WO2020124630A1

WO2020124630A1 - Combination sensor

Info

Publication number: WO2020124630A1
Application number: PCT/CN2018/123796
Authority: WO
Inventors: 杨军伟; 王德信; 潘新超; 端木鲁玉; 邱文瑞
Original assignee: 歌尔股份有限公司
Priority date: 2018-12-18
Filing date: 2018-12-26
Publication date: 2020-06-25
Also published as: CN209017323U

Abstract

Provided is a combination sensor, comprising: a substrate (1); a first ASIC chip (2) and a second ASIC chip (3) mounted in the substrate (1); a first lead plate (4) and a second lead plate (5) arranged on the substrate (1); a first MEMS chip (6) and a second MEMS chip (7) mounted on the surface of the substrate (1); the first MEMS chip (6) is a capacitive structure; the operating voltage of the second MEMS chip (7) is alternating current voltage; the first MEMS chip (6) is electrically connected to the first ASIC chip (2) by means of the first lead plate (4), and the second MEMS chip (7) is electrically connected to the second ASIC chip (3) by means of the second lead plate (5); the shortest distance between the first MEMS chip (6) and the second lead plate (5) is d1, wherein d1≥0.3 mm; the shortest distance between the first lead plate (4) and the second lead plate (5) is d2, wherein d2≥1.2 mm. The combination sensor has the advantages of reducing the effect of parasitic capacitance, decreasing electromagnetic induction, and reducing the background noise of the first MEMS chip (6).

Description

Combination sensor

Technical field

The utility model relates to the technical field of sensors, in particular to a combined sensor.

Background technique

In the prior art, two MEMS chips and two ASIC chips are packaged to form a combined sensor. Among them, the first MEMS chip is capacitive, the working bias voltage is a DC voltage, and the second MEMS chip working bias voltage is an AC voltage. Since the packaging space is relatively compact and the second ASIC uses alternating current signals, the lead pad area between the first ASIC chip and the second ASIC chip and the lead pad area of the first ASIC chip and the second ASIC chip pass through the first The parasitic capacitance formed by the MEMS chip generates electromagnetic induction, thereby increasing the noise floor of the first MEMS chip when the first MEMS chip and the second MEMS chip work simultaneously, thereby affecting the overall performance of the combined sensor.

Utility model content

The main purpose of the utility model is to propose a combined sensor, which aims to solve the technical problem of large background noise of the MEMS chip.

In order to achieve the above purpose, the utility model discloses a combined sensor, which includes:

A substrate; a first ASIC chip and a second ASIC chip installed in the substrate; a first lead plate and a second lead plate provided on the substrate;

A first MEMS chip and a second MEMS chip mounted on the surface of the substrate, the first MEMS chip is a capacitive structure, the operating voltage of the second MEMS chip is an alternating voltage, and the first MEMS chip passes the A first lead plate is electrically connected to the first ASIC chip, and the second MEMS chip is electrically connected to the second ASIC chip through the second lead plate;

The shortest distance between the first MEMS chip and the second lead plate is d1, d1≥0.3mm, and the shortest distance between the first lead plate and the second lead plate is d2, d2≥1.2mm.

Preferably, the shortest distance connection between the first MEMS chip and the second MEMS chip is a, and the shortest distance connection between the first lead plate and the second lead plate is b, a and b intersect.

Preferably, the first MEMS chip and the second MEMS chip are arranged side by side, and the first lead plate and the second lead plate are distributed on both ends of the same diagonal line of the substrate.

Preferably, the volume of at least one of the first MEMS chip and the second lead plate is smaller than a preset volume, so that the shortest distance d1 of the first MEMS chip and the second lead plate can be increased.

Preferably, the volume of at least one of the first lead plate and the second lead plate is smaller than a preset volume, so that the shortest distance d2 of the first lead plate and the second lead plate can be increased.

Preferably, the volume of at least one of the first MEMS chip and the second lead plate is smaller than a preset volume, so that the shortest distance d1 between the first MEMS chip and the second lead plate can be increased, And the volume of at least one of the first lead plate and the second lead plate is smaller than a preset volume, so that the shortest distance d2 of the first lead plate and the second lead plate can be increased.

Preferably, the shortest distance d1 is formed between the side of the first MEMS chip and the side of the second lead plate; the shortest distance d2 is formed between the side of the first lead plate and the second Between the sides of the lead plate.

Preferably, the first MEMS chip is a microphone chip, and a sound hole is provided at a position of the substrate facing the microphone chip.

Preferably, the combined sensor further includes a cover, the cover is provided on an upper surface of the substrate, the cover and the substrate define a package cavity; the first MEMS chip and the second MEMS The chip is arranged in the packaging cavity.

