CN205622876U - Integrated sensor's branch chamber packaging structure - Google Patents
Integrated sensor's branch chamber packaging structure Download PDFInfo
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- CN205622876U CN205622876U CN201620366940.7U CN201620366940U CN205622876U CN 205622876 U CN205622876 U CN 205622876U CN 201620366940 U CN201620366940 U CN 201620366940U CN 205622876 U CN205622876 U CN 205622876U
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- 238000004806 packaging method and process Methods 0.000 title claims abstract description 19
- 230000007613 environmental effect Effects 0.000 claims abstract description 26
- 238000005538 encapsulation Methods 0.000 claims abstract description 19
- 230000008676 import Effects 0.000 claims abstract description 9
- 239000000758 substrate Substances 0.000 claims description 23
- 238000010943 off-gassing Methods 0.000 claims description 13
- 239000000463 material Substances 0.000 claims description 5
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 3
- 239000000428 dust Substances 0.000 abstract description 8
- 230000009931 harmful effect Effects 0.000 abstract description 4
- 238000010586 diagram Methods 0.000 description 4
- 230000008447 perception Effects 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 3
- 238000004891 communication Methods 0.000 description 2
- 238000010276 construction Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- ROXBGBWUWZTYLZ-UHFFFAOYSA-N [6-[[10-formyl-5,14-dihydroxy-13-methyl-17-(5-oxo-2h-furan-3-yl)-2,3,4,6,7,8,9,11,12,15,16,17-dodecahydro-1h-cyclopenta[a]phenanthren-3-yl]oxy]-4-methoxy-2-methyloxan-3-yl] 4-[2-(4-azido-3-iodophenyl)ethylamino]-4-oxobutanoate Chemical compound O1C(C)C(OC(=O)CCC(=O)NCCC=2C=C(I)C(N=[N+]=[N-])=CC=2)C(OC)CC1OC(CC1(O)CCC2C3(O)CC4)CCC1(C=O)C2CCC3(C)C4C1=CC(=O)OC1 ROXBGBWUWZTYLZ-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000008358 core component Substances 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
- 239000000565 sealant Substances 0.000 description 1
- 230000009131 signaling function Effects 0.000 description 1
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- Electrostatic, Electromagnetic, Magneto- Strictive, And Variable-Resistance Transducers (AREA)
Abstract
The application discloses integrated sensor's branch chamber packaging structure is including MEMS chip, ASIC chip, circuit board, casing and environmental sensor, casing and gate plate -type becomes the packaging body, has the first encapsulation cavity and the second encapsulation cavity of keeping apart each other in the packaging body, MEMS chip and ASIC chip are located first encapsulation cavity, environmental sensor is located second encapsulation cavity, second encapsulation cavity is provided with the through -hole with the external environment condition intercommunication, the inside sound hole passageway that sets up of circuit board, the import of sound hole passageway is just to MEMS chip, passageway export of sound hole and second encapsulation cavity intercommunication. This minute chamber packaging structure's MEMS chip communicates to second encapsulation cavity through the sound hole passageway that is located circuit board inside, has increased out -of -the -way chamber, promotes and produces the property ability, and simultaneously big through -hole has improved environmental sensor's perceptual speed, and outside air current or dust etc. Produce harmful effects to the MEMS chip in being difficult to get into first encapsulation cavity through hole passageway.
Description
Technical field
This utility model relates to microphone techniques field, particularly to point chamber encapsulation of a kind of integrated sensor
Structure.
Background technology
The English full name of MEMS is Micro-Electro-Mechanical System, and Chinese is microcomputer
Electricity system, refer to size at the high-tech device of several millimeters the least, its internal structure is typically at micron
Even nanometer scale, is an independent intelligence system.MEMS technology because of have miniaturization, intellectuality,
Highgrade integration and the advantage that can be mass, be widely used to electronics, medical science, industry, automobile and
The fields such as aerospace system.
In electronic product, MEMS microphone has become the first-selection of middle and high end portable intelligent electronic equipment,
The core component of MEMS microphone is MEMS chip, changes for acoustic-electric.MEMS microphone is generally wrapped
Include MEMS chip, asic chip, wiring board and housing, wiring board and housing and be encapsulated as a cavity knot
Structure, MEMS chip and AISC chip are installed in cavity structure, and are fixed on wiring board；ASIC core
Sheet is a kind of integrated circuit having and amplifying signal function, MEMS chip and asic chip by wire with
Wiring board electrically connects.In order to meet the design requirement of miniaturization of electronic products, it will usually by other sensor
It is integrated in the encapsulating structure of MEMS microphone, owing to MEMS chip is responsive type chip, in order to avoid
Interfere with other sensor, divide chamber to arrange MEMS chip and other sensor, form collection
Become point chamber encapsulating structure of sensor.A point chamber encapsulating structure for existing integrated sensor has two kinds of forms,
A kind of is to connect the dividing plate of top cover and wiring board by one whole encapsulating structure is divided into two package cavities
Room, MEMS chip and other sensor lay respectively in two package cavities, the top of two package cavities
Cover and all offer the through hole connected with external environment condition.An another kind of point chamber MEMS microphone is by outside
The big package cavity that housing and wiring board are formed is nested with and arranges an inner shell, by inner shell and line
Road plate forms small package chamber, and MEMS chip is positioned at small package chamber, and other sensor is positioned at big envelope
It behave affectedly indoor, external shell offers the through hole for connecting outside, inner shell offers connection
The acoustic aperture of big package cavity.
It can be seen that in point chamber encapsulating structure of the first integrated sensor, MEMS chip place
Offering acoustic aperture on the top cover of package cavity, MEMS chip is directly in communication with the outside by acoustic aperture.Second
Plant in point chamber encapsulating structure of integrated sensor, the inner shell of the small package chamber at MEMS chip place
On offer acoustic aperture, MEMS chip is directly connected with big package cavity, then pass through external shell by acoustic aperture
On through hole connect with external environment condition.Both structures the most easily occur that outer gas stream, dust etc. are the most logical
Crossing in the package cavity at acoustic aperture and through hole entrance MEMS chip place, the work to MEMS chip causes not
Good impact, and the back of the body chamber of MEMS chip is less, makes properties of product promote limited.
Utility model content
In view of this, the purpose of this utility model is to provide point chamber encapsulating structure of a kind of integrated sensor,
To reduce the harmful effect to MEMS chip such as outer gas stream and dust, and increase MEMS chip back cavity,
Retain the environmental sensor demand to sensing speed simultaneously.
For reaching above-mentioned purpose, this utility model offer techniques below scheme:
A kind of point chamber encapsulating structure of integrated sensor, including MEMS chip, asic chip, wiring board,
Housing and environmental sensor；Described housing forms packaging body with described wiring board, has in described packaging body
The first package cavity being isolated from each other and the second package cavity；Described MEMS chip and described asic chip
It is positioned at described first package cavity, and is fixed on described wiring board；Described environmental sensor is positioned at described
In second package cavity, and it is fixed on described wiring board；Described second package cavity is provided with outside
The through hole of environmental communication；Described wiring board is internally provided with acoustic aperture passage, and the import of described acoustic aperture passage is just
Connecting described MEMS chip with described first package cavity, the outlet of described acoustic aperture passage is with described
Second package cavity connection.
Preferably, in point chamber encapsulating structure of above-mentioned integrated sensor, described through hole is arranged at described
On described housing corresponding to second package cavity.
Preferably, in point chamber encapsulating structure of above-mentioned integrated sensor, described through hole is arranged at described
On wiring board corresponding to second package cavity, the outlet of described acoustic aperture passage crosses with described through hole and connects.
Preferably, in point chamber encapsulating structure of above-mentioned integrated sensor, described wiring board is PCB substrate,
Described acoustic aperture passage is arranged at inside described PCB substrate.
