WO2017012250A1 - Environment sensor - Google Patents

Environment sensor Download PDF

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Publication number
WO2017012250A1
WO2017012250A1 PCT/CN2015/096920 CN2015096920W WO2017012250A1 WO 2017012250 A1 WO2017012250 A1 WO 2017012250A1 CN 2015096920 W CN2015096920 W CN 2015096920W WO 2017012250 A1 WO2017012250 A1 WO 2017012250A1
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Prior art keywords
asic
chip
circuit board
sensor
asic chip
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PCT/CN2015/096920
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French (fr)
Chinese (zh)
Inventor
张俊德
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歌尔声学股份有限公司
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Publication of WO2017012250A1 publication Critical patent/WO2017012250A1/en

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
    • G01D5/00—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable
    • G01D5/12—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable using electric or magnetic means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/16227—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation the bump connector connecting to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/16235—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation the bump connector connecting to a via metallisation of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32135—Disposition the layer connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/32145—Disposition the layer connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being stacked
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48235—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a via metallisation of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73253—Bump and layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1517—Multilayer substrate
    • H01L2924/15192—Resurf arrangement of the internal vias

Definitions

  • the present invention relates to the field of measurement, and more particularly to a sensor, and more particularly to an environmental sensor.
  • Environmental sensors use the relevant physical effects of sensitive materials, such as piezoresistive effect, piezoelectric effect, etc. After the sensitive material is affected by environmental variables, its resistance or capacitance changes, and the measurement circuit can obtain proportional to environmental variables.
  • the electrical signal, environmental sensors are now widely used in the measurement and control of air pressure, altitude, temperature and humidity, gas and other fields.
  • the existing environmental sensor includes a package structure surrounded by a circuit board and a casing, and a sensor chip and an ASIC chip located in the package structure, wherein the sensor chip and the ASIC chip are fixed on the circuit board, the sensor chip and the ASIC chip. Between the ASIC chip and the circuit board, the ASIC chip and the circuit board are electrically connected together through a gold wire. Such a connection method not only increases the manufacturing process, but also contributes to the miniaturization of the environmental sensor.
  • an environmental sensor includes a circuit board, an outer casing, and an outer package surrounded by the circuit board and the outer casing, the outer package further having a through hole communicating with the outside, and further comprising An ASIC chip and a sensor chip inside the external package, wherein the ASIC chip is soldered to the circuit board by a solder ball, and the output end of the ASIC chip is electrically connected to the ASIC output terminal wire provided on the circuit board, the ASIC Chip input and power
  • the ASIC input wires disposed on the circuit board are electrically connected together; the sensor chip is fixed at a position inside the external package above the ASIC chip, and the projection of the sensor chip and the ASIC chip on the circuit board at least partially overlaps; the sensor chip passes the gold The wire is electrically connected to the ASIC input lead.
  • a fixing portion is further fixed inside the outer package, and the holding portion is provided with a first extending in a vertical direction, one end is electrically connected to the ASIC input end wire, and the other end is electrically connected to the gold wire. Connect the wires.
  • the holding portion is fixed on the circuit board, and the lower end of the first connecting wire is directly in contact with the ASIC input terminal wire.
  • the retaining portion is fixed to an inner wall of the upper end of the outer casing; and one end of the first connecting wire is electrically connected to the ASIC input terminal wire through a second connecting wire disposed in the side wall of the outer casing.
  • the sensor chip is directly fixed to the upper end surface of the ASIC chip.
  • the sensor chip is fixed to an inner wall of the upper end of the outer casing.
  • the via hole is disposed on the outer casing.
  • the via holes are disposed on the circuit board.
  • the ASIC chip is inverted, and the output end of the ASIC chip is directly soldered to the ASIC output terminal of the circuit board through the solder ball; the input end of the ASIC chip is directly soldered to the ASIC input terminal of the circuit board through the solder ball.
  • the sensor chip is disposed opposite the ASIC chip.
  • the sensor chip and the ASIC chip are distributed in the vertical direction inside the external package, the ASIC chip is soldered on the circuit board by means of a solder ball, and the sensor chip passes through the gold wire and the ASIC disposed on the circuit board.
  • the input lead is electrically connected to the ASIC chip, which reduces the size of the entire environmental sensor in the lateral direction, thereby saving space in the external package, enabling the product to be made smaller to meet the miniaturization of modern electronic products.
  • the connection mode between the sensor chip and the ASIC chip is simplified, the manufacturing process is simple, the process efficiency is high, and the production cost is low.
  • the size of the ASIC chip is large relative to the sensor chip, which makes it possible to connect the sensor chip by means of a gold wire.
