CN205864743U

CN205864743U - A kind of MEMS microphone and the integrating device of environmental sensor

Info

Publication number: CN205864743U
Application number: CN201620449253.1U
Authority: CN
Inventors: 端木鲁玉
Original assignee: Goertek Inc
Current assignee: Goertek Microelectronics Inc
Priority date: 2016-05-17
Filing date: 2016-05-17
Publication date: 2017-01-04
Anticipated expiration: 2026-05-17

Abstract

This utility model relates to the integrating device of a kind of MEMS microphone and environmental sensor, including substrate, it is provided with MEMS microphone chip on the substrate, and first asic chip corresponding with MEMS microphone chip, it is additionally provided with environmental sensor chip, and second asic chip corresponding with environmental sensor chip on the substrate；Wherein, described MEMS microphone chip is more than 0.3mm to short lines distance d of the second asic chip installation region.Integrating device of the present utility model, MEMS microphone chip, environmental sensor integrated chip are packaged together, and make MEMS microphone chip distance the second asic chip more than 0.3mm, the interference that MEMS microphone chip is brought by the second asic chip can be substantially reduced, improve the accuracy of detection of MEMS microphone.

Description

A kind of MEMS microphone and the integrating device of environmental sensor

Technical field

This utility model relates to sensor field, more particularly, to a kind of MEMS microphone and the collection of environmental sensor Become structure.

Background technology

In recent years, along with the development of science and technology, the volume of the electronic product such as mobile phone, notebook computer is constantly reducing, And people are more and more higher to the performance requirement of these portable electronic products, this just requires matched electronic component Volume also must reduce therewith.

Sensor, as measuring device, has been commonly utilized in the electronics such as mobile phone, notebook computer or wearable device and has produced On product.In existing process structure, environmental sensor and MEMS microphone are encapsulated on pcb board, then carry out DB, WB etc. Series of process.But when microphone chip and other integrated chip are after a chamber, even if by the screen of encapsulating structure shell Covering effect and accomplish the best, microphone chip still can be disturbed by other chips, causes the fall of microphone chip acoustical behavior Low, this is disadvantageous for the development of integrating device.

Utility model content

A purpose of the present utility model there is provided the integrating device of a kind of MEMS microphone and environmental sensor.

According to an aspect of the present utility model, it is provided that a kind of MEMS microphone and the integrating device of environmental sensor, wrap Include substrate, be provided with MEMS microphone chip, and an ASIC core corresponding with MEMS microphone chip on the substrate Sheet, is additionally provided with environmental sensor chip, and second asic chip corresponding with environmental sensor chip on the substrate； Wherein, described MEMS microphone chip is more than 0.3mm to short lines distance d of the second asic chip installation region.

Optionally, described short lines distance d is MEMS microphone chip to the distance of the second asic chip sidewall.

Optionally, described short lines distance d is that MEMS microphone chip connects to the second asic chip lead-in wire with substrate Connect the distance at place.

Optionally, described MEMS microphone chip, the second asic chip be distributed in substrate diagonally opposed on.

Optionally, described MEMS microphone chip, the first asic chip are distributed in the X-direction of substrate, described environment Sensor chip, the second asic chip are distributed in the Y-direction outside neighbouring first asic chip.

Optionally, described MEMS microphone chip, the first asic chip, environmental sensor chip, the second asic chip It is sequentially distributed in the X-direction or Y-direction of substrate.

Optionally, described MEMS microphone chip, the first asic chip, the second asic chip, environmental sensor chip It is sequentially distributed in the X-direction or Y-direction of substrate.

Optionally, described environmental sensor chip is optics, temperature, humidity, pressure or gas sensor chip.

Integrating device of the present utility model, is packaged together MEMS microphone chip, environmental sensor integrated chip, and And make MEMS microphone chip distance the second asic chip more than 0.3mm, the second asic chip can be substantially reduced to MEMS wheat Gram interference that wind chip is brought, improves the accuracy of detection of MEMS microphone.

By detailed description to exemplary embodiment of the present utility model referring to the drawings, of the present utility model other Feature and advantage thereof will be made apparent from.

Accompanying drawing explanation

The accompanying drawing of the part constituting description describes embodiment of the present utility model, and uses together with the description In explaining principle of the present utility model.

Fig. 1 is the schematic diagram of this utility model integrating device.

