CN209017323U - Combination sensor - Google Patents
Combination sensor Download PDFInfo
- Publication number
- CN209017323U CN209017323U CN201822190772.2U CN201822190772U CN209017323U CN 209017323 U CN209017323 U CN 209017323U CN 201822190772 U CN201822190772 U CN 201822190772U CN 209017323 U CN209017323 U CN 209017323U
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- lead plate
- chip
- mems chip
- mems
- substrate
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- 239000000758 substrate Substances 0.000 claims abstract description 38
- 230000005611 electricity Effects 0.000 claims 1
- 230000005674 electromagnetic induction Effects 0.000 abstract description 4
- 230000000694 effects Effects 0.000 abstract description 3
- 230000003071 parasitic effect Effects 0.000 abstract description 3
- 230000003313 weakening effect Effects 0.000 abstract 1
- 239000003990 capacitor Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 235000013399 edible fruits Nutrition 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R19/00—Electrostatic transducers
- H04R19/04—Microphones
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- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Acoustics & Sound (AREA)
- Signal Processing (AREA)
- Pressure Sensors (AREA)
Abstract
The utility model discloses a kind of combination sensors, wherein, combination sensor includes substrate, the first asic chip and the second asic chip being installed in substrate, it is set to the first lead plate and the second lead plate of substrate, it is installed on the first MEMS chip and the second MEMS chip of substrate surface, first MEMS chip is capacitance type structure, the operating voltage of second MEMS chip is alternating voltage, first MEMS chip is electrically connected by first lead plate with the first asic chip, and the second MEMS chip is electrically connected by the second lead plate with the second asic chip；The shortest distance of first MEMS chip and the second lead plate is d1, d1 >=0.3mm, and the shortest distance of first lead plate and the second lead plate is d2, d2 >=1.2mm.The combination sensor has the advantages of capable of weakening parasitic capacitance effect, reducing electromagnetic induction, reduce the background noise of the first MEMS chip.
Description
Technical field
The utility model relates to sensor technical field, in particular to a kind of combination sensor.
Background technique
In the prior art, two MEMS chips and two asic chips encapsulate to form combination sensor.Wherein, the first MEMS
Chip be it is capacitive, working bias voltage is DC voltage, and the working bias voltage of the second MEMS chip is alternating voltage.Due to the encapsulation
Space is more compact and the 2nd ASIC is ac signal, so that the lead of the first asic chip and the second asic chip
It is posted by the formation of the first MEMS chip between the region the Pad and region lead Pad of the first asic chip and the second asic chip
Raw capacitor and produce electromagnetic induction, and then increase the first MEMS chip and the first MEMS when the second MEMS chip works at the same time
The background noise of chip, to affect the overall performance of combination sensor.
Utility model content
The main purpose of the utility model is to propose a kind of combination sensor, it is intended to solve the background noise of MEMS chip compared with
Big technical problem.
To achieve the above object, the utility model discloses a kind of combination sensors, wherein includes:
Substrate；The first asic chip and the second asic chip being installed in the substrate；It is set to the of the substrate
One lead plate and the second lead plate；
It is installed on the first MEMS chip and the second MEMS chip of the substrate surface, first MEMS chip is capacitor
The operating voltage of formula structure, second MEMS chip is alternating voltage, and first MEMS chip passes through the first lead
Plate is electrically connected with first asic chip, and second MEMS chip passes through second lead plate and the 2nd ASIC core
Piece electrical connection；
The shortest distance of first MEMS chip and second lead plate is d1, d1 >=0.3mm, the first lead
The shortest distance of plate and second lead plate is d2, d2 >=1.2mm.
Preferably, the line of the shortest distance of first MEMS chip and second MEMS chip is a, described first
The line of the shortest distance of lead plate and second lead plate is b, and a intersects with b.
Preferably, first MEMS chip and second MEMS chip are arranged side by side, the first lead plate and institute
State same cornerwise both ends that the second lead plate is distributed in the substrate.
Preferably, the volume of at least one of first MEMS chip and described second lead plate is less than default body
Product, to be capable of increasing the shortest distance d1 of first MEMS chip and second lead plate.
Preferably, the volume of at least one of the first lead plate and described second lead plate is less than preset vol,
To be capable of increasing the shortest distance d2 of the first lead plate and second lead plate.
Preferably, the volume of at least one of first MEMS chip and described second lead plate is less than default body
Product, to be capable of increasing the shortest distance d1 of first MEMS chip and second lead plate, and the first lead plate
It is less than preset vol with the volume of at least one of the second lead plate, to be capable of increasing the first lead plate and described second
The shortest distance d2 of lead plate.
