CN209105453U - MEMS microphone and electronic equipment - Google Patents
MEMS microphone and electronic equipment Download PDFInfo
- Publication number
- CN209105453U CN209105453U CN201920066157.2U CN201920066157U CN209105453U CN 209105453 U CN209105453 U CN 209105453U CN 201920066157 U CN201920066157 U CN 201920066157U CN 209105453 U CN209105453 U CN 209105453U
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- Prior art keywords
- mems microphone
- housing
- mounting groove
- layer
- circuit board
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- 239000010410 layer Substances 0.000 claims description 57
- 239000007769 metal material Substances 0.000 claims description 7
- 239000004033 plastic Substances 0.000 claims description 7
- 239000012790 adhesive layer Substances 0.000 claims description 5
- 239000002131 composite material Substances 0.000 claims description 5
- 210000002421 cell wall Anatomy 0.000 claims description 3
- 230000002093 peripheral effect Effects 0.000 claims description 3
- 238000004026 adhesive bonding Methods 0.000 claims description 2
- 238000000034 method Methods 0.000 abstract description 10
- 230000002950 deficient Effects 0.000 abstract description 7
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 23
- 239000006071 cream Substances 0.000 description 23
- 239000000853 adhesive Substances 0.000 description 18
- 230000001070 adhesive effect Effects 0.000 description 18
- 230000000694 effects Effects 0.000 description 10
- 239000003292 glue Substances 0.000 description 6
- 238000007596 consolidation process Methods 0.000 description 5
- 238000009434 installation Methods 0.000 description 5
- 238000007789 sealing Methods 0.000 description 5
- 239000000463 material Substances 0.000 description 4
- 239000000758 substrate Substances 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 3
- 230000002411 adverse Effects 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 238000003780 insertion Methods 0.000 description 2
- 230000037431 insertion Effects 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 210000004556 brain Anatomy 0.000 description 1
- 238000005253 cladding Methods 0.000 description 1
- 230000009194 climbing Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 235000013399 edible fruits Nutrition 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000005459 micromachining Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Abstract
The utility model discloses a kind of MEMS microphone and the electronic equipment using the MEMS microphone.Wherein, MEMS microphone includes outer enclosure structure and the MEMS chip in the outer enclosure structure, the outer enclosure structure offers the sound hole being passed to for external acoustic waves, the outer enclosure structure includes circuit board and the housing for covering at the circuit board surface, the surface of the circuit board offers mounting groove, along the circuit board circumferentially around setting, the periphery of the housing is fixed in the mounting groove mounting groove.The technical solution of the utility model can reduce MEMS microphone technique and the probability that middle defective products generates is made.
Description
Technical field
The utility model relates to sensor technical field, in particular to a kind of MEMS microphone and apply the MEMS microphone
Electronic equipment.
Background technique
Sensor has been commonly utilized in mobile phone, laptop, tablet computer and wearable device as detection device
Among.In recent years, with the fast development of science and technology, MEMS (MEMS, Micro-Electro-Mechanical
System it) comes into being, MEMS microphone (a kind of to change sound device using the electric energy that micromachining technology is made) is it
One of, have the characteristics that small in size, good frequency response, noise are low.Existing MEMS microphone, housing and circuit board it
Between connection, it is common that the periphery of housing is welded on to the surface of circuit board using tin cream, to form outer enclosure structure, is used
In encapsulation chip assembly.But in the technique of MEMS microphone is made, it is easy to lead to tin cream because local tin cream dosage is excessive
It climbs along encloser inner wall face onto MEMS chip, defective products is caused to generate.
Utility model content
The main purpose of the utility model is to provide a kind of MEMS microphone, it is intended to reduce during MEMS microphone technique is made
The probability that defective products generates.
To achieve the above object, the utility model proposes MEMS microphone include outer enclosure structure and be set to described outer
MEMS chip in portion's encapsulating structure, the outer enclosure structure offer the sound hole being passed to for external acoustic waves, the outside
Encapsulating structure includes circuit board and the housing for covering at the circuit board surface, and the surface of the circuit board offers mounting groove,
Along the circuit board circumferentially around setting, the periphery of the housing is fixed in the mounting groove mounting groove.
