WO2022188524A1 - Packaging module, packaging process, and electronic device - Google Patents

Abstract

A packaging module (100), a packaging process, and an electronic device. The packaging module (100) comprises a substrate (1), a housing (2), a chip assembly (3) and a sealing pad (5). The substrate (1) is provided with a first air hole (11); the housing (2) is disposed on the substrate (1), and the housing (2) and the substrate (1) together define a first accommodating cavity (232) and a second accommodating cavity (233) which are spaced apart from each other; the first air hole (11) is communicated with the first accommodating cavity (232); the housing (2) is provided with a second air hole (231) communicated with the second accommodating cavity (233); the chip assembly (3) comprises a first chip (31) and a second chip (32); the first chip (31) is disposed in the first accommodating cavity (232) and is spaced apart from the first air hole (11); the second chip (32) is disposed in the second accommodating cavity (233); the first chip (31) and the second chip (32) are electrically connected to the substrate (1) by means of gold wires (4), respectively; the sealing pad (5) is disposed on the housing (2) and surrounds the second air hole (231), and the sealing pad (5) is adapted to be connected to a terminal system.

Description

Packaging modules, packaging processes and electronic equipment

This application claims the priority of the Chinese patent application filed on March 9, 2021 with application number 202110257461.7, the entire contents of which are incorporated herein by reference.

technical field

The present application relates to the technical field of packaging structures, and in particular, to a packaging module, a packaging process for the packaging module, and an electronic device using the packaging module.

Background technique

Air pressure is a physical quantity closely related to people's daily life. Air pressure data can be used to detect vertical changes in altitude for motion monitoring, indoor navigation and auxiliary weather forecasting. Therefore, sensors based on the principle of air pressure are widely used in smart wearables and smart homes, etc. field.

As the requirement of waterproofness gradually becomes the standard of terminal products (especially in wearable terminals), the application of waterproof air pressure sensors in terminals, and the air tightness test of terminals before leaving the factory to ensure the normal waterproof function has become a must. In the related art, when the air pressure sensor is integrated with the terminal device, there are problems such as poor sealing performance, which reduces the sealing performance of the air pressure sensor, resulting in poor user experience.

technical problem

The main purpose of this application is to provide a packaging module, packaging process and electronic equipment, aiming to provide a packaging module that effectively improves sealing performance when integrated with a terminal system. The packaging module not only improves sealing performance, but also improves the user experience.

technical solutions

In order to achieve the above purpose, the present application proposes a packaging module, the packaging module includes:

a substrate, the substrate is provided with a first air hole;

an outer casing, the outer casing is arranged on the base plate, and is enclosed with the base plate to form a first cavity and a second cavity arranged at intervals, the first air hole is communicated with the first cavity, and the outer shell is provided with There is a second air hole communicated with the second cavity;

A chip assembly, the chip assembly includes a first chip and a second chip, the first chip is disposed in the first cavity and spaced apart from the first air hole, and the second chip is disposed in the first cavity In the second cavity, the first chip and the second chip are electrically connected to the substrate through gold wires, respectively; and

a sealing gasket, which is arranged on the casing and surrounds the second air hole, and is used for connecting with the terminal system.

In one embodiment, the packaging module further includes a dustproof net disposed between the sealing gasket and the casing, and the dustproof net covers the second air hole.

In one embodiment, the packaging module further includes a waterproof membrane disposed between the dustproof net and the housing, and the waterproof membrane covers the second air hole;

Or, the packaging module further includes protective glue, and the protective glue is filled in the second cavity and covers the second chip.

In one embodiment, the housing includes:

a surrounding plate, the surrounding plate is arranged on the periphery of the substrate and is arranged around the first chip, the second chip and the first air hole;

A spacer, the spacer is arranged on the substrate and is located between the first chip and the second chip, and the spacer and the surrounding plate are enclosed to form first grooves and first grooves arranged at intervals. two grooves, so that the first chip is located in the first groove and is spaced apart from the first air hole, and the second chip is located in the second groove; and

a cover plate, the cover plate covers the notches of the first groove and the second groove, and encloses the first cavity and the second cavity, and the cover plate corresponds to The second groove is provided with the second air hole, and the sealing gasket is disposed on the side of the cover plate facing away from the substrate through adhesive.

In one embodiment, the cover plate, the enclosure plate and the partition plate are integrally formed;

And/or, the material of the enclosure plate, the partition plate and the cover plate is metal material, FR4 material, BT material or ceramic material;

And/or, the substrate is FR4, BT or ceramic;

And/or, the first chip and the second chip are ASIC chip+MEMS chip or integrated single chip;

And/or, the enclosure plate and the separator are connected to the substrate through solder paste, conductive glue or epoxy glue;

And/or, the cover plate is connected to the enclosure plate and the partition plate through solder paste, conductive glue or epoxy glue;

And/or, the back glue is hot pressing glue or pressure sensitive glue.

The present application also proposes a packaging process for the above-mentioned packaging module, and the packaging process includes the following steps:

making first air holes on the substrate;

mounting the first chip and the second chip on the substrate at intervals, so that both the first chip and the second chip are spaced from the first air hole;

A second air hole is made on the casing, the casing is mounted on the base plate, and the casing is enclosed with the base plate to form a first cavity and a second cavity arranged at intervals, so that the first air hole communicates with the first cavity a cavity, the second air hole communicates with the second cavity, the first chip is accommodated in the first cavity, and the second chip is accommodated in the second cavity;

A sealing gasket is attached to the casing and arranged around the second air hole.

In one embodiment, before the step of attaching the sealing gasket to the casing and arranging around the second air hole, the method further includes:

Coating back glue on the outer wall of the casing, so that the back glue is arranged around the second air hole;

A dust-proof net is pasted on the side of the adhesive tape away from the casing, so that the dust-proof net covers the second air hole;

A back glue is applied on the side of the dust-proof net facing away from the casing, so that the back glue is arranged around the second air hole.

In one embodiment, before the step of pasting a dustproof net on the side of the adhesive that is away from the casing, so that the dustproof net covers the second air hole, the method further includes:

A waterproof film is pasted on the side of the back glue away from the casing, so that the waterproof film covers the second air hole;

A back glue is applied on the side of the waterproof membrane facing away from the casing, so that the back glue is arranged around the second air hole.