  • FIG. 1 is a schematic structural view of an environmental sensor of the present invention.
  • FIG. 2 is a schematic structural view of another embodiment of the environmental sensor of the present invention.
  • the present invention provides an environmental sensor, which may be a pressure sensor, a temperature sensor, a humidity sensor, or the like for detecting a surrounding environment, including a circuit board 1, a housing 2, and the housing 2 is fixed to the circuit board. 1 and together with the circuit board 1 enclose the external package of the environmental sensor.
  • the outer casing 2 may also be in the form of a flat plate. In this case, a separate side wall portion is also required to support the outer casing 2 on the circuit board 1 to jointly form an outer package of the environmental sensor.
  • the ASIC chip 4 and the sensor chip 3 of the environmental sensor are disposed inside the external package, wherein a conductive hole 11 communicating with the outside is further disposed on the external package to enable the sensor The chip 3 is exposed to the outside environment.
  • the via hole 11 may be disposed on the outer casing 2 or may be disposed on the circuit board 1.
  • the ASIC chip 4 is soldered on the circuit board 1 by means of a soldering ball 9.
  • the circuit layout on the circuit board 1 includes an ASIC output terminal wire 8, an ASIC input terminal wire 7, and an ASIC chip 4 fixed.
  • On the circuit board 1, and its output terminal is electrically connected with the ASIC output terminal 8 and its input terminal is electrically connected with the ASIC input terminal 7 to connect the ASIC chip 4 to the circuit board of the circuit board 1.
  • the ASIC chip 4 is mounted upside down such that the output end and the input end of the ASIC chip 4 face downward, and the output end of the ASIC chip 4 is directly soldered to the circuit board through the solder ball 9.
  • the ASIC output terminal 8 of 1 is mounted; the input of the ASIC chip 4 is soldered directly to the ASIC input terminal 7 of the circuit board 1.
  • the ASIC chip 4 is no longer needed to be inverted, and the metallized through hole at the lower end of the ASIC chip 4 can be directly used as a soldering point to be directly soldered to the circuit layout on the circuit board 1.
  • the sensor chip 3 is fixed at a position inside the external package above the ASIC chip 4, and the projection of the sensor chip 3 and the ASIC chip 4 on the circuit board 1 at least partially overlaps, preferably, the sensor chip 3 Set up with the ASIC chip 4.
  • the sensor chip 3 is electrically connected to the ASIC input terminal 7 through the gold wire 10, so that the electrical signal output by the sensor chip 3 is transmitted to the ASIC chip 4 through the gold wire 10 and the ASIC input terminal wire 7, and the sensor chip is passed through the ASIC chip 4. 3
  • the output electrical signal is amplified for subsequent processing.
  • the sensor chip 3 is directly fixed on the upper end surface of the ASIC chip 4, referring to FIG. 1; in another specific embodiment of the present invention, the sensor chip 3 may also be fixed on the inner wall of the upper end of the outer casing 2. Above, refer to Figure 2.
  • the sensor chip and the ASIC chip are distributed in the vertical direction inside the external package, the ASIC chip is soldered on the circuit board by means of a solder ball, and the sensor chip passes through the gold wire and the ASIC disposed on the circuit board.
  • the input lead is electrically connected to the ASIC chip, which reduces the lateral dimension of the entire environmental sensor, thereby saving space in the external package.
  • the product can be made smaller to meet the miniaturization of modern electronic products.
  • the connection mode between the sensor chip and the ASIC chip is simplified, the manufacturing process is simple, the process efficiency is high, and the production cost is low.
  • the size of the ASIC chip is large relative to the sensor chip, which makes it possible to connect the sensor chip by means of a gold wire.
  • a holding portion 5 is further fixed inside the outer package, and the holding portion 5 can be made of an insulating material, and the holding portion 5 is provided with a first connecting wire 6 extending in a vertical direction.
  • One end of the first connecting wire 6 is electrically connected to the ASIC input terminal 7 and the other end is electrically connected to the gold wire 10, so that the use of the gold wire can be greatly reduced, and the assembly process is also simplified.
  • the holding portion 5 can be fixed on the circuit board 1 such that the lower end of the first connecting wire 6 can be directly connected to the ASIC input terminal 7 and the upper end of the first connecting wire 6 is connected to the sensor chip.
  • the gold wires 10 of 3 are connected together. Referring to FIG. 1, the electrical connection between the sensor chip 3 and the ASIC chip 4 is realized by the gold wire 10, the first connecting wire 6, and the ASIC input terminal 7.