Fig. 2 is the structural representation of this utility model the first detailed description of the invention of integrating device.

Fig. 3 is the structural representation of this utility model integrating device the second detailed description of the invention.

Fig. 4 is the structural representation of this utility model the third detailed description of the invention of integrating device.

Detailed description of the invention

Various exemplary embodiment of the present utility model is described in detail now with reference to accompanying drawing.It should also be noted that it is unless another Illustrating outward, the parts illustrated the most in these embodiments and positioned opposite, the numerical expression of step and numerical value do not limit Make scope of the present utility model.

Description only actually at least one exemplary embodiment is illustrative below, never as to this practicality Any restriction that is novel and that apply or use.

May be not discussed in detail for technology and equipment known to person of ordinary skill in the relevant, but in suitable situation Under, described technology and equipment should be considered a part for description.

It is shown here that any occurrence should be construed as merely exemplary with in all examples discussed, and not It is as restriction.Therefore, other example of exemplary embodiment can have different values.

It should also be noted that similar label and letter represent similar terms, therefore, the most a certain Xiang Yi in following accompanying drawing Individual accompanying drawing is defined, then need not it is further discussed in accompanying drawing subsequently.

With reference to Fig. 1, Fig. 2, this utility model provides the integrating device of a kind of MEMS microphone and environmental sensor, including Substrate 1, this substrate 1 such as can be provided with the circuit board of circuit layout.Described substrate 1 is provided with MEMS microphone core Sheet the 2, first asic chip 3, environmental sensor chip the 4, second asic chip 5.These chips all can pass through people in the art Means known to Yuan are arranged on substrate 1, for example with the mode of attachment.Electrical connection between each chip and substrate 1 is permissible Use the mode of lead-in wire, it is possible to by the way of planting stannum ball, no longer illustrate at this.Certainly, for those skilled in the art For Yuan, integrating device of the present utility model also includes the housing for encapsulation, after this housing and substrate 1 are fixed together, and shape Become to have the outer enclosure of cavity volume.

First asic chip 3 of the present utility model is for being connected with MEMS microphone chip 2 so that MEMS microphone chip 2 signals of telecommunication sent, after the first asic chip 3 processes, are re-introduced in circuit；Second asic chip 5 is used for and environmentally sensitive Device chip 4 connects so that the signal of telecommunication that environmental sensor chip 4 sends, after the second asic chip 5 processes, is re-introduced to circuit In.Environmental sensor chip 4 of the present utility model can be optics, temperature, humidity, pressure or gas sensor chip, these The structure of environmental sensor and operation principle thereof belong to the common knowledge of those skilled in the art, no longer illustrate at this.

As described above, the second asic chip 5 can connect on substrate 1, by planting stannum ball in the way of stannum ball is planted in employing Mode not only achieve the mechanical connection of the second asic chip 5 and substrate 1, also achieve the second asic chip 5 and substrate 1 Electrical connection.It is, of course, also possible to by the second asic chip 5 by glue material directly against dress on substrate 1, and will by the way of lead-in wire The signal of the second asic chip 5 is incorporated in the circuit of substrate 1.But whether be in the way of planting stannum ball or by lead-in wire Mode, the join domain between the second asic chip 5 and substrate 1 is collectively termed as the installation region a of the second asic chip 5.

Short lines distance d of the installation region a of described MEMS microphone chip 2 to the second asic chip 5 is more than 0.3mm.When the sidewall distance MEMS microphone chip 2 of the second asic chip 5 is nearest, described short lines distance d is The distance of MEMS microphone chip 2 to the second asic chip 5 sidewall.And when the junction of the second asic chip 5 lead-in wire with substrate 1 When distance MEMS microphone chip 2 is nearest, then described short lines distance d is that MEMS microphone chip 2 is to the 2nd ASIC core Sheet 5 lead-in wire and the distance of substrate 1 junction.

In order to realize above-mentioned structure, in one specific embodiment of this utility model, described MEMS microphone core Sheet the 2, second asic chip 5 be distributed in substrate 1 diagonally opposed on, with reference to Fig. 2.MEMS microphone chip 2, environmental sensor core Sheet the 4, second asic chip the 5, first asic chip 3 APPROXIMATE DISTRIBUTION on substrate 1 is at four angles of rectangle, and MEMS microphone core Sheet the 2, second asic chip 5 is distributed in the diagonal direction so that can widen on the substrate 1 that area is less therebetween away from From.