Preferably, the first lead plate is a first lead pad, and the second lead plate is a second lead pad.

In the above technical solution of the present invention, the first ASIC chip and the second ASIC chip are provided in the substrate, the first lead plate and the second lead plate are provided on the substrate, and the first MEMS chip and the second MEMS chip are mounted on the surface of the substrate , The first MEMS chip is electrically connected to the first ASIC chip through the first lead plate, and the second MEMS chip is electrically connected to the second ASIC chip through the second lead plate; the first The shortest distance between a MEMS chip and the second lead plate is d1, d1 is greater than or equal to 0.3mm, the shortest distance between the first lead plate and the second lead plate is d2, d2 is greater than or equal to 1.2mm, pass Increasing the values of d1 and d2 reduces the parasitic capacitance effect, thereby reducing electromagnetic induction, so that when the combined sensor works, the noise floor of the first MEMS chip is greatly reduced, and the overall performance of the combined sensor is improved.

BRIEF DESCRIPTION

In order to more clearly explain the embodiments of the present invention or the technical solutions in the prior art, the following will briefly introduce the drawings used in the description of the embodiments or the prior art. Obviously, the drawings in the following description Only some embodiments of the present invention, for those of ordinary skill in the art, without paying any creative labor, other drawings can be obtained according to the structures shown in these drawings.

FIG. 1 is a schematic diagram of a combined sensor according to an embodiment of the present invention;

FIG. 2 is another schematic diagram of the combined sensor structure in the embodiment of the utility model.

Description of Drawing Symbols:

标号Label	名称 name	标号Label		名称name
11	基板 Substrate	22	第一ASIC芯片The first ASIC chip
33	第二ASIC芯片 Second ASIC chip	44	第一引线板 First lead plate
55	第二引线板 Second lead plate	66	第一MEMS芯片The first MEMS chip
77	第二MEMS芯片 Second MEMS chip	88	音孔 Sound hole
99	罩壳Cover	A	A

The realization, functional characteristics and advantages of the utility model will be further described in conjunction with the embodiments and with reference to the drawings.

detailed description

The technical solutions in the embodiments of the present invention will be described clearly and completely in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, but not all Examples. Based on the embodiments of the present invention, all other embodiments obtained by a person of ordinary skill in the art without making creative efforts fall within the protection scope of the present invention.

It should be noted that all the directional indicators (such as up, down, left, right, front, back...) in the embodiments of the present invention are only used to explain between the components in a certain posture (as shown in the drawings) If the specific posture changes, the directional indication changes accordingly.

In the present invention, unless otherwise clearly specified and defined, the terms "connection", "fixed", etc. should be understood in a broad sense, for example, "fixed" may be a fixed connection, a detachable connection, or integrated; It can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium. It can be the connection between two elements or the interaction between two elements, unless otherwise clearly defined. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific situations.

In addition, descriptions related to "first", "second", etc. in the present invention are for descriptive purposes only, and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of technical features indicated. Thus, the features defined as "first" and "second" may include at least one of the features explicitly or implicitly. In addition, the technical solutions between the various embodiments can be combined with each other, but it must be based on the ability of ordinary skilled in the art to achieve, when the combination of technical solutions contradicts each other or cannot be achieved, it should be considered that the combination of such technical solutions does not exist , Nor within the scope of protection required by this utility model.

First of all, it should be noted that the MEMS (Micro-Electro-Mechanical System) chip is an independent intelligent system. Its internal structure is generally in the order of micrometers or even nanometers, with small size, light weight, low power consumption, With the characteristics of good durability and stable performance, with the development of small, light and thin electronic devices, MEMS chips are more and more widely used in these devices. ASIC (Application Specific Integrated Circuit) chips are used to process electrical signals, such as amplification. For those skilled in the art, the MEMS chip and the ASIC chip can be mounted on the substrate in a well-known manner.

Referring to FIGS. 1-2, according to a specific embodiment of the present invention, the present invention provides a combined sensor, wherein the combined sensor includes a substrate 1, a first ASIC chip 2 and a second ASIC chip 3 installed in the substrate 1 ; The first lead plate 4 and the second lead plate 5 provided on the substrate 1; the first MEMS chip 6 and the second MEMS chip 7 mounted on the surface of the substrate 1, the first MEMS chip 6 is a capacitive structure, the first MEMS chip The working bias voltage of 6 is a DC voltage, the working voltage of the second MEMS chip 7 is an AC voltage, the first MEMS chip 6 is electrically connected to the first ASIC chip 2 through the first lead plate 4, and the second MEMS chip 7 is passed through the second lead The board 5 is electrically connected to the second ASIC chip 3; the shortest distance between the first MEMS chip 6 and the second lead plate 5 is d1, d1 is greater than or equal to 0.3 mm, and the shortest distance between the first lead plate 4 and the second lead plate 5 is d2, d2 is greater than or equal to 1.2mm.

