CN206789536U - High-power ultra-thin rectification chip - Google Patents

High-power ultra-thin rectification chip Download PDF

Info

Publication number
CN206789536U
CN206789536U CN201720473628.2U CN201720473628U CN206789536U CN 206789536 U CN206789536 U CN 206789536U CN 201720473628 U CN201720473628 U CN 201720473628U CN 206789536 U CN206789536 U CN 206789536U
Authority
CN
China
Prior art keywords
side pin
pin
horizontal part
bilge
folding turn
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201720473628.2U
Other languages
Chinese (zh)
Inventor
孙伟光
施云峰
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Terrico Microelectronics (huaian) Co Ltd
Original Assignee
Terrico Microelectronics (huaian) Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Terrico Microelectronics (huaian) Co Ltd filed Critical Terrico Microelectronics (huaian) Co Ltd
Priority to CN201720473628.2U priority Critical patent/CN206789536U/en
Application granted granted Critical
Publication of CN206789536U publication Critical patent/CN206789536U/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors

Landscapes

  • Folding Of Thin Sheet-Like Materials, Special Discharging Devices, And Others (AREA)

Abstract

The utility model discloses a kind of high-power ultra-thin rectification chip, including chip, metal substrate, 4 left side pins, 4 right side pins and epoxy resin plastic-sealed body, the chip is fixed on metal substrate upper surface by adhesive layer, electrically connected between the chip and each left side pin by left gold thread, electrically connected between the chip and each right side pin by right gold thread, the chip, metal substrate, the medial extremity of the medial extremity of left side pin and right side pin are located in epoxy resin plastic-sealed body；The upper left horizontal part length of first left side pin and the 3rd left side pin is identical, the upper left horizontal part length of second left side pin and the 4th left side pin is identical, first left side pin, the 3rd left side pin upper left horizontal part length be more than the second left side pin, the 4th left side pin upper left horizontal part length.The utility model all staggers adjacent pin to set in the horizontal direction and the vertical direction, effectively eliminates voltage disturbance between pin, is also beneficial to further reduce the size of device.

