CN111665323A - Chip module - Google Patents
Chip module Download PDFInfo
- Publication number
- CN111665323A CN111665323A CN201910169351.8A CN201910169351A CN111665323A CN 111665323 A CN111665323 A CN 111665323A CN 201910169351 A CN201910169351 A CN 201910169351A CN 111665323 A CN111665323 A CN 111665323A
- Authority
- CN
- China
- Prior art keywords
- gas
- packaging
- chip
- detected
- module
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N33/00—Investigating or analysing materials by specific methods not covered by groups G01N1/00 - G01N31/00
- G01N33/0004—Gaseous mixtures, e.g. polluted air
- G01N33/0009—General constructional details of gas analysers, e.g. portable test equipment
Landscapes
- Chemical & Material Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Engineering & Computer Science (AREA)
- Health & Medical Sciences (AREA)
- Analytical Chemistry (AREA)
- Food Science & Technology (AREA)
- Medicinal Chemistry (AREA)
- Physics & Mathematics (AREA)
- Combustion & Propulsion (AREA)
- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
- General Physics & Mathematics (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Investigating Or Analyzing Materials By The Use Of Fluid Adsorption Or Reactions (AREA)
- Investigating Or Analyzing Materials By The Use Of Electric Means (AREA)
Abstract
The invention relates to an electronic device, and discloses a chip module, which comprises: the bottom plate, set up the encapsulation cover on the bottom plate, form the encapsulation space between bottom plate and the encapsulation cover, still include: the insulating isolation layer is arranged in the packaging space and is respectively abutted against the bottom plate and the packaging cover; the insulating isolation layer divides the packaging space into a first packaging area and a second packaging area, and the packaging cover is provided with air holes corresponding to the first packaging area for the gas to be detected to enter the first packaging area; the detection module is arranged in the first packaging area; the detection module is used for detecting the parameter information of the gas to be detected; the processing module is arranged in the second packaging area; the conducting circuit is embedded in the bottom plate and is respectively and electrically connected with the processing module and the detection module; the detection module is used for passing through the conductive circuit and the plurality of pins; and part of each pin is positioned in the packaging cover and is electrically conducted with the processing module, and the other part of each pin is positioned outside the packaging cover.
Description
Technical Field
The present disclosure relates to electronic devices, and particularly to a chip module.
Background
A gas sensing chip is a device for converting information such as composition, concentration, etc. of gas into information that can be utilized by persons, instruments, computers, etc., and is generally classified as a chemical sensing chip.
Traditional gas perception chip has and installs gas sensing material or sensing chip to the packaging part structure of gas perception chip, gaseous perception chip often need with processing module MCU communication, handle the information that gaseous perception chip obtained through MCU, but gaseous perception chip must be the same with the atmosphere after the encapsulation, and MCU encapsulation at needs airtight environment, lead to gas perception chip and MCU to need encapsulate respectively, extravagant packaging material and time, the cost is higher.
Disclosure of Invention
The invention aims to provide a chip module which can package a processing module and a gas sensing chip together, save packaging materials and time and reduce packaging cost.
In order to solve the above technical problem, an embodiment of the present invention provides a chip module, including: the bottom plate, set up in encapsulation cover on the bottom plate, the bottom plate with form the encapsulation space between the encapsulation cover, the chip module still includes: the insulating isolation layer is arranged in the packaging space and is respectively abutted against the bottom plate and the packaging cover; the insulating isolation layer divides the packaging space into a first packaging area and a second packaging area, and the packaging cover is provided with air holes corresponding to the first packaging area for the gas to be detected to enter the first packaging area; the detection module is arranged in the first packaging area; the detection module is used for detecting the parameter information of the gas to be detected; the processing module is arranged in the second packaging area; the conducting circuit is embedded in the bottom plate and is respectively and electrically connected with the processing module and the detection module; the detection module is used for sending the detected parameter information of the gas to be detected to the processing module through the conducting circuit; the processing module is used for calculating the content of the specific gas in the gas to be detected according to the received parameter information of the gas to be detected; a plurality of pins; and parts of the pins are positioned in the packaging cover and are electrically conducted with the processing module, and the other parts of the pins are positioned outside the packaging cover.