In the above embodiment of the present invention, the shortest distance between the first MEMS chip 6 and the second lead plate 5 is d1, d1 is greater than or equal to 0.3 mm, and the shortest distance between the first lead plate 4 and the second lead plate 5 is d2, d2 is greater than or equal to 1.2mm, by increasing the values of d1 and d2, the parasitic capacitance effect is reduced, thereby reducing electromagnetic induction, so that when the combined sensor works, the noise floor of the first MEMS chip 6 is greatly reduced, improving the combination The overall performance of the sensor. The above embodiment can be applied to the case where the ASIC chip is provided inside the substrate 1.

In addition, the shortest distance connection between the first MEMS chip 6 and the second MEMS chip 7 is the first shortest distance, denoted as a, and the shortest distance connection between the first lead plate 4 and the second lead plate 5 is the second shortest The distance is denoted as b, and a and b intersect. The intersection here refers to the direct intersection or when a and b are different planes, a and b respectively intersect the orthographic projection on the substrate surface. At this time, the first lead plate 4 and the second lead plate 5 are located on both sides of the connection line between the first MEMS chip 6 and the second MEMS chip 7, respectively, which can maximize the value of d1 and d2 under the premise of increasing Use limited board space.

In addition, the first MEMS chip 6 and the second MEMS chip 7 are arranged side by side, and the first lead plate 4 and the second lead plate 5 are distributed at both ends of the same diagonal line of the substrate 1. In this way, on the premise of ensuring the miniaturization of the product to the greatest extent, it is ensured that d1 and d2 are large enough to reduce the noise floor of the first MEMS chip 6.

Further, the volume of at least one of the first MEMS chip 6 and the second lead plate 5 is smaller than the preset volume, so that the shortest distance d1 of the first MEMS chip 6 and the second lead plate 5 can be increased. The preset volume mentioned here refers to the design volume of the chip or lead plate in the prior art, and the preset volume mentioned later also means the same. This embodiment can achieve the purpose of increasing the shortest distance d1 of the first MEMS chip 6 and the second lead plate 5 by reducing the volume in the first MEMS chip 6 and/or the second lead plate 5 to be smaller than the preset volume To reduce the noise floor of the first MEMS chip 6.

Further, the volume of at least one of the first lead plate 4 and the second lead plate 5 is smaller than the preset volume, so that the shortest distance d2 of the first lead plate 4 and the second lead plate 5 can be increased, which can be reduced by The volume in the first lead plate 4 and/or the second lead plate 5 is to increase the shortest distance d2 of the first lead plate 4 and the second lead plate 5 to reduce the noise floor of the first MEMS chip 6.

Further, the volume of at least one of the first MEMS chip 6 and the second lead plate 5 is smaller than the preset volume, so that the shortest distance d1 of the first MEMS chip 6 and the second lead plate 5 can be increased, and the first lead The volume of at least one of the plate 4 and the second lead plate 5 is smaller than the preset volume, so that the shortest distance d2 of the first lead plate 4 and the second lead plate 5 can be increased. This embodiment can increase the number of the first MEMS chip 6 and/or the second lead plate 5 without rotating the second MEMS chip 7, the second ASIC chip 3 and the second lead plate 5 A shortest distance d1 between a MEMS chip 6 and the second lead plate 5, and/or by reducing the volume of the first lead plate 4 and/or the second lead plate 5, the first lead plate 4 and the second lead plate are increased The shortest distance d2 of 5 to reduce the noise floor of the first MEMS chip 6.

Of course, the shortest distance d1 is formed between the side of the first MEMS chip 6 and the side of the second lead plate 5; the shortest distance d2 is formed between the side of the first lead plate 4 and the side of the second lead plate 5. For example, the side of the first MEMS chip 6 has a connection point, and the side of the second lead plate 5 has a connection point. The connection distance between the connection point of the first MEMS chip 6 and the connection point of the second lead plate 5 is the first The same is true for the shortest distance between the MEMS chip 6 and the second lead plate 5 and the shortest distance d2. Preferably, the first MEMS chip 6, the first lead plate 4, and the second lead plate 5 are all cuboid, and the shortest distance d1 is formed between the side edge of the first MEMS chip 6 and the side edge of the second lead plate 5, the shortest The distance d2 is formed between the side edge of the first lead plate 4 and the side edge of the second lead plate 5. Of course, the first MEMS chip 6, the first lead plate 4, and the second lead plate 5 may also be cubes. Similarly, the shortest distance d1 is formed between the side edge of the first MEMS chip 6 and the side edge of the second lead plate 5. The shortest distance d2 is formed between the side edge of the first lead plate 4 and the side edge of the second lead plate 5.

