CN105679685A - Sensor module and manufacturing method thereof - Google Patents

Sensor module and manufacturing method thereof Download PDF

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Publication number
CN105679685A
CN105679685A CN201610169688.5A CN201610169688A CN105679685A CN 105679685 A CN105679685 A CN 105679685A CN 201610169688 A CN201610169688 A CN 201610169688A CN 105679685 A CN105679685 A CN 105679685A
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China
Prior art keywords
area
sensor chip
substrate
colloid
sensor module
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CN201610169688.5A
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Chinese (zh)
Inventor
陈正纲
张哲明
朱二辉
邝国华
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GUANGDONG HEWEI INTEGRATED CIRCUIT TECHNOLOGY Co Ltd
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GUANGDONG HEWEI INTEGRATED CIRCUIT TECHNOLOGY Co Ltd
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Priority to CN201610169688.5A priority Critical patent/CN105679685A/en
Publication of CN105679685A publication Critical patent/CN105679685A/en
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H01L23/3121—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H01L23/3135—Double encapsulation or coating and encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Measuring Fluid Pressure (AREA)

Abstract

The embodiment of the invention discloses a sensor module and a manufacturing method thereof. The method comprises the following steps: setting a sensor chip on a substrate at a set position; setting a preset cavity structure at the set position on the periphery of the sensor chip, wherein the preset cavity structure is used for dividing the upper surface of the substrate into a first area including the sensor chip and a second area on the periphery of the first area; packaging the second area by a first rubber matrix; and packaging the first area. According to the sensor module and the manufacturing method thereof, the preset cavity structure is arranged on the periphery of the sensor chip, and the substrate is divided into the first area including the sensor chip and the second area on the periphery of the first area, so that the two areas are packaged by using different rubber matrixes respectively, and the problems of long mold manufacturing period, modification inconvenience, high cost and the like caused by a pre-mold opening technology since the substrate is divided into the two areas by using a mold manufactured by the pre-mold opening technology in the prior art are solved.

Description

Sensor module and manufacturing method thereof
Technical Field
The invention relates to the field of packaging, in particular to a sensor module and a manufacturing method thereof.
Background
In the information age of the present day, sensor technology is closely combined with computer technology and automatic control technology. The related physical quantity of the measured object is accurately measured by using the sensor, then the related physical quantity is analyzed and processed by using a computer technology, an analysis result is transmitted to the automatic control unit in an electric signal form, and the automatic control unit is instructed to change the current state of the measured object, so that the measured object is ensured to be in the optimal state.
However, the sensor is only a device with a detection function, and it needs to output the measured relevant physical quantity of the measured object to a computer control system for processing in the form of a current or voltage signal, which is not in accordance with the trend of high integration of current products. In response to this phenomenon, a sensor module has appeared, which includes other control chips and discrete electronic components, such as an IC control chip, resistors, capacitors, etc., in addition to the sensor chip. The sensor module can not only complete the measurement of the related physical quantity of the measured object, but also directly analyze and process the related physical quantity.
In the mass production and manufacturing process of the sensor module, one main process is packaging, and the packaging has the function of isolating electronic components on the sensor module from air and prolonging the service life of the electronic components; but also to protect the electronic components from mechanical impact. In the packaging process, a mold corresponding to the sensor module needs to be manufactured in advance, and the manufacturing of the mold is completed by using a pre-open process. The pre-open mold process is complicated in process, long in manufacturing period, inconvenient to modify and high in cost.
Then, at present, before the sensor module is produced in a large scale, the whole product needs to be produced in a small scale in an early stage, and in the small scale production, the mold is manufactured by using the pre-mold opening process, so that the cost of the test production is increased, and meanwhile, the period of the product which is formally put into the large scale production is prolonged.
Disclosure of Invention
The invention aims to provide a sensor module and a manufacturing method thereof, so as to reduce the cost in the production process of the sensor module and shorten the period of formal mass production of the sensor module.
