CN105721998A - Separated cavity packaging structure of integrated sensor - Google Patents
Separated cavity packaging structure of integrated sensor Download PDFInfo
- Publication number
- CN105721998A CN105721998A CN201610273446.0A CN201610273446A CN105721998A CN 105721998 A CN105721998 A CN 105721998A CN 201610273446 A CN201610273446 A CN 201610273446A CN 105721998 A CN105721998 A CN 105721998A
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- package cavity
- wiring board
- encapsulating structure
- integrated sensor
- cavity
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R19/00—Electrostatic transducers
- H04R19/04—Microphones
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R2201/00—Details of transducers, loudspeakers or microphones covered by H04R1/00 but not provided for in any of its subgroups
- H04R2201/003—Mems transducers or their use
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- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Acoustics & Sound (AREA)
- Signal Processing (AREA)
- Electrostatic, Electromagnetic, Magneto- Strictive, And Variable-Resistance Transducers (AREA)
- Pressure Sensors (AREA)
Abstract
The invention discloses a separated cavity packaging structure of an integrated sensor. The structure comprises an MEMS (Micro-Electro-Mechanical System) chip, an ASIC chip, a circuit board, a shell and an environment sensor. The shell and the circuit board form a packaging body. A first packaging cavity and a second packaging cavity which are mutually isolated are arranged in the packaging body. The MEMS chip and the ASIC chip are located in the first packaging cavity. The environment sensor is located in the second packaging cavity. The second packaging cavity is equipped with a through hole communicated with an external environment. A sound hole channel is arranged in the circuit board. The inlet of the sound hole channel aligns with the MEMS chip. The outlet of the sound hole channel is communicated with the second packaging cavity. According to the separated cavity packaging structure, the MEMS chip is communicated with the second packaging cavity through the sound hole channel in the circuit board; the back cavity is increased; the product performance is improved; moreover, the sensing speed of the environment sensor is improved through the large through hole; the external airflow or dusts are not liable to enter into the first packaging cavity through the sound hole channel; and therefore, bad influences resulting from the external airflow or dusts on the MEMS chip are eliminated.
Description
Technical field
The present invention relates to microphone techniques field, particularly to point chamber encapsulating structure of a kind of integrated sensor.
Background technology
The English full name of MEMS is Micro-Electro-MechanicalSystem, and Chinese is MEMS, refers to that size is at high-tech device several millimeters even less, and its internal structure is typically in micron even nanometer scale, is an independent intelligence system.MEMS technology, because having microminiaturization, intellectuality, Highgrade integration and the advantage that can be mass, is widely used to the fields such as electronics, medical science, industry, automobile and aerospace system.
In electronic product, MEMS microphone has become the first-selection of middle and high end portable intelligent electronic equipment, and the core component of MEMS microphone is MEMS chip, changes for acoustic-electric.MEMS microphone generally includes MEMS chip, asic chip, wiring board and housing, wiring board and housing and is encapsulated as a cavity structure, MEMS chip and AISC chip and is installed in cavity structure, and is fixed on wiring board；Asic chip is that a kind of integrated circuit having and amplifying signal function, MEMS chip and asic chip are electrically connected with wiring board by wire.In order to meet the design requirement of miniaturization of electronic products; would generally by other sensor integration in the encapsulating structure of MEMS microphone; owing to MEMS chip is responsive type chip; in order to avoid interfering with other sensor; divide chamber to arrange MEMS chip and other sensor, form point chamber encapsulating structure of integrated sensor.A point chamber encapsulating structure for existing integrated sensor has two kinds of forms, a kind of is connect the dividing plate of top cover and wiring board by one whole encapsulating structure is divided into two package cavities, MEMS chip and other sensor lay respectively in two package cavities, and the top cover of two package cavities all offers the through hole connected with external environment condition.Another kind of point chamber MEMS microphone is to be nested with at the big package cavity formed by external shell and wiring board to arrange an inner shell, small package chamber is formed by inner shell and wiring board, MEMS chip is positioned at small package chamber, other sensor is positioned at big package cavity, external shell offers the through hole for connecting outside, inner shell offers the acoustic aperture connecting big package cavity.