In an embodiment of the utility model, glue is equipped between the peripheral edge surface of the housing and the cell wall of the mounting groove
Glutinous layer.
In an embodiment of the utility model, the depth for defining the mounting groove is H, then meets condition: 5 μm≤H≤300
μm。
In an embodiment of the utility model, the width for defining the mounting groove is W, then meets condition: 80 μm≤W≤
300μm。
In an embodiment of the utility model, the inner wall of the housing is equipped with backstop layer, and the periphery of the backstop layer is adjacent
The periphery setting of the nearly housing.
In an embodiment of the utility model, define the backstop layer with a thickness of D, then meet condition: 20 μm≤D≤
300μm。
In an embodiment of the utility model, the periphery of the backstop layer and the periphery of the housing are defined in the circuit
Difference in height on plate thickness direction is M, then meets condition: 20 μm≤M≤300 μm.
In an embodiment of the utility model, adhesive layer is equipped between the housing and the backstop layer.
In an embodiment of the utility model, the backstop layer is metal material layer, plastic layer or composite layer.
The utility model also proposes a kind of electronic equipment, which includes MEMS microphone, the MEMS microphone packet
Outer enclosure structure and the MEMS chip in the outer enclosure structure are included, the outer enclosure structure is offered for outside
The incoming sound hole of sound wave, the outer enclosure structure include circuit board and the housing for covering at the circuit board surface, described
The surface of circuit board offers mounting groove, and the mounting groove is along the circuit board circumferentially around setting, the periphery of the housing
It is fixed in the mounting groove.
The technical solution of the utility model, the surface of circuit board offer the mounting groove along circuit board circumferentially around setting,
At this point, the periphery of housing is fixed in mounting groove.Specifically, the periphery of housing can be consolidated by tin cream, adhesive consolidates or it
His reasonable and effective mode (such as snapping connection the mode sealed plus sealing ring) is fixed in mounting groove.In this way, when after
It is continuous that tin cream can be filled in mounting groove when housing being fixed using tin cream, later by the periphery insertion mounting groove of housing,
And tin cream is heated, after finally waiting the cooling consolidation of tin cream, it can realize being fixedly connected for housing and circuit board.At this point, due to peace
The setting of tankage, can efficiently control the usage amount of the circumferentially upper tin cream of circuit board, the problem for avoiding local tin cream dosage excessive,
To substantially reduce a possibility that tin cream is climbed along encloser inner wall face onto MEMS chip, that is, substantially reduce MEMS microphone work
The probability that middle defective products generates is made in skill.And when using adhesive consolidation or other it is reasonable and effective in the way of (such as buckle company
Connect plus sealing ring sealing mode) housing is fixed when, due to the use instead of tin cream, tin cream edge can be avoided completely
Encloser inner wall face climb the situation onto MEMS chip generation, namely greatly reduce MEMS microphone technique be made in it is bad
The probability that product generate.
Detailed description of the invention
In order to illustrate the embodiment of the utility model or the technical proposal in the existing technology more clearly, below will be to embodiment
Or attached drawing needed to be used in the description of the prior art is briefly described, it should be apparent that, the accompanying drawings in the following description is only
It is some embodiments of the utility model, for those of ordinary skill in the art, in the premise not made the creative labor
Under, the structure that can also be shown according to these attached drawings obtains other attached drawings.
Fig. 1 is the structural schematic diagram of one embodiment of the utility model MEMS microphone.
Drawing reference numeral explanation:
| Label | Title | Label | Title |
| 100 | MEMS microphone | 50 | MEMS chip |
| 10 | Circuit board | 51 | Substrate |
| 11 | Sound hole | 53 | Vibrating diaphragm |
| 13 | Mounting groove | 70 | Asic chip |
| 30 | Housing | 90 | Backstop layer |
| 30a | Installation cavity |
The embodiments will be further described with reference to the accompanying drawings for the realization, functional characteristics and advantage of the utility model aim.
Specific embodiment
The following will be combined with the drawings in the embodiments of the present invention, carries out the technical scheme in the embodiment of the utility model
Clearly and completely describing, it is clear that described embodiment is only a part of the embodiment of the utility model, rather than all
Embodiment.Based on the embodiments of the present invention, those of ordinary skill in the art are not making creative work premise
Under every other embodiment obtained, fall within the protection scope of the utility model.
