CN105806542A - Air pressure sensor - Google Patents
Air pressure sensor Download PDFInfo
- Publication number
- CN105806542A CN105806542A CN201610277897.1A CN201610277897A CN105806542A CN 105806542 A CN105806542 A CN 105806542A CN 201610277897 A CN201610277897 A CN 201610277897A CN 105806542 A CN105806542 A CN 105806542A
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- CN
- China
- Prior art keywords
- circuit board
- baroceptor
- interface
- chip
- mems sensor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
- G01L9/12—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means by making use of variations in capacitance, i.e. electric circuits therefor
Abstract
The invention provides an air pressure sensor which comprises a circuit board, a shell, an MEMS sensor chip, an ASIC chip, a data interface compatible with an I2C interface and an SPI interface, and an external package defined by the circuit board and the shell.The external package is provided with a communication hole for being connected with the outside world.The MEMS sensor chip and the ASIC chip are arranged inside the external package and electrically connected with the circuit board.The data interface is formed in the circuit board.By adopting the technical scheme, due to the fact that the data interface has an I2C mode and an SPI mode, the data interface is applicable to all products provided with I2C and SPI interfaces, and therefore the application range of the air pressure sensor is enlarged.In addition, the MEMS sensor chip is adopted, so that the testing precision is further improved, the product grade is improved, and the air pressure sensor is applicable to product application with high requirements.
Description
Technical field
The invention belongs to fields of measurement, particularly relate to a kind of baroceptor.
Background technology
In recent years, development along with science and technology, size and performance requirement to sensor are more and more higher, existing sensor generally includes circuit board, encapsulating structure that shell surrounds and be arranged in the sensor chip of this encapsulating structure, asic chip, wherein, sensor chip and ASIC are each attached on circuit board, and sensor mostly relatively is I2C single face, can not meet market diversification demand.
Summary of the invention
In view of this, the present invention provides a kind of baroceptor, including the data-interface of circuit board, shell, MEMS sensor chip, asic chip, compatible I2C and SPI interface and the outer enclosure that is surrounded by circuit board, shell, described outer enclosure is provided with and connects extraneous via, described MEMS sensor chip and asic chip are arranged at the inside of outer enclosure, and electrically connect with circuit board, described data-interface is provided with on circuit board.
After adopting above technical scheme, may select owing to described data-interface has I2C and SPI two class output mode, namely all products with I2C and SPI interface it are applicable to, thus increasing the range of application of described baroceptor, in addition, this product adopts MEMS sensor chip to promote measuring accuracy further, improves the class of product, it is adaptable to the product of high request uses.
Wherein, described data-interface being provided with the conversion equipment of I2C interface and SPI interface, described conversion equipment is arranged on described circuit board.
Wherein, described conversion equipment includes data cache module, judge module and channel selecting module, and described data cache module, judge module and channel selecting module are sequentially connected electrically and are arranged on described conversion equipment.
Wherein, described conversion equipment is CPLD, and described data cache module is the data buffer area hewed out inside described CPLD.
Wherein, described asic chip is fixed on described outer enclosure and is internally located at the position of described circuit board, and the outfan of described asic chip electrically connects with the ASIC outfan arranged on circuit board.
Wherein, described asic chip is directly anchored on the upper surface of described circuit board.
Wherein, described MEMS sensor chip is fixed on described outer enclosure and is internally located at the position above described asic chip, and described MEMS sensor chip electrically connects with described asic chip.
Wherein, described MEMS sensor chip is directly anchored on the upper surface of described asic chip.
Wherein, described via is arranged on the housing.
Wherein, described shell adopts metal material to make.
The foregoing is only presently preferred embodiments of the present invention, be not limited to the present invention, all within the spirit and principles in the present invention, any amendment of making, equivalent replacement, improvement etc., all should include within the scope of protection of the invention.
Accompanying drawing explanation
The three-dimensional structure diagram of a kind of baroceptor that Fig. 1 present pre-ferred embodiments provides.
The sectional view of a kind of baroceptor that Fig. 2 provides for the embodiment of the present invention.
Fig. 3 is the part-structure figure of a kind of baroceptor in embodiment of the present invention offer.
Fig. 4 provides the structural representation of housing for the embodiment of the present invention.
