CN204881659U - Environmental sensor - Google Patents
Environmental sensor Download PDFInfo
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- CN204881659U CN204881659U CN201520532432.7U CN201520532432U CN204881659U CN 204881659 U CN204881659 U CN 204881659U CN 201520532432 U CN201520532432 U CN 201520532432U CN 204881659 U CN204881659 U CN 204881659U
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- asic
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- outer enclosure
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- circuit board
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- 230000007613 environmental effect Effects 0.000 title claims abstract description 35
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims abstract description 14
- 241000218202 Coptis Species 0.000 claims description 10
- 235000002991 Coptis groenlandica Nutrition 0.000 claims description 10
- 238000001746 injection moulding Methods 0.000 claims description 4
- 238000011161 development Methods 0.000 abstract description 2
- 238000005538 encapsulation Methods 0.000 abstract 6
- 230000005611 electricity Effects 0.000 abstract 2
- 238000009434 installation Methods 0.000 abstract 1
- 238000005516 engineering process Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000004891 communication Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 239000002689 soil Substances 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
Abstract
The utility model relates to an environmental sensor, including being located the inside sensor chip of first outside encapsulation, connect the ASIC chip in the first outside encapsulation outside through planting the tin ball bonding, the input and the first outside encapsulation of ASIC chip are gone up the one end electricity of the ASIC input wire that sets up and are connected, sensor chip's output and the other end electricity of ASIC input wire is connected, the first outside encapsulation outside still is provided with the outside encapsulation of second that is used for encapsulating the ASIC chip. The utility model discloses an environmental sensor divides the ASIC chip to open with sensor chip to set up to can prevent that external foreign matter from getting into, not receive the damage with protection ASIC chip, simultaneously, allow installation ASIC chip, sensor chip in vertical direction, reduced whole environmental sensor's size to can save the space of outside encapsulation, make littleer that the product can do, with the miniaturized development of satisfying modern electronic product.
Description
Technical field
The utility model relates to fields of measurement, more specifically, relates to a kind of sensor, particularly relates to a kind of environmental sensor.
Background technology
What environmental sensor utilized is the related physical effect of sensitive material, as piezoresistive effect, piezoelectric effect etc., sensitive material is after the effect being subject to environmental variance, its resistance or electric capacity change, just can obtain being proportional to the electric signal of environmental variance change by metering circuit, environmental sensor be now widely used in air pressure, highly, the measurement in the field such as humiture, gas and in controlling.
In recent years, along with the development of science and technology, the volume of the electronic product such as mobile phone, notebook computer is in continuous reduction, and the performance requirement of people to these portable electronic products is also more and more higher, and this just requires that the volume of electronic component supporting with it also must along with reduction.
Existing environmental sensor, comprise the encapsulating structure surrounded by circuit board, shell, and be arranged in sensor chip, the asic chip of this encapsulating structure, wherein, sensor chip and asic chip are all fixing on circuit boards, be electrically connected by gold thread between sensor chip and asic chip, be electrically connected by gold thread between asic chip and circuit board.Such connected mode, not only adds production process, nor is beneficial to the miniaturization of environmental sensor.
Utility model content
An object of the present utility model is to provide a kind of environmental sensor.
According to an aspect of the present utility model, provide a kind of environmental sensor, comprise circuit board, the first shell, and the first outer enclosure be surrounded by circuit board, the first shell, described first outer enclosure is also provided with and is communicated with extraneous via; Also comprise and be positioned at inner, the fixing sensor chip on circuit boards of the first outer enclosure, asic chip is connected to by planting tin ball bonding outside described first outer enclosure, the input end of described asic chip is electrically connected with the one end of the ASIC input end wire that the first outer enclosure is arranged, and the other end of the output terminal and described ASIC input end wire that are fixed on the sensor chip of the first outer enclosure inside is electrically connected; The second outer enclosure for encapsulating described asic chip is also provided with outside described first outer enclosure.
Preferably, described asic chip is inverted, and the input end of asic chip is by the ASIC input end wire of planting tin ball and being directly welded in the first outer enclosure.
Preferably, described asic chip is arranged on the top of the first shell, and described ASIC input end wire extends to its sidewall from the top of the first shell, and is connected with the circuit layout on circuit board.
Preferably, described sensor chip is connected with the circuit layout on circuit board by gold thread.
Preferably, described via is arranged on circuit boards.
Preferably, described asic chip arranges side relative with sensor chip on circuit boards, described ASIC input end wire runs through the both sides of circuit board, and wherein, the output terminal of described sensor chip is connected directly between one end ASIC input end wire being positioned at sensor chip side by gold thread; The input end of described asic chip is directly welded on by planting tin ball one end ASIC input end wire being positioned at asic chip side.