Description

High-power ultra-thin rectification chip
Technical field
A kind of high-power ultra-thin rectification chip is the utility model is related to, is related to technical field of semiconductors.
Background technology
The design of semiconductor devices is according to circuit theory diagrams, realizes the function required for circuit designers.It is led Refer to layout design, it is necessary to consider the layout of external connection, the optimization of internal electronic element layout, metal connecting line and through hole it is excellent Change the various factors such as layout, electromagnetic protection, heat dissipation.Outstanding semiconductor devices can save production cost, reach good Circuit performance and heat dispersion.
Multicore flake products using above-mentioned encapsulating structure exist some it is congenital the defects of, as the voltage disturbance between pin, The radiating effect of product is poor, product bearing power is smaller, and product service life is relatively low, production cost is higher etc..Therefore Voltage disturbance between pin can be eliminated, improve product radiating effect, improve product bearing power, improving product and make by seeking one kind Encapsulating structure with life-span, reduction production cost is particularly important.
The content of the invention
The utility model purpose is to provide a kind of high-power ultra-thin rectification chip, and the high-power ultra-thin rectification chip is in level All adjacent pin is staggered to set on direction and vertical direction, effectively eliminate pin between voltage disturbance, be also beneficial into One step reduces the size of device, improves the service life of product, reduces production cost.
To reach above-mentioned purpose, the technical solution adopted in the utility model is：A kind of high-power ultra-thin rectification chip, including Chip, metal substrate, 4 left side pins, 4 right side pins and epoxy resin plastic-sealed body, the chip are fixed by adhesive layer In metal substrate upper surface, electrically connected between the chip and each left side pin by left gold thread, the chip and each right side Electrically connected between the pin of side by right gold thread, the chip, metal substrate, the inner side of the medial extremity of left side pin and right side pin End is in epoxy resin plastic-sealed body；
It is described 4 left side pin be followed successively by from front to back the first left side pin, the second left side pin, the 3rd left side pin and 4th left side pin, 4 right sides pin are followed successively by the first right side pin, the second right side pin, the 3rd right side from front to back Pin and the 4th right side pin；
First left side pin, the second left side pin, the 3rd left side pin and the 4th left side pin expose asphalt mixtures modified by epoxy resin Fat plastic packaging body portion is sequentially connected composition, first right side by upper left horizontal part, left folding turn of bilge and lower-left horizontal part head and the tail Pin, the second right side pin, the 3rd right side pin and the 4th right side pin expose epoxy resin plastic packaging body portion by upper right Horizontal part, right folding turn of bilge and bottom right horizontal part head and the tail are sequentially connected composition；
The upper left horizontal part length of first left side pin and the 3rd left side pin is identical, first left side pin and The left folding turn of bilge of 3rd left side pin is highly identical, the upper left horizontal part length of second left side pin and the 4th left side pin Identical, the left folding turn of bilge of second left side pin and the 4th left side pin is highly identical；
First left side pin, the 3rd left side pin upper left horizontal part length be more than the second left side pin, the 4th The length of the upper left horizontal part of left side pin, first left side pin, the height of left folding turn of bilge of the 3rd left side pin are more than Second left side pin, the 4th left side pin left folding turn of bilge height；
The upper right horizontal part length of first right side pin and the 3rd right side pin is identical, first right side pin and The right folding turn of bilge of 3rd right side pin is highly identical, the upper right horizontal part length of second right side pin and the 4th right side pin Identical, the right folding turn of bilge of second right side pin and the 4th right side pin is highly identical；
First right side pin, the 3rd right side pin upper right horizontal part length be more than the second right side pin, the 4th The length of the upper right horizontal part of right side pin, first right side pin, the height of right folding turn of bilge of the 3rd right side pin are more than Second right side pin, the 4th right side pin right folding turn of bilge height.
Further improved scheme is as follows in above-mentioned technical proposal：
