CN205616567U - Packaging structure of integrated sensor - Google Patents
Packaging structure of integrated sensor Download PDFInfo
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- CN205616567U CN205616567U CN201620366546.3U CN201620366546U CN205616567U CN 205616567 U CN205616567 U CN 205616567U CN 201620366546 U CN201620366546 U CN 201620366546U CN 205616567 U CN205616567 U CN 205616567U
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- anger
- pcb board
- duct
- connecting plate
- sensor
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- 238000004806 packaging method and process Methods 0.000 title claims abstract description 16
- 230000007613 environmental effect Effects 0.000 claims abstract description 18
- 230000008676 import Effects 0.000 claims abstract description 15
- 238000010943 off-gassing Methods 0.000 claims description 11
- 238000004891 communication Methods 0.000 claims description 6
- 239000000463 material Substances 0.000 claims description 4
- 239000000203 mixture Substances 0.000 claims description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 3
- 238000005538 encapsulation Methods 0.000 claims description 2
- 239000002184 metal Substances 0.000 claims description 2
- 229910052751 metal Inorganic materials 0.000 claims description 2
- 230000015572 biosynthetic process Effects 0.000 claims 1
- 239000011148 porous material Substances 0.000 abstract description 7
- 238000009434 installation Methods 0.000 description 8
- 238000005516 engineering process Methods 0.000 description 3
- 238000005452 bending Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- ROXBGBWUWZTYLZ-UHFFFAOYSA-N [6-[[10-formyl-5,14-dihydroxy-13-methyl-17-(5-oxo-2h-furan-3-yl)-2,3,4,6,7,8,9,11,12,15,16,17-dodecahydro-1h-cyclopenta[a]phenanthren-3-yl]oxy]-4-methoxy-2-methyloxan-3-yl] 4-[2-(4-azido-3-iodophenyl)ethylamino]-4-oxobutanoate Chemical compound O1C(C)C(OC(=O)CCC(=O)NCCC=2C=C(I)C(N=[N+]=[N-])=CC=2)C(OC)CC1OC(CC1(O)CCC2C3(O)CC4)CCC1(C=O)C2CCC3(C)C4C1=CC(=O)OC1 ROXBGBWUWZTYLZ-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000008358 core component Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
- 230000009131 signaling function Effects 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Abstract
The application discloses packaging structure of integrated sensor, including MEMS chip, circuit board, casing and environmental sensor, circuit board and casing component packaging body, MEMS chip and environmental sensor lie in the packaging body and just are fixed in the circuit board, and the circuit board is inside to be provided with the pore of giving vent to anger, and the import in the pore of giving vent to anger is just to MEMS chip, the export in the pore of giving vent to anger and the optional position that external intercommunication just lies in the outside face of circuit board. This packaging structure of integrated sensor is owing to give vent to anger the export in pore and can set up in the optional position of the outside of circuit board face, consequently, can design the position of the export that the gas pocket said according to actual mounted position, and the pore of avoiding giving vent to anger is stopped by outside article to guaranteeing to give vent to anger the pore with in packaging structure and the external intercommunication, the rational arrangement of of packaging structure of integrated sensor in the electronic product of being convenient for realizes the miniaturized designing requirement of electronic product.
Description
Technical field
This utility model relates to microphone techniques field, particularly to the encapsulating structure of a kind of integrated sensor.
Background technology
The English full name of MEMS is Micro-Electro-Mechanical System, and Chinese is microcomputer
Electricity system, refer to size at the high-tech device of several millimeters the least, its internal structure is typically at micron
Even nanometer scale, is an independent intelligence system.MEMS technology because of have miniaturization, intellectuality,
Highgrade integration and the advantage that can be mass, be widely used to electronics, medical science, industry, automobile and
The fields such as aerospace system.
In electronic product, MEMS microphone has become the first-selection of middle and high end portable intelligent electronic equipment,
The core component of MEMS microphone is MEMS chip, changes for acoustic-electric.Existing a kind of MEMS
Mike, as it is shown in figure 1, include MEMS chip 2, asic chip 3, housing 5 and wiring board 1, housing
5 and wiring board 1 be encapsulated as a cavity structure, MEMS chip 2 and AISC chip 3 is installed on cavity structure
In, and it being fixed on wiring board 1, on wiring board 1, just position to MEMS chip 2 is provided with acoustic aperture 7,
For picking up acoustical signal；Asic chip 3 is a kind of integrated circuit having and amplifying signal function, MEMS
Chip 2 and asic chip 3 are electrically connected with wiring board 1 by wire.In order to meet setting of miniaturization of electronic products
Meter demand, it will usually other sensor 4 is integrated in the encapsulating structure of MEMS microphone, is formed integrated
The encapsulating structure of sensor, the passage that acoustic aperture 7 is connected with the external world simultaneously as other sensor 4.But,
Owing to acoustic aperture 7 can only the position of corresponding MEMS chip 2 be arranged on wiring board 1, in order to make acoustic aperture 7 with outer
Boundary keeps good connection, it is to avoid acoustic aperture 7 is stopped by other object, then the encapsulating structure of integrated sensor
Installation site is restricted, and for some electronic product, the encapsulating structure of integrated sensor can not close
Removing the work is put, and affects the Miniaturization Design of electronic product.