Preferably, also comprise ASIC wire of output terminal, one end of described ASIC wire of output terminal is positioned on circuit board, and the other end through the second outer enclosure, and forms pad in the outside of the second outer enclosure; The output terminal of described asic chip is directly welded on the ASIC wire of output terminal that is positioned on circuit board by planting tin ball.
Preferably, described via is arranged on the first shell.
Preferably, described second outer enclosure is surrounded by the second housing be fixed on outside the first outer enclosure.
Preferably, described second outer enclosure is by by asic chip, the injection molding body be encapsulated in outside the first outer enclosure is formed.
Environmental sensor of the present utility model, it is inner that sensor chip is arranged on the first outer enclosure, and asic chip is arranged in the second outer enclosure, because sensor chip needs to be in communication with the outside, asic chip and sensor chip are provided separately, make it possible to seal asic chip completely, thus can prevent extraneous foreign matter from entering, be not damaged to protect asic chip; Simultaneously, because sensor chip and asic chip are provided separately, make it possible in the vertical direction and asic chip, sensor chip are installed, such as sensor chip and asic chip are arranged on the both sides of circuit board, reduce the size of whole environmental sensor, thus the space of outer enclosure can be saved, what product can be done is less, to meet the miniaturization of modern electronic product.
By referring to the detailed description of accompanying drawing to exemplary embodiment of the present utility model, further feature of the present utility model and advantage thereof will become clear.
Accompanying drawing explanation
What form a part for instructions drawings describes embodiment of the present utility model, and together with the description for explaining principle of the present utility model.
Fig. 1 is the structural representation of the utility model environmental sensor.
Fig. 2 is the structural representation of another embodiment of the utility model environmental sensor.
Embodiment
Various exemplary embodiment of the present utility model is described in detail now with reference to accompanying drawing.It should be noted that: unless specifically stated otherwise, otherwise positioned opposite, the numerical expression of the parts of setting forth in these embodiments and step and numerical value do not limit scope of the present utility model.
Illustrative to the description only actually of at least one exemplary embodiment below, never as any restriction to the utility model and application or use.
The technology and equipment known for person of ordinary skill in the relevant may not discuss in detail, but in the appropriate case, described technology and equipment should be regarded as a part for instructions.
In all examples with discussing shown here, any occurrence should be construed as merely exemplary, instead of as restriction.Therefore, other example of exemplary embodiment can have different values.
It should be noted that: represent similar terms in similar label and letter accompanying drawing below, therefore, once be defined in an a certain Xiang Yi accompanying drawing, then do not need to be further discussed it in accompanying drawing subsequently.
With reference to figure 1, the utility model provides a kind of environmental sensor, it can be the sensor for detecting surrounding environment such as pressure transducer, temperature sensor, humidity sensor, it comprises circuit board 1, first shell 2, described first shell 2 is fixing on the circuit card 1, and jointly defines the first outer enclosure 10 of environmental sensor with circuit board 1.Wherein said first shell 2 also can be tabular, now, also need to arrange one independently sidewall portion the first shell 2 is supported on the circuit card 1, with the first outer enclosure 10 of common soil boy structure sensor.The sensor chip 4 of environmental sensor is arranged on the inside of the first outer enclosure 10, and particularly, sensor chip 4 is arranged on the circuit card 1 by means well-known to those skilled in the art.Described first outer enclosure 10 is also provided with and is communicated with extraneous via 12, sensor chip 4 is exposed in extraneous environment.Wherein, via 12 can be arranged on the first shell 2, also can arrange on the circuit card 1.
Environmental sensor of the present utility model, also comprise asic chip 5, this asic chip 5 is welded on outside described first outer enclosure 10 by the mode of planting tin ball 6, wherein, described first outer enclosure 10 is provided with ASIC input end wire 8, be fixed on the asic chip 5 outside the first outer enclosure 10, one end of its input end and ASIC input end wire 8 is electrically connected, the other end of ASIC input end wire 8 is electrically connected with the output terminal of the sensor chip 4 being fixed on the first outer enclosure 10 inside, the electric signal that sensor chip 4 is exported can transfer on asic chip 5 through ASIC input end wire 8, the electric signal that sensor chip 4 is exported amplifies by asic chip 5, so that subsequent treatment.
Wherein, being also provided with the second outer enclosure 3 for encapsulating asic chip 5 in the outside of described first outer enclosure 10, asic chip 5 can being sealed by this second outer enclosure 3.In the embodiment that the utility model one is concrete, described second outer enclosure 3 is surrounded by the second housing be fixed on outside the first outer enclosure 10.In the embodiment that another is concrete, described second outer enclosure 3 is formed by the injection molding body be injection-moulded in outside the first outer enclosure 10, by this injection molding body, asic chip 5 is encapsulated in the outside of the first outer enclosure 10.