To achieve the object, an embodiment of the present invention provides a method for manufacturing a sensor module, including:
arranging a sensor chip on a substrate at a set position;
arranging a preset cavity structure at a set position on the periphery of the sensor chip, wherein the preset cavity structure divides the upper surface of the substrate into a first area comprising the sensor chip and a second area on the periphery of the first area;
packaging the second area through a first colloid;
and packaging the first area.
In addition, the embodiment of the invention also discloses a sensor module, which comprises:
a substrate;
a sensor chip disposed on the substrate;
the preset cavity structure is arranged at a set position on the periphery of the sensor chip and divides the upper surface of the substrate into a first area comprising the sensor chip and a second area on the periphery of the first area; the first colloid is arranged in the second area and used for packaging the second area;
a sealing structure disposed in the first region, the sealing structure to isolate the sensor chip from an ambient environment.
According to the embodiment of the invention, the prefabricated cavity structure is arranged at the periphery of the sensor chip of the substrate, the upper surface of the substrate and the electronic components arranged on the substrate are divided into two different areas, so that the corresponding areas can be respectively packaged by using different colloids, and the problems of high cost, long production period and inconvenience in modification caused by the fact that the substrate and the electronic components arranged on the substrate are divided into two different areas by using a mold manufactured by a pre-demolding process in small-batch trial production in the prior art are solved.
Drawings
Fig. 1 is a flowchart of a method for manufacturing a sensor module according to an embodiment of the present invention;
fig. 2A is a top view of an electronic component disposed on a substrate according to an embodiment of the present invention;
FIG. 2A 'is a cross-sectional view taken along A-A' of the top view shown in FIG. 2A;
fig. 2B is a top view of an electronic component electrically connected to a substrate through a gold wire packaging process according to an embodiment of the present invention;
FIG. 2B 'is a cross-sectional view taken along A-A' of the top view shown in FIG. 2B;
FIG. 2C is a top view of a preformed cavity structure disposed on a substrate according to one embodiment of the present invention;
FIG. 2C 'is a cross-sectional view taken along A-A' of the top view shown in FIG. 2C;
fig. 2D is a top view of a second region encapsulated by a first encapsulant according to an embodiment of the present invention;
FIG. 2D 'is a cross-sectional view taken along A-A' of the top view shown in FIG. 2D;
fig. 2E is a top view of the first region encapsulated by the glue according to the first embodiment of the present invention;
FIG. 2E 'is a cross-sectional view taken along A-A' of the top view provided in FIG. 2E;
fig. 2F is a top view of a metal cap disposed on the first colloid according to the first embodiment of the present invention;
FIG. 2F 'is a cross-sectional view taken along A-A' of the top view provided in FIG. 2F;
fig. 3A is a top view of a sensor module according to a second embodiment of the present invention;
fig. 3B is a cross-sectional view taken along a-a' direction of the top view shown in fig. 3A.
Detailed Description
The present invention will be described in further detail with reference to the accompanying drawings and examples. It is to be understood that the specific embodiments described herein are merely illustrative of the invention and are not limiting of the invention. It should be further noted that, for the convenience of description, only some but not all of the elements associated with the present invention are shown in the drawings.
Example one
Fig. 1 is a flowchart of a method for manufacturing a sensor module according to an embodiment of the present invention. As shown in fig. 1, the method for manufacturing the sensor module includes:
and S110, arranging the sensor chip on the substrate at a set position.
The sensor chip may be a device having a detection function, which is an electronic component capable of converting a non-electrical physical quantity into an electrical quantity. The substrate may be a copper clad laminate, on which a desired circuit pattern is obtained after a series of processes such as hole processing, electroless copper plating, electro-coppering, etching, etc. are selectively performed, and the substrate having the specific circuit pattern may function as a conductive, insulating, and supporting substrate.
Fig. 2A is a top view of an electronic component disposed on a substrate according to an embodiment of the present invention. Fig. 2A 'is a cross-sectional view taken along a-a' direction of the top view shown in fig. 2A. In the embodiment of the present invention, as shown in fig. 2A, a sensor chip 10 is disposed on a substrate 1, and optionally, a control chip 11 and a discrete electronic component 12 (such as a resistor 121 and/or a capacitor 122) may also be disposed on the substrate 1, where the control chip 11, the discrete electronic component 12 and the sensor chip 10 together form a sensor module. The control chip 11 and the discrete electronic component 12 are used for analyzing and processing the non-electrical physical quantity of the object to be measured, which is measured by the sensor chip 10, and outputting an electrical signal to control the current state of the object to be measured, so that the object to be measured is ensured to be in the optimal state. As shown in fig. 2A', the sensor chip 10 and the control chip 11 are attached to the substrate 1 at a predetermined position by a glue 13 (optionally, silicone), and the resistor 121 and the capacitor 122 are soldered to the substrate 1 at a predetermined position by soldering.
Among them, there are various ways to arrange electronic components on the substrate, and one of them, such as discrete electronic components (resistors and/or capacitors, etc.), can be electrically connected to the substrate by means of solder; secondly, chips with larger power, such as a sensor chip and a control chip, can be electrically connected with the substrate through a gold wire packaging process. At present, the conventional chip packaging process adopts a gold wire packaging process, and an electric connection wire in the gold wire packaging process can be a gold wire, a copper wire or an aluminum wire, wherein the gold wire has the advantages of high conductivity, corrosion resistance, good toughness and the like, and is more widely used in a precision sensor module compared with the copper wire and the aluminum wire. Therefore, preferably, in the technical solution of the embodiment of the present invention, gold wires are selected to electrically connect the sensor chip and the control chip to the substrate.
Fig. 2B is a top view of an electronic component electrically connected to a substrate through a gold wire packaging process according to an embodiment of the present invention. Fig. 2B 'is a cross-sectional view taken along a-a' direction of the top view shown in fig. 2B. As shown in fig. 2B, gold wires 14 are electrically connected to bonding pads (not shown in fig. 2B) on the substrate 1 at four corner positions of the sensor chip 10, so as to electrically connect the positive electrode and the negative electrode of the sensor chip 10, and the measured non-electrical physical quantity of the measured object is transmitted to the control chip 11 through metal traces on the substrate 1 in the form of an electrical signal. The gold wire packaging process of the control chip 11 is similar to the gold wire packaging process of the sensor chip 10, and is not described herein again. As shown in fig. 2B', in the gold wire packaging process, the gold wires 14 form an arc structure to electrically connect the electrodes (not shown) of the sensor chip 10 with the pads (not shown) on the substrate.
Here, it will be appreciated by those skilled in the art that the sensor chip 10, the control chip 11 and the discrete electronic component 12 are preferably disposed on the same side of the substrate 1 (as shown in fig. 2A, disposed on the upper surface of the substrate 1), which is advantageous in that the thickness of the sensor module can be minimized and the integration level can be maximized. Of course, different electronic components may be disposed on different sides of the substrate according to design, if necessary.
And S120, arranging a preset cavity structure at a set position on the periphery of the sensor chip, wherein the preset cavity structure divides the upper surface of the substrate into a first area including the sensor chip and a second area on the periphery of the first area.
After the electronic component on the substrate is electrically connected with the bonding pad on the substrate, a preset cavity structure is arranged at a set position on the periphery of the sensor chip, the upper surface of the substrate is divided into two different areas by the preset cavity structure, the first area is an area of the upper surface of the substrate, which comprises the sensor chip, and the second area is an area on the periphery of the first area of the upper surface of the substrate, so that the different areas on the substrate are respectively packaged in the subsequent operation.
At present, substrates provided with electronic components all need to be packaged, wherein the packaging of the substrates requires different electronic components to be packaged by using different colloids, so that the electronic components can normally realize functions. The purpose of encapsulation can be in with realizing the isolation of electronic components and surrounding environment (such as acid rain, sewage etc.), guarantee electronic components's job stabilization nature and life-span. The premise for realizing the packaging of different electronic components on a substrate by using different colloids is to divide the substrate into different areas. In the prior art, the substrate is typically divided by a mold fabricated using a pre-mold-opening process.
The problems of high cost, long production period and inconvenience in modification exist in the process of manufacturing the die by the pre-die-opening process. Generally, the die manufactured by the pre-die-opening process is suitable for mass production of the sensor module, and because the size and the position of each electronic component in the sensor module are determined during mass production, a large number of dies can be manufactured by the pre-die-opening process, and corresponding changes of the dies caused by changes of the size and the position of the electronic component do not need to be considered.
However, before the sensor module is produced in a large scale, a small-scale trial production is required, and during the small-scale trial production of the sensor module, the performance of the sensor module in the trial production is detected, and the performance of the sensor module is adjusted to a better state by adjusting parameters such as the size and the position of the electronic component. In the process, because the size and the position of the electronic component are changed, if the mold is manufactured by using the pre-mold opening process, the problems of high cost, long production period and the like are caused.
Based on the above problems, the embodiment of the invention creatively provides a method for dividing the upper surface of the substrate and the corresponding electronic component into two areas by using the preset cavity structure, the preset cavity structure in the method is simple to manufacture and easy to change, the manufacturing cost in the small-batch trial production process is greatly reduced, the period of putting the sensor module into large-batch production is shortened, and the technical problems are further solved.
Here, the material, position, size and shape of the preliminary cavity structure will be described in detail.
Fig. 2C is a top view of a prefabricated cavity structure disposed on a substrate according to an embodiment of the present invention. Fig. 2C 'is a cross-sectional view taken along a-a' direction of the top view shown in fig. 2C.
As shown in fig. 2C and 2C', the material of the pre-cavity structure 15 may be a non-metal material to ensure that the sensor module is portable and easy to carry, and in addition, the material may have characteristics of high temperature resistance and low temperature resistance to ensure that the sensitivity and accuracy of the sensor module used at high temperature or low temperature are not affected by the change of the ambient temperature. Optionally, in the technical solution of the embodiment of the present invention, the material of the pre-cavity structure 15 is the same as the material of the substrate 1.
As for the position of the prefabricated cavity structure 15, it may be disposed at a peripheral set position of the sensor chip 10 on the substrate 1. The distance between the prefabricated cavity structure 15 and the sensor chip 10 has no specific requirement, so as to meet the requirement that the prefabricated cavity structure 15 does not touch the gold wires 14 at the corners of the sensor chip 10.
Regarding the height of the pre-cavity structure 15, the height h is higher than the highest height of various electronic components in the sensor module, and it should be noted that, in general, the height of the sensor chip 10 on the substrate 1 is the highest in the sensor module, and therefore, optionally, the height h of the pre-cavity structure 15 may be higher than the height of the sensor chip 10.
The shape of the pre-cavity structure 15 is not particularly required, and as shown in fig. 2C, the top view structure of the pre-cavity structure 15 is rectangular, but the pre-cavity structure may also be square, oval or circular or any closed figure. Alternatively, the shape of the pre-cavity structure 15 may be consistent with the shape of the sensor chip 10.
The pre-cavity structure 15 divides the upper surface of the substrate 1 into two different areas, a first area 15a is a part of the upper surface of the substrate including the sensor chip 10, i.e., a sealed space area formed by the pre-cavity structure 15, and a second area 15b is the upper surface of the substrate 1 and electronic components thereof at the periphery of the first area 15 a. The advantage of this setting is, when subsequently encapsulating different electronic components on base plate 1 upper surface, can select the colloid of different properties according to the region and carry out the selectivity encapsulation.
And S130, packaging the second area through a first colloid.
Fig. 2D is a top view of the second region encapsulated by the first encapsulant according to the first embodiment of the invention. Fig. 2D 'is a cross-sectional view taken along a-a' direction of the top view shown in fig. 2D. As shown in fig. 2D and 2D', the first colloid 16 may be a colloid material with certain strength and hardness, and the first colloid 16 may serve to isolate the electronic component in the second region from the surrounding environment so as to prevent the electronic component from being affected by the surrounding environment (e.g., the pressure sensor is protected from acid rain, sewage, etc.), and may also serve to fix the electronic component so as to prevent the electronic component from being in poor contact with the substrate due to vibration.
