CN109708765A - A kind of infrared ray thermopile sensor component - Google Patents
A kind of infrared ray thermopile sensor component Download PDFInfo
- Publication number
- CN109708765A CN109708765A CN201910017871.7A CN201910017871A CN109708765A CN 109708765 A CN109708765 A CN 109708765A CN 201910017871 A CN201910017871 A CN 201910017871A CN 109708765 A CN109708765 A CN 109708765A
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- China
- Prior art keywords
- pin
- hole
- liner
- infrared ray
- thermopile sensor
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- 238000005538 encapsulation Methods 0.000 claims abstract description 52
- 239000002184 metal Substances 0.000 claims description 8
- 238000004806 packaging method and process Methods 0.000 claims description 7
- 230000015572 biosynthetic process Effects 0.000 claims description 4
- 238000000034 method Methods 0.000 abstract description 7
- 238000004519 manufacturing process Methods 0.000 abstract description 6
- 230000008569 process Effects 0.000 abstract description 6
- 238000010923 batch production Methods 0.000 abstract description 5
- 238000005476 soldering Methods 0.000 abstract description 5
- 230000004048 modification Effects 0.000 description 4
- 238000012986 modification Methods 0.000 description 4
- 230000008859 change Effects 0.000 description 2
- 230000007812 deficiency Effects 0.000 description 2
- 238000001914 filtration Methods 0.000 description 2
- 230000004075 alteration Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000013138 pruning Methods 0.000 description 1
- 238000012797 qualification Methods 0.000 description 1
- 238000009966 trimming Methods 0.000 description 1
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- Photometry And Measurement Of Optical Pulse Characteristics (AREA)
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Abstract
The present invention provides a kind of infrared ray thermopile sensor component, comprising: shell；Encapsulation tube support is located at lower part of the housing, and forms encapsulation cavity with shell, and encapsulation tube support includes several first through hole；Infrared heat pile sensor body is set to the intracorporal encapsulation tube support upper surface of package cavity；Liner is formed in encapsulation tube support lower surface, and liner includes several second through-holes, and the second through-hole is correspondingly arranged with first through hole；Several pins, pin include vertical component and horizontal component, and vertical component runs through first through hole, the second through-hole, and horizontal component is at least extended to the side of liner by the second through-hole along lower pad surface, and pin is connected with infrared heat pile sensor body.Infrared ray thermopile sensor component of the invention is more reliable and more preferable with terminal module compatibility, and terminal module integrated level small in size can be made higher, is able to cooperate reflow soldering process batch production, production capacity is higher and can substantially cut down cost of labor.
Description
Technical field
The invention belongs to electronic fields, more particularly to a kind of infrared ray thermopile sensor component.
Background technique
Existing pin is to be vertically arranged with encapsulation tube support.In process, it needs manually to compare the line of production, manually
Misoperation will cause pin deformation, and can not be by equipment automatization, and product qualified rate is low.It needs according to different manufacturers end
It holds the actual size specification of product to carry out second pruning to pin, increases cost of labor, it is different to generate pin burr etc. in trimming
To equipment precision requirement height when often occurring as, installation, pin is needed to be entirely insertable in slot, otherwise will cause pin deformation, terminal makes
With convenience deficiency, pin needs secondary operation that could use.
It is of the invention the purpose of the present invention is providing a kind of infrared ray thermopile sensor component based on the above
Infrared ray thermopile sensor component is more reliable and more preferable with terminal module compatibility, can make terminal module integrated level small in size
It is higher, it is able to cooperate reflow soldering process batch production, production capacity is higher and can substantially cut down cost of labor.
Summary of the invention
In view of the foregoing deficiencies of prior art, the purpose of the present invention is to provide a kind of infrared ray thermopile sensors
Component, infrared ray thermopile sensor component of the invention is more reliable and more preferable with terminal module compatibility, can make terminal
Module integrated level small in size is higher, be able to cooperate reflow soldering process batch production, production capacity it is higher and can substantially cut down manually at
This.