Preferably, described asic chip 5 is inverted and is installed, and makes the output terminal on asic chip 5, input end towards the junction to be welded of the first outer enclosure 10, and is directly welded on ASIC input end wire 8 by the input end of asic chip 5 by the mode of planting tin ball 6.Certainly, for a person skilled in the art, also plated-through hole can be set in the inside of asic chip 5, the input terminal electrode being positioned at asic chip 5 upper end can be guided to the lower end of asic chip 5 by this plated-through hole, adopt in this way, make no longer to need asic chip 5 to be inverted, can directly using the plated-through hole of asic chip 5 lower end as pad, directly weld together with the ASIC input end wire 8 in the first outer enclosure 10.
In the embodiment that the utility model one is concrete, with reference to figure 2, described asic chip 5 is arranged on the top of the first shell 2, and described via 12 is arranged on the circuit card 1.One end of described ASIC input end wire 8 is positioned at the top of the first shell 2, and is electrically connected with the input end of asic chip 5, and its other end along the sidewall of the first shell 2 to downward-extension, and couples together with the circuit layout on circuit board 1.
The utility model one preferred embodiment in, described sensor chip 4 is coupled together by gold thread 7 and the circuit layout on circuit board 1, that is, sensor chip 4 is electrically connected with asic chip 5 by the circuit layout on gold thread 7, circuit board 1, ASIC input end wire 8, thus the connected mode simplified between sensor chip 4 and asic chip 5, make its manufacturing process simple, process efficiency is high, and production cost is low.
In another concrete embodiment of the utility model, with reference to figure 1, described asic chip 5 arranges side relative with sensor chip 4 on the circuit card 1, that is, sensor chip 4 is fixed on side circuit board 1 being positioned at the first outer enclosure 10 inside, asic chip 5 is then fixed on side circuit board 1 being positioned at the first outer enclosure 10 outside, and now, described via 12 can be arranged on the first shell 2.Wherein, described ASIC input end wire 8 is positioned on circuit board 1, and runs through the both sides of circuit board 1, and the output terminal of described sensor chip 4 is connected directly between one end ASIC input end wire 8 being positioned at sensor chip 4 side by gold thread 7; The input end of described asic chip 5 is directly welded on by planting tin ball 6 one end ASIC input end wire 8 being positioned at asic chip 5 side.
Environmental sensor of the present utility model, it is inner that sensor chip is arranged on the first outer enclosure, and asic chip is arranged in the second outer enclosure, because sensor chip needs to be in communication with the outside, asic chip and sensor chip are provided separately, make it possible to seal asic chip completely, thus can prevent extraneous foreign matter from entering, be not damaged to protect asic chip; Simultaneously, because sensor chip and asic chip are provided separately, make it possible in the vertical direction and asic chip, sensor chip are installed, such as sensor chip and asic chip are arranged on the both sides of circuit board, reduce the size of whole environmental sensor, thus the space of outer enclosure can be saved, what product can be done is less, to meet the miniaturization of modern electronic product.
As described above, sensor chip 4 is directly fixed on the circuit card 1, and by gold thread 7 directly and ASIC input end wire 8 be electrically connected, at this, sensor chip 4 also can adopt the mounting structure similar with asic chip 5, that is, sensor chip 4 also directly can be welded on by the mode of planting tin ball and be arranged on the ASIC input end wire 8 of circuit board 1, or is directly welded on and is arranged on circuit layout that circuit board 1 is connected with ASIC input end wire 8.
The utility model another preferred embodiment in, also comprise ASIC wire of output terminal 9, with reference to figure 1, one end of described ASIC wire of output terminal 9 is positioned on circuit board 1, and the other end through the second outer enclosure 3, and forms pad 11 outside the second outer enclosure 3; The output terminal of described asic chip 5 is directly welded on is arranged on the ASIC wire of output terminal 9 of circuit board 1 by planting tin ball 6; Adopt in this way, the output terminal of asic chip 5 can be guided in the outboard pad 11 of the second outer enclosure 3, and realize the connection of environmental sensor and external user terminal by pad 11.
Although be described in detail specific embodiments more of the present utility model by example, it should be appreciated by those skilled in the art, above example is only to be described, instead of in order to limit scope of the present utility model.It should be appreciated by those skilled in the art, when not departing from scope and spirit of the present utility model, above embodiment can be modified.Scope of the present utility model is limited by claims.
Claims (10)
1. an environmental sensor, it is characterized in that: comprise circuit board (1), the first shell (2), and the first outer enclosure (10) to be surrounded by circuit board (1), the first shell (2), described first outer enclosure (10) is also provided with and is communicated with extraneous via (12); Also comprise and be positioned at the first outer enclosure (10) inside, the sensor chip (4) be fixed on circuit board (1), asic chip (5) is welded with by planting tin ball (6) in described first outer enclosure (10) outside, the input end of described asic chip (5) is electrically connected with one end of the upper ASIC input end wire (8) arranged of the first outer enclosure (10), and the output terminal of sensor chip (4) and the other end of described ASIC input end wire (8) that are fixed on the first outer enclosure (10) inside are electrically connected; Described first outer enclosure (10) outside is also provided with the second outer enclosure (3) for encapsulating described asic chip (5).