Detailed description of the invention
In order to make the purpose of the present invention, technical scheme and advantage clearly understand, below in conjunction with drawings and Examples, the present invention is further elaborated.Should be appreciated that specific embodiment described herein is only in order to explain the present invention, is not intended to limit the present invention.
Refer to Fig. 1-4, a kind of baroceptor provided by the invention, including circuit board 10, MEMS sensor chip 40, asic chip 30 and shell 20, described shell 20 is fixing on the circuit board 10, and the outer enclosure of baroceptor is jointly surrounded with circuit board, wherein, the shape of described shell 20 can be cylinder, cuboid or other are irregularly shaped, in the present embodiment, described shell 20 is cuboid, and seamed edge is equipped with rounding, not only strengthen attractive in appearance, and prevent described shell 20 from suffering external world.
nullRefer to Fig. 1-4，The inside of described shell 20 is cavity body 21，Described circuit board 10 forms an outer enclosure that can place MEMS sensor chip 30 and asic chip 20 with described shell 20，In addition，Described outer enclosure is provided with the via 22 that connection is extraneous，Described MEMS sensor chip 40 is connected with outside air，Described via 22 can be arranged on shell 20，Can also be arranged on circuit board 20，In the present embodiment，Described via 22 is arranged on described shell 20，Described EMS sensor chip 40 and asic chip 30 are arranged on described circuit board 10，After adopting above technical scheme，Both the MEMS sensor chip 40 on described circuit board 10 and asic chip 30 can better have been protected，Do not affect again sensing element and extraneous contact on circuit board 10 simultaneously，Realize its inducing function.
Refer to Fig. 1-4, in the present embodiment, described shell 20 adopts metal material to make, and further enhances the intensity of described shell 20, prevent the MEMS sensor chip 40 on circuit board 10 and asic chip 30 to be subject to external world, improve the aesthetic property of described baroceptor simultaneously.
Refer to Fig. 1-4, in the present embodiment, circuit layout on described circuit board 10 includes ASIC wire of output terminal, ASIC input wire, described asic chip 30 is fixed on described circuit board 10, and make its outfan electrically connect with ASIC wire of output terminal, and input and ASIC input wire are electrically connected, thus described asic chip being connected in the circuit layout of described circuit board 10.
nullRefer to Fig. 1-4，Described asic chip 30 is reverse mounted，So that the outfan of asic chip 30 and input are down，So that the outfan by described asic chip 30 is directly welded on the ASIC wire of output terminal of circuit board 10，And the input of asic chip 30 is directly welded on the ASIC input wire of circuit board 10，Certainly，Plated-through hole can also be set in the inside of described asic chip 30，The outfan of asic chip 30 upper end can be will be located in by this plated-through hole、Input terminal electrode guides to the lower end of asic chip，Adopt in this way，Described asic chip 30 need not be inverted，Namely can directly using the metallization of described asic chip 30 lower end as pad，Circuit layout directly and on circuit board 10 welds together.
Refer to Fig. 1-4, in the present embodiment, described MEMS sensor chip 40 is capacitance pressure transducer, described asic chip 30 mates with described MEMS sensor chip 40, for correspond to sensed by MEMS sensor chip 40 pressure electricity output, so can be more accurate obtain the numerical value that MEMS sensor chip 40 senses.
Refer to Fig. 1-4, described MEMS sensor chip 40 is fixed on outer enclosure and is internally located at the position above asic chip 30, and MEMS sensor chip 40 is least partially overlapped with asic chip 30 projection on circuit boards, in the present embodiment, described MEMS sensor chip 40 be positioned at described asic chip 30 just to position.
nullRefer to Fig. 1-4，Described MEMS sensor chip 40 is electrically connected with ASIC input wire，The signal of telecommunication that described MEMS sensor chip 40 exports is delivered on asic chip 30 by ASIC input wire，Signal of telecommunication MEMS sensor chip 40 exported by asic chip 30 is amplified，So as subsequent treatment，Wherein，Described MEMS sensor chip 40 can be directly anchored to the upper surface of asic chip 30，Can also be fixed on shell 20，In the present embodiment，Described MEMS sensor chip 40 is arranged on the upper surface of asic chip 30，Reduce product size so on the whole，Thus saving the space of outer enclosure，Product be can be made smaller，To meet the miniaturization of present electronic product.