A chip module, comprising: the bottom plate, set up in encapsulation cover on the bottom plate, the bottom plate with form the encapsulation space between the encapsulation cover, the chip module still includes: a conductive substrate laid on the bottom plate; the insulating isolation layer is arranged in the packaging space and is respectively abutted against the conductive base material and the packaging cover; the insulating isolation layer divides the packaging space into a first packaging area and a second packaging area, and the packaging cover is provided with air holes corresponding to the first packaging area for the gas to be detected to enter the first packaging area; the detection module is laid on the part of the conductive substrate, which is positioned in the first packaging area; the detection module is used for detecting the parameter information of the gas to be detected; the processing module is laid on the part of the conductive substrate, which is positioned in the second packaging area; the detection module is used for sending the detected parameter information of the gas to be detected to the processing module through the conductive base material; the processing module is used for calculating the content of the specific gas in the gas to be detected according to the received parameter information of the gas to be detected; a plurality of pins; and parts of the pins are positioned in the packaging cover and are electrically conducted with the processing module, and the other parts of the pins are positioned outside the packaging cover.
Compared with the prior art, the packaging space formed between the packaging cover and the bottom plate is separated by the insulating isolation layer, a first packaging area and a second packaging area which are independent from each other are formed, the first packaging area is used for packaging the detection module, and the first packaging area is communicated with the air; the second packaging area is used for packaging the processing module, the second packaging area is sealed to ensure the normal work of the processing module, and the detection module in the first packaging area is communicated with the processing module in the second packaging area through a conducting circuit; the detection module and the processing module may also communicate through the conductive substrate. The chip module in the embodiment has encapsulated the detection module and the processing module at the same time and provides corresponding working environments for the detection module and the processing module respectively, so that the detection module can detect gas in the chip module, and sends the gas parameter information to the processing module for calculation processing, thereby saving encapsulating materials and time and reducing the encapsulating cost.
In addition, the detection module includes: the first conductive substrate is arranged in the first packaging area, laid on the bottom plate and electrically conducted with the conductive circuit; the sensing chip submodule is positioned in the first packaging area, arranged on the first conductive base material and electrically conducted with the first conductive base material; the sensing chip submodule is used for detecting the parameter information of the gas to be detected; the processing module comprises: the second conductive substrate is arranged in the second packaging area, laid on the bottom plate and electrically conducted with the conductive circuit; and the processing chip is positioned in the second packaging area, arranged on the second conductive base material and electrically conducted with the second conductive base material.
In addition, the sense-chip submodule includes at least: the first sensing chip and the second sensing chip are arranged on the first conductive substrate; the first sensing chip is used for detecting the content of the gas to be detected and sending the total content of the gas to be detected to the processing chip, and the gas to be detected comprises specific gas and non-specific gas; the second sensing chip is used for detecting the content of the non-specific gas and sending the content of the non-specific gas to the processing chip; and the processing chip is used for calculating the content of the specific gas according to the received total content of the gas to be detected and the content of the nonspecific gas.
In addition, the package cover includes: the protective plate is arranged on the packaging cover body, and air holes are formed in the protective plate and used for allowing gas to be detected to enter the first packaging area.
In addition, the protection plate is a metal plate.
In addition, offer on the encapsulation cover body and be used for the installation the mounting groove of guard plate, be equipped with on the guard plate be used for with mounting groove complex joint portion.
In addition, the first packaging area is filled with protective gas.
In addition, a fixing groove is formed in the conductive base material, and the insulating isolation layer is embedded into the fixing groove.
Drawings
One or more embodiments are illustrated by way of example in the accompanying drawings, which correspond to the figures in which like reference numerals refer to similar elements and which are not to scale unless otherwise specified.
Fig. 1 is a plan view of a chip module in a first embodiment;
fig. 2 is a sectional view of a chip module in the first embodiment;
fig. 3 is a schematic structural view of the inside of a chip module in the first embodiment;
fig. 4 is a schematic diagram of an internal structure of a chip module according to a third embodiment.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, embodiments of the present invention will be described in detail below with reference to the accompanying drawings. However, it will be appreciated by those of ordinary skill in the art that numerous technical details are set forth in order to provide a better understanding of the present application in various embodiments of the present invention. However, the technical solution claimed in the present application can be implemented without these technical details and various changes and modifications based on the following embodiments.
A first embodiment of the present invention relates to a chip module for detecting a content of a specific gas in air and issuing an instruction according to the content.