In one embodiment, the outer shell includes a surrounding plate, a partition plate and a cover plate, the second air hole is formed on the outer shell, the outer shell is mounted on the substrate, and is enclosed with the A first cavity and a second cavity, so that the first air hole communicates with the first cavity, the second air hole communicates with the second cavity, and the first chip is accommodated in the first cavity In the cavity, the step of accommodating the second chip in the second cavity includes:

attaching the enclosure plate to the substrate, so that the enclosure plate surrounds the first chip, the second chip and the first air hole;

The spacer is mounted on the substrate and is located between the first chip and the second chip, so that the spacer and the surrounding plate are enclosed to form first grooves and first grooves arranged at intervals. two grooves, so that the first chip is located in the first groove and is spaced apart from the first air hole, and the second chip is located in the second groove;

The second air hole is formed on the cover plate, the cover plate is attached to the end of the enclosure plate and the partition plate away from the base plate, and the cover plate is covered on the first groove and the first The notches of the two grooves make the cover plate, the enclosure plate, the partition plate and the base plate enclose the first cavity and the second cavity, and the second air hole communicates with each other. In the second cavity, the first air hole communicates with the first cavity.

In an embodiment, the second air hole is formed in the cover plate, the cover plate is attached to the end of the enclosure plate and the partition plate away from the base plate, and the cover plate is sealed on the The notches of the first groove and the second groove enable the cover plate, the enclosure plate, the partition plate and the base plate to enclose the first cavity and the second cavity , and the second air hole communicates with the second cavity, and before the step of connecting the first air hole with the first cavity, the method further includes:

Filling protective glue into the second groove through the dispensing valve to cover the second chip;

The protective glue is degassed in the form of vacuuming;

The protective adhesive is cured using a stepped heating process.

In one embodiment, the step of mounting the first chip and the second chip on the substrate at intervals includes:

Apply adhesive on one side of the substrate;

Paste the first chip and the second chip on the side of the adhesive facing away from the substrate, so that the first chip and the second chip are spaced apart;

reflowing the glue to solidify the glue;

The first chip and the second chip are respectively connected to the substrate by wire bonding with gold wires.

The present application also proposes an electronic device, which includes a device housing and the above-mentioned packaging module, wherein the packaging module is arranged on the device housing.

beneficial effect

In the packaging module of the technical solution of the present application, a casing is arranged on the substrate, so that the casing and the substrate are enclosed to form a first cavity and a second cavity arranged at intervals, so that the first air hole on the substrate is connected with the first cavity, and the casing is The second air hole is communicated with the second cavity, and the first chip of the chip assembly is set in the first cavity, so that the first chip can detect the external environment data through the first air hole, and the second chip of the chip assembly is set in the first cavity. in the second cavity, so that the second chip can detect the external environment data through the second air hole, and further, by disposing a sealing gasket on the casing, the sealing gasket is arranged around the second air hole, so that the sealing gasket is used to connect with the terminal system, so that it can be The sealing gasket is integrated with the terminal system to effectively improve the sealing performance of the package module. The packaging module proposed in the present application not only improves its own sealing performance, but also can be sealed and integrated with the terminal system through the sealing gasket, in addition to measuring the external atmospheric pressure, it also has the function of measuring the internal pressure value of the terminal, which effectively improves the user's sense of experience.

Description of drawings

In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the following briefly introduces the accompanying drawings required for the description of the embodiments or the prior art. Obviously, the drawings in the following description are only These are some embodiments of the present application. For those of ordinary skill in the art, other drawings can also be obtained according to the structures shown in these drawings without any creative effort.

1 is a schematic structural diagram of a packaging module in an embodiment of the application;

2 is a schematic structural diagram of a packaging module in another embodiment of the present application;

3 is a schematic flowchart of a packaging process of a packaging module according to an embodiment of the application;

4 is a schematic flowchart of a packaging process of a packaging module according to another embodiment of the present application;

FIG. 5 is a schematic structural diagram of the packaging module corresponding to steps 30 to 90 in FIG. 4;

6 is a schematic flowchart of a packaging process for a packaging module in another embodiment of the present application;

FIG. 7 is a schematic structural diagram of the packaging module corresponding to steps 31 to 33 in FIG. 6;

8 is a schematic flowchart of an embodiment of step S20 in FIGS. 4 and 6;

FIG. 9 is a schematic structural diagram of the packaging module corresponding to steps 21 to 24 in FIG. 8 .

Description of reference numbers:

label	name	label	name
100	Package module	233	second volume
1	substrate	3	chip assembly
11	first stomata	31	first chip
2	shell	32	second chip
twenty one	Hoarding	4	Gold Line
twenty two	Separator	5	gasket
221	first groove	6	dust filter
222	second groove	7	Waterproof membrane
twenty three	cover	8	protective glue
231	second stomata	9	Adhesive
232	first volume

The realization, functional characteristics and advantages of the purpose of the present application will be further described with reference to the accompanying drawings in conjunction with the embodiments.

Embodiments of the present invention

The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative work fall within the protection scope of the present application.

It should be noted that all directional indications (such as up, down, left, right, front, back, etc.) in the embodiments of the present application are only used to explain the relationship between various components under a certain posture (as shown in the accompanying drawings). The relative positional relationship, the movement situation, etc., if the specific posture changes, the directional indication also changes accordingly.

At the same time, the meaning of "and/or" or "and/or" in the whole text is that it includes three schemes, taking "A and/or B" as an example, including scheme A, scheme B, or scheme A and B at the same time satisfied plan.

In addition, descriptions such as "first", "second", etc. in this application are only for descriptive purposes, and should not be construed as indicating or implying their relative importance or implicitly indicating the number of indicated technical features. Thus, a feature delimited with "first", "second" may expressly or implicitly include at least one of that feature. In addition, the technical solutions between the various embodiments can be combined with each other, but must be based on the realization by those of ordinary skill in the art. When the combination of technical solutions is contradictory or cannot be realized, it should be considered that the combination of such technical solutions does not exist. , is not within the scope of protection claimed in this application.

Air pressure is a physical quantity closely related to people's daily life. Air pressure data can be used to detect vertical changes in altitude for motion monitoring, indoor navigation and auxiliary weather forecasting. Therefore, sensors based on the principle of air pressure are widely used in smart wearables and smart homes, etc. field.

As the requirement of waterproofness gradually becomes the standard of terminal products (especially in wearable terminals), the application of waterproof air pressure sensors in terminals, and the air tightness test of terminals before leaving the factory to ensure the normal waterproof function has become a must. In the related art, when the air pressure sensor is integrated with the terminal device, there are problems such as poor sealing performance, which reduces the sealing performance of the air pressure sensor, resulting in poor user experience.

Based on the above-mentioned concepts and problems, the present application proposes a package module 100 , and the package module 100 may be an air pressure sensor or other types of sensors, which are not limited herein. It can be understood that the packaging module 100 can be applied to an electronic device, and the electronic device can be a smart wearable device, which is not limited herein.

Please refer to FIG. 1 , FIG. 2 , FIG. 5 , FIG. 7 and FIG. 9 , in the embodiment of the present application, the packaging module 100 includes a substrate 1 , a housing 2 , a chip assembly 3 and a sealing gasket 5 , wherein the substrate 1 is provided with a first air hole 11; the casing 2 is provided on the base plate 1, and is enclosed with the base plate 1 to form a first cavity 232 and a second cavity 233 arranged at intervals, the first air hole 11 is communicated with the first cavity 232, and the shell 2 is provided with a second air hole 231 communicating with the second cavity 233; the chip assembly 3 includes a first chip 31 and a second chip 32, the first chip 31 is arranged in the first cavity 232 and is spaced from the first air hole 11 The second chip 32 is disposed in the second cavity 233 , the first chip 31 and the second chip 32 are respectively electrically connected to the substrate 1 through the gold wire 4 ; the sealing gasket 5 is disposed in the casing 2 and is disposed around the second air hole 231 , the gasket 5 is configured to connect with the end system.

In this embodiment, the substrate 1 is configured to mount, fix and support components such as the casing 2 , the sealing pad 5 , and the chip assembly 3 , and the structure of the substrate 1 can be optionally a plate-like structure. It can be understood that the substrate 1 can be selected as a circuit board. The substrate 1 is a PCB board, and the PCB board is printed with circuits to realize corresponding electrical functions, and can be selected and designed according to actual needs. The PCB board is composed of a multi-layer structure, such as a substrate layer, one or more copper foil layers, and one or more solder mask ink layers, which are selected according to the actual scene. In one embodiment, the substrate 1 can be selected from FR4, BT or ceramic, which is not limited herein.

In order to make the first chip 31 and the second chip 32 of the chip assembly 3 mounted on the substrate 1 and can be electrically connected with the circuit layer inside the substrate 1 , in this embodiment, one side surface of the substrate 1 is provided with There are pads. It can be understood that the pads are configured to be electrically connected to the chip component 3, and the pads may have structures such as exposed copper, contacts, pins, or solder pins, which are not limited herein.

In this embodiment, a first cavity 232 and a second cavity 233 are formed by enclosing the casing 2 and the substrate 1 at intervals, so that the first chip 31 is disposed in the first cavity 232 and is connected with the first air hole. 11 are arranged at intervals, the second chip 32 is arranged in the second cavity 233, and is arranged at an interval with the second air hole 231, so that the first chip 31 and the second chip 32 are respectively installed in the two spaced spaces, so that the first chip 31 The first air hole 11 and the second air hole 231 respectively separate the environmental data of different regions from the second chip 32 , so as to avoid problems such as mutual interference and improve the detection accuracy of the packaging module 100 .

Of course, the first chip 31 and the second chip 32 of the chip assembly 3 are integrated into one package module 100 , thereby improving the integration performance and multi-functionality of the package module 100 . It can be understood that the first chip 31 and the second chip 32 of the chip assembly 3 can be mounted on the surface of the substrate 1 by using the SMT process, which is not limited herein.

In this embodiment, the first chip 31 and the second chip 32 of the chip assembly 3 can be an analysis chip or an integrated single chip, and for a discrete chip (ie, an ASIC chip + a MEMS chip), the ASIC chip and the MEMS chip can be placed side by side; The ASIC chip and the MEMS chip may also be stacked, that is, the ASIC chip is first pasted on the substrate 1, and then the MEMS chip is pasted on the ASIC chip, which is not limited here. For the integrated single chip, the chip only needs to be pasted on the substrate 1, which is not limited here.

It can be understood that, in order to enable the data signals detected by the first chip 31 and the second chip 32 of the chip assembly 3 to be transmitted through the substrate 1 smoothly, the first chip 31 and the second chip 32 of the chip assembly 3 can use gold wires to realize the substrate 1 . The first chip 31 and the second chip 32 are connected by wire bonding to realize the connection, and the first chip 31 and the second chip 32 can also be connected by wire bonding by using a gold wire, which is not limited herein.

In this embodiment, the casing 2 can be made of metal material, plastic material or ceramic material, which is not limited herein.

In the packaging module 100 of the present application, the casing 2 is disposed on the substrate 1, so that the casing 2 and the substrate 1 enclose the first cavity 232 and the second cavity 233 arranged at intervals, so that the first air hole 11 on the substrate 1 and the The first cavity 232 is connected, the second air hole 231 on the housing 2 communicates with the second cavity 233, and the first chip 31 of the chip assembly 3 is set in the first cavity 232, so that the first chip 31 passes through the first cavity 232. An air hole 11 detects the external environment data, and the second chip 32 of the chip assembly 3 is arranged in the second cavity 233 , so that the second chip 32 detects the external environment data through the second air hole 231 , and further through the sealing of the casing 2 The gasket 5 is placed around the second air hole 231 , so that the gasket 5 is used to connect with the terminal system, so that the gasket 5 can be sealed and integrated with the terminal system, and the sealing performance of the packaging module 100 can be effectively improved. The packaging module 100 proposed in the present application not only improves its own sealing performance, but also can be sealed and integrated with the terminal system through the sealing gasket 5 to measure the external atmospheric pressure and also have the function of measuring the internal pressure value of the terminal, which effectively improves the user experience. sense.

In one embodiment, as shown in FIG. 1 , FIG. 2 and FIG. 5 , the packaging module 100 further includes a dustproof net 6 disposed between the sealing gasket 5 and the casing 2 , and the dustproof net 6 covers the second air hole 231 set up.

It can be understood that by arranging the dust-proof net 6 to cover the second air hole 231 with the dust-proof net 6 , it is possible to effectively prevent dust or debris from entering the second cavity 233 through the second air hole 231 and affecting the effect of the second chip 32 . performance. In this embodiment, the dustproof net 6 can be fixedly connected to the housing 2 , for example, by welding or integral molding, so as to improve the connection stability of the dustproof net 6 . The dustproof net 6 can also be disposed on the housing 2 by detachable connection methods such as snap connection, plug fit, screw connection or pin connection, so as to improve the convenience of disassembly and assembly of the dustproof net 6 .

In this embodiment, the dustproof net 6 can be connected to the housing 2 through the adhesive 9. In one embodiment, the adhesive can be hot-pressed adhesive or pressure-sensitive adhesive, which is not limited here. It can be understood that the dust filter 6 can be arranged on the outer wall of the casing 2 facing away from the substrate 1, can also be arranged on the hole wall of the second air hole 231, and can also be arranged on the side of the casing 2 facing the substrate 1, and cover the second air hole. 231, which is not limited here.

Of course, in other embodiments, a dust filter 6 may also be provided at the first air hole 11 to effectively prevent dust or debris from entering the first cavity 232 from the first air hole 11 and affect the performance of the first chip 31 .

In one embodiment, as shown in FIG. 2 and FIG. 5 , the packaging module 100 further includes a waterproof membrane 7 disposed between the dustproof net 6 and the casing 2 , and the waterproof membrane 7 is disposed to cover the second air hole 231 .

It can be understood that by providing the waterproof membrane 7, the second air hole 231 is covered by the waterproof membrane 7 to effectively prevent water vapor and water droplets from entering the second cavity 233 from the second air hole 231 to affect the performance of the second chip 32. In this embodiment, the waterproof membrane 7 can be fixedly connected to the casing 2, for example, by welding or integral molding, so as to improve the connection stability of the waterproof membrane 7. The waterproof membrane 7 can also be disposed on the housing 2 by detachable connection methods such as snap connection, plug fit, screw connection or pin connection, so as to improve the convenience of disassembly and assembly of the waterproof membrane 7 .

In this embodiment, the waterproof membrane 7 can be connected to the housing 2 through a back glue 9. In one embodiment, the back glue 9 can be a hot-press glue or a pressure-sensitive glue, which is not limited here. It can be understood that the waterproof membrane 7 can be disposed on the outer wall of the casing 2 facing away from the substrate 1 , can also be disposed on the hole wall of the second air hole 231 , and can also be disposed on the side of the casing 2 facing the substrate 1 , and cover the second air hole 231 . , which is not limited here.

In one embodiment, the waterproof membrane 7 is attached to the outer wall of the housing 2 through the adhesive 9, and covers the second air hole 231; And cover the second air hole 231; the gasket 5 is attached to the side of the dustproof net 6 facing away from the waterproof membrane 7 through the back glue 9, and is arranged around the second air hole 231, so that the gasket 5 is convenient to connect with the terminal system, so that the Through the second air hole 231, the packaging module 100 can check not only the environmental data of the external atmosphere, but also the environmental data inside the terminal system, which is not limited herein.

Of course, in other embodiments, a waterproof membrane 7 can also be provided at the first air hole 11 to effectively prevent water vapor and water droplets from entering the first cavity 232 from the first air hole 11 and affect the performance of the first chip 31 .

In this embodiment, the sealing gasket 5 can be selected from a structure such as a sealing ring, a sealing ring, and the like, and the sealing gasket 5 can be selected from an elastic rubber material, which is not limited herein. It can be understood that when the casing 2 is a metal casing, the casing 2 can be connected to the substrate 1 through solder paste or conductive glue; when the casing 2 is a plastic casing, the casing 2 can be connected to the substrate 1 through epoxy glue, which is not limited here.

In one embodiment, as shown in FIGS. 1 and 7 , the packaging module 100 further includes a protective glue 8 , and the protective glue 8 is filled in the second cavity 233 and covers the second chip 32 .

It can be understood that by providing the protective glue 8, the protective glue 8 is filled in the second cavity 233 and covers the second chip 32, so that the second chip 32 is protected by the protective glue 8, thereby preventing the second chip 32 from being exposed to air. , humidity, and other external influences, thereby affecting its performance. In one embodiment, the protective glue 8 may be plastic sealing glue or waterproof glue, which is not limited herein.

Of course, in other embodiments, the protective glue 8 can also be filled in the first cavity 232 , and the protective glue 8 covers the first chip 31 , which can effectively prevent air, humidity and other external factors from affecting the first chip 31 . Performance is not limited here.

In this embodiment, the casing 2 can be selected as a cylindrical structure with two open ends, and one end of the casing 2 is connected to the substrate 1, so that the formed first cavity 232 and the second cavity 233 have an opening, which is convenient The protective glue 8 is filled through the openings of the first cavity 232 and the second cavity 233 to improve convenience. Of course, in other embodiments, the casing 2 can also adopt a cover body or a cylindrical structure with one end open. At this time, the first cavity 232 and the second cavity 233 enclosed by the casing 2 and the substrate 1 are sealed cavities. The sealing cavity may be filled with protective glue 8 or not filled with protective glue 8, which is selected according to actual needs, which is not limited herein.

In an embodiment, as shown in FIG. 1 , FIG. 2 , FIG. 5 and FIG. 7 , the housing 2 includes a surrounding plate 21 , a partition plate 22 and a cover plate 23 , wherein the surrounding plate 21 is provided on the periphery of the base plate 1 and surrounds the The first chip 31 , the second chip 32 and the first air hole 11 are arranged; the spacer 22 is arranged on the substrate 1 and is located between the first chip 31 and the second chip 32 , and the spacer 22 and the surrounding plate 21 are enclosed to form a spaced arrangement The first groove 221 and the second groove 222 are formed, so that the first chip 31 is located in the first groove 221 and is spaced from the first air hole 11, and the second chip 32 is located in the second groove 222; the cover plate 23 Covering the notch of the first groove 221 and the second groove 222, and enclosing the first cavity 232 and the second cavity 233, the cover plate 23 is provided with a second air hole 231 corresponding to the second groove 222, The sealing gasket 5 is disposed on the side of the cover plate 23 facing away from the substrate 1 through the adhesive 9 .

In this embodiment, as shown in FIG. 1 and FIG. 7 , the enclosure plate 21 has a cylindrical structure with two open ends, and one end of the enclosure plate 21 is connected to the substrate 1 , so that the enclosure plate 21 surrounds the first chip 31 and the second chip 32 and the first air hole 11 are provided. The spacer 22 can be optionally a plate-like structure. The spacer 22 is arranged in the cavity formed by the enclosure plate 21 and the substrate 1 and is connected to the substrate 1. The spacer 22 is located between the first chip 31 and the second chip 32 , so that the partition plate 22 and the enclosure plate 21 are enclosed to form a first groove 221 and a second groove 222 arranged at intervals. At this time, the first chip 31 is located in the first groove 221 and is spaced from the first air hole 11. The second chip 32 is located in the second groove 222 . The cover plate 23 covers the notches of the first groove 221 and the second groove 222, and encloses the first cavity 232 and the second cavity 233, that is, the cover plate 23, the surrounding plate 21 and the partition plate 22 One end away from the substrate 1 is connected.

It can be understood that the material of the enclosure plate 21 is metal material, FR4 material, BT material or ceramic material. The material of the separator 22 is metal material, FR4 material, BT material or ceramic material. The material of the cover plate 23 is metal material, FR4 material, BT material or ceramic material.

In this embodiment, when the enclosure plate 21 is made of metal material, the enclosure plate 21 is connected to the substrate 1 through solder paste or conductive adhesive, and when the enclosure plate 21 is made of non-metallic material, the enclosure plate 21 is connected to the substrate 1 through epoxy glue. When the spacer 22 is made of metal material, the spacer 22 is connected to the substrate 1 through solder paste or conductive adhesive, and when the spacer 22 is made of non-metallic material, the spacer 22 is connected to the substrate 1 through epoxy glue. When the enclosure plate 21, the partition plate 22 and the cover plate 23 are all made of metal, the cover plate 23 is connected to the enclosure plate 21 and the partition plate 22 through solder paste or conductive glue. When made of metal, the cover plate 23 is connected to the enclosure plate 21 and the partition plate 22 through epoxy glue, which is not limited herein.