It can be seen that in point chamber encapsulating structure of the first integrated sensor, the top cover of the package cavity at MEMS chip place is offered acoustic aperture, MEMS chip is in communication with the outside either directly through acoustic aperture.In point chamber encapsulating structure of the second integrated sensor, the inner shell of the small package chamber at MEMS chip place offering acoustic aperture, MEMS chip is directly connected with big package cavity by acoustic aperture, connects with external environment condition again through the through hole on external shell.Both structures all easily occur that outer gas stream, dust etc. enter in the package cavity at MEMS chip place either directly through acoustic aperture and through hole, the work of MEMS chip is had undesirable effect, and the back of the body chamber of MEMS chip is less, make properties of product promote limited.
Summary of the invention
In view of this, it is an object of the invention to provide point chamber encapsulating structure of a kind of integrated sensor, to reduce the harmful effect to MEMS chip such as outer gas stream and dust, and increase MEMS chip back cavity, retain the environmental sensor demand to sensing speed simultaneously.
For reaching above-mentioned purpose, the present invention provides techniques below scheme:
Point chamber encapsulating structure of a kind of integrated sensor, including MEMS chip, asic chip, wiring board, housing and environmental sensor；Described housing forms packaging body with described wiring board, has the first package cavity and the second package cavity that are isolated from each other in described packaging body；Described MEMS chip and described asic chip are positioned at described first package cavity, and are fixed on described wiring board；Described environmental sensor is positioned at described second package cavity, and is fixed on described wiring board；Described second package cavity is provided with the through hole connected with external environment condition；Described wiring board is internally provided with acoustic aperture passage, and described MEMS chip is just connected by the import of described acoustic aperture passage with described first package cavity, and the outlet of described acoustic aperture passage connects with described second package cavity.
Preferably, in point chamber encapsulating structure of above-mentioned integrated sensor, described through hole is arranged on the described housing corresponding to described second package cavity.
Preferably, in point chamber encapsulating structure of above-mentioned integrated sensor, described through hole is arranged on the wiring board corresponding to described second package cavity, and the outlet of described acoustic aperture passage crosses with described through hole and connects.
Preferably, in point chamber encapsulating structure of above-mentioned integrated sensor, described wiring board is PCB substrate, and described acoustic aperture passage is arranged at inside described PCB substrate.
Preferably, in point chamber encapsulating structure of above-mentioned integrated sensor, described wiring board includes PCB substrate and connecting plate, the inner plate surface of described PCB substrate is provided with outgassing groove, described connecting plate is covered on described outgassing groove and is fixed in described PCB substrate, and described connecting plate and described outgassing groove surround described acoustic aperture passage.
Preferably, in point chamber encapsulating structure of above-mentioned integrated sensor, described connecting plate is silica glass plate, metallic plate or PCB material plate.
Preferably, in point chamber encapsulating structure of above-mentioned integrated sensor, described housing includes top board, hollow frame and dividing plate；The two ends of described hollow frame are fixed with described wiring board and described top board respectively, form described packaging body, and described packaging body is separated into described first package cavity and described second package cavity by described dividing plate.
Preferably, in point chamber encapsulating structure of above-mentioned integrated sensor, described top board is pcb board or is injection molded into template.
Preferably, in point chamber encapsulating structure of above-mentioned integrated sensor, described housing includes external shell and inner shell；Described inner shell and described wiring board form described first package cavity, and described external shell, described inner shell and described wiring board form described second package cavity.
Preferably, in point chamber encapsulating structure of above-mentioned integrated sensor, described environmental sensor is one or more in pressure transducer, temperature sensor, humidity sensor or gas sensor.
Compared with prior art, the invention has the beneficial effects as follows:
In point chamber encapsulating structure of integrated sensor provided by the invention, housing and wiring board form packaging body, there is in packaging body the first package cavity and the second package cavity that are isolated from each other, in MEMS chip, asic chip the first package cavity, and it is fixed on wiring board, environmental sensor is positioned at the second package cavity, and is fixed on wiring board；Second package cavity is provided with the through hole connected with external environment condition；Being provided with acoustic aperture passage in wiring board, and the import of acoustic aperture passage is just to MEMS chip, the outlet of acoustic aperture passage connects with the second package cavity.This structure arranges and not only makes the back of the body cavity space of MEMS chip increase, improve signal to noise ratio, and MEMS chip does not directly connect with external environment condition, but by being positioned at the second package cavity to environmental sensor place of the acoustic aperture channel connection within wiring board, through hole and ft connection again through the second package cavity, outer gas stream or dust etc. are easily detected by acoustic aperture passage and enter in the first package cavity, reduce the impact on MEMS chip, and, through hole on second package cavity increases the connected surface that environmental sensor connects with external environment condition, improve the perception velocities of environmental sensor.