Utility model content
In view of this, the purpose of this utility model is to provide the encapsulating structure of a kind of integrated sensor,
On the premise of ensureing that acoustic aperture well connects with the external world, it is possible to the encapsulating structure of reasonable installation integrated sensor,
Meet the design requirement of miniaturization of electronic products.
For reaching above-mentioned purpose, this utility model offer techniques below scheme:
The encapsulating structure of a kind of integrated sensor, passes including MEMS chip, wiring board, housing and environment
Sensor, described wiring board and described housing composition packaging body, described MEMS chip and described environmentally sensitive
Device is positioned at described packaging body and is fixed on described wiring board, and described wiring board is internally provided with venthole
Road, described in the give vent to anger import in duct just to described MEMS chip, described in give vent to anger the outlet in duct with extraneous
Connection and be positioned at the optional position in outer panel face of described wiring board.
Preferably, in the encapsulating structure of above-mentioned integrated sensor, described wiring board is pcb board, described
Duct of giving vent to anger is arranged at inside described pcb board.
Preferably, in the encapsulating structure of above-mentioned integrated sensor, described wiring board includes pcb board and company
Fishplate bar, described connecting plate is fixed on the inner plate surface of described pcb board, and described MEMS chip is fixed on described
On connecting plate, formed between the inner plate surface of described connecting plate and described pcb board described in give vent to anger duct, described in go out
The import in pore road is opened on described connecting plate, described in the give vent to anger outlet in duct be opened in described pcb board
On.
Preferably, in the encapsulating structure of above-mentioned integrated sensor, described wiring board includes pcb board and company
Fishplate bar, the inner plate surface of described pcb board is provided with outgassing groove, and described connecting plate is covered on described outgassing groove
And be fixed on described pcb board, described MEMS chip is fixed on described connecting plate, described connecting plate with
Described outgassing groove is given vent to anger duct described in surrounding, described in the give vent to anger import in duct be opened on described connecting plate,
The outlet in described duct of giving vent to anger is arranged on described pcb board.
Preferably, in the encapsulating structure of above-mentioned integrated sensor, described environmental sensor is fixed on institute
State on pcb board, and electrically connect with described pcb board.
Preferably, in the encapsulating structure of above-mentioned integrated sensor, described connecting plate be silica glass plate,
Metallic plate or PCB material plate.
Preferably, in the encapsulating structure of above-mentioned integrated sensor, described connecting plate is bonding, welding or
It is threaded connection part to be fixed on described pcb board.
Preferably, in the encapsulating structure of above-mentioned integrated sensor, the gold that described housing is formed in one
Belong to housing, or be made up of the circuit board frame of top board and hollow.
Preferably, in the encapsulating structure of above-mentioned integrated sensor, described environmental sensor is that pressure passes
One or more in sensor, temperature sensor, humidity sensor or gas sensor.
Compared with prior art, the beneficial effects of the utility model are:
In the encapsulating structure of the integrated sensor that this utility model provides, wiring board and housing composition packaging body,
MEMS chip and environmental sensor are positioned at packaging body and are fixed on wiring board, and wiring board is internal to be arranged
Giving vent to anger duct, the import in duct of giving vent to anger is just to MEMS chip, and the outlet in duct of giving vent to anger is in communication with the outside
And it is positioned at the optional position in the outer panel face of wiring board.Owing to the outlet in duct of giving vent to anger can be arranged on circuit
The optional position in the outer panel face of plate, therefore, it can give vent to anger the going out of duct according to actual installation Position Design
The position of mouth, it is to avoid duct of giving vent to anger is stopped by external object, thus ensure that duct of giving vent to anger is by packaging body
While being in communication with the outside, it is simple to the encapsulating structure of integrated sensor reasonable Arrangement in electronic product,
Realize the design requirement of miniaturization of electronic products.