It is to be appreciated that the directional instruction (such as up, down, left, right, before and after ...) of institute in the utility model embodiment
It is only used for explaining in relative positional relationship, the motion conditions etc. under a certain particular pose (as shown in the picture) between each component, such as
When the fruit particular pose changes, then directionality instruction also correspondingly changes correspondingly.
In addition, the description for being such as related to " first ", " second " in the present invention is used for description purposes only, and cannot manage
Solution is its relative importance of indication or suggestion or the quantity for implicitly indicating indicated technical characteristic.Define as a result, " the
One ", the feature of " second " can explicitly or implicitly include at least one of the features.It is " more in the description of the present invention,
It is a " it is meant that at least two, such as two, three etc., unless otherwise specifically defined.
In the present invention unless specifically defined or limited otherwise, term " connection ", " fixation " etc. should do broad sense reason
Solution, for example, " fixation " may be a fixed connection, may be a detachable connection, or integral；It can be mechanical connection, it can also
To be electrical connection；It can be directly connected, the connection inside two elements can also be can be indirectly connected through an intermediary
Or the interaction relationship of two elements, unless otherwise restricted clearly.It for the ordinary skill in the art, can be with
The concrete meaning of above-mentioned term in the present invention is understood as the case may be.
It in addition, the technical solution between each embodiment of the utility model can be combined with each other, but must be with ability
Based on domain those of ordinary skill can be realized, it will be understood that when the combination of technical solution appearance is conflicting or cannot achieve
The combination of this technical solution is not present, also not within the protection scope of the requires of the utility model.
The utility model proposes a kind of MEMS microphone 100, which can be applied to mobile phone, notebook electricity
Among brain, tablet computer and wearable device, it is intended to reduce by 100 technique of MEMS microphone and the probability that middle defective products generates is made.
The specific structure of the utility model MEMS microphone 100 will be illustrated below, and with 100 water of MEMS microphone
It is introduced for placing flat:
As shown in Figure 1, the MEMS microphone 100 includes outside in 100 1 embodiment of the utility model MEMS microphone
Encapsulating structure and the MEMS chip 50 in the outer enclosure structure, the outer enclosure structure are offered for external acoustic waves
Incoming sound hole 11, the outer enclosure structure include circuit board 10 and the housing 30 for covering at 10 surface of circuit board,
The surface of the circuit board 10 offers mounting groove 13, and the mounting groove 13 is along the circuit board 10 circumferentially around setting, institute
The periphery for stating housing 30 is fixed in the mounting groove 13.
Specifically, circuit board 10 is plate structure, and is horizontally disposed with.Housing 30 is substantially in the bowl structure of back-off, cover
An installation cavity 30a is enclosed set on a surface of circuit board 10, and with circuit board 10.Installation cavity 30a can be used for encapsulating core
Piece component.Generally, housing 30 is metal material, can play the role of electromagnetic shielding, ensures the work of its internal chip assembly
Make performance is not influenced by the external world.
Chip assembly includes MEMS chip 50 and asic chip 70, and MEMS chip 50 and asic chip 70 can pass through gluing
The surface of circuit board 10 being located in housing 30 is fixed in agent.Also, it can be by leading between MEMS chip 50 and asic chip 70
Line (bonding wire) is electrically connected, and can also be electrically connected by conducting wire (bonding wire) between asic chip 70 and circuit board 10.
MEMS chip 50 includes substrate 51 and vibrating diaphragm 53, and substrate 51 is substantially in the tubular structure of both ends open, and axis hangs down
The surface setting of straight circuit board 10, the table of circuit board 10 can be fixed on towards one end (lower end) of circuit board 10 by adhesive
Face is provided with vibrating diaphragm 53 in one end (upper end) of circuit board 10.At this point, circuit board 10 offers inside connection substrate 51
The sound hole 11 in space realizes acquisition of the MEMS chip 50 to information of acoustic wave for importing sound wave.
Further, the surface of circuit board 10 offers the mounting groove 13 along circuit board 10 circumferentially around setting, at this point, cover
The periphery of shell 30 is fixed in mounting groove 13.Specifically, the periphery of housing 30 can be consolidated by tin cream, adhesive consolidates or it
His reasonable and effective mode (such as snapping connection the mode sealed plus sealing ring) is fixed in mounting groove 13.In this way, working as
When continuing with tin cream housing 30 being fixed, tin cream can be filled in mounting groove 13, be later inserted into the periphery of housing 30
In mounting groove 13, and tin cream is heated, after finally waiting the cooling consolidation of tin cream, can realize that housing 30 and the fixed of circuit board 10 connect
It connects.At this point, can efficiently control the usage amount of the circumferential upper tin cream of circuit board 10 due to the setting of mounting groove 13, avoid part
The excessive problem of tin cream dosage is climbed along 30 inner wall of housing to the possibility on MEMS chip 50 to substantially reduce tin cream
Property, that is, it substantially reduces 100 technique of MEMS microphone and the probability that middle defective products generates is made.And when using adhesive consolidation or other
When housing 30 is fixed in reasonable and effective mode (such as snapping connection the mode sealed plus sealing ring), due to replacing
The use of tin cream can avoid tin cream to climb along housing 30 inner wall to the situation on MEMS chip 50 completely and occur, namely
It greatly reduces 100 technique of MEMS microphone and the probability that middle defective products generates is made.
As shown in Figure 1, in 100 1 embodiment of the utility model MEMS microphone, the peripheral edge surface of the housing 30 with
Adhesive layer is equipped between the cell wall of the mounting groove 13.Specifically, when housing 30 is fixed using adhesive, can pacify
Adhesive is filled in tankage 13, and the periphery of housing 30 is inserted into mounting groove 13 later, after finally waiting adhesive consolidation,
Realization housing 30 is fixedly connected with circuit board 10.Epoxide-resin glue etc. can be selected in adhesive.
In this way, it is simpler, more convenient, more efficient to may make the fixation procedure of housing 30, and make housing 30
Stability, reliability are higher.
Further, the depth for defining the mounting groove 13 is H, then meets condition: 5 μm≤H≤300 μm.In this way, control
The depth H of mounting groove 13 is in the range of being not less than 5 μm and being not higher than 300 μm.When the depth H of mounting groove 13 is less than 5 μm,
Then the depth H of mounting groove 13 is too small, and the dosage of fillable adhesive is very few, and the fixed effect that will lead to housing 30 is deteriorated, and leads
Bad stability, the reliability of MEMS microphone 100 of housing 30 is caused to substantially reduce.When the depth H of mounting groove 13 is greater than 300 μm
When, then the depth H of mounting groove 13 is excessive, and the thickness that will lead to the corresponding position of circuit board 10 is excessively thin, intensity is too low, variable
Shape causes the fixed effect of housing 30 to be deteriorated, and the reliability of the bad stability, MEMS microphone 100 that lead to housing 30 is significantly
It reduces；Also, the depth H of mounting groove 13 is excessive, and the spill-out that also will lead to adhesive is excessive, leads to MEMS microphone 100
Cavity volume is carried on the back to reduce excessively, to cause adverse effect to the acoustical behavior of MEMS microphone 100.
Further, the width for defining the mounting groove 13 is W, then meets condition: 80 μm≤W≤300 μm.In this way, control
The width W of mounting groove 13 processed is in the range of being not less than 80 μm and being not higher than 300 μm.When the width W of mounting groove 13 is lower than 80 μm
When, then the width W of mounting groove 13 is narrow, the installation of insertion and housing 30 not only bad for 30 periphery of housing, and adhesive
The package effect of 30 periphery of housing will be also greatly reduced, lead to that the fixed effect of housing 30 substantially reduces, stability drops significantly
It is low, so that the reliability of MEMS microphone 100 be caused to substantially reduce.When the width W of mounting groove 13 is higher than 300 μm, then install
The width W of slot 13 is wide, miniaturization, micromation not only bad for MEMS microphone 100, and the dosage of adhesive will be bad
Control, causes fixed effect to substantially reduce, stability substantially reduces, so that the reliability of MEMS microphone 100 be caused to drop significantly
It is low；Meanwhile adhesive overflow is also added to intracavitary possibility is carried on the back, to cause not to the acoustical behavior of MEMS microphone 100
Good influence.
As shown in Figure 1, the inner wall of the housing 30 is equipped in 100 1 embodiment of the utility model MEMS microphone
The periphery of backstop layer 90, the backstop layer 90 is arranged adjacent to the periphery of the housing 30.