Accompanying drawing explanation
In order to be illustrated more clearly that the embodiment of the present invention or technical scheme of the prior art, the accompanying drawing used required in embodiment or description of the prior art will be briefly described below, apparently, accompanying drawing in the following describes is only embodiments of the invention, for those of ordinary skill in the art, under the premise not paying creative work, it is also possible to obtain other accompanying drawing according to the accompanying drawing provided.
The structural representation of point chamber encapsulating structure of the first integrated sensor that Fig. 1 provides for the embodiment of the present invention；
The structural representation of point chamber encapsulating structure of the second integrated sensor that Fig. 2 provides for the embodiment of the present invention；
Fig. 3 is the structural representation of Section A-A in Fig. 1；
Fig. 4 is the structural representation of section B-B in Fig. 2；
The structural representation of point chamber encapsulating structure of the third integrated sensor that Fig. 5 provides for the embodiment of the present invention；
The structural representation of point chamber encapsulating structure of the 4th kind of integrated sensor that Fig. 6 provides for the embodiment of the present invention；
Fig. 7 is the structural representation in C-C cross section in Fig. 5；
Fig. 8 is the structural representation in D-D cross section in Fig. 6.
In Fig. 1-Fig. 8,1 be wiring board, 11 be PCB substrate, outgassing groove 111,12 is connecting plate, 2 is hollow frame, 3 is top board, 4 is the second package cavity, 41 is through hole, 5 is the first package cavity, 51 is acoustic aperture passage, 511 is import, 512 is outlet, 6 is asic chip, 7 is MEMS chip, 8 is dividing plate, 9 is environmental sensor, 13 is external shell, 14 is inner shell.
Detailed description of the invention
The core of the present invention there is provided point chamber encapsulating structure of a kind of integrated sensor, reduces the harmful effect to MEMS chip such as outer gas stream and dust.
Below in conjunction with the accompanying drawing in the embodiment of the present invention, the technical scheme in the embodiment of the present invention is clearly and completely described, it is clear that described embodiment is only a part of embodiment of the present invention, rather than whole embodiments.Based on the embodiment in the present invention, the every other embodiment that those of ordinary skill in the art obtain under not making creative work premise, broadly fall into the scope of protection of the invention.
Refer to shown in Fig. 1, Fig. 2, Fig. 3 and Fig. 4, embodiments provide point chamber encapsulating structure of a kind of integrated sensor, including MEMS chip 7, asic chip 6, wiring board 1, housing and environmental sensor 9；Wherein, housing and wiring board 1 form packaging body, have the first package cavity 5 and the second package cavity 4 being isolated from each other in packaging body；MEMS chip 7 and asic chip 6 are positioned at the first package cavity 5, and are fixed on wiring board 1, are electrically connected with wiring board 1 by wire；Environmental sensor 9 is positioned at the second package cavity 4, and is fixed on wiring board 1, is electrically connected with wiring board 1 by wire；Second package cavity 4 is provided with the through hole 41 connected with external environment condition；Will not produce between MEMS chip 7 and environmental sensor 9 to interfere；Wiring board 1 is internally provided with acoustic aperture passage, and MEMS chip 7 ground and the first package cavity 5 are just connected by the import 511 of acoustic aperture passage 51, and the outlet 512 of acoustic aperture passage 51 connects with the second package cavity 4.
In point chamber encapsulating structure of above-mentioned integrated sensor, the import 511 of acoustic aperture passage 51 is arranged on wiring board 1, and just MEMS chip 7 is arranged, therefore, the back of the body chamber of MEMS chip 7 is the space of whole first package cavity 5, with existing acoustic aperture is arranged on housing compared with, increase the space in back of the body chamber, thus improve signal to noise ratio, improve the sound quality of mike.And MEMS chip 7 does not directly connect with external environment condition, but second package cavity 4 at environmental sensor 9 place it is communicated to by the acoustic aperture passage 51 being positioned within wiring board 1, through hole 41 and ft connection again through the second package cavity 4, outer gas stream or dust etc. are easily detected by acoustic aperture passage 51 and enter in the first package cavity 5, reduce the harmful effect to MEMS chip 7, through hole 41 increases the connected surface that environmental sensor connects with external environment condition, improves the speed of environmental sensor 9 perception external environment condition.