1. in such scheme, first left side pin, upper left horizontal part length and the second left side of the 3rd left side pin Pin, the upper left horizontal part length of the 4th left side pin differs 0.2 ~ 2mm, first right side pin, the 3rd right side pin Upper right horizontal part length differs 0.2 ~ 2mm with the upper right horizontal part length of the second right side pin, the 4th right side pin.
2. in such scheme, the adjacent left side pin at intervals of 0.5mm ~ 5mm, the adjacent right side pin at intervals of 0.5mm~5mm。
3. in such scheme, the upper left horizontal part of the left side pin and the angle of left folding turn of bilge and left folding turn of bilge and a left side The angle of lower horizontal part is 90 ° ~ 120 °, the upper right horizontal part of the right side pin and the angle of right folding turn of bilge and right folding turn of bilge Angle with bottom right horizontal part is 90 ° ~ 120 °.
4. in such scheme, first left side pin, the 3rd left side pin left folding turn of bilge height and the second left side Pin, the 4th left side pin left folding turn of bilge height difference 0.5mm ~ 1.3mm, first right side pin, the 3rd right side draw The height of the right folding turn of bilge of pin be more than the second right side pin, the 4th right side pin right folding turn of bilge height difference 0.5mm ~ 1.3mm。
Because above-mentioned technical proposal is used, the utility model has following advantages compared with prior art：
The upper left horizontal part of the high-power ultra-thin rectification chip of the utility model, its first left side pin and the 3rd left side pin Length is identical, and the upper left horizontal part length of second left side pin and the 4th left side pin is identical, first left side pin, Length of the length of the upper left horizontal part of 3rd left side pin more than the second left side pin, the upper left horizontal part of the 4th left side pin Degree；The upper right horizontal part length of first right side pin and the 3rd right side pin is identical, second right side pin and the 4th right side The upper right horizontal part length of pin is identical, and first right side pin, the length of upper right horizontal part of the 3rd right side pin are more than Second right side pin, the 4th right side pin upper right horizontal part length, in the horizontal direction and the vertical direction all will be adjacent Pin staggers to set, and effectively eliminates voltage disturbance between pin, is also beneficial to further reduce the size of device, improves product Service life, reduce production cost.
Brief description of the drawings
Accompanying drawing 1 is the high-power ultra-thin rectification chip structural representation of the utility model；
Accompanying drawing 2 is the A-A cross-sectional views of accompanying drawing 1.
In the figures above：1st, chip；2nd, metal substrate；3rd, left side pin；31st, the first left side pin；32nd, the second left side is drawn Pin；33rd, the 3rd left side pin；34th, the 4th left side pin；4th, right side pin；41st, the first right side pin；42nd, the second right side is drawn Pin；43rd, the 3rd right side pin；44th, the 4th right side pin；5th, epoxy resin plastic-sealed body；6th, adhesive layer；7th, left gold thread；8th, right gold Line；9th, upper left horizontal part；10th, left folding turn of bilge；11st, lower-left horizontal part；12nd, upper right horizontal part；13rd, right folding turn of bilge；14th, bottom right water Flat portion.
Embodiment
Below in conjunction with the accompanying drawings and embodiment is further described to the utility model：
Embodiment 1：A kind of high-power ultra-thin rectification chip of high heat conduction type, including 2,4 chip 1, metal substrate left sides draw 3,4 right side pins 4 of pin and epoxy resin plastic-sealed body 5, the chip 1 are fixed on the upper surface of metal substrate 2 by adhesive layer 6, Electrically connected by left gold thread 7 between the chip 1 and each left side pin 3, led between the chip 1 and each right side pin 4 Cross right gold thread 8 to electrically connect, the chip 1, metal substrate 2, the medial extremity of the medial extremity of left side pin 3 and right side pin 4 are located at In epoxy resin plastic-sealed body 5；
4 left sides pin 3 is followed successively by the first left side pin 31, the left side of the second left side pin the 32, the 3rd from front to back The left side pin 34 of pin 33 and the 4th, 4 right sides pin 4 are followed successively by first the 41, second right side of right side pin from front to back Pin 42, the 3rd right side pin 43 and the 4th right side pin 44；
First left side pin 31, the second left side pin 32, the 3rd left side pin 33 and the 4th left side pin 34 are exposed Go out the part of epoxy resin plastic-sealed body 5 and be sequentially connected group by upper left horizontal part 9, left folding turn of bilge 10 and the head and the tail of lower-left horizontal part 11 Into first right side pin 41, the second right side pin 42, the 3rd right side pin 43 and the 4th right side pin 44 expose epoxy The resin plastic-sealed part of body 5 is sequentially connected composition by upper right horizontal part 12, right folding turn of bilge 13 and the head and the tail of bottom right horizontal part 14；
