the trapezoidal card slot type structure that matches with trapezoidal groove; This structure can not only can make the radiator structure convenient disassembly, can also increase the contact area with heat sink device, reaches the effect of high-cooling property; IC chip is through the single integrated circuit after the wafer cutting processing, has while thermal conductivity favorable conductive material and is connected with a kind of between IC chip bottom and the lead frame; Be connected with plain conductor between IC wafer surface and the lead frame pin; Plastic packaging material adhesive body 1 is filled in around IC wafer and the lead frame with the pressing mold mode; Usually adopt plastic packaging material with certain thermal conductivity; For example the outer surface of epoxy molding compound lead frame 9, trapezoidal groove expose outside the plastic-sealed body, so that IC chip can directly link to each other with heat abstractor; The inner surface of lead frame can be processed the projection of array grid shape, and a plurality of sulculuses can be offered in the edge of lead frame, with the be connected sealing of increase with adhesive body; Then the formed product good to plastic packaging removed unnecessary carrier part.
Described heat sink device is a plough groove type.Lead frame is to be cut into the trapezoidal card slot type structure that matches with trapezoidal groove by the heat conductive metal material impact, and the inner surface of lead frame becomes the projection of array grid shape, or the edge offers a plurality of sulculuses, and IC chip is flip-over type in the plastic packaging material adhesive body.
What should explain at last is: obviously, the foregoing description only be for explain clearly that the utility model does for example, and be not qualification to execution mode.For the those of ordinary skill in affiliated field, on the basis of above-mentioned explanation, can also make other multi-form variation or change.Here need not also can't give exhaustive to all execution modes.And conspicuous variation of being amplified out thus or change still are among the protection range of the utility model.
Claims (3)
1. one kind contains heat sink lead frame, it is characterized in that, comprises plastic packaging colloid and semiconductor wafer thereof; Semiconductor wafer places in the plastic packaging colloid; Said wafer links to each other with the pin outside the IC wafer through lead, and plastic packaging colloid central upper portion place has trapezoidal groove, and the formed lead framework is housed in the trapezoidal groove; The formed lead framework links to each other with the integrated semiconductor wafer through the electric conducting material of its underpart, through heat sink base heat sink device is housed in the trapezoidal groove.
2. according to claim 1ly contain heat sink lead frame, it is characterized in that heat sink device is a plough groove type.
3. according to claim 1 and 2ly contain heat sink lead frame; It is characterized in that; Lead frame is to be cut into the trapezoidal card slot type structure that matches with trapezoidal groove by the heat conductive metal material impact; The inner surface of lead frame becomes the projection of array grid shape, or the edge offers a plurality of sulculuses, and IC chip is flip-over type in the plastic packaging material adhesive body.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011203174416U CN202259261U (en) | 2011-08-29 | 2011-08-29 | Lead frame with a heat sink |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011203174416U CN202259261U (en) | 2011-08-29 | 2011-08-29 | Lead frame with a heat sink |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202259261U true CN202259261U (en) | 2012-05-30 |
Family
ID=46120460
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011203174416U Expired - Fee Related CN202259261U (en) | 2011-08-29 | 2011-08-29 | Lead frame with a heat sink |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202259261U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107816907A (en) * | 2016-09-13 | 2018-03-20 | 中国科学院工程热物理研究所 | A kind of micro-nano compound structure surface is heat sink and its method for enhanced heat exchange |
-
2011
- 2011-08-29 CN CN2011203174416U patent/CN202259261U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107816907A (en) * | 2016-09-13 | 2018-03-20 | 中国科学院工程热物理研究所 | A kind of micro-nano compound structure surface is heat sink and its method for enhanced heat exchange |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20120530 Termination date: 20160829 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |