CN110784814A - Microphone and electronic equipment - Google Patents
Microphone and electronic equipment Download PDFInfo
- Publication number
- CN110784814A CN110784814A CN201911046287.0A CN201911046287A CN110784814A CN 110784814 A CN110784814 A CN 110784814A CN 201911046287 A CN201911046287 A CN 201911046287A CN 110784814 A CN110784814 A CN 110784814A
- Authority
- CN
- China
- Prior art keywords
- substrate
- microphone
- side wall
- annular groove
- capacitive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R19/00—Electrostatic transducers
- H04R19/04—Microphones
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Acoustics & Sound (AREA)
- Signal Processing (AREA)
- Details Of Audible-Bandwidth Transducers (AREA)
- Electrostatic, Electromagnetic, Magneto- Strictive, And Variable-Resistance Transducers (AREA)
Abstract
The invention discloses a microphone and electronic equipment, wherein the microphone comprises a substrate, a shell, a capacitive sound-electricity conversion part and a signal processing element, wherein the shell is fixedly connected with the substrate, and the shell and the substrate form an accommodating cavity; the shell is provided with a bottom surface and a side wall which extends around the bottom surface, and the side wall is fixedly connected with the substrate; the outer side edge of the base plate extends to the outer side of the outer surface of the side wall so as to form a first annular groove at the position where the inner surface of the base plate corresponds to the outer surface of the side wall; a second annular groove is formed in the inner surface of the substrate at a position corresponding to the inner surface of the side wall, and a connecting agent for connecting the side wall and the substrate is filled in the first annular groove and the second annular groove; the capacitance type sound-electricity conversion component is arranged in the accommodating cavity; the signal processing element is also arranged in the accommodating cavity and is electrically connected with the capacitive sound-electricity conversion component; the substrate is provided with a sound hole at a position corresponding to the capacitive sound-electricity conversion component.
Description
Technical Field
The invention relates to the technical field of electroacoustic conversion, in particular to a microphone and electronic equipment.
Background
Acoustic devices are used in many electronic devices to convert electrical energy into acoustic energy. The microphone is a very common acoustic device in daily life and production, and is widely applied to mobile phones, computers and other electronic devices.
The MEMS (micro electro mechanical system) microphone is a microphone manufactured based on the MEMS technology, and has the characteristics of small volume, good frequency response characteristics, low noise, and the like. MEMS (micro-electro-mechanical system) is a miniaturized mechanical and electro-mechanical component that in its most general form can be defined as being fabricated using micro-fabrication. The MEMS microphone unit can be first manufactured and then encapsulated in a microelectromechanical microphone device on a substrate. Microelectromechanical microphone devices can also be incorporated into electronic devices such as cell phones, tablet computers, laptops, VRs, etc., and are used in a wide variety of applications.
With the rapid development of electronic products, people have higher and higher requirements on the performance of acoustic devices matched with the electronic products; moreover, because the microphone may be applied in various environments, it is necessary to improve the packaging form of the existing microphone, so that the microphone is more robust and firm, the anti-interference capability and the service life of the microphone are improved, and the quality of electronic products is further ensured.
Disclosure of Invention
The invention aims to provide a new technical scheme of a microphone and electronic equipment.
According to a first aspect of the present invention, there is provided a microphone comprising:
a substrate;
the shell is fixedly connected with the substrate, and the shell and the substrate form an accommodating cavity; the shell is provided with a bottom surface and a side wall which extends around the bottom surface, and the side wall is fixedly connected with the substrate; the outer side edge of the base plate extends to the outer side of the outer surface of the side wall to form a first annular groove at a position where the inner surface of the base plate corresponds to the outer surface of the side wall; a second annular groove is formed in the inner surface of the substrate at a position corresponding to the inner surface of the side wall, and a connecting agent for connecting the side wall and the substrate is filled in the first annular groove and the second annular groove;
the capacitive sound-electricity conversion component is arranged in the accommodating cavity;
the signal processing element is also arranged in the accommodating cavity and is electrically connected with the capacitive sound-electricity conversion component;
and the substrate is provided with a sound hole at a position corresponding to the capacitive sound-electricity conversion component.
Optionally, the substrate is a PCB with a laminated structure, and the substrate is sequentially provided with a first PCB copper cladding layer, a PCB substrate layer and a second PCB copper cladding layer from the inner side of the accommodating cavity to the outer side.
Optionally, the first annular groove and the second annular groove extend from the surface of the first PCB copper cladding layer inwards to the surface of the PCB substrate layer.
Optionally, the capacitive acoustic-electric conversion component and the signal processing element are disposed on a substrate.
Optionally, the side wall and the substrate are connected by welding, and the connecting agent is solder.
Optionally, the capacitive acoustic-electric conversion component and the signal processing element are disposed on a substrate; and solder masks are arranged between the capacitive acoustic-electric conversion component and the substrate and between the signal processing element and the substrate.
Optionally, the outer surface of the substrate is provided with at least one pad.
Optionally, the housing is a metal housing.
Optionally, the capacitive acoustic-electric conversion component is a MEMS chip, and the signal processing element is an ASIC chip.
According to another aspect of the present invention, there is provided an electronic device comprising the microphone as described above.
According to the microphone provided by the invention, the first annular groove and the second annular groove which are specially used for filling the connecting agent are respectively arranged at the positions corresponding to the inner surface of the substrate and the outer side and the inner side of the side wall, so that when the substrate and the shell are connected through the connecting agent, the connecting agent is connected between the inner surface of the substrate and the bottom surface of the side wall, and is connected between the side surface of the substrate and the outer side and the inner side of the side wall, the connection effect is more stable, the peeling force of the shell is greatly improved, and the shell and the substrate are not easy to separate when the microphone is impacted by external force. In addition, the connecting agent is filled in the first annular groove and the second annular groove, so that other components of the microphone are not easy to overflow and pollute. When the lateral wall of base plate and shell passes through welded connection, this technological effect is more outstanding, and the phenomenon that tin was climbed to soldering tin can also effectively be inhibited in the setting of first ring channel and second ring channel.
Other features of the present invention and advantages thereof will become apparent from the following detailed description of exemplary embodiments thereof, which proceeds with reference to the accompanying drawings.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description, serve to explain the principles of the invention.
FIG. 1 is a schematic cross-sectional view of a microphone according to the present invention;
fig. 2 is an enlarged schematic view of a structure labeled a in fig. 1.
Detailed Description
Various exemplary embodiments of the present invention will now be described in detail with reference to the accompanying drawings. It should be noted that: the relative arrangement of the components and steps, the numerical expressions and numerical values set forth in these embodiments do not limit the scope of the present invention unless specifically stated otherwise.
The following description of at least one exemplary embodiment is merely illustrative in nature and is in no way intended to limit the invention, its application, or uses.
Techniques, methods, and apparatus known to those of ordinary skill in the relevant art may not be discussed in detail but are intended to be part of the specification where appropriate.
In all examples shown and discussed herein, any particular value should be construed as merely illustrative, and not limiting. Thus, other examples of the exemplary embodiments may have different values.
It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, further discussion thereof is not required in subsequent figures.
Referring to fig. 1-2, a microphone is provided according to one embodiment of the present invention. The microphone comprises a substrate 1, a shell 2, a capacitance type sound-electricity conversion part 3 and a signal processing element 4; the shell 2 is fixedly connected with the substrate 1, and the shell 2 and the substrate 1 form an accommodating cavity; the housing 2 has a bottom 21 and a sidewall 22 extending around the bottom 21, and the sidewall 22 is fixedly connected to the substrate 1; the outer side edge 11 of the base plate 1 extends to the outside of the outer surface of the side wall 22 to form a first annular groove 5 at a position where the inner surface of the base plate 1 corresponds to the outer surface of the side wall 22; a second annular groove 6 is formed in the inner surface of the substrate 1 at a position corresponding to the inner surface of the side wall 22, and a connecting agent for connecting the side wall 22 and the substrate 1 is filled in the first annular groove 5 and the second annular groove 6; the capacitance type sound-electricity conversion component 3 is arranged in the accommodating cavity; the signal processing element 4 is also arranged in the accommodating cavity and is electrically connected with the capacitance type sound-electricity conversion part 3; the substrate 1 is provided with a sound hole 7 at a position corresponding to the capacitive sound-electricity conversion component 3.
In the prior art, when the substrate 1 is connected with the housing 2, the outer side edge 11 of the substrate 1 is flush with the outer surface of the side wall 22, i.e. the first annular groove 5 is not provided; and the second annular groove 6 is not opened in the inner surface of the base plate 1. When the substrate 1 and the housing 2 are connected by the connecting agent, the connecting agent can only be connected between the inner surface of the substrate 1 and the bottom surface of the side wall 22, which is poor in connection effect, and the substrate 1 and the housing 2 are easy to be separated when being impacted by external force. And because the position for filling the connecting agent is not arranged, if the using amount of the connecting agent is slightly excessive, the phenomenon of overflow occurs, so that the risk of polluting other components in the microphone and further influencing the acoustic performance of the microphone exists. In the embodiment of the invention, because the first annular groove 5 and the second annular groove 6 which are specially used for filling the connecting agent are respectively arranged on the inner surface of the substrate 1 and at the positions corresponding to the outer side and the inner side of the side wall 22, when the substrate 1 and the shell 2 are connected through the connecting agent, the connecting agent is connected between the inner surface of the substrate 1 and the bottom surface of the side wall 22, and is connected between the side surface of the substrate 1 and the outer side and the inner side of the side wall 22, so that the connecting effect is firmer, the peeling force of the shell is greatly improved, and the shell 2 and the substrate 1 are not easy to separate when the microphone is impacted by external force. In addition, the connecting agent is filled in the first annular groove 5 and the second annular groove 6, so that other components of the microphone are not easy to overflow and pollute.
In one embodiment, the substrate 1 is a circuit board, specifically, for example, the substrate 1 is a PCB board with a laminated structure, and the substrate 1 is sequentially provided with a first PCB copper cladding layer 12, a PCB substrate layer 13 and a second PCB copper cladding layer 14 from the inner side of the accommodating cavity to the outer side. Of course, the substrate 1 may also be a PCB of other structure according to specific needs.
In one embodiment, when the substrate 1 is a PCB board having a laminated structure of a first PCB copper clad layer 12, a PCB substrate layer 13 and a second PCB copper clad layer 14 sequentially arranged from the inside of the housing chamber to the outside, the first annular groove 5 and the second annular groove 6 extend from the surface of the first PCB copper clad layer 12 to the surface of the PCB substrate layer 13. I.e. the first annular groove 5 and the second annular groove 6 are provided through the entire first PCB copper cladding layer 12.
In one embodiment, the capacitive acoustic-electric conversion part 3 and the signal processing element 4 are disposed on the substrate 1. For example, the capacitive sound-to-electricity conversion member 3 and the signal processing element 4 may be fixed on the substrate 1 by means of adhesion, mounting, or the like, but the capacitive sound-to-electricity conversion member 3 and the signal processing element 4 may be electrically connected to the substrate by means well known to those skilled in the art, and will not be described herein in detail.
In one embodiment, the side wall 22 and the substrate 1 are connected by soldering, and the connecting agent is solder. When the substrate 1 and the housing 2 are connected by welding, the first annular groove 5 and the second annular groove 6 provided in the present invention have more prominent functions. First, if the second annular groove 6 is not provided, the base plate 1 and the side wall 22 of the housing 2 can be welded only on one side, that is, at the outer surface of the side wall 22, but cannot be welded at the inner surface of the side wall 22, so that the effect of the one-side welding is very limited, and there is a great risk that the housing 2 is separated from the base plate 1 when the microphone is impacted by an external force. In the embodiment of the present invention, due to the second annular groove 6, the substrate 1 and the side wall 22 of the housing 2 can be welded on both sides, that is, the outer surface of the side wall 22 and the inner surface of the side wall 22 are welded at the same time, so that the connection effect between the housing 2 and the substrate 1 is greatly improved, the peel force of the housing is improved, and the housing 2 and the substrate 1 are not easily separated when the microphone is impacted by an external force. In addition, when not setting up first ring channel 5 and second ring channel 6, when welding the surface department of base plate 1 and lateral wall 22, the phenomenon of tin is climbed along the surface emergence of lateral wall 22 to soldering tin very easily, and the emergence of tin phenomenon can effectively be suppressed in the setting up of first ring channel 5 and second ring channel 6, has not only improved welded effect to can effectively prevent soldering tin pollution components and parts in the microphone.
In one embodiment, a solder resist layer 8 is disposed between the capacitive acoustic-electric conversion part 3 and the signal processing element 4 and the substrate 1. Specifically, the solder resist layer 8 is an ink layer, and of course, the solder resist layer 8 may also be an insulating resin material. The provision of the solder resist layer 8 can prevent the capacitive acoustic-electric conversion member 3 and the signal processing element 4 from being in sound conduction with solder.
In one embodiment, the outer surface of the substrate 1 is provided with at least one pad 9. The pad 9 may be provided in plural as necessary, for example, an output pad, a power supply pad, etc., and the present invention is not particularly limited thereto.
The outer surface of the side wall 22 and the outer surface of the substrate 1 are both surfaces far away from the accommodating cavity; the inner surface of the sidewall 22 and the inner surface of the substrate 1 are both surfaces close to the receiving cavity.
In one embodiment, the housing 2 is a metal housing. Specifically, for example, the housing 2 may be a copper housing with a middle portion and gold plating may be performed on inner and outer surface layers of the copper housing. The metal case thus manufactured has an excellent electromagnetic shielding effect, and prevents the capacitive sound-to-electricity conversion member 3 and the signal processing element 4 inside thereof from being subjected to external electromagnetic interference.
In one embodiment, the capacitive acoustoelectric conversion component 3 is a MEMS chip and the signal processing element 4 is an ASIC chip. The sound hole 7 which is arranged corresponding to the MEMS chip can be used for external sound and airflow to enter the cavity of the MEMS chip, the cavity of the MEMS chip is called a back cavity, the airflow touches the vibrating diaphragm arranged on the MEMS chip to send out a sound signal after entering, and the sound signal is converted into an electric signal through the MEMS chip and then transmitted to the ASIC chip to be processed.
According to another embodiment of the present invention, there is provided an electronic device including the microphone as described above. The electronic equipment can be a mobile phone, a notebook computer, a tablet computer, VR equipment, intelligent wearable equipment and the like.
Although some specific embodiments of the present invention have been described in detail by way of examples, it should be understood by those skilled in the art that the above examples are for illustrative purposes only and are not intended to limit the scope of the present invention. It will be appreciated by those skilled in the art that modifications may be made to the above embodiments without departing from the scope and spirit of the invention. The scope of the invention is defined by the appended claims.
Claims (10)
1. A microphone, comprising:
a substrate;
the shell is fixedly connected with the substrate, and the shell and the substrate form an accommodating cavity; the shell is provided with a bottom surface and a side wall which extends around the bottom surface, and the side wall is fixedly connected with the substrate; the outer side edge of the base plate extends to the outer side of the outer surface of the side wall to form a first annular groove at a position where the inner surface of the base plate corresponds to the outer surface of the side wall; a second annular groove is formed in the inner surface of the substrate at a position corresponding to the inner surface of the side wall, and a connecting agent for connecting the side wall and the substrate is filled in the first annular groove and the second annular groove;
the capacitive sound-electricity conversion component is arranged in the accommodating cavity;
the signal processing element is also arranged in the accommodating cavity and is electrically connected with the capacitive sound-electricity conversion component;
and the substrate is provided with a sound hole at a position corresponding to the capacitive sound-electricity conversion component.
2. The microphone of claim 1, wherein the substrate is a PCB board with a laminated structure, and the substrate is provided with a first PCB copper clad layer, a PCB substrate layer and a second PCB copper clad layer in sequence from the inner side of the accommodating cavity to the outer side.
3. The microphone of claim 2, wherein the first and second annular grooves extend inwardly from the surface of the first PCB copper cladding layer to the surface of the PCB substrate layer.
4. The microphone according to claim 1, wherein the capacitive acoustic-electric conversion member and the signal processing element are provided on a substrate.
5. The microphone of claim 1, wherein the sidewall is connected to the substrate by soldering, and the connecting agent is solder.
6. The microphone according to claim 5, wherein the capacitive acoustic-electric conversion member and the signal processing element are provided on a substrate; and solder masks are arranged between the capacitive acoustic-electric conversion component and the substrate and between the signal processing element and the substrate.
7. The microphone of claim 1, wherein an outer surface of the substrate is provided with at least one pad.
8. The microphone of any one of claims 1-7, wherein the housing is a metal housing.
9. The microphone according to any one of claims 1 to 7, wherein the capacitive acoustoelectric conversion component is a MEMS chip and the signal processing element is an ASIC chip.
10. An electronic device, characterized in that it comprises a microphone according to any one of claims 1-9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911046287.0A CN110784814A (en) | 2019-10-30 | 2019-10-30 | Microphone and electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911046287.0A CN110784814A (en) | 2019-10-30 | 2019-10-30 | Microphone and electronic equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110784814A true CN110784814A (en) | 2020-02-11 |
Family
ID=69388029
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201911046287.0A Pending CN110784814A (en) | 2019-10-30 | 2019-10-30 | Microphone and electronic equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110784814A (en) |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201403198Y (en) * | 2009-02-27 | 2010-02-10 | 比亚迪股份有限公司 | Micro-electro-mechanical system microphone |
| US7843021B2 (en) * | 2008-02-28 | 2010-11-30 | Shandong Gettop Acoustic Co. Ltd. | Double-side mountable MEMS package |
| CN104469640A (en) * | 2013-09-13 | 2015-03-25 | 欧姆龙株式会社 | Acoustic transducer and microphone |
| CN205616567U (en) * | 2016-04-27 | 2016-10-05 | 歌尔股份有限公司 | Packaging structure of integrated sensor |
| CN206100450U (en) * | 2016-08-31 | 2017-04-12 | 歌尔股份有限公司 | Packaging structure of MEMS microphone |
| CN206365043U (en) * | 2016-12-08 | 2017-07-28 | 歌尔科技有限公司 | A kind of MEMS sensor |
| CN206932404U (en) * | 2017-06-28 | 2018-01-26 | 歌尔科技有限公司 | Mems microphone |
| CN208924506U (en) * | 2018-12-18 | 2019-05-31 | 歌尔科技有限公司 | The encapsulating structure and MEMS microphone of sensor |
| CN209105453U (en) * | 2019-01-15 | 2019-07-12 | 歌尔科技有限公司 | MEMS microphone and electronic equipment |
-
2019
- 2019-10-30 CN CN201911046287.0A patent/CN110784814A/en active Pending
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7843021B2 (en) * | 2008-02-28 | 2010-11-30 | Shandong Gettop Acoustic Co. Ltd. | Double-side mountable MEMS package |
| CN201403198Y (en) * | 2009-02-27 | 2010-02-10 | 比亚迪股份有限公司 | Micro-electro-mechanical system microphone |
| CN104469640A (en) * | 2013-09-13 | 2015-03-25 | 欧姆龙株式会社 | Acoustic transducer and microphone |
| CN205616567U (en) * | 2016-04-27 | 2016-10-05 | 歌尔股份有限公司 | Packaging structure of integrated sensor |
| CN206100450U (en) * | 2016-08-31 | 2017-04-12 | 歌尔股份有限公司 | Packaging structure of MEMS microphone |
| CN206365043U (en) * | 2016-12-08 | 2017-07-28 | 歌尔科技有限公司 | A kind of MEMS sensor |
| CN206932404U (en) * | 2017-06-28 | 2018-01-26 | 歌尔科技有限公司 | Mems microphone |
| CN208924506U (en) * | 2018-12-18 | 2019-05-31 | 歌尔科技有限公司 | The encapsulating structure and MEMS microphone of sensor |
| CN209105453U (en) * | 2019-01-15 | 2019-07-12 | 歌尔科技有限公司 | MEMS microphone and electronic equipment |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US8995694B2 (en) | Embedded circuit in a MEMS device | |
| US9485560B2 (en) | Embedded circuit in a MEMS device | |
| CN110868682B (en) | MEMS microphone | |
| KR101748344B1 (en) | Loudspeaker module | |
| JP2007037096A (en) | Electric acoustic converter | |
| US20150195659A1 (en) | Interposer For MEMS-On-Lid MIcirophone | |
| CN108366330A (en) | Micro-electromechanical packaging structure | |
| JP5298384B2 (en) | Microphone unit | |
| JP2015532548A (en) | Embedded circuit in a MEMS device | |
| US8411881B2 (en) | Electret capacitor microphone with one-piece vocal cavity component | |
| CN202799144U (en) | Micro-electromechanical systems (MEMS) microphone | |
| CN204681598U (en) | A kind of encapsulating structure of MEMS microphone | |
| CN110784814A (en) | Microphone and electronic equipment | |
| WO2016153871A1 (en) | Embedded circuit in a mems device | |
| CN102378093A (en) | Silicon microphone | |
| CN202799143U (en) | Micro-electromechanical systems (MEMS) microphone | |
| CN201204675Y (en) | FPC connection type electro-acoustic transducer | |
| CN109462807B (en) | Electric connection structure and electronic equipment of sensor | |
| CN207706372U (en) | A kind of microphone structure and electronic equipment of the enhancing of back of the body chamber | |
| CN204836577U (en) | Mems microphone | |
| KR101593926B1 (en) | Microphone mounted structure of mainboard with multimedia device | |
| CN202310095U (en) | MEMS (Micro Electro Mechanical System) microphone | |
| CN204859557U (en) | Mems microphone | |
| CN215773562U (en) | MEMS device, microphone and electronic product | |
| CN204887465U (en) | Mems microphone |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| TA01 | Transfer of patent application right | ||
| TA01 | Transfer of patent application right |
Effective date of registration: 20200603 Address after: 261061 building 10, Geer phase II Industrial Park, No. 102, Ronghua Road, Ronghua community, Xincheng street, high tech Zone, Weifang City, Shandong Province Applicant after: Weifang goer Microelectronics Co.,Ltd. Address before: 261031 Dongfang Road, Weifang high tech Development Zone, Shandong, China, No. 268 Applicant before: GOERTEK Inc. |
|
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20200211 |