As shown in Figure 1, the invention provides point chamber encapsulating structure of the first concrete integrated sensor, its housing includes hollow frame 2, top board 3 and dividing plate 8, the two-port of hollow frame 2 seals fixing with wiring board 1 and top board 3 respectively, form packaging body, dividing plate 8 is positioned at packaging body, the edge of dividing plate 8 is fixed with top board 3, wiring board 1 and hollow frame 2 inwall respectively, packaging body is divided into the first mutually isolated package cavity 5 and the second package cavity 4, and namely a point chamber form is parallel point of cavity configuration.
As optimization, top board 3 and dividing plate 8, hollow frame 2 are integrated, and top board 3 is for pcb board or is injection molded into template.Certainly, top board 3 and dividing plate 8, hollow frame 2 can also is that separable assembled structure, and material is identical or different.
When housing adopts parallel point of cavity configuration, as shown in Figure 1, the through hole 41 of the second package cavity 4 can be arranged on the top board 3 corresponding to the second package cavity 4, just environmental sensor 9 is arranged, meanwhile, the outlet 512 of acoustic aperture passage 51 is arranged on the inner plate surface of wiring board 1 at the second package cavity 4 place, is connected with the second package cavity 4 by the first package cavity 5 by acoustic aperture passage 51, is connected with external environment condition by MEMS chip 7 again through through hole 41.Preferably, the size of through hole 41 can suitably increase, to improve the speed of environmental sensor 9 perception external environment condition further.
As shown in figures 1 and 3, the wiring board 1 of point chamber encapsulating structure of the first integrated sensor includes PCB substrate 11 and connecting plate 12, the inner plate surface of PCB substrate 11 is provided with outgassing groove 111, its cross sectional shape is as shown in Figure 3, it can be T-slot structure, connecting plate 12 is covered on outgassing groove 111 and is fixed in PCB substrate 11, is adhesively fixed by fluid sealant, and connecting plate 12 and outgassing groove 111 surround acoustic aperture passage 51.The import 511 of acoustic aperture passage 51 can be arranged on connecting plate 12, it is also possible to is formed by connecting plate 12 and PCB substrate 11 common combination, as long as import 511 is just to MEMS chip 7.
Or, the wiring board 1 only PCB substrate 11 of point chamber encapsulating structure of the first integrated sensor, as shown in Figure 4, acoustic aperture passage 51 is arranged at the inside of PCB substrate 11.
As shown in Figure 2, present embodiments provide point chamber encapsulating structure of the second integrated sensor, its point of chamber form adopts parallel point of cavity configuration equally, with point chamber encapsulating structure of the first integrated sensor the difference is that, the through hole 41 of the second package cavity 4 is opened on the wiring board 1 corresponding to the second package cavity 4.The outlet 512 of acoustic aperture passage 51 preferably crosses with through hole 41 and connects, simple in construction, and acoustic aperture passage 51 connects with external environment condition either directly through through hole 41, air-flow or dust etc. can be avoided to be directly entered the first package cavity simultaneously.Certainly, outlet 512 positions on wiring board 1 of the through hole 41 position on wiring board 1 and acoustic aperture passage 51 can also be without crossing, adopting the mode being independently arranged, connecting with external environment condition respectively with the second package cavity 4 as long as being capable of the first package cavity 5.
Structure in equally possible employing Fig. 3 of acoustic aperture passage 51 of point chamber encapsulating structure of the second integrated sensor, is namely arranged inside PCB substrate 11, or adopts the structure in Fig. 4, and namely acoustic aperture passage 51 is surrounded by outgassing groove 111 and the connecting plate 12 of PCB substrate 11.
