CN203553143U - Leading-wire frame - Google Patents
Leading-wire frame Download PDFInfo
- Publication number
- CN203553143U CN203553143U CN201320667155.1U CN201320667155U CN203553143U CN 203553143 U CN203553143 U CN 203553143U CN 201320667155 U CN201320667155 U CN 201320667155U CN 203553143 U CN203553143 U CN 203553143U
- Authority
- CN
- China
- Prior art keywords
- leading
- lead frame
- wire
- pin
- brace
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000011159 matrix material Substances 0.000 claims description 13
- 238000004519 manufacturing process Methods 0.000 abstract description 6
- 238000001816 cooling Methods 0.000 abstract 2
- 238000005452 bending Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Abstract
The utility model discloses a leading-wire frame which is formed through connection of thirty leading-wire frame units arrayed in a single row. The leading-wire frame units are connected through connecting sheets. Each leading-wire frame unit includes a positioning hole (3), a cooling fin (4), a basal body (5) and leading-wire pins. The positioning holes are arranged in the connecting sheets (2-3). The cooling fins (4) are arranged on the connecting sheets. The leading-wire pins include middle leading-wire pins (6) and side leading-wire pins (7). Bonding parts (8) are arranged on the middle leading-wire pins (6) and oblique sections (9) are arranged on the bonding parts (8). The middle leading-wire pins (6) are connected with the basal bodies (5) through the bonding parts (8). The bonding parts (8) are bent. The middle leading-wire pins (6) and the side leading-wire pins (7) are connected through the connecting sheets (2-2). Disqualified products are less likely to be produced in the leading-wire frame in a production process and the quality of the products meets the demands.
Description
Technical field
The utility model relates to lead frame, the lead frame that particularly a kind of part of bending tilts.
Background technology
Along with the development of electron trade, large power semiconductor device adopts the more and more many of Plastic Package form, this just need to adapt to the lead frame of plastic packaging high power device, and lead frame must adapt to the requirement of heat radiation, conduction and the carrying high-power chip of high-power epoxy seal semiconductor device.
In process of production, material discontinuity while bending, very easily causes lead frame basal plane crooked to lead frame.Cause cost to increase, be not easy to industrialized production.
Utility model content
Problem to be solved in the utility model is to provide in a kind of production and is difficult for generation substandard products and the standard compliant lead frame of product quality.
For addressing the above problem, the utility model provides a kind of lead frame, by 30 single connecting to form in lead frame unit, described lead frame is fixedly connected with by brace between unit, described lead frame unit comprises location hole, fin, described in matrix and terminal pin, location hole is located on brace, described fin is located on brace, described terminal pin comprises middle leads pin and side terminal pin, described middle leads pin is provided with bonding part, described bonding part is provided with tilting section, described middle leads pin is fixedly connected with by bonding part with matrix, described bonding part bends, between described middle leads pin and side terminal pin, by brace, be fixedly connected with.
As further improvement of the utility model, described tilting section is plane parallel quadrangle, and described plane parallel four distortion angle is on one side 135 ° and 45 °.
As further improvement of the utility model, the diameter of described location hole is 1.95-2.05mm.
As further improvement of the utility model, described matrix width is 4mm, and width is 2.8mm.
As further improvement of the utility model, described matrix is arranged with Baltimore groove outward, and the degree of depth of described Baltimore groove is 0.05mm.
As further improvement of the utility model, the width of described middle leads pin or side terminal pin is 0.81mm.
The utility model compared with prior art, has the following advantages.
Bonding part on lead frame of the present utility model is tilting section, this kind of structure makes bending in program in lead frame production process, can not cause the discontinuity of material, can not cause lead frame basal plane crooked, product quality meets standard, avoid the generation of substandard products, reduced production cost.
Accompanying drawing explanation
Fig. 1 is the structural representation of the utility model lead frame.
Fig. 2 is the left view of the utility model lead frame.
Fig. 3 is the schematic diagram of the bonding part of the utility model lead frame.
In figure: 1-lead frame unit, 2-1 brace, 2-2 brace, 2-3 brace, 3-location hole, 4-fin, 5-matrix, 6-middle leads pin, 7-side terminal pin, 8-bonding part, 9-tilting section.