Of course, the first MEMS chip 6 is a microphone chip, and a sound hole 8 is provided at a position of the substrate 1 facing the microphone chip. The sound hole 8 is a through hole penetrating through the substrate 1, and the microphone chip is directly opposite the sound hole 8 to facilitate acquiring a sound signal.

In addition, the combined sensor further includes a housing 9 provided on the upper surface of the substrate 1. The housing 9 and the substrate 1 define a package cavity; the first MEMS chip 6 and the second MEMS chip 7 are provided in the package cavity. The cover 9 is disposed on the upper surface of the substrate 1, and the two together define a packaging cavity. Specifically, the cover 9 includes a cover plate and a surrounding plate formed at the edge of the cover plate, the cover plate and the surrounding plate may be integrally formed, the surrounding plate surrounds the cover plate to form an open cavity, and the cover 9 is attached through the surrounding plate Onto the substrate 1 to form a closed package cavity. The mounting of the cover 9 and the substrate 1 can be carried out by patch glue or soldered to form a package structure. The packaging structure is used to encapsulate each chip, and each chip is installed on the upper surface of the substrate 1 corresponding to the packaging cavity to avoid interference of external signals. Preferably, the material of the cover 9 is metal, that is, the cover 9 forms an electromagnetic shielding cover, which satisfies the packaging requirements of each chip and protects each chip from the interference of external electromagnetic signals.

In addition, the first lead plate 4 is a first lead pad, and the second lead plate 5 is a second lead pad. Both the first MEMS chip 6 and the first ASIC chip 2 are soldered on the first lead pad, and the second MEMS chip 7 and the second ASIC chip 3 are soldered on the second lead pad.

The above is only the preferred embodiment of the utility model, and does not limit the patent scope of the utility model. Any equivalent structural transformation made by the specification and drawings of the utility model under the concept of the utility model of the utility model, Or directly/indirectly used in other related technical fields are included in the patent protection scope of the utility model.

Claims

A combined sensor, characterized in that it includes:

Substrate

A first ASIC chip and a second ASIC chip installed in the substrate;

A first lead plate and a second lead plate provided on the substrate;

A first MEMS chip and a second MEMS chip mounted on the surface of the substrate, the first MEMS chip is a capacitive structure, the operating voltage of the second MEMS chip is an alternating voltage, and the first MEMS chip passes the A first lead plate is electrically connected to the first ASIC chip, and the second MEMS chip is electrically connected to the second ASIC chip through the second lead plate;

The shortest distance between the first MEMS chip and the second lead plate is d1, d1≥0.3mm, and the shortest distance between the first lead plate and the second lead plate is d2, d2≥1.2mm.
The combination sensor according to claim 1, wherein the shortest distance between the first MEMS chip and the second MEMS chip is a, and the first lead plate and the second lead plate The shortest distance is b, and a and b intersect.
The combination sensor according to claim 2, wherein the first MEMS chip and the second MEMS chip are arranged side by side, and the first lead plate and the second lead plate are distributed on the same substrate Diagonal ends.
The combination sensor according to claim 2, wherein the volume of at least one of the first MEMS chip and the second lead plate is smaller than a preset volume, so that the first MEMS chip and The shortest distance d1 of the second lead plate.
The combination sensor according to claim 2, wherein the volume of at least one of the first lead plate and the second lead plate is smaller than a preset volume, so that the first lead plate and the The shortest distance d2 of the second lead plate.
The combination sensor according to claim 1, wherein at least one of the first MEMS chip and the second lead plate has a volume smaller than a preset volume, so that the first MEMS chip and The shortest distance d1 of the second lead plate, and the volume of at least one of the first lead plate and the second lead plate is smaller than a preset volume, so that the first lead plate and the second lead plate can be increased The shortest distance d2 of the lead plate.
The combination sensor according to claim 1, wherein the shortest distance d1 is formed between the side of the first MEMS chip and the side of the second lead plate; the shortest distance d2 is formed at the Between the side of the first lead plate and the side of the second lead plate.
The combination sensor according to claim 1, wherein the first MEMS chip is a microphone chip, and a sound hole is provided at a position of the substrate facing the microphone chip.
The combination sensor according to claim 1, wherein the combination sensor further comprises a cover, the cover is provided on the upper surface of the substrate, the cover and the substrate define a packaging cavity; The first MEMS chip and the second MEMS chip are provided in the packaging cavity.
The combination sensor according to any one of claims 1-9, wherein the first lead plate is a first lead pad, and the second lead plate is a second lead pad.