Preferably, in point chamber encapsulating structure of above-mentioned integrated sensor, described wiring board includes PCB
Substrate and connecting plate, the inner plate surface of described PCB substrate is provided with outgassing groove, and described connecting plate is covered in institute
Stating on outgassing groove and be fixed in described PCB substrate, described connecting plate and described outgassing groove surround described acoustic aperture
Passage.
Preferably, in point chamber encapsulating structure of above-mentioned integrated sensor, described connecting plate is silica glass
Plate, metallic plate or PCB material plate.
Preferably, in point chamber encapsulating structure of above-mentioned integrated sensor, described housing include top board,
Hollow frame and dividing plate；The two ends of described hollow frame are fixed with described wiring board and described top board respectively,
Forming described packaging body, described packaging body is separated into described first package cavity and described by described dividing plate
Two package cavities.
Preferably, in point chamber encapsulating structure of above-mentioned integrated sensor, described top board is pcb board or note
It is moulded template.
Preferably, in point chamber encapsulating structure of above-mentioned integrated sensor, described housing includes external shell
Body and inner shell；Described inner shell and described wiring board form described first package cavity, described outside
Portion's housing, described inner shell and described wiring board form described second package cavity.
Preferably, in point chamber encapsulating structure of above-mentioned integrated sensor, described environmental sensor is pressure
One or more in force transducer, temperature sensor, humidity sensor or gas sensor.
Compared with prior art, the beneficial effects of the utility model are:
In point chamber encapsulating structure of the integrated sensor that this utility model provides, housing and wiring board form envelope
Dress body, has the first package cavity and the second package cavity being isolated from each other in packaging body, MEMS chip,
In asic chip the first package cavity, and being fixed on wiring board, environmental sensor is positioned at the second package cavity
Indoor, and be fixed on wiring board；Second package cavity is provided with the through hole connected with external environment condition；Line
It is provided with acoustic aperture passage in the plate of road, and the import of acoustic aperture passage is just to MEMS chip, going out of acoustic aperture passage
Mouth connects with the second package cavity.This structure arranges and not only makes the back of the body cavity space of MEMS chip increase, and carries
High signal to noise ratio, and MEMS chip directly do not connects with external environment condition, but by being positioned at wiring board
Internal acoustic aperture channel connection is in second package cavity at environmental sensor place, then by the second encapsulation
The through hole of chamber and ft connection, outer gas stream or dust etc. are easily detected by acoustic aperture passage and enter the first envelope
It behave affectedly indoor, reduce the impact on MEMS chip, and, the through hole on the second package cavity increases
The connected surface that environmental sensor connects with external environment condition, improves the perception velocities of environmental sensor.
Accompanying drawing explanation
In order to be illustrated more clearly that this utility model embodiment or technical scheme of the prior art, below will
The accompanying drawing used required in embodiment or description of the prior art is briefly described, it should be apparent that,
Accompanying drawing in describing below is only embodiment of the present utility model, comes for those of ordinary skill in the art
Say, on the premise of not paying creative work, it is also possible to obtain other accompanying drawing according to the accompanying drawing provided.
The knot of point chamber encapsulating structure of the first integrated sensor that Fig. 1 provides for this utility model embodiment
Structure schematic diagram；
The knot of point chamber encapsulating structure of the second integrated sensor that Fig. 2 provides for this utility model embodiment
Structure schematic diagram；
Fig. 3 is the structural representation of Section A-A in Fig. 1；
Fig. 4 is the structural representation of section B-B in Fig. 2；
The knot of point chamber encapsulating structure of the third integrated sensor that Fig. 5 provides for this utility model embodiment
Structure schematic diagram；
The knot of point chamber encapsulating structure of the 4th kind of integrated sensor that Fig. 6 provides for this utility model embodiment
Structure schematic diagram；
Fig. 7 is the structural representation in C-C cross section in Fig. 5；
Fig. 8 is the structural representation in D-D cross section in Fig. 6.