In order to achieve the above objects and other related objects, the present invention provides a kind of infrared ray thermopile sensor component,
Include:
Shell；
Encapsulation tube support is located at the lower part of the housing, and forms encapsulation cavity with the shell, if the encapsulation tube support includes
Dry first through hole；
Infrared heat pile sensor body is set to the intracorporal encapsulation tube support upper surface of package cavity；
Liner, is formed in the encapsulation tube support lower surface, and the liner includes several second through-holes, second through-hole with
The first through hole is correspondingly arranged；
Several pins, the pin include vertical component and horizontal component, the vertical component through the first through hole,
Second through-hole, the horizontal component are at least extended to the side of the liner by second through-hole along the lower pad surface
Face, the pin are connected with the infrared heat pile sensor body.
Optionally, the pin includes the first pin and second pin, and the infrared heat pile sensor body includes
Infrared heat pile sensor chip and temperature sensor, wherein the infrared heat pile sensor chip and described first
Pin is connected, and the temperature sensor is connected with the second pin.
Optionally, the shell includes: side wall；Pipe cap is encapsulated, the encapsulation tube support is set to above the side wall, described
The formation of package tube cap has window；Infrared fileter is formed in the beneath window.
Optionally, the type of the encapsulation tube support includes Metal Packaging tube socket, and the type of the encapsulation pipe cap includes metal
Encapsulate pipe cap.
Optionally, the lower part of the liner is formed with several grooves, and the groove connects second through-hole and extends to
The horizontal component of the side of the liner, the pin is arranged in the groove.
Optionally, the horizontal component of the pin protrudes from the lower pad surface.
Optionally, second through-hole and the first through hole is equal in magnitude.
Optionally, the number of the first through hole includes 3,4.
Optionally, the number of the first through hole, the number of second through-hole are equal with the number of the pin.
Optionally, second through-hole lines up the first lead column and second pin along the direction of the parallel liner side
The opposite sides of pin towards the liner of column, first lead column and second pin column extends.
Optionally, the vertical component of the pin protrudes from the encapsulation tube support upper surface.
It optionally, further include that the horizontal component of the pin protrudes from the side of the liner.
Optionally, the shape of the liner includes round, rectangular.
As described above, the present invention provides a kind of infrared ray thermopile sensor component, infrared heat pile of the invention
Sensor component is more reliable and more preferable with terminal module compatibility, and terminal module integrated level small in size can be made higher, be able to cooperate
Reflow soldering process batch production, production capacity is higher and can substantially cut down cost of labor.Further, encapsulation pipe cap has heat steady
The characteristics of qualitative, air-tightness and reliability.The liner makes mutual insulating between the pin.
Detailed description of the invention
Fig. 1 is shown as the sectional view that embodiment 1 is presented in infrared ray thermopile sensor component of the invention.
Fig. 2 is shown as the top view that embodiment 1 is presented in infrared ray thermopile sensor component of the invention.
Fig. 3 is shown as the sectional view that embodiment 2 is presented in infrared ray thermopile sensor component of the invention.
Fig. 4 is shown as the top view that embodiment 2 is presented in infrared ray thermopile sensor component of the invention.
Component label instructions
101 shells
102 infrared heat pile sensor bodies
103 encapsulation tube supports
104 first through hole
105 liners
106 second through-holes
107 grooves
108 third pins
109 infrared heat pile sensor chips
110 temperature sensors
111 side walls
112 encapsulation pipe caps
113 infrared fileters
114 windows
115 first pins
116 second pins
Specific embodiment
Illustrate embodiments of the present invention below by way of specific specific example, those skilled in the art can be by this specification
Other advantages and efficacy of the present invention can be easily understood for disclosed content.The present invention can also pass through in addition different specific realities
The mode of applying is embodied or practiced, the various details in this specification can also based on different viewpoints and application, without departing from
Various modifications or alterations are carried out under spirit of the invention.
Please refer to FIG. 1 to FIG. 4.It should be clear that this specification structure depicted in this specification institute accompanying drawings, ratio, size etc., only to
Cooperate the revealed content of specification, so that those skilled in the art understands and reads, being not intended to limit the invention can be real
The qualifications applied, therefore do not have technical essential meaning, the tune of the modification of any structure, the change of proportionate relationship or size
It is whole, in the case where not influencing the effect of present invention can be generated and the purpose that can reach, it should all still fall in disclosed skill
Art content obtains in the range of capable of covering.Meanwhile in this specification it is cited as "upper", "lower", "left", "right", " centre " and
The term of " one " etc. is merely convenient to being illustrated for narration, rather than to limit the scope of the invention, relativeness
It is altered or modified, under the content of no substantial changes in technology, when being also considered as the enforceable scope of the present invention.