  • the holding portion 5 is fixed on the inner wall of the upper end of the outer casing 2; a second connecting wire 12 is disposed in the side wall of the outer casing 2, and the lower end of the second connecting wire 12 and the ASIC input end are provided.
  • the wires 7 are directly electrically connected together, the upper end of which is electrically connected to one end of the first connecting wire 6, and the other end of the first connecting wire 6 is connected to the gold wire 10 of the sensor chip 3, with reference to FIG.
  • the gold wire 10, the first connecting wire 6, the second connecting wire 12, and the ASIC input terminal 7 realize an electrical connection between the sensor chip 3 and the ASIC chip 4.

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Testing Or Calibration Of Command Recording Devices (AREA)

Abstract

An environment sensor comprises a circuit board (1), a housing (2), and an external packaging surrounding the circuit board (1) and the housing (2), the external packaging being further provided with a conductive via (11) in communication with the external environment; the sensor further comprises an ASIC chip (4) and a sensor chip (3) provided inside the external packaging; the ASIC chip (4) is soldered onto the circuit board (1) by means of embedded solder balls (9), the output end of the ASIC chip (4) is electrically connected to an ASIC output end lead (8) provided on the circuit board (1), and the input end of the ASIC chip (4) is electrically connected to an ASIC input end lead (7) provided on the circuit board (1); the sensor chip (3) is fixed in place at a position inside the external packaging and above the ASIC chip (4), and the projection of the ASIC chip (4) onto the circuit board (1) at least partly overlaps with that of the sensor chip (3); and the sensor chip (3) is electrically connected to the ASIC input end lead (7) by means of a gold wire (10). The invention provides for a sensor having a reduced horizontal size, and allows for product miniaturization.

Description

一种环境传感器Environmental sensor 技术领域Technical field
本发明涉及测量领域，更具体地，涉及一种传感器，尤其涉及一种环境传感器。The present invention relates to the field of measurement, and more particularly to a sensor, and more particularly to an environmental sensor.
背景技术Background technique
环境传感器利用的是敏感材料的相关物理效应,如压阻效应、压电效应等，敏感材料在受到环境变量的作用后，其电阻或者电容发生变化，通过测量电路就可以得到正比于环境变量变化的电信号，环境传感器现已广泛应用于气压、高度、温湿度、气体等领域的测量和控制中。Environmental sensors use the relevant physical effects of sensitive materials, such as piezoresistive effect, piezoelectric effect, etc. After the sensitive material is affected by environmental variables, its resistance or capacitance changes, and the measurement circuit can obtain proportional to environmental variables. The electrical signal, environmental sensors are now widely used in the measurement and control of air pressure, altitude, temperature and humidity, gas and other fields.
近年来，随着科学技术的发展，手机、笔记本电脑等电子产品的体积在不断减小，而且人们对这些便携电子产品的性能要求也越来越高，这就要求与之配套的电子零部件的体积也必须随着减小。In recent years, with the development of science and technology, the volume of electronic products such as mobile phones and notebook computers is decreasing, and the performance requirements of these portable electronic products are getting higher and higher, which requires electronic components compatible with them. The volume must also decrease with it.
现有的环境传感器，包括由电路板、外壳围成的封装结构，以及位于该封装结构中的传感器芯片、ASIC芯片，其中，传感器芯片和ASIC芯片均固定在电路板上，传感器芯片和ASIC芯片之间通过金线电连接，ASIC芯片与电路板之间通过金线电连接在一起。这样的连接方式，不但增加了制作工序，而且也不利于环境传感器的小型化发展。The existing environmental sensor includes a package structure surrounded by a circuit board and a casing, and a sensor chip and an ASIC chip located in the package structure, wherein the sensor chip and the ASIC chip are fixed on the circuit board, the sensor chip and the ASIC chip. Between the ASIC chip and the circuit board, the ASIC chip and the circuit board are electrically connected together through a gold wire. Such a connection method not only increases the manufacturing process, but also contributes to the miniaturization of the environmental sensor.
发明内容Summary of the invention
本发明的一个目的是提供了一种环境传感器。It is an object of the present invention to provide an environmental sensor.