In Fig. 1-Fig. 8,1 be wiring board, 11 be PCB substrate, outgassing groove 111,12 be connecting plate, 2
For hollow frame, 3 for top board, 4 be the second package cavity, 41 for through hole, 5 be the first package cavity, 51
For acoustic aperture passage, 511 for import, 512 for outlet, 6 be asic chip, 7 for MEMS chip, 8 be every
Plate, 9 be environmental sensor, 13 be external shell, 14 for inner shell.
Detailed description of the invention
Core of the present utility model there is provided point chamber encapsulating structure of a kind of integrated sensor, outside reducing
The harmful effect to MEMS chip such as portion's air-flow and dust.
Below in conjunction with the accompanying drawing in this utility model embodiment, to the technology in this utility model embodiment
Scheme is clearly and completely described, it is clear that described embodiment is only this utility model one
Divide embodiment rather than whole embodiments.Based on the embodiment in this utility model, this area is common
The every other embodiment that technical staff is obtained under not making creative work premise, broadly falls into this
The scope of utility model protection.
Refer to shown in Fig. 1, Fig. 2, Fig. 3 and Fig. 4, this utility model embodiment provides a kind of integrated biography
Point chamber encapsulating structure of sensor, including MEMS chip 7, asic chip 6, wiring board 1, housing and environment
Sensor 9；Wherein, housing and wiring board 1 form packaging body, have first be isolated from each other in packaging body
Package cavity 5 and the second package cavity 4；MEMS chip 7 and asic chip 6 are positioned at the first package cavity 5,
And be fixed on wiring board 1, electrically connected with wiring board 1 by wire；Environmental sensor 9 is positioned at the second encapsulation
In chamber 4, and it is fixed on wiring board 1, is electrically connected with wiring board 1 by wire；Second package cavity 4
It is provided with the through hole 41 connected with external environment condition；Will not produce between MEMS chip 7 and environmental sensor 9
Interfere；Wiring board 1 is internally provided with acoustic aperture passage, and the import 511 of acoustic aperture passage 51 is just to MEMS
Chip 7 ground and the first package cavity 5 connect, and the outlet 512 of acoustic aperture passage 51 connects with the second package cavity 4.
In point chamber encapsulating structure of above-mentioned integrated sensor, the import 511 of acoustic aperture passage 51 is arranged on circuit
On plate 1, and just arranging MEMS chip 7, therefore, the back of the body chamber of MEMS chip 7 is whole first encapsulation
The space of chamber 5, with existing acoustic aperture is arranged on housing compared with, increase the space in back of the body chamber, thus
Improve signal to noise ratio, improve the sound quality of mike.And MEMS chip 7 is not direct and external rings
Border connects, but is communicated to environmental sensor 9 place by being positioned at the acoustic aperture passage 51 within wiring board 1
In second package cavity 4, then by the through hole 41 of the second package cavity 4 and ft connection, outer gas stream or
Dust etc. are easily detected by acoustic aperture passage 51 and enter in the first package cavity 5, reduce MEMS chip 7
Harmful effect, through hole 41 increases the connected surface that environmental sensor connects with external environment condition, improves ring
The speed of border sensor 9 perception external environment condition.
As it is shown in figure 1, this utility model provides point chamber encapsulation knot of the first concrete integrated sensor
Structure, its housing includes hollow frame 2, top board 3 and dividing plate 8, the two-port of hollow frame 2 respectively with circuit
Plate 1 and top board 3 seal fixing, form packaging body, and dividing plate 8 is positioned at packaging body, the edge of dividing plate 8
Fix with top board 3, wiring board 1 and hollow frame 2 inwall respectively, packaging body is divided into mutually isolated
One package cavity 5 and the second package cavity 4, i.e. a point chamber form are parallel point of cavity configuration.
As optimization, top board 3 is integrated with dividing plate 8, hollow frame 2, and top board 3 is pcb board or note
It is moulded template.Certainly, top board 3 and dividing plate 8, hollow frame 2 can also is that separable assembled structure, material phase
Same or different.