Preferably, the shortest distance d1 is formed in the side of first MEMS chip and the side of second lead plate
Between face；The shortest distance d2 is formed between the side of the first lead plate and the side of second lead plate.
Preferably, first MEMS chip is microphone chip, position of the real estate to the microphone chip
It is provided with sound hole.
Preferably, the combination sensor further includes housing, and the housing is set to the upper surface of the substrate, the housing
Package cavity is limited with the substrate；First MEMS chip and second MEMS chip are set in the package cavity.
Preferably, the first lead plate is first lead pad, and second lead plate is the second lead pad.
The first asic chip and the second asic chip, base are provided in the above-mentioned technical proposal of the utility model, in substrate
First lead plate and the second lead plate are provided on plate, the first MEMS chip and the second MEMS chip are mounted on substrate surface, institute
It states the first MEMS chip and is electrically connected by the first lead plate with first asic chip, second MEMS chip passes through
Second lead plate is electrically connected with second asic chip；First MEMS chip and second lead plate it is most short
Distance is d1, and d1 is greater than or equal to 0.3mm, and the shortest distance of the first lead plate and second lead plate is d2, and d2 is big
Weaken parasitic capacitance effect, so that electromagnetic induction is reduced, so that combination by increasing the value of d1 and d2 in or equal to 1.2mm
When working sensor, the background noise sharp fall of the first MEMS chip improves the overall performance of combination sensor.
Detailed description of the invention
In order to illustrate the embodiment of the utility model or the technical proposal in the existing technology more clearly, below will be to embodiment
Or attached drawing needed to be used in the description of the prior art is briefly described, it should be apparent that, the accompanying drawings in the following description is only
It is some embodiments of the utility model, for those of ordinary skill in the art, in the premise not made the creative labor
Under, the structure that can also be shown according to these attached drawings obtains other attached drawings.
Fig. 1 is the schematic diagram of the utility model embodiment combination sensor；
Fig. 2 is another schematic diagram of combination sensor structure in the utility model embodiment.
Drawing reference numeral explanation:
| Label | Title | Label | Title |
| 1 | Substrate | 2 | First asic chip |
| 3 | Second asic chip | 4 | First lead plate |
| 5 | Second lead plate | 6 | First MEMS chip |
| 7 | Second MEMS chip | 8 | Sound hole |
| 9 | Housing |
The embodiments will be further described with reference to the accompanying drawings for the realization, functional characteristics and advantage of the utility model aim.
Specific embodiment
The following will be combined with the drawings in the embodiments of the present invention, carries out the technical scheme in the embodiment of the utility model
Clearly and completely describing, it is clear that described embodiment is only a part of the embodiment of the utility model, rather than all
Embodiment.Based on the embodiments of the present invention, those of ordinary skill in the art are not making creative work premise
Under every other embodiment obtained, fall within the protection scope of the utility model.
It is to be appreciated that the directional instruction (such as up, down, left, right, before and after ...) of institute in the utility model embodiment
It is only used for explaining in relative positional relationship, the motion conditions etc. under a certain particular pose (as shown in the picture) between each component, such as
When the fruit particular pose changes, then directionality instruction also correspondingly changes correspondingly.
In the present invention unless specifically defined or limited otherwise, term " connection ", " fixation " etc. should do broad sense reason
Solution, for example, " fixation " may be a fixed connection, may be a detachable connection, or integral；It can be mechanical connection, it can also
To be electrical connection；It can be directly connected, the connection inside two elements can also be can be indirectly connected through an intermediary
Or the interaction relationship of two elements, unless otherwise restricted clearly.It for the ordinary skill in the art, can be with
The concrete meaning of above-mentioned term in the present invention is understood as the case may be.
In addition, the description for being such as related to " first ", " second " in the present invention is used for description purposes only, and cannot manage
Solution is its relative importance of indication or suggestion or the quantity for implicitly indicating indicated technical characteristic.Define as a result, " the
One ", the feature of " second " can explicitly or implicitly include at least one of the features.In addition, the skill between each embodiment
Art scheme can be combined with each other, but must be based on can be realized by those of ordinary skill in the art, when technical solution
It will be understood that the combination of this technical solution is not present in conjunction with there is conflicting or cannot achieve when, also not in the utility model
It is required that protection scope within.