根据本发明的一个方面，提供一种环境传感器，包括电路板、外壳，以及由电路板、外壳包围起来的外部封装，所述外部封装上还设有连通外界的导通孔；还包括设置在外部封装内部的ASIC芯片、传感器芯片，其中，所述ASIC芯片通过植锡球焊接在电路板上，且ASIC芯片的输出端与电路板上设置的ASIC输出端导线电连接在一起，所述ASIC芯片的输入端与电 路板上设置的ASIC输入端导线电连接在一起；所述传感器芯片固定在外部封装内部位于ASIC芯片上方的位置，且传感器芯片与ASIC芯片在电路板上的投影至少部分重叠；传感器芯片通过金线与ASIC输入端导线电连接在一起。According to an aspect of the present invention, an environmental sensor includes a circuit board, an outer casing, and an outer package surrounded by the circuit board and the outer casing, the outer package further having a through hole communicating with the outside, and further comprising An ASIC chip and a sensor chip inside the external package, wherein the ASIC chip is soldered to the circuit board by a solder ball, and the output end of the ASIC chip is electrically connected to the ASIC output terminal wire provided on the circuit board, the ASIC Chip input and power The ASIC input wires disposed on the circuit board are electrically connected together; the sensor chip is fixed at a position inside the external package above the ASIC chip, and the projection of the sensor chip and the ASIC chip on the circuit board at least partially overlaps; the sensor chip passes the gold The wire is electrically connected to the ASIC input lead.
优选地，所述外部封装内部还固定有保持部，所述保持部中设有沿垂直方向延伸的、一端与ASIC输入端导线电连接在一起，另一端与金线电连接在一起的第一连接导线。Preferably, a fixing portion is further fixed inside the outer package, and the holding portion is provided with a first extending in a vertical direction, one end is electrically connected to the ASIC input end wire, and the other end is electrically connected to the gold wire. Connect the wires.
优选地，所述保持部固定在电路板上，所述第一连接导线的下端与ASIC输入端导线直接接触连接。Preferably, the holding portion is fixed on the circuit board, and the lower end of the first connecting wire is directly in contact with the ASIC input terminal wire.
优选地，所述保持部固定在外壳上端的内壁上；且第一连接导线的一端通过设置在外壳侧壁内的第二连接导线与ASIC输入端导线电连接在一起。Preferably, the retaining portion is fixed to an inner wall of the upper end of the outer casing; and one end of the first connecting wire is electrically connected to the ASIC input terminal wire through a second connecting wire disposed in the side wall of the outer casing.
优选地，所述传感器芯片直接固定在ASIC芯片的上端面。Preferably, the sensor chip is directly fixed to the upper end surface of the ASIC chip.
优选地，所述传感器芯片固定在外壳上端的内壁上。Preferably, the sensor chip is fixed to an inner wall of the upper end of the outer casing.
优选地，所述导通孔设置在外壳上。Preferably, the via hole is disposed on the outer casing.
优选地，所述导通孔设置在电路板上。Preferably, the via holes are disposed on the circuit board.
优选地，所述ASIC芯片倒置，ASIC芯片的输出端通过植锡球直接焊接在电路板的ASIC输出端导线上；ASIC芯片的输入端通过植锡球直接焊接在电路板的ASIC输入端导线上。Preferably, the ASIC chip is inverted, and the output end of the ASIC chip is directly soldered to the ASIC output terminal of the circuit board through the solder ball; the input end of the ASIC chip is directly soldered to the ASIC input terminal of the circuit board through the solder ball. .
优选地，所述传感器芯片与ASIC芯片正对设置。Preferably, the sensor chip is disposed opposite the ASIC chip.
本发明的环境传感器，传感器芯片、ASIC芯片分布在外部封装内部的竖直方向上，ASIC芯片通过植锡球的方式焊接在电路板上，且传感器芯片通过金线、设置在电路板上的ASIC输入端引线与ASIC芯片电连接在一起，降低了整个环境传感器的在横向上的尺寸，从而可以节省外部封装的空间，使得产品可以做的更小，以满足现代电子产品的小型化发展。同时也简化了传感器芯片与ASIC芯片之间的连接方式，使其制造工艺简单，制程效率高，生产成本低。而且，相对于传感器芯片而言，ASIC芯片的尺寸较大，这就使得可以采用金线的方式来连接传感器芯片。In the environmental sensor of the present invention, the sensor chip and the ASIC chip are distributed in the vertical direction inside the external package, the ASIC chip is soldered on the circuit board by means of a solder ball, and the sensor chip passes through the gold wire and the ASIC disposed on the circuit board. The input lead is electrically connected to the ASIC chip, which reduces the size of the entire environmental sensor in the lateral direction, thereby saving space in the external package, enabling the product to be made smaller to meet the miniaturization of modern electronic products. At the same time, the connection mode between the sensor chip and the ASIC chip is simplified, the manufacturing process is simple, the process efficiency is high, and the production cost is low. Moreover, the size of the ASIC chip is large relative to the sensor chip, which makes it possible to connect the sensor chip by means of a gold wire.
通过以下参照附图对本发明的示例性实施例的详细描述，本发明的其 它特征及其优点将会变得清楚。A detailed description of an exemplary embodiment of the present invention, Its features and its advantages will become clear.