When housing uses parallel point of cavity configuration, as it is shown in figure 1, the through hole 41 of the second package cavity 4 is permissible
It is arranged on the top board 3 corresponding to the second package cavity 4, just environmental sensor 9 is arranged, meanwhile,
On the inner plate surface of the wiring board 1 that the outlet 512 of acoustic aperture passage 51 is arranged on the second package cavity 4 place, pass through
First package cavity 5 is connected by acoustic aperture passage 51 with the second package cavity 4, then by through hole 41 by MEMS
Chip 7 connects with external environment condition.Preferably, the size of through hole 41 can suitably increase, to improve further
The speed of environmental sensor 9 perception external environment condition.
As shown in figures 1 and 3, the wiring board 1 of point chamber encapsulating structure of the first integrated sensor includes PCB
Substrate 11 and connecting plate 12, the inner plate surface of PCB substrate 11 is provided with outgassing groove 111, and its cross sectional shape is such as
Shown in Fig. 3, can be T-slot structure, connecting plate 12 be covered on outgassing groove 111 and be fixed on PCB substrate
On 11, being adhesively fixed by fluid sealant, connecting plate 12 and outgassing groove 111 surround acoustic aperture passage 51.Acoustic aperture is led to
The import 511 in road 51 can be arranged on connecting plate 12, it is also possible to common by connecting plate 12 and PCB substrate 11
Combination is formed, as long as import 511 is just to MEMS chip 7.
Or, the wiring board 1 only PCB substrate 11 of point chamber encapsulating structure of the first integrated sensor, as
Shown in Fig. 4, acoustic aperture passage 51 is arranged at the inside of PCB substrate 11.
As in figure 2 it is shown, present embodiments provide point chamber encapsulating structure of the second integrated sensor, its point of chamber
Form uses parallel point of cavity configuration equally, unlike point chamber encapsulating structure of the first integrated sensor,
The through hole 41 of the second package cavity 4 is opened on the wiring board 1 corresponding to the second package cavity 4.Acoustic aperture passage
The outlet 512 of 51 preferably crosses with through hole 41 and connects, and simple in construction, acoustic aperture passage 51 directly passes through through hole
41 connect with external environment condition, air-flow or dust etc. can be avoided to be directly entered the first package cavity simultaneously.When
So, the outlet 512 of the through hole 41 position on wiring board 1 and acoustic aperture passage 51 position on wiring board 1 is also
Can not cross, use the mode being independently arranged, as long as being capable of the first package cavity 5 and the second encapsulation
Chamber 4 connects with external environment condition respectively.
The acoustic aperture passage 51 of point chamber encapsulating structure of the second integrated sensor equally uses in Fig. 3
Structure, is i.e. arranged inside PCB substrate 11, or uses the structure in Fig. 4, and i.e. acoustic aperture passage 51 is by PCB
Outgassing groove 111 and the connecting plate 12 of substrate 11 surround.
As it is shown in figure 5, this utility model embodiment provides point chamber encapsulation knot of the third integrated sensor
Structure, its housing includes that external shell 13 and inner shell 14, external shell 13 and inner shell 14 all use
Basin assembling structure, it is internal that inner shell 14 is nested in external shell 13, and inner shell 14 and wiring board 1 form the
One package cavity 5, external shell 13 and inner shell 14 and wiring board 1 form the second package cavity 4, this
Dividing chamber form is nested point of cavity configuration.The through hole 41 of the second package cavity 4 is arranged on external shell 13, excellent
Environmental sensor 9 is just arranged by choosing.Meanwhile, the outlet 512 of acoustic aperture passage 51 is arranged on the second encapsulation
On the inner plate surface of the wiring board 1 at chamber 4 place, by acoustic aperture passage 51 by the first package cavity 5 and the second envelope
Room 4 of behaveing affectedly connects, then MEMS chip 7 is connected with external environment condition by through hole 41.Preferably, through hole
The size of 41 can suitably increase, to improve the speed of environmental sensor 9 perception external environment condition further.