First left side pin 31 is identical with the length of upper left horizontal part 9 of the 3rd left side pin 33, first left side The left folding turn of bilge 10 of the left side pin 33 of pin 31 and the 3rd is highly identical, second left side pin 32 and the 4th left side pin 34 The length of upper left horizontal part 9 it is identical, the left folding turn of bilge 10 of second left side pin 32 and the 4th left side pin 34 is highly identical；
First left side pin 31, the length of upper left horizontal part 9 of the 3rd left side pin 33 are more than the second left side pin 32nd, the length of the upper left horizontal part 9 of the 4th left side pin 34, first left side pin 31, the left folding of the 3rd left side pin 33 Height of the height of turn of bilge 10 more than the second left side pin 32, the left folding turn of bilge 10 of the 4th left side pin 34；
First right side pin 41 is identical with the length of upper right horizontal part 12 of the 3rd right side pin 43, first right side The right folding turn of bilge 13 of the right side pin 43 of pin 41 and the 3rd is highly identical, second right side pin 42 and the 4th right side pin 44 The length of upper right horizontal part 12 it is identical, the height phase of right folding turn of bilge 13 of second right side pin 42 and the 4th right side pin 44 Together；
First right side pin 41, the length of upper right horizontal part 12 of the 3rd right side pin 43 are more than the second right side pin 42nd, the length of the upper right horizontal part 12 of the 4th right side pin 44, first right side pin 41, the right folding of the 3rd right side pin 43 Height of the height of turn of bilge 13 more than the second right side pin 42, the right folding turn of bilge 13 of the 4th right side pin 44.
Above-mentioned first left side pin 31, the length of upper left horizontal part 9 and the second left side pin 32 of the 3rd left side pin 33, the The length of the upper left horizontal part 9 difference 0.5mm of four left side pins 34, first right side pin 41, the right side of the 3rd right side pin 43 The upper length of horizontal part 12 differs 0.5mm with the length of upper right horizontal part 12 of the second right side pin 42, the 4th right side pin 44.
The adjacent left side pin 3 is at intervals of 1mm, and the adjacent right side pin 4 is at intervals of 1mm.
The upper left horizontal part 9 of above-mentioned left side pin 3 and the angle of left folding turn of bilge 10 and left folding turn of bilge 10 and lower-left horizontal part 11 angle is 90 °, the upper right horizontal part 12 of the right side pin 4 and the angle of right folding turn of bilge 13 and right folding turn of bilge 13 and the right side The angle of lower horizontal part 14 is 90 °.
Above-mentioned first left side pin 31, the 3rd left side pin 33 left folding turn of bilge 10 height and the second left side pin 32, The height difference 1mm of the left folding turn of bilge 10 of 4th left side pin 34, first right side pin 41, the right side of the 3rd right side pin 43 The height of bending part 13 is more than the second right side pin 42, the height difference 1mm of the right folding turn of bilge 13 of the 4th right side pin 44.
Embodiment 2：A kind of high-power ultra-thin rectification chip of high heat conduction type, including 2,4 chip 1, metal substrate left sides draw 3,4 right side pins 4 of pin and epoxy resin plastic-sealed body 5, the chip 1 are fixed on the upper surface of metal substrate 2 by adhesive layer 6, Electrically connected by left gold thread 7 between the chip 1 and each left side pin 3, led between the chip 1 and each right side pin 4 Cross right gold thread 8 to electrically connect, the chip 1, metal substrate 2, the medial extremity of the medial extremity of left side pin 3 and right side pin 4 are located at In epoxy resin plastic-sealed body 5；
4 left sides pin 3 is followed successively by the first left side pin 31, the left side of the second left side pin the 32, the 3rd from front to back The left side pin 34 of pin 33 and the 4th, 4 right sides pin 4 are followed successively by first the 41, second right side of right side pin from front to back Pin 42, the 3rd right side pin 43 and the 4th right side pin 44；
First left side pin 31, the second left side pin 32, the 3rd left side pin 33 and the 4th left side pin 34 are exposed Go out the part of epoxy resin plastic-sealed body 5 and be sequentially connected group by upper left horizontal part 9, left folding turn of bilge 10 and the head and the tail of lower-left horizontal part 11 Into first right side pin 41, the second right side pin 42, the 3rd right side pin 43 and the 4th right side pin 44 expose epoxy The resin plastic-sealed part of body 5 is sequentially connected composition by upper right horizontal part 12, right folding turn of bilge 13 and the head and the tail of bottom right horizontal part 14；