In one embodiment, as shown in FIG. 2 and FIG. 5 , the cover plate 23 , the enclosure plate 21 and the partition plate 22 are integrally formed. It can be understood that, by setting in this way, the structural strength of the casing 2 is improved, and the processing steps of the casing 2 are simplified at the same time.

As shown in FIG. 3 , the present application also proposes a packaging process for the above-mentioned packaging module 100 , and the packaging process includes the following steps:

Step S10 : forming the first air hole 11 on the substrate 1 ;

Step S20 : mounting the first chip 31 and the second chip 32 on the substrate 1 at intervals, so that the first chip 31 and the second chip 32 are spaced apart from the first air hole 11 ;

Step S30 : forming a second air hole 231 on the casing 2 , mounting the casing 2 on the substrate 1 , and enclosing the casing 2 with the substrate 1 to form a first cavity 232 and a second cavity 233 arranged at intervals, so that the first air hole 11 The first cavity 232 is communicated, the second air hole 231 is communicated with the second cavity 233, the first chip 31 is accommodated in the first cavity 232, and the second chip 32 is accommodated in the second cavity 233;

Step S90 : the sealing gasket 5 is mounted on the casing 2 and arranged around the second air hole 231 .

In this embodiment, the structure of the substrate 1 can be optionally a plate-like structure, for example, the substrate 1 is FR4, BT or ceramic, which is not limited herein. It can be understood that the substrate 1 can be selected as a circuit board. The substrate 1 is a PCB board, and the PCB board is printed with circuits to realize corresponding electrical functions, and can be selected and designed according to actual needs. The PCB board is composed of a multi-layer structure, such as a substrate layer, one or more copper foil layers, and one or more solder mask ink layers, which are selected according to the actual scene.

It can be understood that the first air holes 11 are formed on the substrate 1 through a punching process. It can be understood that the first air hole 11 is a through hole, that is, the first air hole 11 is disposed through the substrate 1 . In this embodiment, by mounting the first chip 31 and the second chip 32 on the substrate 1 at intervals, both the first chip 31 and the second chip 32 are arranged at intervals from the first air hole 11 .

In this embodiment, the first chip 31 and the second chip 32 can be mounted on the surface of the substrate 1 by using the SMT process, which is not limited herein. In one embodiment, the first chip 31 and the second chip 32 may be an analysis chip or an integrated single chip, and for a discrete chip (ie, an ASIC chip + a MEMS chip), the ASIC chip and the MEMS chip may be placed side by side; the ASIC chip and the MEMS chip The chips can also be stacked, that is, the ASIC chip is first pasted on the substrate 1, and then the MEMS chip is pasted on the ASIC chip, which is not limited here. For the integrated single chip, the chip only needs to be pasted on the substrate 1, which is not limited here.

In one embodiment, as shown in FIG. 8 and FIG. 9 , step S20 : the step of mounting the first chip 31 and the second chip 32 on the substrate 1 at intervals includes:

Step S21: coating adhesive on one side of the substrate 1;

Step S22: pasting the first chip 31 and the second chip 32 on the side of the adhesive facing away from the substrate 1, so that the first chip 31 and the second chip 32 are spaced apart;

Step S23: reflow the adhesive to solidify the adhesive;

Step S24 : the first chip 31 and the second chip 32 are respectively connected to the substrate 1 by wire bonding with gold wires 4 .

In this embodiment, an adhesive is provided, and the adhesive can be coated on one side of the substrate 1 through a coating process or a dispensing process, and then the first chip 31 and the second chip 32 are attached to the adhesive facing away from the substrate 1 side, and the first chip 31 and the second chip 32 are arranged at intervals. It can be understood that the adhesive can be an adhesive used to bond the substrate 1 and the first chip 31 and the second chip 32, and the adhesive can also be solder paste or conductive adhesive.

It can be understood that when the adhesive is solder paste or conductive glue, the first chip 31 and the second chip 32 are electrically connected to the substrate 1 through the solder paste or conductive glue. When the adhesive is only used for bonding and fixing the first chip 31 and the second chip 32, the first chip 31 and the second chip 32 can be respectively bonded to the first chip 31 and the second chip 32 with the gold wire 4 by wire bonding. The substrate 1 is connected, so that the first chip 31 and the second chip 32 can be electrically connected to the substrate 1 through the gold wires 4 respectively.

In this embodiment, the adhesive can be cured by heating to play a reinforcing role. The reflow method can also be used to solidify the adhesive to achieve reinforcement, which is not limited here.

In this embodiment, holes are punched in the casing 2 through a punching process to manufacture the second air holes 231 . As shown in FIG. 2 and FIG. 5 , the casing 2 is mounted on the substrate 1 through the SMT process, so that the casing 2 and the substrate 1 are enclosed to form a first cavity 232 and a second cavity 233 arranged at intervals. An air hole 11 communicates with the first cavity 232 , the second air hole 231 communicates with the second cavity 233 , the first chip 31 is accommodated in the first cavity 232 , and the second chip 32 is accommodated in the second cavity 233 .

It can be understood that the housing 2 can be connected to the substrate 1 through solder paste or conductive glue, and at this time the housing 2 is a metal housing. Of course, in other embodiments, when the casing 2 is a plastic casing, the casing 2 is connected and fixed to the substrate 1 through epoxy glue. In this embodiment, two spaced groove structures are formed in the casing 2 , and the casing 2 is inverted on the substrate 1 so that the two groove structures cover the first chip 31 and the second chip 32 respectively.

In one embodiment, as shown in FIG. 1 , FIG. 2 , FIG. 5 and FIG. 7 , the housing 2 includes a surrounding plate 21 , a partition plate 22 and a cover plate 23 .