In addition, it should be noted that the first glue 16 encapsulates the second region 15b by side pouring, that is, the first glue 16 is poured into the second region from the side of the second region (for example, from the left side or the right side of the substrate in the figure), and in general, the direct pouring of the first glue 16 from the upper side of the second region is avoided, so that the advantage of this arrangement is that, because the pre-cavity structure 15 is an open structure, if the first glue 16 is poured directly from the upper side of the second region, the first glue 16 may enter the first region 15a, so that the pre-cavity structure 15 cannot divide the upper surface of the substrate 1 into two different regions.
It will also be appreciated by those skilled in the art that in the embodiment of the present invention, the pre-cavity structure 15 is an open structure, as shown in fig. 2D, and that the pre-cavity structure 15 is composed of four rectangular dams, as seen in the top view of the sensor module. It is of course also possible to provide the pre-formed cavity structure 15 in the form of a closed cover which covers the sensor chip and its corresponding substrate part to divide the upper surface of the substrate into two different areas. However, since the sensor chip needs to be packaged in a subsequent operation, the enclosure needs to be removed, which results in an increase in process steps and an increase in manufacturing cycle time. Therefore, in the technical scheme of the embodiment of the invention, the mode of forming the prefabricated cavity structure by adopting the box dams is more reasonable.
And S140, packaging the first area.
The first region may be encapsulated by a glue or by a plating film.
Fig. 2E is a top view of the first region encapsulated by the glue according to an embodiment of the present invention. FIG. 2E 'is a cross-sectional view taken along A-A' of the top view provided in FIG. 2E. As shown in fig. 2E, when the first region is encapsulated by the colloid, the second colloid 17 easy to be encapsulated by the first colloid 16 is selected, and the second colloid 17 has lower strength than the first colloid 16, so as to ensure that the sensor chip 10 can normally work under the protection of the second colloid 17. For example, taking the sensor chip 10 as a pressure sensor as an example for explanation, after the sensor chip 10 is packaged by the second colloid 17, the sensor chip 10 can still accurately detect the pressure change in the surrounding environment because the second colloid 17 has small strength and low hardness. As shown in fig. 2E', the second colloid 17 in the first region is "concave" due to the surface tension of the second colloid 17.
When the first area is packaged in a film coating mode, the film coating on the surface of the sensor chip can be realized by a physical vapor deposition method, or the film coating on the surface of the sensor chip can also be realized by a chemical vapor deposition method. In the technical scheme of the embodiment of the invention, the surface of the sensor chip is coated by adopting a chemical vapor deposition method. The chemical vapor deposition (cvd) is a method in which one or more compounds or elemental gases containing elements constituting a thin film are supplied to a substrate and a desired thin film is formed by a vapor phase reaction or a chemical reaction on the substrate, and specifically, a vapor phase reaction at a high temperature, for example, thermal decomposition of metal halides, organic metals, hydrocarbons, etc., hydrogen reduction, or a method in which a mixed gas thereof is chemically reacted at a high temperature to precipitate inorganic materials such as metals, oxides, carbides, etc. Low pressure chemical vapor deposition (lpcvd) (low pressure chemical vapor deposition) refers to chemical vapor deposition performed at less than one atmosphere. Plasma chemical vapor deposition (pecvd) refers to the growth of thin films by the influence of glow discharge plasma in low pressure CVD.
Chemical vapor deposition has the advantages of capability of depositing various films, high film forming speed, good compactness of the films, small residual stress, high film purity and the like, so the chemical vapor deposition is widely applied to the technical fields of refining of high-purity metals, powder synthesis, semiconductor films and the like. The effect of chemical vapor deposition in the embodiments of the present invention is to deposit various functional thin film layers to achieve the desired process effects.
On the basis of the technical solution of the above embodiment, further, after the first region is encapsulated, the method further includes:
s150, arranging a metal cover on the first colloid, wherein the metal cover extends to cover the upper part of the sensor chip in the first area.
At present, after the first region and the second region are encapsulated, the sensor module may normally operate, and the sensor chip is taken as a pressure sensor for example, further optionally, the pressure sensor is a tire pressure sensor, and the sensor module including the tire pressure sensor may be installed inside a tire of a motor vehicle to detect the air pressure inside the tire in real time.