附图说明DRAWINGS
构成说明书的一部分的附图描述了本发明的实施例，并且连同说明书一起用于解释本发明的原理。The accompanying drawings, which are incorporated in FIG.
图1是本发明环境传感器的结构示意图。1 is a schematic structural view of an environmental sensor of the present invention.
图2是本发明环境传感器另一实施例的结构示意图。2 is a schematic structural view of another embodiment of the environmental sensor of the present invention.
具体实施方式detailed description
现在将参照附图来详细描述本发明的各种示例性实施例。应注意到：除非另外具体说明，否则在这些实施例中阐述的部件和步骤的相对布置、数字表达式和数值不限制本发明的范围。Various exemplary embodiments of the present invention will now be described in detail with reference to the drawings. It should be noted that the relative arrangement of the components and steps, numerical expressions and numerical values set forth in the embodiments are not intended to limit the scope of the invention unless otherwise specified.
以下对至少一个示例性实施例的描述实际上仅仅是说明性的，决不作为对本发明及其应用或使用的任何限制。The following description of the at least one exemplary embodiment is merely illustrative and is in no way
对于相关领域普通技术人员已知的技术和设备可能不作详细讨论，但在适当情况下，所述技术和设备应当被视为说明书的一部分。Techniques and devices known to those of ordinary skill in the relevant art may not be discussed in detail, but where appropriate, the techniques and devices should be considered as part of the specification.
在这里示出和讨论的所有例子中，任何具体值应被解释为仅仅是示例性的，而不是作为限制。因此，示例性实施例的其它例子可以具有不同的值。In all of the examples shown and discussed herein, any specific values are to be construed as illustrative only and not as a limitation. Thus, other examples of the exemplary embodiments may have different values.
应注意到：相似的标号和字母在下面的附图中表示类似项，因此，一旦某一项在一个附图中被定义，则在随后的附图中不需要对其进行进一步讨论。It should be noted that similar reference numerals and letters indicate similar items in the following figures, and therefore, once an item is defined in one figure, it is not required to be further discussed in the subsequent figures.
参考图1，本发明提供了一种环境传感器，其可以是压力传感器、温度传感器、湿度传感器等用于检测周围环境的传感器，其包括电路板1、外壳2，所述外壳2固定在电路板1上，并与电路板1共同围成了环境传感器的外部封装。其中，所述外壳2也可以是呈平板状，此时，还需要设置一独立的侧壁部将外壳2支撑在电路板1上，以共同形成环境传感器的外部封装。环境传感器的ASIC芯片4、传感器芯片3设置在外部封装的内部，其中，在所述外部封装上还设有连通外界的导通孔11，以便将传感器 芯片3暴露在外界的环境中。其中，导通孔11可以设置在外壳2上，也可以设置在电路板1上。Referring to FIG. 1, the present invention provides an environmental sensor, which may be a pressure sensor, a temperature sensor, a humidity sensor, or the like for detecting a surrounding environment, including a circuit board 1, a housing 2, and the housing 2 is fixed to the circuit board. 1 and together with the circuit board 1 enclose the external package of the environmental sensor. The outer casing 2 may also be in the form of a flat plate. In this case, a separate side wall portion is also required to support the outer casing 2 on the circuit board 1 to jointly form an outer package of the environmental sensor. The ASIC chip 4 and the sensor chip 3 of the environmental sensor are disposed inside the external package, wherein a conductive hole 11 communicating with the outside is further disposed on the external package to enable the sensor The chip 3 is exposed to the outside environment. The via hole 11 may be disposed on the outer casing 2 or may be disposed on the circuit board 1.
本发明的环境传感器，所述ASIC芯片4通过植锡球9的方式焊接在电路板1上，电路板1上的电路布图包括ASIC输出端导线8、ASIC输入端导线7，ASIC芯片4固定在电路板1上，并使其输出端与ASIC输出端导线8电连接在一起，使其输入端与ASIC输入端导线7电连接在一起，从而将ASIC芯片4连接到电路板1的电路布图中。In the environmental sensor of the present invention, the ASIC chip 4 is soldered on the circuit board 1 by means of a soldering ball 9. The circuit layout on the circuit board 1 includes an ASIC output terminal wire 8, an ASIC input terminal wire 7, and an ASIC chip 4 fixed. On the circuit board 1, and its output terminal is electrically connected with the ASIC output terminal 8 and its input terminal is electrically connected with the ASIC input terminal 7 to connect the ASIC chip 4 to the circuit board of the circuit board 1. In the picture.