As shown in FIG. 6 and FIG. 7 , step S30 : forming a second air hole 231 on the casing 2 , attaching the casing 2 to the substrate 1 , and enclosing the casing 2 with the substrate 1 to form a first cavity 232 and a second cavity arranged at intervals The cavity 233 allows the first air hole 11 to communicate with the first cavity 232, the second air hole 231 to communicate with the second cavity 233, the first chip 31 is accommodated in the first cavity 232, and the second chip 32 is accommodated in the second cavity 233. Steps within chamber 233 include:

Step S31 : attaching the enclosure plate 21 to the substrate 1 so that the enclosure plate 21 surrounds the first chip 31 , the second chip 32 and the first air hole 11 ;

Step S32 : mount the spacer 22 on the substrate 1 between the first chip 31 and the second chip 32 , and enclose the spacer 22 and the surrounding plate 21 to form a first groove 221 and a second groove arranged at intervals. groove 222, so that the first chip 31 is located in the first groove 221, and is spaced from the first air hole 11, and the second chip 32 is located in the second groove 222;

Step S33 : forming the second air hole 231 in the cover plate 23 , attaching the cover plate 23 to the end of the enclosure plate 21 and the partition plate 22 away from the substrate 1 , and covering the grooves of the first groove 221 and the second groove 222 The cover plate 23, the enclosure plate 21, the partition plate 22 and the base plate 1 are enclosed to form a first cavity 232 and a second cavity 233, and the second air hole 231 communicates with the second cavity 233, and the first air hole 11 communicates with the second cavity 233. A cavity 232 .

In this embodiment, the enclosure plate 21 , the partition plate 22 and the cover plate 23 of the housing 2 are arranged in separate parts, the enclosure plate 21 has a cylindrical structure with openings at both ends, and the enclosure plate 21 can be connected to the substrate through solder paste or conductive adhesive. 1 To achieve a fixed connection, the enclosure plate 21 is made of metal at this time. Of course, when the enclosure plate 21 is made of plastic material, the enclosure plate 21 can be connected to the substrate 1 through epoxy glue. It can be understood that the surrounding plate 21 is arranged around the periphery of the substrate 1 to surround the first chip 31 , the second chip 32 and the first air hole 11 .

It can be understood that the spacer 22 can be optionally a plate-like structure, and the spacer 22 can be fixedly connected to the substrate 1 through solder paste or conductive adhesive, and at this time, the spacer 22 is made of metal material. Of course, when the spacer 22 is made of plastic material, the spacer 22 can be connected to the substrate 1 through epoxy glue.

In this embodiment, when the spacer 22 is mounted on the substrate 1 , the spacer 22 is located between the first chip 31 and the second chip 32 . The groove 221 and the second groove 222 are such that the first chip 31 is located in the first groove 221 and is spaced apart from the first air hole 11 , and the second chip 32 is located in the second groove 222 .

In one embodiment, the material of the cover plate 23 is metal material, FR4 material, BT material or ceramic material. The cover plate 23 can be fixedly connected to the enclosure plate 21 and the partition plate 22 through solder paste or conductive glue. At this time, the cover plate 23 , the enclosure plate 21 and the partition plate 22 are all made of metal. Of course, when the cover plate 23 , the enclosure plate 21 and the partition plate 22 are all made of plastic, the cover plate 23 can be connected to the enclosure plate 21 and the partition plate 22 through epoxy glue. In this embodiment, the cover plate 23 and the base plate 1 are arranged opposite and parallel to each other, and the enclosure plate 21 and the partition plate 22 are located between the cover plate 23 and the base plate 1 .

In one embodiment, as shown in FIG. 4 , FIG. 5 , FIG. 6 and FIG. 7 , step S90 : before the step of attaching the sealing gasket 5 to the casing 2 and setting around the second air hole 231 , the packaging process further includes: :

Step S40: coating the back glue 9 on the outer wall of the casing 2, so that the back glue 9 is arranged around the second air hole 231;

Step S70: Paste the dustproof net 6 on the side of the adhesive 9 away from the casing 2, so that the dustproof net 6 covers the second air hole 231;

Step S80 : coating the back glue 9 on the side of the dustproof net 6 facing away from the casing 2 , so that the back glue 9 is arranged around the second air hole 231 .

In this embodiment, the back glue 9 can be coated on the side of the cover plate 23 of the housing 2 facing away from the substrate 1 through a coating process or a glue dispensing process, so that the back glue 9 is arranged around the second air hole 231 . In one embodiment, the adhesive 9 is a hot-pressed adhesive or a pressure-sensitive adhesive.

It can be understood that the dustproof net 6 is attached to the side of the adhesive 9 away from the casing 2 by the SMT process, so that the dustproof net 6 covers the second air hole 231, which can effectively avoid dust and other debris from the second air hole 231. The air hole 231 entering the second cavity 233 affects the performance of the second chip 32 .

In this embodiment, in order to facilitate the mounting of the sealing gasket 5, a coating process or a glue dispensing process can be used to coat a layer of back glue 9 on the side of the dust filter 6 facing away from the casing 2, so that the back glue 9 surrounds The second air hole 231 is provided, that is, the back glue 9 is applied to the peripheral position of the dustproof net 6, so that the sealing gasket 5 is attached to the side of the back glue 9 away from the dustproof net 6 through the SMT process, so that the sealing gasket 5 surrounds The second air hole 231 is provided to facilitate the sealing and integration of the sealing gasket 5 with the terminal device.

In one embodiment, as shown in FIG. 4 and FIG. 5 , step S70: before the step of pasting the dustproof net 6 on the side of the adhesive 9 away from the casing 2 so that the dustproof net 6 covers the second air holes 231, The packaging process also includes:

Step S50': paste the waterproof membrane 7 on the side of the adhesive 9 away from the casing 2, so that the waterproof membrane 7 covers the second air hole 231;

Step S60': coating the back glue 9 on the side of the waterproof membrane 7 facing away from the casing 2, so that the back glue 9 is arranged around the second air hole 231.

In this embodiment, the waterproof membrane 7 is attached to the side of the adhesive 9 away from the casing 2 through the SMT process, so that the waterproof membrane 7 covers the second air hole 231 , which can effectively prevent water vapor, water droplets, etc. from passing through the second air hole 231 Entering the second cavity 233 affects the performance of the second chip 32 .

It can be understood that, in order to facilitate the installation of the dustproof net 6, a coating process or a glue dispensing process can be used to apply a layer of back glue 9 on the side of the waterproof membrane 7 away from the casing 2, so that the back glue 9 surrounds the second layer. The air holes 231 are provided, that is, the adhesive 9 is applied to the peripheral position of the waterproof membrane 7, so that the dustproof net 6 is attached to the side of the adhesive 9 away from the waterproof membrane 7 through the SMT process, so that the dustproof net 6 covers the first part. Two air holes 231 are provided to facilitate the dustproof net 6 and the waterproof membrane 7 to cover the second air holes 231 at the same time, so as to prevent dust or water vapor from entering the second cavity 233 through the second air holes 231 and affecting the performance of the second chip 32 .