2. environmental sensor according to claim 1, it is characterized in that: described asic chip (5) is inverted, the input end of asic chip (5) is by the ASIC input end wire (8) of planting tin ball (6) and being directly welded in the first outer enclosure (10).
3. environmental sensor according to claim 2, it is characterized in that: described asic chip (5) is arranged on the top of the first shell (2), described ASIC input end wire (8) extends to its sidewall from the top of the first shell (2), and is connected with the circuit layout on circuit board (1).
4. environmental sensor according to claim 3, is characterized in that: described sensor chip (4) is connected with the circuit layout on circuit board (1) by gold thread (7).
5. environmental sensor according to claim 3, is characterized in that: described via (12) is arranged on circuit board (1).
6. environmental sensor according to claim 2, it is characterized in that: described asic chip (5) is arranged on the upper side relative with sensor chip (4) of circuit board (1), described ASIC input end wire (8) runs through the both sides of circuit board (1), wherein, the output terminal of described sensor chip (4) is connected directly between by gold thread (7) one end ASIC input end wire (8) being positioned at sensor chip (4) side; The input end of described asic chip (5) is directly welded on by planting tin ball (6) one end ASIC input end wire (8) being positioned at asic chip (5) side.
7. environmental sensor according to claim 6, it is characterized in that: also comprise ASIC wire of output terminal (9), one end of described ASIC wire of output terminal (9) is positioned on circuit board (1), the other end through the second outer enclosure (3), and forms pad (11) in the outside of the second outer enclosure (3); The output terminal of described asic chip (5) is directly welded on the ASIC wire of output terminal (9) that is positioned on circuit board (1) by planting tin ball (6).
8. environmental sensor according to claim 6, is characterized in that: described via (12) is arranged on the first shell (2).
9. the environmental sensor according to any one of claim 1 to 8, is characterized in that: described second outer enclosure (3) is surrounded by the second housing being fixed on the first outer enclosure (10) outside.
10. the environmental sensor according to any one of claim 1 to 8, is characterized in that: described second outer enclosure (3) is formed by injection molding body asic chip (5) being encapsulated in the first outer enclosure (10) outside.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520532432.7U CN204881659U (en) | 2015-07-21 | 2015-07-21 | Environmental sensor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520532432.7U CN204881659U (en) | 2015-07-21 | 2015-07-21 | Environmental sensor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204881659U true CN204881659U (en) | 2015-12-16 |
Family
ID=54826022
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520532432.7U Active CN204881659U (en) | 2015-07-21 | 2015-07-21 | Environmental sensor |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204881659U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104990566A (en) * | 2015-07-21 | 2015-10-21 | 歌尔声学股份有限公司 | Environmental sensor |
| CN112174084A (en) * | 2020-09-22 | 2021-01-05 | 青岛歌尔智能传感器有限公司 | Combined sensor, electronic equipment and manufacturing method of combined sensor |
-
2015
- 2015-07-21 CN CN201520532432.7U patent/CN204881659U/en active Active
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104990566A (en) * | 2015-07-21 | 2015-10-21 | 歌尔声学股份有限公司 | Environmental sensor |
| CN104990566B (en) * | 2015-07-21 | 2019-04-30 | 歌尔股份有限公司 | A kind of environmental sensor |
| CN112174084A (en) * | 2020-09-22 | 2021-01-05 | 青岛歌尔智能传感器有限公司 | Combined sensor, electronic equipment and manufacturing method of combined sensor |
| CN112174084B (en) * | 2020-09-22 | 2023-09-22 | 青岛歌尔智能传感器有限公司 | Combined sensor, electronic equipment and manufacturing method of combined sensor |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C56 | Change in the name or address of the patentee | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 261031 Dongfang Road, Weifang high tech Development Zone, Shandong, China, No. 268 Patentee after: Goertek Inc. Address before: 261031 Dongfang Road, Weifang high tech Development Zone, Shandong, China, No. 268 Patentee before: Goertek Inc. |
|
| TR01 | Transfer of patent right |
Effective date of registration: 20200616 Address after: 266104 room 103, 396 Songling Road, Laoshan District, Qingdao, Shandong Province Patentee after: Goer Microelectronics Co.,Ltd. Address before: 261031 Dongfang Road, Weifang high tech Development Zone, Shandong, China, No. 268 Patentee before: GOERTEK Inc. |
|
| TR01 | Transfer of patent right |