在本发明一个具体的实施方式中，所述ASIC芯片4倒置安装，使得ASIC芯片4上的输出端、输入端朝下，并通过植锡球9将ASIC芯片4的输出端直接焊接在电路板1的ASIC输出端导线8上；将ASIC芯片4的输入端直接焊接在电路板1的ASIC输入端导线7上。当然，对于本领域的技术人员来说，也可以在ASIC芯片4的内部设置金属化通孔，通过该金属化通孔可以将位于ASIC芯片4上端的输出端、输入端电极引到ASIC芯片4的下端，采用这种方式，使得不再需要将ASIC芯片4倒置，可以直接将ASIC芯片4下端的金属化通孔作为焊接点，直接与电路板1上的电路布图焊接在一起。In a specific embodiment of the present invention, the ASIC chip 4 is mounted upside down such that the output end and the input end of the ASIC chip 4 face downward, and the output end of the ASIC chip 4 is directly soldered to the circuit board through the solder ball 9. The ASIC output terminal 8 of 1 is mounted; the input of the ASIC chip 4 is soldered directly to the ASIC input terminal 7 of the circuit board 1. Of course, it is also possible for a person skilled in the art to provide a metallized via hole inside the ASIC chip 4, and the output terminal and the input terminal electrode at the upper end of the ASIC chip 4 can be led to the ASIC chip 4 through the metallized via hole. In this way, in this way, the ASIC chip 4 is no longer needed to be inverted, and the metallized through hole at the lower end of the ASIC chip 4 can be directly used as a soldering point to be directly soldered to the circuit layout on the circuit board 1.
本发明的环境传感器，所述传感器芯片3固定在外部封装内部位于ASIC芯片4上方的位置，且传感器芯片3与ASIC芯片4在电路板1上的投影至少部分重叠，优选的是，传感器芯片3与ASIC芯片4正对设置。In the environmental sensor of the present invention, the sensor chip 3 is fixed at a position inside the external package above the ASIC chip 4, and the projection of the sensor chip 3 and the ASIC chip 4 on the circuit board 1 at least partially overlaps, preferably, the sensor chip 3 Set up with the ASIC chip 4.
传感器芯片3通过金线10与ASIC输入端导线7电连接在一起，使得传感器芯片3输出的电信号通过金线10、ASIC输入端导线7传输至ASIC芯片4上，通过ASIC芯片4对传感器芯片3输出的电信号进行放大，以便后续处理。在本发明一个具体的实施方式中，传感器芯片3直接固定在ASIC芯片4的上端面，参考图1；在本发明另一具体的实施方式中，传感器芯片3也可以固定在外壳2上端的内壁上，参考图2。The sensor chip 3 is electrically connected to the ASIC input terminal 7 through the gold wire 10, so that the electrical signal output by the sensor chip 3 is transmitted to the ASIC chip 4 through the gold wire 10 and the ASIC input terminal wire 7, and the sensor chip is passed through the ASIC chip 4. 3 The output electrical signal is amplified for subsequent processing. In a specific embodiment of the present invention, the sensor chip 3 is directly fixed on the upper end surface of the ASIC chip 4, referring to FIG. 1; in another specific embodiment of the present invention, the sensor chip 3 may also be fixed on the inner wall of the upper end of the outer casing 2. Above, refer to Figure 2.
本发明的环境传感器，传感器芯片、ASIC芯片分布在外部封装内部的竖直方向上，ASIC芯片通过植锡球的方式焊接在电路板上，且传感器芯片通过金线、设置在电路板上的ASIC输入端引线与ASIC芯片电连接在一起，降低了整个环境传感器的在横向上的尺寸，从而可以节省外部封装的空间， 使得产品可以做的更小，以满足现代电子产品的小型化发展。同时也简化了传感器芯片与ASIC芯片之间的连接方式，使其制造工艺简单，制程效率高，生产成本低。而且，相对于传感器芯片而言，ASIC芯片的尺寸较大，这就使得可以采用金线的方式来连接传感器芯片。In the environmental sensor of the present invention, the sensor chip and the ASIC chip are distributed in the vertical direction inside the external package, the ASIC chip is soldered on the circuit board by means of a solder ball, and the sensor chip passes through the gold wire and the ASIC disposed on the circuit board. The input lead is electrically connected to the ASIC chip, which reduces the lateral dimension of the entire environmental sensor, thereby saving space in the external package. The product can be made smaller to meet the miniaturization of modern electronic products. At the same time, the connection mode between the sensor chip and the ASIC chip is simplified, the manufacturing process is simple, the process efficiency is high, and the production cost is low. Moreover, the size of the ASIC chip is large relative to the sensor chip, which makes it possible to connect the sensor chip by means of a gold wire.