In another embodiment, as shown in FIG. 6 and FIG. 7 , step S33 : forming the second air hole 231 in the cover plate 23 , attaching the cover plate 23 to the end of the enclosure plate 21 and the partition plate 22 away from the substrate 1 , and Cover the slots of the first groove 221 and the second groove 222, so that the cover plate 23, the surrounding plate 21, the partition plate 22 and the base plate 1 are enclosed to form the first cavity 232 and the second cavity 233, and the first cavity 232 and the second cavity 233 are formed. Before the step that the second air hole 231 communicates with the second cavity 233 and the first air hole 11 communicates with the first cavity 232, the packaging process further includes:

Step S51 : filling the second groove 222 with protective glue 8 through a glue dispensing valve to cover the second chip 32 ;

Step S52: degassing the protective glue 8 by vacuuming;

Step S53 : curing the protective adhesive 8 by adopting a step-type heating process.

In order to facilitate filling of the protective glue 8 in the second cavity 233 to cover the second chip 32 , in this embodiment, the cover plate 23 is attached to the end of the enclosure plate 21 and the partition plate 22 away from the substrate 1 , and seals the cover plate 23 . Before covering the openings of the first groove 221 and the second groove 222 , the protective glue 8 is filled into the second groove 222 through a glue dispensing valve, so that the protective glue 8 covers the second chip 32 .

It can be understood that the dispensing valve adopts a piezoelectric ceramic valve, and a piezoelectric valve of an automatic dispensing machine can be selected for bottom filling. The working principle of the piezoelectric valve of the automatic dispensing machine: the high-speed piezoelectric ceramic is used to swing the striker to the valve seat (nozzle insert), the liquid (under pressure) flows into the cavity between the striker and the nozzle, and the striker strikes the nozzle to produce droplets. At the initial moment of the piezoelectric valve of the automatic dispensing machine, the colloid fills the valve body channel, the upper part of the striker is pressed against the bottom of the nozzle by the weight of the colloid and seals the nozzle outlet, the piezoelectric brake is applied with a high level, and the piezoelectric brake extends laterally. long so that the piezo valve striker lifts up.

Then the nozzle of the piezoelectric valve of the automatic glue dispenser is opened, and the external air pressure drives the liquid to fill the gap of the valve body formed by the upward movement of the striker, and a certain amount of glue flows out of the nozzle. At this time, the piezoelectric brake is applied with low power Flat, piezo brake and rhombus zoom mechanism retract. At the same time, under the action of the spring restoring force, the striker hits the inner cavity of the nozzle at a high speed and seals the nozzle. The colloid is squeezed into the cavity in the nozzle and under the action of the inertial force, the striker continuously vibrates up and down, so as to realize fully automatic The high-speed spray dispensing of the glue dispenser can adjust the amplitude and frequency of the striker by changing the driving voltage amplitude, frequency, duty cycle, etc., and then realize the control of the spray performance of the glue drop.

The valve of the automatic glue dispenser adopts non-contact spray dispensing, which has high precision and powerful function, and can spray glue in narrow gaps.

In order to prevent the dispensing valve from filling the second groove 222 with the protective glue 8, since the air in the bottom wall of the second groove 222 cannot be removed in time, the air bubbles float to the upper surface of the protective glue 8 when the protective glue 8 is cured, thereby forming Defects affect the performance and aesthetics of the protective adhesive 8 . In this embodiment, the filled protective glue 8 is degassed by means of vacuuming, so that all the air bubbles in the protective glue 8 are discharged. It can be understood that the protective adhesive 8 is further cured by a stepped heating method, so as to ensure that the protective adhesive 8 completely covers the second chip 32 .

In one embodiment, as shown in FIG. 1 , FIG. 6 and FIG. 7 , the packaging process of the packaging module 100 proposed in the present application mounts the first chip 31 and the second chip 32 on the substrate 1 by mounting chips. On one side, wire bonding is used to connect the first chip 31 and the second chip 32 to the substrate 1 with the gold wire 4, and the enclosure plate 21 and the spacer 22 are mounted on the substrate 1, so that the first chip 31 is located on the spacer 22 In the first groove 221 formed by the enclosure plate 21, the second chip 32 is located in the second groove 222 formed by the partition plate 22 and the enclosure plate 21, and the protective glue 8 is poured into the In the second groove 222, the second chip 32 and the gold wire 4 are protected. Before the protective glue 8 is cured, it can be degassed by vacuuming, and during the curing process, a stepped heating process can be used. . Then, the cover plate 23 is pasted on the end of the enclosure plate 21 and the partition plate 22 away from the base plate 1 to cover the notches of the first groove 221 and the second groove 222, and enclose the first cavity 232 and the second cavity 232. Cavity 233. Then, the dustproof net 6 is attached to the side of the cover plate 23 facing away from the substrate 1 through the adhesive 9, and the second air hole 231 is covered, and the sealing gasket 5 is attached to the cover of the dustproof net 6 through the adhesive 9. One side of the board 23 and surrounds the second air hole 231, so that the sealing gasket 5 is convenient for connecting with the terminal equipment.

In another embodiment, as shown in FIG. 2 , FIG. 4 and FIG. 3 , the packaging process of the packaging module 100 proposed in the present application mounts the first chip 31 and the second chip 32 on the substrate 1 by mounting chips. On one side, wire bonding is used to connect the first chip 31 and the second chip 32 to the substrate 1 with the gold wire 4 , the shell 2 is mounted on the substrate 1, and is enclosed with the substrate 1 to form a first container arranged at intervals. cavity 232 and the second cavity 233, so that the first chip 31 is located in the first cavity 232, so that the second chip 32 is located in the second cavity 233, and then the waterproof film 7 is attached to the casing 2 through the adhesive 9. The cover plate 23 faces the side of the base plate 1 and covers the second air hole 231. The dustproof net 6 is attached to the side of the waterproof membrane 7 that faces away from the cover plate 23 of the housing 2 through the adhesive 9, and covers the second air hole 231. With the second air hole 231, the sealing gasket 5 is attached to the side of the dust filter 6 facing away from the cover plate 23 through the adhesive 9, and surrounds the second air hole 231, so that the sealing gasket 5 is convenient for connecting with the terminal device.

It can be understood that the package module 100 manufactured by the above two methods not only improves its own waterproof performance, but also can be sealed and integrated with the terminal system through the sealing gasket 5 to measure the external atmospheric pressure and also measure the internal pressure value of the terminal. function. Using this function in this way, a high-pressure air-tightness test process can be added outside the terminal before it leaves the factory, and whether the air-tightness of the whole machine is good can be judged by reading the change of the air pressure value inside the terminal.

The present application also provides an electronic device, the electronic device includes a device casing and an encapsulation module 100 , and the encapsulation module 100 is provided in the device casing. The specific structure of the packaging module 100 refers to the foregoing embodiments. Since the electronic device adopts all the technical solutions of the foregoing embodiments, it at least has all the functions brought by the technical solutions of the foregoing embodiments, which will not be described here. Repeat.