As shown in figure 5 and figure 7, the wiring board 1 of point chamber encapsulating structure of the third integrated sensor only includes
PCB substrate 11, it is internal that acoustic aperture passage 51 is arranged at PCB substrate 11.Or wiring board 1 includes PCB substrate
11 and connecting plate 12, as shown in Figure 8, its structure is identical with Fig. 1, Fig. 3, the description seen above,
Do not repeat them here.
As shown in Figure 6, this utility model embodiment provides point chamber encapsulation knot of the 4th kind of integrated sensor
Structure, its point of chamber form uses nested point of cavity configuration equally, with point chamber encapsulation knot of the third integrated sensor
Unlike structure, the through hole 41 of the second package cavity 4 is opened in the wiring board 1 corresponding to the second package cavity 4
On.The outlet 512 of acoustic aperture passage 51 preferably crosses with through hole 41 and connects, simple in construction, acoustic aperture passage 51
Directly connected with external environment condition by through hole 41, air-flow or dust etc. can be avoided to be directly entered first simultaneously
Package cavity 5.Certainly, the through hole 41 position on wiring board 1 and the outlet 512 of acoustic aperture passage 51 are at circuit
Position on plate 1 can also be without crossing, and uses the mode being independently arranged, as long as being capable of the first package cavity
Room 5 connects with external environment condition respectively with the second package cavity 4.
The acoustic aperture passage 51 of point chamber encapsulating structure of the 4th kind of integrated sensor equally uses in Fig. 7
Structure, is i.e. arranged inside PCB substrate 11, or uses the structure in Fig. 8, and i.e. acoustic aperture passage 51 is by PCB
Outgassing groove 111 and the connecting plate 12 of substrate 11 surround.
The connecting plate 12 of point chamber encapsulating structure of above four kinds of integrated sensors be silica glass plate, metallic plate or
PCB material plate, as long as acoustic aperture passage 51 can be surrounded with outgassing groove 111 and support MEMS chip 7,
It is not limited to the material cited by the present embodiment.
Specifically, the quantity of the environmental sensor 9 of above-mentioned four kinds of mikes is one or more, environmentally sensitive
Device 9 is one or more in pressure transducer, temperature sensor, humidity sensor or gas sensor.
Functional requirement with specific reference to point chamber encapsulating structure of integrated sensor selects suitable environmental sensor 9.And
It is not limited to the kind of sensor cited by the present embodiment.
In this specification, each embodiment uses the mode gone forward one by one to describe, and each embodiment stresses
Being the difference with other embodiments, between each embodiment, identical similar portion sees mutually.
Described above to the disclosed embodiments, makes professional and technical personnel in the field be capable of or uses
This utility model.Multiple amendment to these embodiments will be aobvious for those skilled in the art
And be clear to, generic principles defined herein can be without departing from spirit or scope of the present utility model
In the case of, realize in other embodiments.Therefore, this utility model is not intended to be limited to institute herein
These embodiments shown, and it is to fit to consistent with principles disclosed herein and features of novelty the widest
Scope.
Claims (10)
1. a point chamber encapsulating structure for integrated sensor, including MEMS chip (7), ASIC core
Sheet (6), wiring board (1), housing and environmental sensor (9)；Described housing and described wiring board (1)
Form packaging body, there is in described packaging body the first package cavity (5) and the second package cavity being isolated from each other
Room (4)；Described MEMS chip (7) and described asic chip (6) are positioned at described first package cavity
Room (5), and be fixed on described wiring board (1)；Described environmental sensor (9) is positioned at described second
In package cavity (4), and it is fixed on described wiring board (1)；Described second package cavity (4) sets
It is equipped with the through hole (41) connected with external environment condition；It is characterized in that, described wiring board (1) is internal to be arranged
Sound hole path (51), the import (511) of described acoustic aperture passage (51) is just to described MEMS core
Connect with described first package cavity (4), the outlet (512) of described acoustic aperture passage (51) sheet (7)
Connect with described second package cavity (4).
Point chamber encapsulating structure of integrated sensor the most according to claim 1, it is characterised in that institute
State through hole (41) to be arranged on the described housing corresponding to described second package cavity (4).