Embodiment 1
As shown in FIG. 1 to FIG. 2, the present embodiment provides a kind of infrared ray thermopile sensor components, comprising: shell 101,
It is infrared heat pile sensor body 102, encapsulation tube support 103, liner 105, pin, first through hole 104, the second through-hole 106, recessed
Slot 107.
In the present embodiment, the shell 101 includes: side wall 111, and the side wall 111 is set to the encapsulation tube support 103
Edge；Pipe cap 112 is encapsulated, 111 top of side wall is set to, the encapsulation pipe cap 112 is formed with window 114；Infrared filtering
Piece 113 is formed in 114 lower section of window.
Encapsulation pipe cap 112 has the characteristics that thermal stability, air-tightness and reliability.
The infrared heat pile sensor body 102 is set in shell 101.
In the present embodiment, the pin includes the first pin 115 and second pin 116, and the infrared heat pile passes
Sensor ontology 102 includes: infrared heat pile sensor chip 109, the infrared heat pile sensor chip 109 with it is described
First pin 115 is connected；Temperature sensor 110, the temperature sensor 110 are connected with the second pin 116.
The encapsulation tube support 103 is located at 102 lower section of infrared heat pile sensor body, the formation of encapsulation tube support 103
There are several first through hole 104, the encapsulation tube support 103 coats the infrared heat pile sensor body with the shell 101
102。
As an example, the type of the encapsulation tube support 103 includes Metal Packaging tube socket, the type of the encapsulation pipe cap 112
Including Metal Packaging pipe cap.
As an example, the number of the first through hole 104 includes 3,4.
In the present embodiment, the number of the first through hole 104 is 4.
The liner 105 is formed in 103 lower surface of encapsulation tube support, and the liner 105 is formed with several second through-holes
106, second through-hole 106 is correspondingly arranged with the first through hole 104, and the lower part of the liner 105 is formed with several grooves
107, the groove 107 is correspondingly arranged with second through-hole 106, and the groove 107 is at least extended by second through-hole 106
To the side of the liner 105.
As an example, the shape of the liner 105 includes round, rectangular.In the present embodiment, the shape of the liner 105
Shape is rectangular.
In the present embodiment, second through-hole 106 and the first through hole 104 is equal in magnitude.
In the present embodiment, second through-hole 106 lines up the first pin along the direction of 105 sides of the parallel liner
115 column and second pin 116 arrange, and the pins of first pin 115 column and the second pin 116 column is towards the liner 105
Opposite sides extend.
The liner 105 makes mutual insulating between the pin.
The pin is formed in the first through hole 104, second through-hole 106, in the groove 107, the pin
It is connected with the infrared heat pile sensor body.
In the present embodiment, first pin 115 is connected with the infrared heat pile sensor chip 109, described
First pin 115 includes 2 pins, and the second pin 116 is connected with the temperature sensor 110, and described second draws
Foot 116 includes 1 pin, first pin 115 and the corresponding first through hole 104 of the second pin 116
Inner wall includes insulating layer, and third pin 108 includes 1 pin, the corresponding first through hole of the third pin 108
104 inner wall does not include the insulating layer, to be connected with the encapsulation tube support 103.
In the present embodiment, the number of the first through hole 104, the number of second through-hole 106, the groove 107
Number it is equal with the number of the pin.
In the present embodiment, the pin protrudes from 103 upper surface of encapsulation tube support, and the pin protrudes from the lining
Pad 105 lower surfaces.
Embodiment 2
As shown in Fig. 3~Fig. 4, the present embodiment provides a kind of infrared ray thermopile sensor components, comprising: shell 101,
It is infrared heat pile sensor body 102, encapsulation tube support 103, liner 105, pin, first through hole 104, the second through-hole 106, recessed
Slot 107.Difference with embodiment 1 is only that: the pin protrudes from 105 sides of the liner.