First left side pin 31 is identical with the length of upper left horizontal part 9 of the 3rd left side pin 33, first left side The left folding turn of bilge 10 of the left side pin 33 of pin 31 and the 3rd is highly identical, second left side pin 32 and the 4th left side pin 34 The length of upper left horizontal part 9 it is identical, the left folding turn of bilge 10 of second left side pin 32 and the 4th left side pin 34 is highly identical；
First left side pin 31, the length of upper left horizontal part 9 of the 3rd left side pin 33 are more than the second left side pin 32nd, the length of the upper left horizontal part 9 of the 4th left side pin 34, first left side pin 31, the left folding of the 3rd left side pin 33 Height of the height of turn of bilge 10 more than the second left side pin 32, the left folding turn of bilge 10 of the 4th left side pin 34；
First right side pin 41 is identical with the length of upper right horizontal part 12 of the 3rd right side pin 43, first right side The right folding turn of bilge 13 of the right side pin 43 of pin 41 and the 3rd is highly identical, second right side pin 42 and the 4th right side pin 44 The length of upper right horizontal part 12 it is identical, the height phase of right folding turn of bilge 13 of second right side pin 42 and the 4th right side pin 44 Together；
First right side pin 41, the length of upper right horizontal part 12 of the 3rd right side pin 43 are more than the second right side pin 42nd, the length of the upper right horizontal part 12 of the 4th right side pin 44, first right side pin 41, the right folding of the 3rd right side pin 43 Height of the height of turn of bilge 13 more than the second right side pin 42, the right folding turn of bilge 13 of the 4th right side pin 44.
Above-mentioned first left side pin 31, the length of upper left horizontal part 9 and the second left side pin 32 of the 3rd left side pin 33, the The length of the upper left horizontal part 9 difference 1.8mm of four left side pins 34, first right side pin 41, the right side of the 3rd right side pin 43 The upper length of horizontal part 12 differs 1.8mm with the length of upper right horizontal part 12 of the second right side pin 42, the 4th right side pin 44.
The adjacent left side pin 3 is at intervals of 3mmmm, and the adjacent right side pin 4 is at intervals of 3mmmm.
The upper left horizontal part 9 of above-mentioned left side pin 3 and the angle of left folding turn of bilge 10 and left folding turn of bilge 10 and lower-left horizontal part 11 angle is 110 °, the upper right horizontal part 12 of the right side pin 4 and the angle of right folding turn of bilge 13 and right folding turn of bilge 13 and The angle of bottom right horizontal part 14 is 110 °.
Above-mentioned first left side pin 31, the 3rd left side pin 33 left folding turn of bilge 10 height and the second left side pin 32, The height difference 0.6mm of the left folding turn of bilge 10 of 4th left side pin 34, first right side pin 41, the 3rd right side pin 43 The height of right folding turn of bilge 13 is more than the second right side pin 42, the height difference 0.6mm of the right folding turn of bilge 13 of the 4th right side pin 44.
During ultra-thin rectification chip high-power using above-mentioned high heat conduction type, a left side for its first left side pin and the 3rd left side pin Upper horizontal part length is identical, and the upper left horizontal part length of second left side pin and the 4th left side pin is identical, and described first Left side pin, the 3rd left side pin upper left horizontal part length be more than the second left side pin, the upper left water of the 4th left side pin The length in flat portion；The upper right horizontal part length of first right side pin and the 3rd right side pin is identical, second right side pin and The upper right horizontal part length of 4th right side pin is identical, first right side pin, the upper right horizontal part of the 3rd right side pin Length be more than the second right side pin, the 4th right side pin upper right horizontal part length, in the horizontal direction and the vertical direction all Adjacent pin is staggered to set, effectively eliminates voltage disturbance between pin, be also beneficial to further reduce the size of device, The service life of product is improved, reduces production cost.
For above-described embodiment only to illustrate technical concepts and features of the present utility model, its object is to allow be familiar with technique Personage can understand content of the present utility model and implement according to this, the scope of protection of the utility model can not be limited with this. All equivalent change or modifications made according to the utility model Spirit Essence, should all cover the scope of protection of the utility model it It is interior.