As shown in fig. 1 to 3, the chip module includes: bottom plate 1, establish encapsulation cover 2 on bottom plate 1, insulating isolation layer 3, form the encapsulation space between bottom plate 1 and the encapsulation cover 2, insulating isolation layer 3 sets up between bottom plate 1 and the encapsulation cover 2, and 3 both ends of insulating isolation layer offset with bottom plate 1 and encapsulation cover 2 respectively, insulating isolation layer 3 separates into two first encapsulation district 4 and the second encapsulation district 5 independent each other with the encapsulation space, wherein insulating isolation layer 3 can with bottom plate 1, encapsulation cover 2 is sealed, avoid having circulation of air in first encapsulation district 4 and the second encapsulation district 5.
The chip module further comprises: the detection module 6 is arranged in the first packaging area 4, the processing module 8 is arranged in the second packaging area 5, the conductive circuit 7 is used for realizing communication between the detection module 6 and the processing module 8, and the pins 10 are arranged. The packaging cover 2 is provided with an air hole 23 at a position corresponding to the first packaging area 4, so that air can enter the first packaging area 4 to contact with the detection module 6, and the detection module 6 is used for detecting parameter information of gas to be detected in the air. The conducting circuit 7 is embedded in the bottom plate 1, one end of the conducting circuit 7 is electrically connected with the detection module 6, the other end of the conducting circuit 7 is electrically connected with the processing module 8, the detection module 6 transmits the detected parameter information of the gas to be detected to the processing module 8 through the conducting circuit 7, the processing module 8 calculates the parameter information of the gas to be detected to obtain the content of the specific gas, and the processing module 8 is electrically connected with the pins 10 and used for sending processing signals to the outside of the chip module through the pins 10.
From the above, the chip module in this embodiment separates the encapsulation space between the sealing cover and the bottom plate 1 into the first encapsulation area 4 and the second encapsulation area 5 through the insulating isolation layer 3, the detection module 6 and the processing module 8 are respectively encapsulated in the first encapsulation area 4 and the second encapsulation area 5, the first encapsulation area 4 and the second encapsulation area 5 are independent of each other, the first encapsulation area 4 is internally communicated with the air, the second encapsulation area 5 is closed, the first encapsulation area 4 and the second encapsulation area 5 respectively provide a proper working environment for the detection module 6 and the processing module 8, the chip module encapsulates the detection module 6 and the processing module 8 at the same time, the respective encapsulation of the detection module 6 and the processing module 8 is avoided, the encapsulation efficiency is greatly improved, and the encapsulation cost and time are reduced.
Specifically, the detection module 6 includes: the sensing chip comprises a first conductive substrate 962 and a sensing chip submodule 61 arranged on the first conductive substrate 962, wherein the first conductive substrate 962 is positioned in the first packaging area 4 and is laid on the bottom plate 1, the first conductive substrate 962 is electrically conducted with the conductive circuit 7, and the sensing chip submodule 61 is used for detecting parameter information of the gas to be detected. The processing module 8 comprises: a second conductive substrate 82 and a processing chip 81 disposed on the second conductive substrate 82, wherein the second conductive substrate 82 is located in the second package region 5 and laid on the bottom board 1, the second conductive substrate 82 is also electrically connected to the conductive trace 7, and the sensor chip submodule 61 communicates with the processing chip 81 through the first conductive substrate 962, the conductive trace 7 and the second conductive substrate 82. Meanwhile, the second conductive substrate 82 is used to electrically connect with a portion of the leads 10, and the leads 10 that are not electrically connected with the second conductive substrate 82 are electrically connected with the first conductive substrate 962, so that all the leads 10 are electrically connected with the processing chip 81. In this embodiment, the first conductive base material 962 and the second conductive base material 82 are made of a silicon-based material, but the first conductive base material 962 and the second conductive base material 82 may be made of other materials.