Wherein the tire pressure sensor in the first region of the sensor module is aligned with the tire inflation port. In order to prevent the tire from leaking air through the sensor module, the sensor module is generally sealed inside the tire by a sealing ring. Because the sealing washer needs to be connected with the first colloid in the second area, but, on one hand, because the upper surface of the first colloid is uneven, the sealing washer can not seal the sensor module in the tire, and on the other hand, because the sealing washer is usually a rubber material, the material composition of the sealing washer is similar to that of the first colloid, and because the performances of the same material are the same, the sealing washer and the first colloid are not suitable for forming a sealing condition. For example, at low temperatures, due to the similar materials and properties of the sealing ring and the first gel, a certain degree of shrinkage occurs, which results in failure to achieve sealing of the sensor module with the tire.
In view of the above problem, in the solution of the embodiment of the present invention, a metal cover is attached on the first colloid. Because the metal cover is made of metal materials, the phenomenon of expansion with heat and contraction with cold is not obvious compared with a sealing ring, and the metal cover is in contact with the sealing ring, so that the sensor module can be well sealed with the tire.
Fig. 2F is a top view of a metal cover disposed on the first colloid according to the first embodiment of the present invention. FIG. 2F 'is a cross-sectional view taken along A-A' of the top view provided in FIG. 2F. As shown in fig. 2F', after the first region and the second region are encapsulated respectively, optionally, a metal cover 18 may be further disposed on the first colloid 16, and the metal cover 18 is attached to the surface of the first colloid 16 through a colloid (not shown). And, further optionally, the metal cover 18 may also extend over a portion of the sensor chip 10 in the first area.
As shown in fig. 2F, the first area not covered by the metal cover 18 is circular, and is provided to ensure that the portion of the first area corresponding to the seal ring (not shown) conforms to the shape of the existing seal ring. The prior art seal ring is generally circular, and therefore, optionally, the shape of the first region not covered by the metal cover 18 is set to be circular; in addition, since the size of the first region is generally larger than the size of the sealing ring due to the size limitation of the existing sealing ring and the size limitation of the sensor chip 10 itself, it is necessary to cover a portion of the first region with the metal cap 18 to adjust the size of the first region corresponding to the sealing ring.
It is noted that when the sensor chip 10 in the first area is encapsulated by the second glue 17, the metal cap 18 extending over the part of the sensor chip 10 that covers the first area is not in contact with the second glue 17, and optionally the metal cap 18 is at a distance from the second glue 17. The advantage of this arrangement is that, because in general, in order to ensure the sensitivity of the sensor chip 10, the height of the second colloid 17 is low (lower than the height of the first colloid 16), when the sensor module is in a high-temperature environment, the second colloid 17 is heated and expands and cannot abut against the metal cover, so that the phenomenon that the metal cover 18 is separated from the first colloid 16 due to the expansion of the second colloid 17 is not caused. Thereby ensuring a good seal of the sensor module with the tyre.
Example two
Fig. 3A is a top view of a sensor module according to a second embodiment of the present invention. Fig. 3B is a cross-sectional view taken along a-a' direction of the top view shown in fig. 3A. The sensor module can be obtained by adopting the manufacturing method of the sensor provided by the technical scheme of the embodiment.
As shown in connection with fig. 3A and 3B, the sensor module includes:
a substrate 1;
a sensor chip 10 provided on the substrate 1;
a pre-cavity structure 15 disposed at a set position on the periphery of the sensor chip 10, wherein the pre-cavity structure 15 divides the upper surface of the substrate 1 into a first region 15a including the sensor chip 10 and a second region 15b on the periphery of the first region 15 a; the first colloid 16 is arranged in the second area 15b, and the first colloid 16 is used for encapsulating the second area 15 b;
a sealing structure 17 disposed in the first region 15a, the sealing structure 17 being configured to isolate the sensor chip 10 from an ambient environment.
Optionally, the sealing structure 17 specifically includes:
a second gel 17 disposed on the first region 15 a; (or a protective film disposed on the first region).