After adopting above technical scheme, not only simplify asic chip 30 in described baroceptor, MEMS sensor chip 40 and the direct connected mode of circuit board 10, make its manufacturing process simple, make efficiency height, production cost is low, and the further certainty of measurement improving described product after adopting MEMS sensor chip 40, improve quality and the class problem of product.
Refer to Fig. 1-4, also include the data-interface (not shown) of compatible I2C and SPI interface, described data-interface can for not only can mate I2C interface but also can mate the single face of SPI interface, it is alternatively the double nip that two interfaces of I2C interface and SPI interface combine, in the present embodiment, described data-interface is the double nip that two interfaces of I2C interface and SPI interface combine, after adopting above technical scheme so that the use scope of described product is more extensive.
Refer to Fig. 1-4, described data-interface is provided with the conversion equipment (not shown) of I2C interface and SPI interface, when described data-interface is connected with the I2C interface of external circuit, described conversion equipment will start I2C control signal, and I2C control signal is delivered to by data-interface the I2C interface of external circuit, when described data-interface is connected with the SPI interface of external circuit, described conversion equipment will start SPI control signal, and I2C control signal is delivered to by data-interface the SPI interface of external circuit, when described data-interface is connected with the SPI interface of external circuit and I2C interface simultaneously, described conversion equipment starts I2C and SPI control signal simultaneously, and I2C and SPI control signal is delivered in external circuit.
Refer to Fig. 1-4, in the present embodiment, described conversion equipment includes data cache module (not shown), judge module (not shown) and channel selecting module (not shown), described conversion equipment is CPLD, and described data cache module is the data buffer area hewed out inside described CPLD.
Refer to Fig. 1-4, when described data cache module is connected with described circuit board 10, after receiving the data that the asic chip 30 on circuit board 10 transmits, described judge module is connected with described data cache module, judge that whether the data that described data cache module receives are complete, and the data in data cache module the need of buffer memory several times and repeatedly send, described channel selecting module is connected with described data cache module, the interface type corresponding passage of selection according to the external circuit that data-interface connects, and the data of described data cache module are sent.
After adopting above technical scheme, described baroceptor according to the situation of actual interface, can select the interface that described baroceptor is corresponding, it is not necessary to any signal adapter, have bigger motility, thus improving the scope of application of product.
The foregoing is only presently preferred embodiments of the present invention, be not limited to the present invention, all within the spirit and principles in the present invention, any amendment of making, equivalent replacement, improvement etc., all should include within the scope of protection of the invention.
Claims (10)
1. a baroceptor, including circuit board, shell, MEMS sensor chip, asic chip and the outer enclosure that is surrounded by circuit board, shell, it is characterized in that: also include the data-interface of compatible I2C and SPI interface, described outer enclosure is provided with and connects extraneous via, described MEMS sensor chip and asic chip are arranged at the inside of outer enclosure, and electrically connect with circuit board, described data-interface is provided with on circuit board.
2. a kind of baroceptor as claimed in claim 1, it is characterised in that: being provided with the conversion equipment of I2C interface and SPI interface on described data-interface, described conversion equipment is arranged on described circuit board.
3. a kind of baroceptor as claimed in claim 2, it is characterized in that: described conversion equipment includes data cache module, judge module and channel selecting module, described data cache module, judge module and channel selecting module are sequentially connected electrically and are arranged on described conversion equipment.
4. a kind of baroceptor as claimed in claim 2, it is characterised in that: described conversion equipment is CPLD, and described data cache module is the data buffer area hewed out inside described CPLD.
5. a kind of baroceptor as claimed in claim 1, it is characterised in that: described asic chip is fixed on described outer enclosure and is internally located at the position of described circuit board, and the outfan of described asic chip electrically connects with the ASIC outfan arranged on circuit board.
6. a kind of baroceptor as claimed in claim 5, it is characterised in that: described asic chip is directly anchored on the upper surface of described circuit board.
7. a kind of baroceptor as claimed in claim 1, it is characterised in that: described MEMS sensor chip is fixed on described outer enclosure and is internally located at the position above described asic chip, and described MEMS sensor chip electrically connects with described asic chip.