Firstly, it is necessary to explanation, MEMS (Micro-Electro-Mechanical System, MEMS) core
Piece is an independent intelligence system, and internal structure generally in micron even nanometer scale, has small in size, light-weight, function
The features such as low, durability is good, performance is stablized is consumed, with compact, the lightening development of electronic equipment, MEMS chip is more and more wider
Generally on devices.ASIC (Application Specific Integrated Circuit, integrated circuit) core
Piece is used to handle electric signal, such as amplifies.To those skilled in the art, well known mode can be used by MEMS
On chip and asic chip attachment to substrate.
- Fig. 2 referring to Fig.1, specific embodiment according to the present utility model, the utility model provide a kind of combination sensing
Device, wherein combination sensor includes substrate 1, the first asic chip 2 and the second asic chip 3 being installed in substrate 1；Setting
In the first lead plate 4 and the second lead plate 5 of substrate 1；It is installed on first MEMS chip 6 and the 2nd MEMS core on 1 surface of substrate
Piece 7, the first MEMS chip 6 are capacitance type structure, and the working bias voltage of the first MEMS chip 6 is DC voltage, the second MEMS chip 7
Operating voltage be alternating voltage, the first MEMS chip 6 is electrically connected by first lead plate 4 with the first asic chip 2, second
MEMS chip 7 is electrically connected by the second lead plate 5 with the second asic chip 3；First MEMS chip 6 and the second lead plate 5 are most
Short distance is d1, and d1 is greater than or equal to 0.3mm, and the shortest distance of first lead plate 4 and the second lead plate 5 is d2, d2 be greater than or
Equal to 1.2mm.
In the above embodiments of the present invention, the shortest distance of the first MEMS chip 6 and the second lead plate 5 is d1, d1
More than or equal to 0.3mm, the shortest distance of first lead plate 4 and the second lead plate 5 is d2, and d2 is greater than or equal to 1.2mm, passes through
Increase the value of d1 and d2, weakens parasitic capacitance effect, so that electromagnetic induction is reduced, when so that combination sensor working, first
The background noise sharp fall of MEMS chip 6, improves the overall performance of combination sensor.Above-described embodiment can be suitable for
The situation inside substrate 1 is arranged in asic chip.
In addition, the line of the shortest distance of the first MEMS chip 6 and the second MEMS chip 7 is first shortest distance, it is denoted as
The line of the shortest distance of a, first lead plate 4 and the second lead plate 5 is second shortest distance, is denoted as b, a intersects with b, herein
Intersection refer to and directly intersect or as a and when b antarafacial, a intersects in the orthographic projection of substrate surface respectively with b.At this point, first draws
Line plate 4 and the second lead plate 5 are located at the two sides of 7 line of the first MEMS chip 6 and the second MEMS chip, can increase in this way
Under the premise of the value of d1 and d2, limited substrate space is maximumlly utilized.
In addition, the first MEMS chip 6 and the second MEMS chip 7 are arranged side by side, first lead plate 4 and the second lead plate 5 divide
Cloth is at same cornerwise both ends of substrate 1.Under the premise of capable of guaranteeing product miniaturization to the maximum extent in this way, it is ensured that d1 and d2
It is sufficiently large, to reduce the background noise of the first MEMS chip 6.
Further, the volume of at least one of the first MEMS chip 6 and second lead plate 5 is less than preset vol, with
It is capable of increasing the shortest distance d1 of the first MEMS chip 6 and the second lead plate 5.Preset vol said herein refers in the prior art
Chip or lead plate design volume size, aftermentioned described preset vol also refers to the identical meaning.The embodiment can
Reach increase first to be less than preset vol by the volume in the first MEMS chip 6 of reduction and/or the second lead plate 5
The purpose of the shortest distance d1 of MEMS chip 6 and the second lead plate 5, to reduce the background noise of the first MEMS chip 6.
Further, the volume of at least one of first lead plate 4 and second lead plate 5 is less than preset vol, with energy
Enough increase the shortest distance d2 of first lead plate 4 and the second lead plate 5, can be drawn by reduction first lead plate 4 and/or second
Volume in line plate 5 increases the shortest distance d2 purpose of first lead plate 4 and the second lead plate 5 to reach, to reduce first
The background noise of MEMS chip 6.
Further, the volume of at least one of the first MEMS chip 6 and second lead plate 5 is less than preset vol, with
It is capable of increasing the shortest distance d1 of the first MEMS chip 6 and the second lead plate 5, and in first lead plate 4 and the second lead plate 5
The volume of at least one be less than preset vol, to be capable of increasing the shortest distance d2 of first lead plate 4 and the second lead plate 5.