Claims (5)

  1. A kind of 1. high-power ultra-thin rectification chip, it is characterised in that：Including chip（1）, metal substrate（2）, 4 left side pins （3）, 4 right side pins（4）With epoxy resin plastic-sealed body（5）, the chip（1）Pass through adhesive layer（6）It is fixed on metal substrate （2）Upper surface, the chip（1）With each left side pin（3）Between pass through left gold thread（7）Electrical connection, the chip（1）With it is every Individual right side pin（4）Between pass through right gold thread（8）Electrical connection, the chip（1）, metal substrate（2）, left side pin（3）It is interior Side and right side pin（4）Medial extremity be located at epoxy resin plastic-sealed body（5）It is interior；
    4 left sides pin（3）The first left side pin is followed successively by from front to back（31）, the second left side pin（32）, it is the 3rd left Side pin（33）With the 4th left side pin（34）, 4 right sides pin（4）The first right side pin is followed successively by from front to back （41）, the second right side pin（42）, the 3rd right side pin（43）With the 4th right side pin（44）；
    First left side pin（31）, the second left side pin（32）, the 3rd left side pin（33）With the 4th left side pin（34） Expose epoxy resin plastic-sealed body（5）Part is by upper left horizontal part（9）, left folding turn of bilge（10）With lower-left horizontal part（11）From beginning to end It is sequentially connected composition, first right side pin（41）, the second right side pin（42）, the 3rd right side pin（43）With the 4th right side Pin（44）Expose epoxy resin plastic-sealed body（5）Part is by upper right horizontal part（12）, right folding turn of bilge（13）It is horizontal with bottom right Portion（14）Head and the tail are sequentially connected composition；
    First left side pin（31）With the 3rd left side pin（33）Upper left horizontal part（9）Length is identical, and described first is left Side pin（31）With the 3rd left side pin（33）Left folding turn of bilge（10）It is highly identical, second left side pin（32）With the 4th Left side pin（34）Upper left horizontal part（9）Length is identical, second left side pin（32）With the 4th left side pin（34）'s Left folding turn of bilge（10）It is highly identical；
    First left side pin（31）, the 3rd left side pin（33）Upper left horizontal part（9）Length be more than second left side draw Pin（32）, the 4th left side pin（34）Upper left horizontal part（9）Length, first left side pin（31）, the 3rd left side draw Pin（33）Left folding turn of bilge（10）Height be more than the second left side pin（32）, the 4th left side pin（34）Left folding turn of bilge（10） Height；
    First right side pin（41）With the 3rd right side pin（43）Upper right horizontal part（12）Length is identical, and described first is right Side pin（41）With the 3rd right side pin（43）Right folding turn of bilge（13）It is highly identical, second right side pin（42）With the 4th Right side pin（44）Upper right horizontal part（12）Length is identical, second right side pin（42）With the 4th right side pin（44）'s Right folding turn of bilge（13）It is highly identical；
    First right side pin（41）, the 3rd right side pin（43）Upper right horizontal part（12）Length be more than second right side draw Pin（42）, the 4th right side pin（44）Upper right horizontal part（12）Length, first right side pin（41）, the 3rd right side draw Pin（43）Right folding turn of bilge（13）Height be more than the second right side pin（42）, the 4th right side pin（44）Right folding turn of bilge（13） Height.
  2. 2. high-power ultra-thin rectification chip according to claim 1, it is characterised in that：First left side pin（31）、 3rd left side pin（33）Upper left horizontal part（9）Length and the second left side pin（32）, the 4th left side pin（34）Upper left Horizontal part（9）Length differs 0.2 ~ 2mm, first right side pin（41）, the 3rd right side pin（43）Upper right horizontal part （12）Length and the second right side pin（42）, the 4th right side pin（44）Upper right horizontal part（12）Length differs 0.2 ~ 2mm.
  3. 3. high-power ultra-thin rectification chip according to claim 1 or 2, it is characterised in that：The adjacent left side pin（3） At intervals of 0.5mm ~ 5mm, the adjacent right side pin（4）At intervals of 0.5mm ~ 5mm.
  4. 4. high-power ultra-thin rectification chip according to claim 1 or 2, it is characterised in that：The left side pin（3）A left side Upper horizontal part（9）With left folding turn of bilge（10）Angle and left folding turn of bilge（10）With lower-left horizontal part（11）Angle be 90 ° ~ 120 °, the right side pin（4）Upper right horizontal part（12）With right folding turn of bilge（13）Angle and right folding turn of bilge（13）And bottom right Horizontal part（14）Angle be 90 ° ~ 120 °.
  5. 5. high-power ultra-thin rectification chip according to claim 1 or 2, it is characterised in that：First left side pin （31）, the 3rd left side pin（33）Left folding turn of bilge（10）Height and the second left side pin（32）, the 4th left side pin（34） Left folding turn of bilge（10）Height difference 0.5mm ~ 1.3mm, first right side pin（41）, the 3rd right side pin（43）The right side Bending part（13）Height be more than the second right side pin（42）, the 4th right side pin（44）Right folding turn of bilge（13）Height difference 0.5mm~1.3mm。
CN201720473628.2U 2017-05-02 2017-05-02 High-power ultra-thin rectification chip Active CN206789536U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201720473628.2U CN206789536U (en) 2017-05-02 2017-05-02 High-power ultra-thin rectification chip