8. a kind of baroceptor as claimed in claim 7, it is characterised in that: described MEMS sensor chip is directly anchored on the upper surface of described asic chip.
9. a kind of baroceptor as claimed in claim 1, it is characterised in that: described via is arranged on the housing.
10. a kind of baroceptor as claimed in claim 1, it is characterised in that: described shell adopts metal material to make.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610277897.1A CN105806542A (en) | 2016-04-29 | 2016-04-29 | Air pressure sensor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610277897.1A CN105806542A (en) | 2016-04-29 | 2016-04-29 | Air pressure sensor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105806542A true CN105806542A (en) | 2016-07-27 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610277897.1A Pending CN105806542A (en) | 2016-04-29 | 2016-04-29 | Air pressure sensor |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105806542A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106405035A (en) * | 2016-08-31 | 2017-02-15 | 歌尔股份有限公司 | Automatic oxygen-increasing device and method based on MEMS gas pressure sensor |
| CN108529551A (en) * | 2017-03-02 | 2018-09-14 | 罗伯特·博世有限公司 | Baroceptor and its packaging method |
| CN111343340A (en) * | 2020-03-11 | 2020-06-26 | 杭州十域科技有限公司 | Posture distinguishing method of low-end hardware equipment based on big data |
| CN113218568A (en) * | 2021-05-21 | 2021-08-06 | 深圳市伟烽恒科技有限公司 | Digital pressure sensor with air hole for measuring air pressure height and liquid level depth |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN200986482Y (en) * | 2006-11-28 | 2007-12-05 | 李彩珍 | Air pressure sensor |
| CN202547855U (en) * | 2012-04-10 | 2012-11-21 | 武汉神动汽车电子电器有限公司 | Ceramic thick film resistor oil pressure sensor based on novel connection |
| CN203587270U (en) * | 2013-10-16 | 2014-05-07 | 杭州永富电子仪表有限公司 | Air pressure sensor |
| CN104990565A (en) * | 2015-07-21 | 2015-10-21 | 歌尔声学股份有限公司 | An environment sensor |
| CN105067013A (en) * | 2015-07-21 | 2015-11-18 | 歌尔声学股份有限公司 | Environmental sensor |
| CN205607581U (en) * | 2016-04-29 | 2016-09-28 | 深圳市宇朔晶合微机电技术有限公司 | Atmospheric pressure sensor |
-
2016
- 2016-04-29 CN CN201610277897.1A patent/CN105806542A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN200986482Y (en) * | 2006-11-28 | 2007-12-05 | 李彩珍 | Air pressure sensor |
| CN202547855U (en) * | 2012-04-10 | 2012-11-21 | 武汉神动汽车电子电器有限公司 | Ceramic thick film resistor oil pressure sensor based on novel connection |
| CN203587270U (en) * | 2013-10-16 | 2014-05-07 | 杭州永富电子仪表有限公司 | Air pressure sensor |
| CN104990565A (en) * | 2015-07-21 | 2015-10-21 | 歌尔声学股份有限公司 | An environment sensor |
| CN105067013A (en) * | 2015-07-21 | 2015-11-18 | 歌尔声学股份有限公司 | Environmental sensor |
| CN205607581U (en) * | 2016-04-29 | 2016-09-28 | 深圳市宇朔晶合微机电技术有限公司 | Atmospheric pressure sensor |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106405035A (en) * | 2016-08-31 | 2017-02-15 | 歌尔股份有限公司 | Automatic oxygen-increasing device and method based on MEMS gas pressure sensor |
| CN108529551A (en) * | 2017-03-02 | 2018-09-14 | 罗伯特·博世有限公司 | Baroceptor and its packaging method |
| CN111343340A (en) * | 2020-03-11 | 2020-06-26 | 杭州十域科技有限公司 | Posture distinguishing method of low-end hardware equipment based on big data |
| CN113218568A (en) * | 2021-05-21 | 2021-08-06 | 深圳市伟烽恒科技有限公司 | Digital pressure sensor with air hole for measuring air pressure height and liquid level depth |
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| C10 | Entry into substantive examination | ||
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| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20160727 |
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| RJ01 | Rejection of invention patent application after publication |