The above descriptions are only optional embodiments of the present application, and are not intended to limit the patent scope of the present application. Under the conception of the present application, any equivalent structural transformations made by the contents of the description and drawings of the present application, or direct/indirect application Other related technical fields are included in the scope of patent protection of this application.

Claims (12)

1. A packaging module, wherein the packaging module comprises:

   a substrate, the substrate is provided with a first air hole;

   an outer casing, the outer casing is arranged on the base plate, and is enclosed with the base plate to form a first cavity and a second cavity arranged at intervals, the first air hole is communicated with the first cavity, and the outer shell is provided with There is a second air hole communicated with the second cavity;

   A chip assembly, the chip assembly includes a first chip and a second chip, the first chip is disposed in the first cavity and spaced apart from the first air hole, and the second chip is disposed in the first cavity In the second cavity, the first chip and the second chip are electrically connected to the substrate through gold wires, respectively; and

   a sealing gasket, which is arranged on the casing and surrounds the second air hole, and is used for connecting with the terminal system.
2. The packaging module according to claim 1, wherein the packaging module further comprises a dustproof net disposed between the sealing gasket and the casing, the dustproof net covering the second air hole is provided .
3. The packaging module according to claim 2, wherein the packaging module further comprises a waterproof membrane disposed between the dust-proof net and the casing, the waterproof membrane covering the second air hole is disposed;

   Or, the packaging module further includes protective glue, and the protective glue is filled in the second cavity and covers the second chip.
4. The package module of any one of claims 1 to 3, wherein the housing comprises:

   a surrounding plate, the surrounding plate is arranged on the periphery of the substrate and is arranged around the first chip, the second chip and the first air hole;

   A spacer, the spacer is arranged on the substrate and is located between the first chip and the second chip, and the spacer and the surrounding plate are enclosed to form first grooves and first grooves arranged at intervals. two grooves, so that the first chip is located in the first groove and is spaced apart from the first air hole, and the second chip is located in the second groove; and

   a cover plate, the cover plate covers the notches of the first groove and the second groove, and encloses the first cavity and the second cavity, and the cover plate corresponds to The second groove is provided with the second air hole, and the sealing gasket is disposed on the side of the cover plate facing away from the substrate through adhesive.
5. The packaging module according to claim 4, wherein the cover plate, the enclosure plate and the partition plate are integrally formed;

   And/or, the material of the enclosure plate, the partition plate and the cover plate is metal material, FR4 material, BT material or ceramic material;

   And/or, the substrate is FR4, BT or ceramic;

   And/or, the first chip and the second chip are ASIC chip+MEMS chip or integrated single chip;

   And/or, the enclosure plate and the separator are connected to the substrate through solder paste, conductive glue or epoxy glue;

   And/or, the cover plate is connected to the enclosure plate and the partition plate through solder paste, conductive glue or epoxy glue;

   And/or, the back glue is hot pressing glue or pressure sensitive glue.
6. A packaging process for a packaging module as claimed in any one of claims 1 to 5, wherein the packaging process comprises the following steps:

   making first air holes on the substrate;

   mounting the first chip and the second chip on the substrate at intervals, so that both the first chip and the second chip are spaced from the first air hole;

   A second air hole is made on the casing, the casing is mounted on the base plate, and the casing is enclosed with the base plate to form a first cavity and a second cavity arranged at intervals, so that the first air hole communicates with the first cavity a cavity, the second air hole communicates with the second cavity, the first chip is accommodated in the first cavity, and the second chip is accommodated in the second cavity;

   A sealing gasket is attached to the casing and arranged around the second air hole.
7. The packaging process according to claim 6, wherein before the step of attaching the sealing gasket to the casing and arranging around the second air hole, further comprising:

   Coating back glue on the outer wall of the casing, so that the back glue is arranged around the second air hole;

   A dust-proof net is pasted on the side of the adhesive tape away from the casing, so that the dust-proof net covers the second air hole;

   A back glue is applied on the side of the dust-proof net facing away from the casing, so that the back glue is arranged around the second air hole.
8. The packaging process according to claim 7, wherein before the step of pasting a dustproof net on the side of the adhesive backing away from the casing, so that the dustproof net covers the second air holes, further include:

   A waterproof film is pasted on the side of the back glue away from the casing, so that the waterproof film covers the second air hole;

   A back glue is applied on the side of the waterproof membrane facing away from the casing, so that the back glue is arranged around the second air hole.
9. The packaging process according to claim 6, wherein the casing comprises a surrounding plate, a partition plate and a cover plate, the second air hole is formed on the casing, the casing is mounted on the substrate, and is connected with the substrate. A first cavity and a second cavity arranged at intervals are encircled, so that the first air hole communicates with the first cavity, the second air hole communicates with the second cavity, and the first chip accommodates In the first cavity, the step of accommodating the second chip in the second cavity includes:

   attaching the enclosure plate to the substrate, so that the enclosure plate surrounds the first chip, the second chip and the first air hole;

   The spacer is mounted on the substrate and is located between the first chip and the second chip, so that the spacer and the surrounding plate are enclosed to form first grooves and first grooves arranged at intervals. two grooves, so that the first chip is located in the first groove and is spaced apart from the first air hole, and the second chip is located in the second groove;

   The second air hole is formed on the cover plate, the cover plate is attached to the end of the enclosure plate and the partition plate away from the base plate, and the cover plate is covered on the first groove and the first The notches of the two grooves make the cover plate, the enclosure plate, the partition plate and the base plate enclose the first cavity and the second cavity, and the second air hole communicates with each other. In the second cavity, the first air hole communicates with the first cavity.
10. The packaging process according to claim 9, wherein the second air hole is formed in the cover plate, and the cover plate is attached to an end of the enclosure plate and the partition plate away from the substrate, and cover the notch of the first groove and the second groove, so that the cover plate, the enclosure plate, the partition plate and the base plate are enclosed to form the first cavity and the second cavity, and the second air hole communicates with the second cavity, and before the step of connecting the first air hole with the first cavity, further comprising:

    Filling protective glue into the second groove through the dispensing valve to cover the second chip;

    The protective glue is degassed in the form of vacuuming;

    The protective adhesive is cured using a stepped heating process.
11. The packaging process of claim 6, wherein the step of mounting the first chip and the second chip on the substrate at intervals comprises:

    Apply adhesive on one side of the substrate;

    Paste the first chip and the second chip on the side of the adhesive facing away from the substrate, so that the first chip and the second chip are spaced apart;

    reflowing the glue to solidify the glue;

    The first chip and the second chip are respectively connected to the substrate by wire bonding with gold wires.
12. An electronic device, comprising a device casing and the packaging module according to any one of claims 1 to 5, wherein the packaging module is arranged on the device casing.