Point chamber encapsulating structure of integrated sensor the most according to claim 1, it is characterised in that institute
State through hole (41) to be arranged on the wiring board (1) corresponding to described second package cavity (4), described
The outlet (512) of acoustic aperture passage (51) crosses with described through hole (41) and connects.
Point chamber encapsulating structure of integrated sensor the most according to claim 1, it is characterised in that institute
Stating wiring board (1) is PCB substrate (11), and described acoustic aperture passage (51) is arranged at described PCB base
Plate (11) is internal.
Point chamber encapsulating structure of integrated sensor the most according to claim 1, it is characterised in that institute
State wiring board (1) and include PCB substrate (11) and connecting plate (12), described PCB substrate (11)
Inner plate surface on be provided with outgassing groove (111), described connecting plate (12) is covered in described outgassing groove (111)
Go up and be fixed in described PCB substrate (11), described connecting plate (12) and described outgassing groove (111)
Surround described acoustic aperture passage (51).
Point chamber encapsulating structure of integrated sensor the most according to claim 5, it is characterised in that institute
Stating connecting plate (12) is silica glass plate, metallic plate or PCB material plate.
7. according to point chamber encapsulating structure of the integrated sensor described in any one of claim 1-6, its feature
Being, described housing includes top board (3), hollow frame (2) and dividing plate (8)；Described hollow frame
(2) two ends are fixed with described wiring board (1) and described top board (3) respectively, form described packaging body,
Described packaging body is separated into described first package cavity (5) and described second encapsulation by described dividing plate (8)
Chamber (4).
Point chamber encapsulating structure of integrated sensor the most according to claim 7, it is characterised in that institute
State top board (3) to be pcb board or be molded into template.
9. according to point chamber encapsulating structure of the integrated sensor described in any one of claim 1-6, its feature
Being, described housing includes external shell (13) and inner shell (14)；Described inner shell (14)
Described first package cavity (5), described external shell (13), institute is formed with described wiring board (1)
State inner shell (14) and described wiring board (1) forms described second package cavity (4).
10. according to point chamber encapsulating structure of the integrated sensor described in any one of claim 1-6, its feature
Being, described environmental sensor (9) is pressure transducer, temperature sensor, humidity sensor or gas
One or more in sensor.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620366940.7U CN205622876U (en) | 2016-04-27 | 2016-04-27 | Integrated sensor's branch chamber packaging structure |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620366940.7U CN205622876U (en) | 2016-04-27 | 2016-04-27 | Integrated sensor's branch chamber packaging structure |
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| CN205622876U true CN205622876U (en) | 2016-10-05 |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105721998A (en) * | 2016-04-27 | 2016-06-29 | 歌尔声学股份有限公司 | Separated cavity packaging structure of integrated sensor |
| CN107200300A (en) * | 2017-04-26 | 2017-09-26 | 歌尔股份有限公司 | MEMS and encapsulating structure preparation method |
| CN116986548A (en) * | 2023-09-26 | 2023-11-03 | 苏州敏芯微电子技术股份有限公司 | Packaging structure of sensing sensor and electronic equipment |
-
2016
- 2016-04-27 CN CN201620366940.7U patent/CN205622876U/en active Active
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105721998A (en) * | 2016-04-27 | 2016-06-29 | 歌尔声学股份有限公司 | Separated cavity packaging structure of integrated sensor |
| CN107200300A (en) * | 2017-04-26 | 2017-09-26 | 歌尔股份有限公司 | MEMS and encapsulating structure preparation method |
| CN107200300B (en) * | 2017-04-26 | 2023-07-21 | 潍坊歌尔微电子有限公司 | MEMS device and packaging structure manufacturing method |
| CN116986548A (en) * | 2023-09-26 | 2023-11-03 | 苏州敏芯微电子技术股份有限公司 | Packaging structure of sensing sensor and electronic equipment |
| CN116986548B (en) * | 2023-09-26 | 2023-12-01 | 苏州敏芯微电子技术股份有限公司 | Packaging structure of sensing sensor and electronic equipment |
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