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201720473628.2U CN206789536U (en) 2017-05-02 2017-05-02 High-power ultra-thin rectification chip

Publications (1)

Publication Number Publication Date
CN206789536U true CN206789536U (en) 2017-12-22

Family

ID=60709956

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201720473628.2U Active CN206789536U (en) 2017-05-02 2017-05-02 High-power ultra-thin rectification chip

Country Status (1)

Country Link
CN (1) CN206789536U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109708765A (en) * 2019-01-09 2019-05-03 上海烨映电子技术有限公司 A kind of infrared ray thermopile sensor component

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109708765A (en) * 2019-01-09 2019-05-03 上海烨映电子技术有限公司 A kind of infrared ray thermopile sensor component

Similar Documents

Publication Publication Date Title
CN207340280U (en) A kind of computer heat radiation system flexible circuit board
CN206789536U (en) High-power ultra-thin rectification chip
CN103944354B (en) Integrated power module packaging structure
CN206961821U (en) High-reliable semiconductor chip
CN206992099U (en) The miniature rectifying device of high thermal conductivity coefficient
CN206789545U (en) Discrete ultrathin rectifier part
CN203850288U (en) Plastic-sealed lead frame with separated heat radiating fins
CN203085518U (en) A leading wire frame
CN206272950U (en) It is a kind of to concentrate the high-performance circuit board for radiating
CN206947332U (en) Low-power consumption type semiconductor device
CN204088364U (en) Ultra-thin extra small positive luminous dual-colored LED element
CN203398100U (en) A semiconductor chip with a novel heat dissipating structure
CN203085519U (en) A chip leading wire frame
CN202196772U (en) Printed circuit board chip packaging radiating structure
CN202259441U (en) Novel LED chip
CN206209786U (en) Without shirt rim bio-identification module
CN202384327U (en) Small-size chip package structure
CN202796930U (en) Packaging body for metal-oxide-semiconductor field effect transistor (MOSFET) chip
CN203491251U (en) Sheet-type rectifier-bridge pile-packaging structure
CN102842548A (en) Square flat-type power metal oxide semi-conductor (MOS) chip packaging structure
CN212587495U (en) Semiconductor product electric connection structure and electronic product
CN204179109U (en) A kind of novel luminescence unit
CN203788620U (en) Novel electronic component radiation structure
CN202839595U (en) High-power high-density semiconductor device
CN202374614U (en) Heat radiation structure of electronic equipment and electronic equipment

Legal Events

Date Code Title Description
GR01 Patent grant
GR01 Patent grant