As shown in Figure 5, embodiments provide point chamber encapsulating structure of the third integrated sensor, its housing includes external shell 13 and inner shell 14, external shell 13 and inner shell 14 all adopt basin assembling structure, it is internal that inner shell 14 is nested in external shell 13, inner shell 14 and wiring board 1 form the first package cavity 5, and external shell 13 and inner shell 14 and wiring board 1 form the second package cavity 4, and this point of chamber form is nested point cavity configuration.The through hole 41 of the second package cavity 4 is arranged on external shell 13, it is preferable that just environmental sensor 9 is arranged.Meanwhile, the outlet 512 of acoustic aperture passage 51 is arranged on the inner plate surface of wiring board 1 at the second package cavity 4 place, is connected with the second package cavity 4 by the first package cavity 5 by acoustic aperture passage 51, is connected with external environment condition by MEMS chip 7 again through through hole 41.Preferably, the size of through hole 41 can suitably increase, to improve the speed of environmental sensor 9 perception external environment condition further.
As shown in figure 5 and figure 7, the wiring board 1 of point chamber encapsulating structure of the third integrated sensor only includes PCB substrate 11, and it is internal that acoustic aperture passage 51 is arranged at PCB substrate 11.Or wiring board 1 includes PCB substrate 11 and connecting plate 12, as shown in Figure 8, its structure is identical with Fig. 1, Fig. 3, referring to described above, does not repeat them here.
As shown in Figure 6, embodiments provide point chamber encapsulating structure of the 4th kind of integrated sensor, its point of chamber form adopts nested point cavity configuration equally, with point chamber encapsulating structure of the third integrated sensor the difference is that, the through hole 41 of the second package cavity 4 is opened on the wiring board 1 corresponding to the second package cavity 4.The outlet 512 of acoustic aperture passage 51 preferably crosses with through hole 41 and connects, simple in construction, and acoustic aperture passage 51 connects with external environment condition either directly through through hole 41, air-flow or dust etc. can be avoided to be directly entered the first package cavity 5 simultaneously.Certainly, outlet 512 positions on wiring board 1 of the through hole 41 position on wiring board 1 and acoustic aperture passage 51 can also be without crossing, adopting the mode being independently arranged, connecting with external environment condition respectively with the second package cavity 4 as long as being capable of the first package cavity 5.
Structure in equally possible employing Fig. 7 of acoustic aperture passage 51 of point chamber encapsulating structure of the 4th kind of integrated sensor, is namely arranged inside PCB substrate 11, or adopts the structure in Fig. 8, and namely acoustic aperture passage 51 is surrounded by outgassing groove 111 and the connecting plate 12 of PCB substrate 11.
The connecting plate 12 of point chamber encapsulating structure of above four kinds of integrated sensors is silica glass plate, metallic plate or PCB material plate, as long as can surround acoustic aperture passage 51 with outgassing groove 111 and support MEMS chip 7, it is not limited to the material cited by the present embodiment.
Specifically, the quantity of the environmental sensor 9 of above-mentioned four kinds of mikes is one or more, and environmental sensor 9 is one or more in pressure transducer, temperature sensor, humidity sensor or gas sensor.Functional requirement with specific reference to point chamber encapsulating structure of integrated sensor selects suitable environmental sensor 9.It is not limited to the kind of sensor cited by the present embodiment.
In this specification, each embodiment adopts the mode gone forward one by one to describe, and what each embodiment stressed is the difference with other embodiments, between each embodiment identical similar portion mutually referring to.
Described above to the disclosed embodiments, makes professional and technical personnel in the field be capable of or uses the present invention.The multiple amendment of these embodiments be will be apparent from for those skilled in the art, and generic principles defined herein can without departing from the spirit or scope of the present invention, realize in other embodiments.Therefore, the present invention is not intended to be limited to the embodiments shown herein, and is to fit to the widest scope consistent with principles disclosed herein and features of novelty.
Claims (10)
1. a point chamber encapsulating structure for integrated sensor, including MEMS chip (7), asic chip (6), wiring board (1), housing and environmental sensor (9)；Described housing forms packaging body with described wiring board (1), has the first package cavity (5) and the second package cavity (4) that are isolated from each other in described packaging body；Described MEMS chip (7) and described asic chip (6) are positioned at described first package cavity (5), and are fixed on described wiring board (1)；Described environmental sensor (9) is positioned at described second package cavity (4), and is fixed on described wiring board (1)；Described second package cavity (4) is provided with the through hole (41) connected with external environment condition；It is characterized in that, described wiring board (1) is internally provided with acoustic aperture passage (51), described MEMS chip (7) is just connected by the import (511) of described acoustic aperture passage (51) with described first package cavity (4), and the outlet (512) of described acoustic aperture passage (51) connects with described second package cavity (4).