In the present embodiment, housing 30 includes roof and encloses the side wall set on roof surrounding, and the lower end of side wall is inserted in installation
In slot 13, and it is glued agent and is fixed in mounting groove 13.Correspondingly, backstop layer 90 also includes roof and encloses set on roof surrounding
Side wall, the roof of backstop layer 90 are bonded setting with the roof of housing 30, and the side wall of backstop layer 90 is bonded with the side wall of housing 30 to be set
It sets.Also, the side wall lower ends of backstop layer 90 are arranged adjacent to the side wall lower ends of housing 30.In this way, using the periphery of backstop layer 90,
In 30 inner wall of housing close to the anti-creep plastic structure of one annular of formation at the position of 30 periphery of housing, to effectively prevent adhesive
It climbs along 30 inner wall of housing, avoids adhesive from climbing and 50 performance of MEMS chip is adversely affected, and then greatly mention
Rise the reliability of MEMS microphone 100.
As shown in Figure 1, defining the thickness of the backstop layer 90 in 100 1 embodiment of the utility model MEMS microphone
For D, then meet condition: 20 μm≤D≤300 μm.In this way, the thickness D of control backstop layer 90 is being not less than 20 μm and is being not higher than
In the range of 300 μm.When the thickness D of backstop layer 90 is lower than 20 μm, then the thickness D of backstop layer 90 is excessively thin, the effect of anti-creep glue
It is poor.When the thickness D of backstop layer 90 is higher than 300 μm, then the thickness D of backstop layer 90 is blocked up, will lead to MEMS microphone 100
The volume of back chamber substantially reduces, and not only influences the acoustical behavior of MEMS microphone 100, but also also affects the envelope of chip assembly
Dress causes assembly inconvenient.
As shown in Figure 1, defining the periphery of the backstop layer 90 in 100 1 embodiment of the utility model MEMS microphone
It is M with the difference in height of the periphery of the housing 30 on 10 thickness direction of circuit board, then meets condition: 20 μm≤M≤300
μm.In this way, difference in height M of the periphery of periphery and the housing 30 of control backstop layer 90 on 10 thickness direction of circuit board is being not less than
20 μm and not higher than in the range of 300 μm.When difference in height M is lower than 20 μm, then difference in height M is too small, the periphery mistake of backstop layer 90
In close to housing 30 periphery, get too close to adhesive, anti-creep glue effect is poor.When difference in height M is higher than 300 μm, then difference in height M
It is excessive, the periphery of backstop layer 90 too far away from the periphery of housing 30, too far away from adhesive, anti-creep glue effect is poor.
In 100 1 embodiment of the utility model MEMS microphone, it is equipped between the housing 30 and the backstop layer 90
Adhesive layer.In this way, it is simpler, more convenient, more efficient to may make the fixation procedure of backstop layer 90, and make backstop layer 90
Stability, reliability it is higher.Specifically, epoxide-resin glue can be selected in adhesive layer.
In 100 1 embodiment of the utility model MEMS microphone, the backstop layer 90 be metal material layer, plastic layer or
Composite layer.It should be understood that composite layer is either double-layer structure, is also possible to three layers or three layers or more structures.
Composite layer can be compounded to form by metal material layer and plastic layer, can also be by metal material layer and other materials complex
At, it can also be compounded to form by plastic layer and other materials, it can also be by metal material layer, plastic layer and other Material cladding shapes
At.
The technical effect of the utility model can be achieved in the backstop layer 90 of various material, and processing, molding, manufacture are more clever
Living, effective, practicability, reliability are higher.
The utility model also proposes a kind of electronic equipment, which includes foregoing MEMS microphone 100, should
The specific structure of MEMS microphone 100 is with reference to the foregoing embodiments.Since this electronic equipment uses the complete of aforementioned all embodiments
Portion's technical solution, therefore at least all beneficial effects brought by whole technical solutions with aforementioned all embodiments, herein
No longer repeat one by one.
It should be understood that electronic equipment can be mobile phone, laptop, tablet computer, wearable device etc..