Accompanying drawing explanation
In order to be illustrated more clearly that this utility model embodiment or technical scheme of the prior art, below will
The accompanying drawing used required in embodiment or description of the prior art is briefly described, it should be apparent that,
Accompanying drawing in describing below is only embodiment of the present utility model, comes for those of ordinary skill in the art
Say, on the premise of not paying creative work, it is also possible to obtain other accompanying drawing according to the accompanying drawing provided.
Fig. 1 is the structural representation of the encapsulating structure of existing integrated sensor；
The structural representation of the encapsulating structure of a kind of integrated sensor that Fig. 2 provides for this utility model embodiment
Figure；
The structure of the encapsulating structure of the second integrated sensor that Fig. 3 provides for this utility model embodiment is shown
It is intended to；
The structure of the encapsulating structure of the third integrated sensor that Fig. 4 provides for this utility model embodiment is shown
It is intended to.
In Figs. 1-4,1 be wiring board, 11 for pcb board, 111 for outgassing groove, 12 for connecting plate, 2
For MEMS chip, 3 be asic chip, 4 be environmental sensor, 5 be housing, 6 be duct of giving vent to anger, 501
For import, 602 be outlet, 7 be acoustic aperture.
Detailed description of the invention
Core of the present utility model there is provided the encapsulating structure of a kind of integrated sensor, is ensureing encapsulation knot
On the premise of structure well connects with the external world, it is possible to the encapsulating structure of reasonable installation integrated sensor, meet
The design requirement of miniaturization of electronic products.
Below in conjunction with the accompanying drawing in this utility model embodiment, to the technology in this utility model embodiment
Scheme is clearly and completely described, it is clear that described embodiment is only this utility model one
Divide embodiment rather than whole embodiments.Based on the embodiment in this utility model, this area is common
The every other embodiment that technical staff is obtained under not making creative work premise, broadly falls into this
The scope of utility model protection.
Refer to Fig. 2-Fig. 4, this utility model embodiment provides the encapsulating structure of a kind of integrated sensor,
Including MEMS chip 2, asic chip 3, wiring board 1, housing 5 and environmental sensor 4, environmental sensor
The quantity of 4 is one or more.Wherein, housing 5 is formed in one metal shell or by top board and in
Empty circuit board frame composition, housing 5 and wiring board 1 form packaging body, MEMS chip 2, asic chip
3 and environmental sensor 4 be positioned at packaging body and be fixed on wiring board 1, and MEMS chip 2 and ASIC
Chip 3 is connected by wire, and asic chip 3 and environmental sensor 4 are all electrically connected with wiring board 1 by wire.
Wiring board 1 be internally provided with duct 6 of giving vent to anger, and two ports in duct 6 of giving vent to anger are import 601 He respectively
Outlet 602, import 601 just position to MEMS chip 2 is arranged on the inner plate surface of wiring board 1, outlet
The optional position in the 602 outer panel faces being in communication with the outside and being arranged at wiring board 1, duct 6 of i.e. giving vent to anger can be
Axis is perpendicular to the duct of wiring board 1, it is also possible to axis bending or the duct of bending, import 601 and outlet
602 might not be the most just to MEMS chip 2, and outlet 602 is configured according to actual installation position, as long as
Venthole road 6 is made to keep being in communication with the outside, as such, it is possible to the position of integrated MEMS chip is carried out
Reasonable Arrangement, meets the design requirement of miniaturization of electronic products.
As in figure 2 it is shown, present embodiments provide the encapsulating structure of a kind of concrete integrated sensor, this enforcement
Wiring board 1 in example is pcb board 11, and it is internal that duct 6 of giving vent to anger is arranged at pcb board 11, entering of duct 6 of giving vent to anger
Mouth 601 is arranged on the inner plate surface of pcb board 11, and just to MEMS chip 2, the outlet 602 in duct 6 of giving vent to anger
Being arranged at the optional position in the outer plate surface of pcb board 11, particular location is according to the encapsulating structure of integrated sensor
Installation site depending on.Fig. 2 gives the shape in a kind of duct 6 of giving vent to anger, and is similar to zigzag shape, certainly,
Duct 6 of giving vent to anger can also be arranged at the shape within pcb board 11 for other, will envelope as long as ensureing to give vent to anger duct 6
Dress body is in communication with the outside.
As it is shown on figure 3, present embodiments provide the encapsulating structure of the concrete integrated sensor of the second, at this
In embodiment, wiring board 1 includes pcb board 11 and connecting plate 12, and connecting plate 12 is fixed on the interior of pcb board 11
On plate face, MEMS chip 2 and asic chip 3 are fixed on connecting plate 12, and asic chip 3 passes through wire
Electrically connect with pcb board 11, form duct 6 of giving vent to anger between the inner plate surface of connecting plate 12 and pcb board 11, give vent to anger
The import 601 in duct 6 is opened on connecting plate 12, and the outlet 602 in duct 6 of giving vent to anger is opened on pcb board 11,
I.e. connecting plate 12 near the side plate face of pcb board 11 with a certain distance from the inner plate surface of pcb board 11, connecting plate 12
The inner plate surface of surrounding and pcb board 11 be tightly connected, form duct 6 of giving vent to anger, import 601 is just to MEMS
Chip 2, outlet 602 runs through pcb board 11 and is arranged at the optional position of pcb board 11 outer plate surface, with specific reference to
Depending on installation site.That gives vent to anger duct 6 is shaped like in zigzag, and certainly, other can connect packaging body
The most permissible with extraneous shape.
As shown in Figure 4, this utility model provides the encapsulating structure of the third concrete integrated sensor,
In the present embodiment, wiring board 12 includes pcb board 11 and connecting plate 12 equally, with the integrated sensor in Fig. 3
Encapsulating structure unlike, the inner plate surface of pcb board 11 is provided with outgassing groove 111, connecting plate 12 covers
On outgassing groove 111 and be fixed on pcb board 11, connecting plate 12 and outgassing groove 111 surround duct 6 of giving vent to anger,
Connecting plate 12 can be concordant with the inner plate surface of pcb board 11 or have a spacing near the plate face of pcb board 11
From, the import 601 in duct 6 of giving vent to anger is opened on connecting plate 12, and the outlet 602 in duct 6 of giving vent to anger is arranged at PCB
On plate 11, outlet 602 connects with outgassing groove 111, and outlet 602 is positioned at the optional position of pcb board 11, specifically
It is set according to installation site.MEMS chip 2 and asic chip 3 are fixed on connecting plate 12, ASIC
Chip 3 is electrically connected with pcb board 11 by wire.
As shown in Figure 3 and Figure 4, integrated sensor wiring board 1 being made up of pcb board 11 and connecting plate 12
Encapsulating structure, its environmental sensor 4 is fixed on pcb board 11, and electrically connects with pcb board 11, i.e. connects
Fishplate bar 12 is only intended to fixing MEMS chip 2 and asic chip 3.Certainly, if the size of connecting plate 12
Sufficiently large, environmental sensor 4 can also be fixed on connecting plate 12, and environmental sensor 4 and pcb board 11
Electrically connected by wire.
As optimization, connecting plate 12 is silica glass plate, metallic plate or PCB material plate, primarily serves support
MEMS chip 2 and asic chip 3 and form the effect in duct 6 of giving vent to anger.It is not limited to the present embodiment institute
The material enumerated.
In the present embodiment, connecting plate 12 is bonded and fixed on pcb board 11, and certainly, connecting plate 12 can also
It is threaded connection part or is fixedly welded on pcb board 11.
In the present embodiment, environmental sensor 4 can be pressure transducer, temperature sensor, humidity sensor
One or more in device or gas sensor etc..According to actual functional capability demand, environmental sensor 4 is set.
In this specification, each embodiment uses the mode gone forward one by one to describe, and each embodiment stresses
Being the difference with other embodiments, between each embodiment, identical similar portion sees mutually.
Described above to the disclosed embodiments, makes professional and technical personnel in the field be capable of or uses
This utility model.Multiple amendment to these embodiments will be aobvious for those skilled in the art
And be clear to, generic principles defined herein can be without departing from spirit or scope of the present utility model
In the case of, realize in other embodiments.Therefore, this utility model is not intended to be limited to institute herein
These embodiments shown, and it is to fit to consistent with principles disclosed herein and features of novelty the widest
Scope.
Claims (9)
1. an encapsulating structure for integrated sensor, including MEMS chip (2), wiring board (1),
Housing (5) and environmental sensor (4), described wiring board (1) and described housing (5) composition encapsulation
Body, described MEMS chip (2) and described environmental sensor (4) are positioned at described packaging body and fix
On described wiring board (1), it is characterised in that described wiring board (1) is internally provided with duct of giving vent to anger
(6), described in the give vent to anger import (601) of duct (6) just to described MEMS chip (2), described
The outlet (602) of duct (6) of giving vent to anger is in communication with the outside and is positioned at the outer panel face of described wiring board (1)
Optional position.