In second specific embodiment of this utility model, described MEMS microphone chip the 2, first asic chip 3 Being distributed in the X-direction of substrate 1, described environmental sensor chip the 4, second asic chip 5 is distributed in neighbouring first asic chip 3 In the Y-direction in outside, with reference to Fig. 3.Can also regard as, MEMS microphone chip the 2, first asic chip 3 is distributed in the horizontal stroke of substrate 1 On direction, and environmental sensor chip the 4, second asic chip 5 is distributed on the longitudinal direction of substrate 1, and neighbouring described the The outside distribution of one asic chip 3.

In the 3rd specific embodiment of this utility model, described MEMS microphone chip the 2, first asic chip 3, Second asic chip 5, environmental sensor chip 4 are sequentially distributed in the X-direction or Y-direction of substrate 1, with reference to Fig. 4.MEMS Mike Wind chip the 2, first asic chip the 3, second asic chip 5, environmental sensor chip 4 are sequentially distributed the same direction at substrate On so that it is spaced the first asic chip 3 between MEMS microphone chip 2 and the second asic chip 5, thus can widen MEMS wheat Distance gram between wind chip 2 and the second asic chip 5.

In the 4th specific embodiment of this utility model, described MEMS microphone chip the 2, first asic chip 3, Environmental sensor chip the 4, second asic chip 5 is sequentially distributed in the X-direction or Y-direction of substrate 1.MEMS microphone chip 2, First asic chip 3, environmental sensor chip the 4, second asic chip 5 are sequentially distributed on the same direction of substrate 1 so that It is spaced the first asic chip 3, environmental sensor chip 4 between MEMS microphone chip 2 and the second asic chip 5, thus may be used Widen the distance between MEMS microphone chip 2 and the second asic chip 5.

Although by example, specific embodiments more of the present utility model have been described in detail, but this area It is to be understood by the skilled artisans that above example is merely to illustrate rather than in order to limit scope of the present utility model.This Field it is to be understood by the skilled artisans that can be in the case of without departing from scope and spirit of the present utility model, to above example Modify.Scope of the present utility model is defined by the following claims.

Claims

1. a MEMS microphone and the integrating device of environmental sensor, it is characterised in that: include substrate (1), at described substrate (1) MEMS microphone chip (2), and first asic chip (3) corresponding with MEMS microphone chip (2) it are provided with on, Environmental sensor chip (4), and twoth ASIC corresponding with environmental sensor chip (4) it is additionally provided with on described substrate (1) Chip (5)；Wherein, described MEMS microphone chip (2) is to short lines distance d of the second asic chip (5) installation region (a) More than 0.3mm.

Integrating device the most according to claim 1, it is characterised in that: described short lines distance d is MEMS microphone core Sheet (2) is to the distance of the second asic chip (5) sidewall.

Integrating device the most according to claim 1, it is characterised in that: described short lines distance d is MEMS microphone core Sheet (2) is to the second asic chip (5) lead-in wire and the distance of substrate (1) junction.

4. according to the integrating device described in any one of claims 1 to 3, it is characterised in that: described MEMS microphone chip (2), Second asic chip (5) be distributed in substrate (1) diagonally opposed on.

5. according to the integrating device described in any one of claims 1 to 3, it is characterised in that: described MEMS microphone chip (2), First asic chip (3) is distributed in the X-direction of substrate (1), described environmental sensor chip (4), the second asic chip (5) point Cloth is in the Y-direction in neighbouring first asic chip (3) outside.

6. according to the integrating device described in any one of claims 1 to 3, it is characterised in that: described MEMS microphone chip (2), First asic chip (3), environmental sensor chip (4), the second asic chip (5) are sequentially distributed at the X-direction of substrate (1) or Y On direction.

7. according to the integrating device described in any one of claims 1 to 3, it is characterised in that: described MEMS microphone chip (2), First asic chip (3), the second asic chip (5), environmental sensor chip (4) are sequentially distributed at the X-direction of substrate (1) or Y On direction.

Integrating device the most according to claim 1, it is characterised in that: described environmental sensor chip (4) is optics, temperature Degree, humidity, pressure or gas sensor chip.