The embodiment can pass through reduction in the case where not rotating the second MEMS chip 7, the second asic chip 3 and the second lead plate 5
The volume of first MEMS chip 6 and/or the second lead plate 5 increases the shortest distance of the first MEMS chip 6 and the second lead plate 5
D1, and/or the volume by reducing first lead plate 4 and/or the second lead plate 5, Lai Zeng great first lead plate 4 and the second lead
The shortest distance d2 of plate 5, to reduce the background noise of the first MEMS chip 6.
Certainly, shortest distance d1 is formed between the side of the first MEMS chip 6 and the side of the second lead plate 5；It is most short
Distance d2 is formed between the side of first lead plate 4 and the side of the second lead plate 5.For example, the side of the first MEMS chip 6
With a tie point, the side of the second lead plate 5 has a tie point, the tie point of the first MEMS chip 6 and the second lead plate 5
Tie point line distance be the first MEMS chip 6 and the second lead plate 5 the shortest distance, shortest distance d2 is also such.
Preferably, the first MEMS chip 6, first lead plate 4, the second lead plate 5 are cuboid, and shortest distance d1 is formed in first
Between the incline of MEMS chip 6 and the incline of the second lead plate 5, shortest distance d2 is formed in the incline and of first lead plate 4
Between the incline of two lead plates 5.Certainly, the first MEMS chip 6, first lead plate 4, the second lead plate 5 are also possible to square,
Equally, shortest distance d1 is formed between the incline of the first MEMS chip 6 and the incline of the second lead plate 5, shortest distance d2 shape
At between the incline of first lead plate 4 and the incline of the second lead plate 5.
Certainly, the first MEMS chip 6 is microphone chip, and substrate 1 is provided with sound hole 8 in face of the position of microphone chip,
Sound hole 8 is that perforative through-hole, microphone chip face sound hole 8 are convenient for obtaining voice signal on substrate 1.
In addition, combination sensor further includes housing 9, housing 9 is set to the upper surface of substrate 1, and housing 9 is limited with substrate 1
Package cavity；First MEMS chip 6 and the second MEMS chip 7 are set in package cavity.Housing 9 is set to the upper surface of substrate 1, and the two is total
It is same to limit package cavity.Specifically, housing 9 includes cover board and the coaming plate for being formed in side edge thereof position, cover board and coaming plate can
To be integrally formed, coaming plate, which encloses, sets the cavity that cover board forms an opening, and housing 9 is mounted by coaming plate to substrate 1, to be formed
One closed package cavity.Housing 9 and the attachment of substrate 1 can be mounted by Heraeus, or be welded by scolding tin, to be formed
One encapsulating structure.For the encapsulating structure for encapsulating each chip, each chip is mounted on the upper surface of the corresponding substrate 1 of package cavity,
Avoid the interference of outer signals.Preferably, the material of housing 9 is that metal namely housing 9 form an electro-magnetic shielding cover, is met
The package requirements of each chip protect each chip not by the interference of extraneous electromagnetic signals.
In addition, first lead plate 4 is first lead pad, the second lead plate 5 is the second lead pad.First MEMS chip
6 and first asic chip 2 be welded on first lead pad, the second MEMS chip 7 and the second asic chip 3 are welded on
Two draw on pad.
The above is only the preferred embodiment of the present invention, and therefore it does not limit the scope of the patent of the utility model,
Under all utility models in the utility model are conceived, equivalent structure made based on the specification and figures of the utility model
Transformation, or directly/be used in other related technical areas indirectly and be included in the scope of patent protection of the utility model.
Claims (10)
1. a kind of combination sensor characterized by comprising
Substrate；
The first asic chip and the second asic chip being installed in the substrate；
It is set to the first lead plate and the second lead plate of the substrate；
It is installed on the first MEMS chip and the second MEMS chip of the substrate surface, first MEMS chip is condenser type knot
Structure, the operating voltage of second MEMS chip are alternating voltage, first MEMS chip by the first lead plate and
The first asic chip electrical connection, second MEMS chip pass through second lead plate and second asic chip electricity
Connection；
The shortest distance of first MEMS chip and second lead plate be d1, d1 >=0.3mm, the first lead plate and
The shortest distance of second lead plate is d2, d2 >=1.2mm.
2. combination sensor as described in claim 1, which is characterized in that first MEMS chip and the 2nd MEMS core
The line of the shortest distance of piece is a, and the line of the shortest distance of the first lead plate and second lead plate is b, a and b
Intersection.