In the present embodiment, the shell 101 includes: side wall 111, and the side wall 111 is set to the encapsulation tube support 103
Edge；Pipe cap 112 is encapsulated, 111 top of side wall is set to, the encapsulation pipe cap 112 is formed with window 114；Infrared filtering
Piece 113 is formed in 114 lower section of window.
Encapsulation pipe cap 112 has the characteristics that thermal stability, air-tightness and reliability.
The infrared heat pile sensor body 102 is set in shell 101.
In the present embodiment, it includes the first pin that the infrared heat pile sensor body 102, which includes: the pin,
115 and second pin 116, the infrared heat pile sensor body 102 include: infrared heat pile sensor chip 109,
The infrared heat pile sensor chip 109 is connected with first pin 115；Temperature sensor 110, the temperature sensing
Device 110 is connected with the second pin 116.
The encapsulation tube support 103 is located at 102 lower section of infrared heat pile sensor body, the formation of encapsulation tube support 103
There are several first through hole 104, the encapsulation tube support 103 coats the infrared heat pile sensor body with the shell 101
102。
As an example, the type of the encapsulation tube support 103 includes Metal Packaging tube socket, the type of the encapsulation pipe cap 112
Including Metal Packaging pipe cap.
As an example, the number of the first through hole 104 includes 3,4.
In the present embodiment, the number of the first through hole 104 is 4.
The liner 105 is formed in 103 lower surface of encapsulation tube support, and the liner 105 is formed with several second through-holes
106, second through-hole 106 is correspondingly arranged with the first through hole 104, and the lower part of the liner 105 is formed with several grooves
107, the groove 107 is correspondingly arranged with second through-hole 106, and the groove 107 is at least extended by second through-hole 106
To the side of the liner 105.
As an example, the shape of the liner 105 includes round, rectangular.In the present embodiment, the shape of the liner 105
Shape is rectangular.
In the present embodiment, second through-hole 106 and the first through hole 104 is equal in magnitude.
In the present embodiment, second through-hole 106 lines up the first pin along the direction of 105 sides of the parallel liner
115 column and second pin 116 arrange, and the pins of first pin 115 column and the second pin 116 column is towards the liner 105
Opposite sides extend.
The liner 105 makes mutual insulating between the pin.
The pin is formed in the first through hole 104, second through-hole 106, in the groove 107, the pin
It is connected with the infrared heat pile sensor body.
In the present embodiment, first pin 115 is connected with the infrared heat pile sensor chip 109, described
First pin 115 includes 2 pins, and the second pin 116 is connected with the temperature sensor 110, and described second draws
Foot 116 includes 1 pin, first pin 115 and the corresponding first through hole 104 of the second pin 116
Inner wall includes insulating layer, and third pin 108 includes 1 pin, the corresponding first through hole of the third pin 108
104 inner wall does not include the insulating layer, to be connected with the encapsulation tube support 103.
In the present embodiment, the number of the first through hole 104, the number of second through-hole 106, the groove 107
Number it is equal with the number of the pin.
In the present embodiment, the pin protrudes from 103 upper surface of encapsulation tube support, and the pin protrudes from the lining
105 lower surfaces are padded, the pin protrudes from 105 sides of the liner.
In conclusion the present invention provides a kind of infrared ray thermopile sensor component, infrared heat pile of the invention
Sensor component is more reliable and more preferable with terminal module compatibility, and terminal module integrated level small in size can be made higher, be able to cooperate
Reflow soldering process batch production, production capacity is higher and can substantially cut down cost of labor.Further, encapsulation pipe cap 112 has
The characteristics of thermal stability, air-tightness and reliability.The liner 105 makes mutual insulating between the pin.So the present invention has
Effect overcomes various shortcoming in the prior art and has high industrial utilization value.
The above-described embodiments merely illustrate the principles and effects of the present invention, and is not intended to limit the present invention.It is any ripe
The personage for knowing this technology all without departing from the spirit and scope of the present invention, carries out modifications and changes to above-described embodiment.Cause
This, institute is complete without departing from the spirit and technical ideas disclosed in the present invention by those of ordinary skill in the art such as
At all equivalent modifications or change, should be covered by the claims of the present invention.