The above is only the preferred embodiment of the present invention, and therefore it does not limit the scope of the patent of the utility model,
It is all under the inventive concept of the utility model, equivalent structure made based on the specification and figures of the utility model becomes
It changes, or directly/be used in other related technical areas indirectly and be included in the scope of patent protection of the utility model.
Claims (10)
1. a kind of MEMS microphone, the MEMS chip including outer enclosure structure and in the outer enclosure structure is described
Outer enclosure structure offers the sound hole being passed to for external acoustic waves, which is characterized in that the outer enclosure structure includes circuit
Plate and the housing for covering at the circuit board surface, the surface of the circuit board offer mounting groove, and the mounting groove is described in
Circuit board circumferentially around setting, the periphery of the housing is fixed in the mounting groove.
2. MEMS microphone as described in claim 1, which is characterized in that the peripheral edge surface of the housing and the mounting groove
Adhesive layer is equipped between cell wall.
3. MEMS microphone as claimed in claim 2, which is characterized in that the depth for defining the mounting groove is H, then meets item
Part: 5 μm≤H≤300 μm.
4. MEMS microphone as claimed in claim 2, which is characterized in that the width for defining the mounting groove is W, then meets item
Part: 80 μm≤W≤300 μm.
5. MEMS microphone according to any one of claims 1 to 4, which is characterized in that the inner wall of the housing is equipped with
The periphery of backstop layer, the backstop layer is arranged adjacent to the periphery of the housing.
6. MEMS microphone as claimed in claim 5, which is characterized in that define the backstop layer with a thickness of D, then meet item
Part: 20 μm≤D≤300 μm.
7. MEMS microphone as claimed in claim 5, which is characterized in that define the periphery and the housing of the backstop layer
Difference in height of the periphery on the circuit plate thickness direction is M, then meets condition: 20 μm≤M < 300 μm.
8. MEMS microphone as claimed in claim 5, which is characterized in that be equipped with gluing between the housing and the backstop layer
Layer.
9. MEMS microphone as claimed in claim 5, which is characterized in that the backstop layer be metal material layer, plastic layer or
Composite layer.
10. a kind of electronic equipment, which is characterized in that including MEMS microphone as claimed in any one of claims 1-9 wherein.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920066157.2U CN209105453U (en) | 2019-01-15 | 2019-01-15 | MEMS microphone and electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920066157.2U CN209105453U (en) | 2019-01-15 | 2019-01-15 | MEMS microphone and electronic equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209105453U true CN209105453U (en) | 2019-07-12 |
Family
ID=67164066
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201920066157.2U Active CN209105453U (en) | 2019-01-15 | 2019-01-15 | MEMS microphone and electronic equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN209105453U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110784814A (en) * | 2019-10-30 | 2020-02-11 | 歌尔股份有限公司 | Microphone and electronic equipment |
| CN112839275A (en) * | 2020-12-30 | 2021-05-25 | 神思电子技术股份有限公司 | Pickup device of self-service equipment and design method |
| CN113573220A (en) * | 2021-07-28 | 2021-10-29 | 杭州安普鲁薄膜科技有限公司 | MEMS composite part with dustproof and sound-transmitting membrane component |
-
2019
- 2019-01-15 CN CN201920066157.2U patent/CN209105453U/en active Active
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110784814A (en) * | 2019-10-30 | 2020-02-11 | 歌尔股份有限公司 | Microphone and electronic equipment |
| CN112839275A (en) * | 2020-12-30 | 2021-05-25 | 神思电子技术股份有限公司 | Pickup device of self-service equipment and design method |
| CN113573220A (en) * | 2021-07-28 | 2021-10-29 | 杭州安普鲁薄膜科技有限公司 | MEMS composite part with dustproof and sound-transmitting membrane component |
| CN113573220B (en) * | 2021-07-28 | 2023-01-03 | 杭州安普鲁薄膜科技有限公司 | MEMS composite part with dustproof and sound-transmitting membrane component |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20200611 Address after: 266104 room 103, 396 Songling Road, Laoshan District, Qingdao, Shandong Province Patentee after: Goer Microelectronics Co.,Ltd. Address before: 266104 Laoshan Qingdao District North House Street investment service center room, Room 308, Shandong Patentee before: GOERTEK TECHNOLOGY Co.,Ltd. |
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| TR01 | Transfer of patent right |