2. point chamber encapsulating structure of integrated sensor according to claim 1, it is characterised in that described through hole (41) is arranged on the described housing corresponding to described second package cavity (4).
3. point chamber encapsulating structure of integrated sensor according to claim 1, it is characterized in that, described through hole (41) is arranged on the wiring board (1) corresponding to described second package cavity (4), and the outlet (512) of described acoustic aperture passage (51) crosses with described through hole (41) and connects.
4. point chamber encapsulating structure of integrated sensor according to claim 1, it is characterized in that, described wiring board (1) is PCB substrate (11), and it is internal that described acoustic aperture passage (51) is arranged at described PCB substrate (11).
5. point chamber encapsulating structure of integrated sensor according to claim 1, it is characterized in that, described wiring board (1) includes PCB substrate (11) and connecting plate (12), the inner plate surface of described PCB substrate (11) is provided with outgassing groove (111), described connecting plate (12) is covered in described outgassing groove (111) and above and is fixed in described PCB substrate (11), and described connecting plate (12) and described outgassing groove (111) surround described acoustic aperture passage (51).
6. point chamber encapsulating structure of integrated sensor according to claim 5, it is characterised in that described connecting plate (12) is silica glass plate, metallic plate or PCB material plate.
7. point chamber encapsulating structure of the integrated sensor according to any one of claim 1-6, it is characterised in that described housing includes top board (3), hollow frame (2) and dividing plate (8)；The two ends of described hollow frame (2) are fixed with described wiring board (1) and described top board (3) respectively, forming described packaging body, described packaging body is separated into described first package cavity (5) and described second package cavity (4) by described dividing plate (8).
8. point chamber encapsulating structure of integrated sensor according to claim 7, it is characterised in that described top board (3) for pcb board or is injection molded into template.
9. point chamber encapsulating structure of the integrated sensor according to any one of claim 1-6, it is characterised in that described housing includes external shell (13) and inner shell (14)；Described inner shell (14) and described wiring board (1) form described first package cavity (5), and described external shell (13), described inner shell (14) and described wiring board (1) form described second package cavity (4).
10. point chamber encapsulating structure of the integrated sensor according to any one of claim 1-6, it is characterised in that described environmental sensor (9) is pressure transducer, temperature sensor, one or more in humidity sensor or gas sensor.
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| CN201610273446.0A CN105721998A (en) | 2016-04-27 | 2016-04-27 | Separated cavity packaging structure of integrated sensor |
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| CN201610273446.0A CN105721998A (en) | 2016-04-27 | 2016-04-27 | Separated cavity packaging structure of integrated sensor |
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| CN107725355A (en) * | 2017-11-29 | 2018-02-23 | 浙江耀达智能科技股份有限公司 | The water pump of having electronic pressure switch |
| CN108012416A (en) * | 2017-12-25 | 2018-05-08 | 佛山市车品匠汽车用品有限公司 | A kind of self-powered multifunction flexible circuit board |
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| TWI804009B (en) * | 2021-10-19 | 2023-06-01 | 香港商睿克科技有限公司 | Separated microelectromechanical system microphone structure and manufacturing method thereof |
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| CN108012416B (en) * | 2017-12-25 | 2020-06-02 | 江苏蓝特电路板有限公司 | Self-powered multifunctional flexible circuit board |
| CN108489556A (en) * | 2018-06-05 | 2018-09-04 | 潍坊浩森智能科技有限公司 | A kind of combination heart rate module |
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| CN110300343B (en) * | 2019-04-30 | 2021-07-13 | 深圳市湾区通信技术有限公司 | Outdoor pickup equipment |
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| CN111277938A (en) * | 2020-03-09 | 2020-06-12 | 无锡韦尔半导体有限公司 | Packaging structure of microphone |
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| WO2022188524A1 (en) * | 2021-03-09 | 2022-09-15 | 歌尔微电子股份有限公司 | Packaging module, packaging process, and electronic device |
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Address after: 261031 Dongfang Road, Weifang high tech Industrial Development Zone, Shandong, China, No. 268 Applicant after: Goertek Inc. Address before: 261031 Dongfang Road, Weifang high tech Industrial Development Zone, Shandong, China, No. 268 Applicant before: Goertek Inc. |
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Application publication date: 20160629 |