Claims (13)
1. a kind of infrared ray thermopile sensor component characterized by comprising
Shell；
Encapsulation tube support is located at the lower part of the housing, and forms encapsulation cavity with the shell, and the encapsulation tube support includes several the
One through-hole；
Infrared heat pile sensor body is set to the intracorporal encapsulation tube support upper surface of package cavity；
Liner, is formed in the encapsulation tube support lower surface, and the liner includes several second through-holes, second through-hole with it is described
First through hole is correspondingly arranged；
Several pins, the pin include vertical component and horizontal component, and the vertical component is through the first through hole, described
Second through-hole, the horizontal component are at least extended to the side of the liner by second through-hole along the lower pad surface,
The pin is connected with the infrared heat pile sensor body.
2. infrared ray thermopile sensor component according to claim 1, it is characterised in that: the pin includes first
Pin and second pin, the infrared heat pile sensor body include infrared heat pile sensor chip and temperature sensing
Device, wherein the infrared heat pile sensor chip is connected with first pin, the temperature sensor and described second
Pin is connected.
3. infrared ray thermopile sensor component according to claim 1, it is characterised in that: the shell includes: side
Wall；Pipe cap is encapsulated, the encapsulation pipe cap is set to above the side wall, and the package tube cap formation has window；Infrared fileter,
It is formed in the beneath window.
4. infrared ray thermopile sensor component according to claim 3, it is characterised in that: the kind of the encapsulation tube support
Class includes Metal Packaging tube socket, and the type of the encapsulation pipe cap includes Metal Packaging pipe cap.
5. infrared ray thermopile sensor component according to claim 1, it is characterised in that: the lower part shape of the liner
At there is several grooves, the groove connects second through-hole and extends to the side of the liner, the horizontal part of the pin
Divide and is arranged in the groove.
6. infrared ray thermopile sensor component according to claim 5, it is characterised in that: the horizontal part of the pin
Divide and protrudes from the lower pad surface.
7. infrared ray thermopile sensor component according to claim 1, it is characterised in that: second through-hole and institute
State the equal in magnitude of first through hole.
8. infrared ray thermopile sensor component according to claim 1, it is characterised in that: of the first through hole
Number includes 3,4.
9. infrared ray thermopile sensor component according to claim 1, it is characterised in that: of the first through hole
The number of several, described second through-hole is equal with the number of the pin.
10. infrared ray thermopile sensor component according to claim 1, it is characterised in that: second through-hole edge
Line up the first lead column and second pin column, first lead column and the second pin in the direction of the parallel liner side
The opposite sides of the pin of column towards the liner extends.
11. infrared ray thermopile sensor component according to claim 1, it is characterised in that: the pin it is vertical
Part protrudes from the encapsulation tube support upper surface.
12. infrared ray thermopile sensor component according to claim 1, it is characterised in that: further include the pin
Horizontal component protrude from the side of the liner.
13. infrared ray thermopile sensor component according to claim 1, it is characterised in that: the shape of the liner
Including round, rectangular.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910017871.7A CN109708765A (en) | 2019-01-09 | 2019-01-09 | A kind of infrared ray thermopile sensor component |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910017871.7A CN109708765A (en) | 2019-01-09 | 2019-01-09 | A kind of infrared ray thermopile sensor component |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109708765A true CN109708765A (en) | 2019-05-03 |
Family
ID=66259835
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910017871.7A Pending CN109708765A (en) | 2019-01-09 | 2019-01-09 | A kind of infrared ray thermopile sensor component |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109708765A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111900244A (en) * | 2020-07-01 | 2020-11-06 | 上海烨映电子技术有限公司 | Insulating plate heat-carrying electric pile sensor component and manufacturing method thereof |
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| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
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| CB02 | Change of applicant information |
Address after: 201800 room j310, building 1, 2222 Huancheng Road, Juyuan New District, Jiading District, Shanghai Applicant after: Shanghai Yeying Microelectronics Technology Co.,Ltd. Address before: 201800 room j310, building 1, No. 2222, Huancheng Road, Juyuan New District, Jiading District, Shanghai Applicant before: SHANGHAI YEYING ELECTRONIC TECHNOLOGY Co.,Ltd. |
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| CB02 | Change of applicant information |