The encapsulating structure of integrated sensor the most according to claim 1, it is characterised in that described line
Road plate (1) is pcb board (11), described in give vent to anger in duct (6) is arranged at described pcb board (11)
Portion.
The encapsulating structure of integrated sensor the most according to claim 1, it is characterised in that described line
Road plate (1) includes pcb board (11) and connecting plate (12), and described connecting plate (12) is fixed on described
On the inner plate surface of pcb board (11), described MEMS chip (2) is fixed on described connecting plate (12)
On, duct of giving vent to anger described in formation between the inner plate surface of described connecting plate (12) and described pcb board (11)
(6), described in the give vent to anger import (601) of duct (6) be opened on described connecting plate (12), described
The outlet (602) of duct (6) of giving vent to anger is opened on described pcb board (11).
The encapsulating structure of integrated sensor the most according to claim 1, it is characterised in that described line
Road plate (1) includes pcb board (11) and connecting plate (12), the inner plate surface of described pcb board (11)
On be provided with outgassing groove (111), described connecting plate (12) be covered in described outgassing groove (111) upper and
Being fixed on described pcb board (11), described MEMS chip (2) is fixed on described connecting plate (12)
On, described connecting plate (12) and described outgassing groove (111) surround described in give vent to anger duct (6), described
The import (601) of duct (6) of giving vent to anger is opened on described connecting plate (12), described in give vent to anger duct (6)
Outlet (602) be arranged on described pcb board (11).
5. according to the encapsulating structure of the integrated sensor described in claim 3 or 4, it is characterised in that institute
State environmental sensor (4) to be fixed on described pcb board (11), and electric with described pcb board (11)
Connect.
6. according to the encapsulating structure of the integrated sensor described in claim 3 or 4, it is characterised in that institute
Stating connecting plate (12) is silica glass plate, metallic plate or PCB material plate.
7. according to the encapsulating structure of the integrated sensor described in claim 3 or 4, it is characterised in that institute
State that connecting plate (12) is bonding, weld or be threaded connection part is fixed on described pcb board (11).
The encapsulating structure of integrated sensor the most according to claim 1, it is characterised in that described shell
The metal shell that body (5) is formed in one, or be made up of the circuit board frame of top board and hollow.
The encapsulating structure of integrated sensor the most according to claim 1, it is characterised in that described ring
Border sensor (4) is in pressure transducer, temperature sensor, humidity sensor or gas sensor
Plant or multiple.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620366546.3U CN205616567U (en) | 2016-04-27 | 2016-04-27 | Packaging structure of integrated sensor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620366546.3U CN205616567U (en) | 2016-04-27 | 2016-04-27 | Packaging structure of integrated sensor |
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| Publication Number | Publication Date |
|---|---|
| CN205616567U true CN205616567U (en) | 2016-10-05 |
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| CN201620366546.3U Active CN205616567U (en) | 2016-04-27 | 2016-04-27 | Packaging structure of integrated sensor |
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| Country | Link |
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| CN (1) | CN205616567U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109348389A (en) * | 2018-12-07 | 2019-02-15 | 歌尔股份有限公司 | Combination sensor and electronic equipment |
| CN110132877A (en) * | 2019-06-17 | 2019-08-16 | 山东大学 | A kind of integrated infrared gas sensor based on MEMS |
| CN110784814A (en) * | 2019-10-30 | 2020-02-11 | 歌尔股份有限公司 | Microphone and electronic equipment |
-
2016
- 2016-04-27 CN CN201620366546.3U patent/CN205616567U/en active Active
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109348389A (en) * | 2018-12-07 | 2019-02-15 | 歌尔股份有限公司 | Combination sensor and electronic equipment |
| WO2020113698A1 (en) * | 2018-12-07 | 2020-06-11 | 歌尔股份有限公司 | Combined sensor and electronic device |
| CN110132877A (en) * | 2019-06-17 | 2019-08-16 | 山东大学 | A kind of integrated infrared gas sensor based on MEMS |
| CN110784814A (en) * | 2019-10-30 | 2020-02-11 | 歌尔股份有限公司 | Microphone and electronic equipment |
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| TR01 | Transfer of patent right |
Effective date of registration: 20200615 Address after: 266104 room 103, 396 Songling Road, Laoshan District, Qingdao, Shandong Province Patentee after: Goer Microelectronics Co.,Ltd. Address before: 261031 Dongfang Road, Weifang high tech Industrial Development Zone, Shandong, China, No. 268 Patentee before: GOERTEK Inc. |