由于传感器芯片3设置在ASIC芯片4的上方，这就使得传感器芯片3距离电路板1较远，也就是说，需要采用较长的金线10才能将传感器芯片3与位于电路板1上的ASIC输入端导线7连接在一起。在本发明一个优选的实施方式中，在外部封装内部还固定有保持部5，该保持部5可由绝缘材料制成，所述保持部5中设有沿垂直方向延伸的第一连接导线6，该第一连接导线6的一端与ASIC输入端导线7电连接在一起，另一端与金线10电连接在一起的，从而可以大大减少金线的使用，同时也简化了组装的工艺。Since the sensor chip 3 is disposed above the ASIC chip 4, this makes the sensor chip 3 farther from the circuit board 1, that is, a longer gold wire 10 is required to connect the sensor chip 3 to the ASIC on the circuit board 1. The input wires 7 are connected together. In a preferred embodiment of the present invention, a holding portion 5 is further fixed inside the outer package, and the holding portion 5 can be made of an insulating material, and the holding portion 5 is provided with a first connecting wire 6 extending in a vertical direction. One end of the first connecting wire 6 is electrically connected to the ASIC input terminal 7 and the other end is electrically connected to the gold wire 10, so that the use of the gold wire can be greatly reduced, and the assembly process is also simplified.
其中，所述保持部5可以固定在电路板1上，这样，所述第一连接导线6的下端可以直接与ASIC输入端导线7接触连接在一起，第一连接导线6的上端则与传感器芯片3的金线10连接在一起，参考图1，通过金线10、第一连接导线6、ASIC输入端导线7实现了传感器芯片3与ASIC芯片4之间的电连接。The holding portion 5 can be fixed on the circuit board 1 such that the lower end of the first connecting wire 6 can be directly connected to the ASIC input terminal 7 and the upper end of the first connecting wire 6 is connected to the sensor chip. The gold wires 10 of 3 are connected together. Referring to FIG. 1, the electrical connection between the sensor chip 3 and the ASIC chip 4 is realized by the gold wire 10, the first connecting wire 6, and the ASIC input terminal 7.
在本发明另一实施例中，所述保持部5固定在外壳2上端的内壁上；在外壳2的侧壁内设置有第二连接导线12，该第二连接导线12的下端与ASIC输入端导线7直接电连接在一起，其上端与第一连接导线6的一端电连接在一起，而第一连接导线6的另一端则与传感器芯片3的金线10连接在一起，参考图2，通过金线10、第一连接导线6、第二连接导线12、ASIC输入端导线7实现了传感器芯片3与ASIC芯片4之间的电连接。In another embodiment of the present invention, the holding portion 5 is fixed on the inner wall of the upper end of the outer casing 2; a second connecting wire 12 is disposed in the side wall of the outer casing 2, and the lower end of the second connecting wire 12 and the ASIC input end are provided. The wires 7 are directly electrically connected together, the upper end of which is electrically connected to one end of the first connecting wire 6, and the other end of the first connecting wire 6 is connected to the gold wire 10 of the sensor chip 3, with reference to FIG. The gold wire 10, the first connecting wire 6, the second connecting wire 12, and the ASIC input terminal 7 realize an electrical connection between the sensor chip 3 and the ASIC chip 4.
虽然已经通过示例对本发明的一些特定实施例进行了详细说明，但是本领域的技术人员应该理解，以上示例仅是为了进行说明，而不是为了限制本发明的范围。本领域的技术人员应该理解，可在不脱离本发明的范围和精神的情况下，对以上实施例进行修改。本发明的范围由所附权利要求来限定。 While the invention has been described in detail with reference to the specific embodiments of the present invention, it should be understood that It will be appreciated by those skilled in the art that the above embodiments may be modified without departing from the scope and spirit of the invention. The scope of the invention is defined by the appended claims.