Embodiment
Below in conjunction with accompanying drawing and embodiment, the utility model is further explained to explanation.
As shown in Figure 1, Figure 2 and Figure 3, a kind of lead frame, by 30 single connecting to form in lead frame unit 1, between lead frame unit 1, by brace 2-1,2-2,2-3, be fixedly connected with, lead frame unit 1 comprises location hole 3, fin 4, matrix 5 and terminal pin, it is upper that location hole 3 is located at brace 2-3, and the diameter of location hole 3 is 2.0mm.Matrix 5 width are 4mm, and width is 2.8mm.
It is upper that fin 4 is located at brace 2-1, and terminal pin comprises middle leads pin 6 and side terminal pin 7, and the width of middle leads pin 6 or side terminal pin 7 is 0.81mm
Middle leads pin 6 is fixedly connected with by bonding part 8 with matrix 5, and bonding part 8 bends, and between middle leads pin 6 and side terminal pin 7, by brace 2-2, is fixedly connected with.
Middle leads pin 6 is provided with bonding part 8, and bonding part 8 is provided with tilting section 9, and tilting section 9 is plane parallel quadrangle, and plane parallel four distortion angle is on one side 135 ° and 45 °.Matrix 5 is outer is arranged with Baltimore groove, and the degree of depth of Baltimore groove is 0.05mm.
Whole framework adopts copper strips through mould punching, surface treatment, cut-out, to be shaped and to make successively.
Teachings herein is example of the present utility model and explanation; but do not mean that the obtainable advantage of the utility model is so limited, may be to wherein one or more of the advantage realizing in the simple transformation of structure and/or some execution modes all in the application's protection range in every the utility model practice process.
Claims (6)
1. a lead frame, it is characterized in that: by single the connecting to form in 30 lead frame unit (1), between described lead frame unit (1), pass through brace (2-1, 2-2, 2-3) be fixedly connected with, described lead frame unit (1) comprises location hole (3), fin (4), matrix (5) and terminal pin, described location hole (3) is located on brace (2-3), described fin (4) is located on brace (2-1), described terminal pin comprises middle leads pin (6) and side terminal pin (7), described middle leads pin (6) is provided with bonding part (8), described bonding part (8) is provided with tilting section (9), described middle leads pin (6) is fixedly connected with by bonding part (8) with matrix (5), described bonding part (8) bends, between described middle leads pin (6) and side terminal pin (7), by brace (2-2), be fixedly connected with.
2. lead frame according to claim 1, is characterized in that: described tilting section (9) is plane parallel quadrangle, and described plane parallel four distortion angle is on one side 135 ° and 45 °.
3. lead frame according to claim 1, is characterized in that: the diameter of described location hole (3) is 1.95-2.05mm.
4. lead frame according to claim 1, is characterized in that: described matrix (5) width is 4mm, and width is 2.8mm.
5. lead frame according to claim 1, is characterized in that: described matrix (5) is outer is arranged with Baltimore groove, and the degree of depth of described Baltimore groove is 0.05mm.
6. lead frame according to claim 1, is characterized in that: the width of described middle leads pin (6) or side terminal pin (7) is 0.81mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320667155.1U CN203553143U (en) | 2013-10-28 | 2013-10-28 | Leading-wire frame |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320667155.1U CN203553143U (en) | 2013-10-28 | 2013-10-28 | Leading-wire frame |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203553143U true CN203553143U (en) | 2014-04-16 |
Family
ID=50471223
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201320667155.1U Expired - Fee Related CN203553143U (en) | 2013-10-28 | 2013-10-28 | Leading-wire frame |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203553143U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103560123A (en) * | 2013-10-28 | 2014-02-05 | 沈健 | Lead frame with inclined bending portion |
-
2013
- 2013-10-28 CN CN201320667155.1U patent/CN203553143U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103560123A (en) * | 2013-10-28 | 2014-02-05 | 沈健 | Lead frame with inclined bending portion |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20170425 Address after: 225300 Taizhou province high Port District Xu Zhuang prosperous road east side Patentee after: Taizhou Dongtian Electronics Co., Ltd. Address before: 225324 Taizhou, Jiangsu high port Xu Zhuang Road, East Yongfeng Road, No. 9 Patentee before: Shen Jian |
|
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20140416 Termination date: 20171028 |