3. combination sensor as claimed in claim 2, which is characterized in that first MEMS chip and the 2nd MEMS core
Piece is arranged side by side, and the first lead plate and second lead plate are distributed in same cornerwise both ends of the substrate.
4. combination sensor as claimed in claim 2, which is characterized in that first MEMS chip and second lead plate
At least one of volume be less than preset vol, to be capable of increasing first MEMS chip and second lead plate most
Short distance d1.
5. combination sensor as claimed in claim 2, which is characterized in that in the first lead plate and second lead plate
The volume of at least one be less than preset vol, to be capable of increasing the most short distance of the first lead plate and second lead plate
From d2.
6. combination sensor as described in claim 1, which is characterized in that first MEMS chip and second lead plate
At least one of volume be less than preset vol, to be capable of increasing first MEMS chip and second lead plate most
Short distance d1, and the volume of at least one of the first lead plate and second lead plate is less than preset vol, with can
Increase the shortest distance d2 of the first lead plate and second lead plate.
7. combination sensor as described in claim 1, which is characterized in that the shortest distance d1 is formed in the first MEMS
Between the side of chip and the side of second lead plate；The shortest distance d2 is formed in the side of the first lead plate
Between the side of second lead plate.
8. combination sensor as described in claim 1, which is characterized in that first MEMS chip is microphone chip, institute
It states real estate and sound hole is provided with to the position of the microphone chip.
9. combination sensor as described in claim 1, which is characterized in that the combination sensor further includes housing, the cover
Shell is set to the upper surface of the substrate, and the housing and the substrate limit package cavity；First MEMS chip and described
Second MEMS chip is set in the package cavity.
10. combination sensor as claimed in any one of claims 1-9 wherein, which is characterized in that the first lead plate is first
Lead pad, second lead plate are the second lead pad.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2018221278186 | 2018-12-18 | ||
| CN201822127818 | 2018-12-18 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209017323U true CN209017323U (en) | 2019-06-21 |
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ID=66844239
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201822190772.2U Active CN209017323U (en) | 2018-12-18 | 2018-12-21 | Combination sensor |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN209017323U (en) |
| WO (1) | WO2020124630A1 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110783318A (en) * | 2019-10-28 | 2020-02-11 | 歌尔股份有限公司 | Sensor packaging structure and electronic equipment |
| WO2020124630A1 (en) * | 2018-12-18 | 2020-06-25 | 歌尔股份有限公司 | Combination sensor |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN205140944U (en) * | 2015-11-30 | 2016-04-06 | 歌尔声学股份有限公司 | Packaging structure for chip |
| CN205864743U (en) * | 2016-05-17 | 2017-01-04 | 歌尔股份有限公司 | A kind of MEMS microphone and the integrating device of environmental sensor |
| CN206413130U (en) * | 2016-12-27 | 2017-08-15 | 歌尔科技有限公司 | A kind of integrating device of microphone and environmental sensor |
| CN206683673U (en) * | 2017-02-18 | 2017-11-28 | 山东共达电声股份有限公司 | A kind of MEMS sensor integrated morphology |
| WO2018218073A1 (en) * | 2017-05-25 | 2018-11-29 | Knowles Electronics, Llc | Microphone package for fully encapsulated asic and wires |
| CN208094792U (en) * | 2018-04-02 | 2018-11-13 | 歌尔科技有限公司 | Integrated type sensor |
| CN209017323U (en) * | 2018-12-18 | 2019-06-21 | 歌尔科技有限公司 | Combination sensor |
-
2018
- 2018-12-21 CN CN201822190772.2U patent/CN209017323U/en active Active
- 2018-12-26 WO PCT/CN2018/123796 patent/WO2020124630A1/en active Application Filing
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2020124630A1 (en) * | 2018-12-18 | 2020-06-25 | 歌尔股份有限公司 | Combination sensor |
| CN110783318A (en) * | 2019-10-28 | 2020-02-11 | 歌尔股份有限公司 | Sensor packaging structure and electronic equipment |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2020124630A1 (en) | 2020-06-25 |
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Effective date of registration: 20200110 Address after: 266104 room 103, 396 Songling Road, Laoshan District, Qingdao, Shandong Province Patentee after: Goer Microelectronics Co., Ltd Address before: 266104 Laoshan Qingdao District North House Street investment service center room, Room 308, Shandong Patentee before: GEER TECHNOLOGY CO., LTD. |