Further, on the basis of the above technical solution, the sensor module further includes:
a metal cover 18 disposed on the first colloid 16, wherein the metal cover 18 extends to cover a portion of the sensor chip 10 in the first region 15 a.
Optionally, the sensor chip 10 is a pressure sensor chip.
Further, optionally, the upper surface of the substrate 1 in the second region 15b is provided with at least one of the following devices: a controller chip 11 and discrete components 12 (e.g., resistors and/or capacitors, etc.).
The sensor module provided by the embodiment of the invention can be obtained by executing the manufacturing method of the sensor module, and has the corresponding functional modules and beneficial effects of the execution method.
It is to be noted that the foregoing is only illustrative of the preferred embodiments of the present invention and the technical principles employed. It will be understood by those skilled in the art that the present invention is not limited to the particular embodiments described herein, but is capable of various obvious changes, rearrangements and substitutions as will now become apparent to those skilled in the art without departing from the scope of the invention. Therefore, although the present invention has been described in greater detail by the above embodiments, the present invention is not limited to the above embodiments, and may include other equivalent embodiments without departing from the spirit of the present invention, and the scope of the present invention is determined by the scope of the appended claims.

Claims (10)

1. A method of making a sensor module, comprising:
arranging a sensor chip on a substrate at a set position;
arranging a preset cavity structure at a set position on the periphery of the sensor chip, wherein the preset cavity structure divides the upper surface of the substrate into a first area comprising the sensor chip and a second area on the periphery of the first area;
packaging the second area through a first colloid;
and packaging the first area.
2. The method according to claim 1, wherein encapsulating the first region specifically comprises:
packaging the first area through a second colloid; or,
and packaging the first area through a film evaporation process.
3. The method of claim 2, wherein the second colloid has a higher fluidity than the first colloid.
4. The method of claim 1, further comprising, after encapsulating the first region:
and arranging a metal cover on the first colloid, wherein the metal cover extends to cover the upper part of the sensor chip in the first area.
5. The method of claim 1, wherein the sensor chip comprises a pressure sensor chip.
6. A sensor module, comprising:
a substrate;
a sensor chip disposed on the substrate;
the preset cavity structure is arranged at a set position on the periphery of the sensor chip and divides the upper surface of the substrate into a first area comprising the sensor chip and a second area on the periphery of the first area; the first colloid is arranged in the second area and used for packaging the second area;
a sealing structure disposed in the first region, the sealing structure to isolate the sensor chip from an ambient environment.
7. The sensor module according to claim 6, wherein the sealing structure provided in the first region comprises in particular:
the second colloid is arranged in the first area; or,
a protective film disposed in the first region.
8. The sensor module of claim 6, wherein the tactile sensor module further comprises:
and the metal cover is arranged on the first colloid and extends to cover the upper part of the sensor chip in the first area.
9. The sensor module of claim 6, wherein the sensor module comprises a pressure sensor chip.
10. The method of claim 6, wherein the substrate upper surface of the second region is provided with at least one of: a controller chip and discrete components.
CN201610169688.5A 2016-03-23 2016-03-23 Sensor module and manufacturing method thereof Pending CN105679685A (en)

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Application Number Priority Date Filing Date Title
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CN111668167A (en) * 2019-03-06 2020-09-15 复凌科技（上海）有限公司 Packaging method of chip module
CN111665323A (en) * 2019-03-06 2020-09-15 复凌科技（上海）有限公司 Chip module
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WO2023273718A1 (en) * 2021-06-29 2023-01-05 华进半导体封装先导技术研发中心有限公司 Sensing chip packaging structure and method

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CN108726468A (en) * 2018-08-08 2018-11-02 宁波琻捷电子科技有限公司 Sensor-packaging structure, method and encapsulating mould
CN111668167A (en) * 2019-03-06 2020-09-15 复凌科技（上海）有限公司 Packaging method of chip module
CN111665323A (en) * 2019-03-06 2020-09-15 复凌科技（上海）有限公司 Chip module
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CN111866310A (en) * 2019-04-24 2020-10-30 北京小米移动软件有限公司 Camera module and terminal
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