Claims (10)

  1. 一种环境传感器，其特征在于：包括电路板(1)、外壳(2)，以及由电路板(1)、外壳(2)包围起来的外部封装，所述外部封装上还设有连通外界的导通孔(11)；还包括设置在外部封装内部的ASIC芯片(4)、传感器芯片(3)，其中，所述ASIC芯片(4)通过植锡球(9)焊接在电路板(1)上，且ASIC芯片(4)的输出端与电路板(1)上设置的ASIC输出端导线(8)电连接在一起，所述ASIC芯片(4)的输入端与电路板(1)上设置的ASIC输入端导线(7)电连接在一起；所述传感器芯片(3)固定在外部封装内部位于ASIC芯片(4)上方的位置，且传感器芯片(3)与ASIC芯片(4)在电路板(1)上的投影至少部分重叠；传感器芯片(3)通过金线(10)与ASIC输入端导线(7)电连接在一起。An environmental sensor comprising: a circuit board (1), a casing (2), and an outer package surrounded by the circuit board (1) and the outer casing (2), wherein the outer package is further provided with an external connection a via hole (11); further comprising an ASIC chip (4) disposed inside the outer package, the sensor chip (3), wherein the ASIC chip (4) is soldered to the circuit board (1) by a solder ball (9) And the output end of the ASIC chip (4) is electrically connected to the ASIC output terminal (8) provided on the circuit board (1), and the input end of the ASIC chip (4) is disposed on the circuit board (1) The ASIC input wires (7) are electrically connected together; the sensor chip (3) is fixed inside the external package at a position above the ASIC chip (4), and the sensor chip (3) and the ASIC chip (4) are on the circuit board The projections on (1) at least partially overlap; the sensor chip (3) is electrically connected to the ASIC input lead (7) via a gold wire (10).
  2. 根据权利要求1所述的环境传感器，其特征在于：所述外部封装内部还固定有保持部(5)，所述保持部(5)中设有沿垂直方向延伸的、一端与ASIC输入端导线(7)电连接在一起，另一端与金线(10)电连接在一起的第一连接导线(6)。The environmental sensor according to claim 1, wherein a fixing portion (5) is further fixed inside the outer package, and the holding portion (5) is provided with a vertical extending end and an ASIC input terminal wire. (7) A first connecting wire (6) electrically connected together and electrically connected to the gold wire (10) at the other end.
  3. 根据权利要求2所述的环境传感器，其特征在于：所述保持部(5)固定在电路板(1)上，所述第一连接导线(6)的下端与ASIC输入端导线(7)直接接触连接。The environmental sensor according to claim 2, characterized in that the holding portion (5) is fixed on the circuit board (1), and the lower end of the first connecting wire (6) is directly connected to the ASIC input terminal wire (7) Contact connection.
  4. 根据权利要求2所述的环境传感器，其特征在于：所述保持部(5)固定在外壳(2)上端的内壁上；且第一连接导线(6)的一端通过设置在外壳(2)侧壁内的第二连接导线(12)与ASIC输入端导线(7)电连接在一起。The environmental sensor according to claim 2, wherein the holding portion (5) is fixed to an inner wall of the upper end of the outer casing (2); and one end of the first connecting wire (6) is disposed on the side of the outer casing (2) The second connecting wire (12) in the wall is electrically connected to the ASIC input terminal wire (7).
  5. 根据权利要求1至4任一项所述的环境传感器，其特征在于：所述传感器芯片(3)直接固定在ASIC芯片(4)的上端面。The environmental sensor according to any one of claims 1 to 4, characterized in that the sensor chip (3) is directly fixed to the upper end surface of the ASIC chip (4).
  6. 根据权利要求1至4任一项所述的环境传感器，其特征在于：所述传感器芯片(3)固定在外壳(2)上端的内壁上。The environmental sensor according to any one of claims 1 to 4, characterized in that the sensor chip (3) is fixed to the inner wall of the upper end of the outer casing (2).
  7. 根据权利要求1所述的环境传感器，其特征在于：所述导通孔(11)设置在外壳(2)上。 The environmental sensor according to claim 1, characterized in that the through hole (11) is provided on the outer casing (2).
  8. 根据权利要求1所述的环境传感器，其特征在于：所述导通孔(11)设置在电路板(1)上。The environmental sensor according to claim 1, characterized in that the via hole (11) is provided on the circuit board (1).
  9. 根据权利要求1所述的环境传感器，其特征在于：所述ASIC芯片(4)倒置，ASIC芯片(4)的输出端通过植锡球(9)直接焊接在电路板(1)的ASIC输出端导线(8)上；ASIC芯片(4)的输入端通过植锡球(9)直接焊接在电路板(1)的ASIC输入端导线(7)上。The environmental sensor according to claim 1, characterized in that the ASIC chip (4) is inverted, and the output end of the ASIC chip (4) is directly soldered to the ASIC output of the circuit board (1) through a solder ball (9). On the wire (8); the input end of the ASIC chip (4) is directly soldered to the ASIC input terminal wire (7) of the circuit board (1) by a solder ball (9).
  10. 根据权利要求1所述的环境传感器，其特征在于：所述传感器芯片(3)与ASIC芯片(4)正对设置。 The environmental sensor according to claim 1, characterized in that the sensor chip (3) is disposed opposite the ASIC chip (4).
PCT/CN2015/096920 2015-07-21 2015-12-10 Environment sensor WO2017012250A1 (en)

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