The sense chip sub-module 61 at least includes: the first sensing chip 611 and the second sensing chip 612 are separated from each other, the first sensing chip 611 and the second sensing chip 612 are micro-nano sensing chips made of nano sensing gas sensitive materials and are sensitive to special gases, the first sensing chip 611 is sensitive to specific gases required to be detected by the chip module, but it is worth noting that the first sensing chip 611 is also sensitive to other gases in the air, namely, the content of the gas to be detected measured by the first sensing chip 611 contains the specific gases required to be detected and non-specific gases not required to be detected. Where the non-specific gas that does not need to be detected is an interfering gas, the interfering gas may comprise one or more gases. The second sensing chip 612 and the first sensing chip 611 are separated from each other, and the detection between the first sensing chip 611 and the second sensing chip 612 does not interfere with each other. For example, in the present embodiment, the first sensing chip 611 is made of a formaldehyde gas-sensitive material, that is, the specific gas in the gas to be measured detected measured by the first sensing chip 611 is formaldehyde, but the formaldehyde gas-sensitive material also responds to ethanol. That is, the interference gas in the gas to be detected measured of the first sensing chip 611 is ethanol. Thus, the first sensor chip 611 responds when the concentration of formaldehyde is low and the concentration of ethanol is significant, thereby generating false alarm. To avoid the false alarm, the sensitive gas of the second sensing chip 612 is ethanol, and the second sensing chip 612 is used for detecting the content of the interfering gas in the air. Of course, the specific gas and the interfering gas may be other gases, and in the present embodiment, only formaldehyde and ethanol are taken as examples, and are not particularly limited.
The first sensing chip 611 and the second sensing chip 612 transmit the detected gas parameters to the processing chip 81 through the first conductive base material 962 and the conductive circuit 7, and the processing chip 81 receives the measured gas content parameter transmitted by the first sensing chip 611 and the interference gas content measured by the second sensing chip 612, where the measured gas content parameter includes: the processing chip 81 calculates the content of the specific gas in the air by subtracting the content of the first gas to be detected from the content of the interference gas detected by the second sensing chip 612. The second sensing chip 612 is arranged to avoid errors when the first sensing chip 611 measures the specific gas content alone, so that the accuracy of measuring the specific gas content is greatly improved.
It should be noted that, if the gases to which the first sensing chip 611 is sensitive include excessive types of gases other than the specific gases, that is, excessive types of interfering gases, and the second sensing chip 612 can only measure the content of a part of the interfering gases, and cannot measure the content of all the interfering gases, the sensing chip sub-module 61 may further include: the third sensing chip or a larger number of sensing chips, in this embodiment, only the sensing chip sub-module 61 includes the third sensing chip as an example, and is not limited specifically. The third sensing chip and the second sensing chip 612 are used for being sensitive to all kinds of gases in the interference gas, and the gases to which the second sensing chip 612 and the third sensing chip are sensitive do not overlap with each other. When the content of the specific gas is detected, the first sensing chip 611, the second sensing chip 612 and the third sensing chip respectively send the detected gas content parameters to the processing unit, the processing unit firstly sums the data detected by the second sensing chip 612 and the data detected by the third sensing chip to obtain the content data of the interfering gas, and then performs subtraction on the data detected by the first sensing chip 611 and the content data of the interfering gas to obtain the content data of the specific gas.
In the present embodiment, the package cover 2 includes: encapsulation cover 2 body and guard plate 22 offer the bleeder vent 23 that corresponds with perception chip submodule piece 61 on the guard plate 22, and the mounting groove is offered at the part that corresponds with first encapsulation district 4 to encapsulation cover 2 body, and the mounting groove is the echelonment setting, and guard plate 22 has the joint portion with the mounting groove block, and guard plate 22 when the installation, agrees with the cell wall of the mounting groove of joint portion and encapsulation cover 2 body. It should be noted that the package cover 2 body is made of a ceramic material, the ceramic material is not easy to expand when heated, the sealing performance of the chip module can be maintained, the protection plate 22 is made of a metal material with a small expansion coefficient, such as heat-resistant steel, and the protection plate 22 also has the characteristic of being not easy to expand when heated, and is used for maintaining the sealing performance of the chip module.
Meanwhile, the second encapsulation area 5 is further filled with a protective gas, in this embodiment, the protective gas is nitrogen, of course, the protective gas may also be other gases, such as rare gases, etc., and in this embodiment, only nitrogen is taken as an example, and is not particularly limited. After the second packaging region 5 is filled with the protective gas, the processing chip 81 can be prevented from being weathered, and the service life of the chip module is prolonged.
A second embodiment of the present invention relates to a chip module. The second embodiment is substantially the same as the first embodiment, and mainly differs therefrom in that: the sensing chip sub-module 61 in the first embodiment includes a first sensing chip 611 and a second sensing chip 612, where the first sensing chip 611 is used to measure the content of the gas to be measured, and the second sensing chip 612 is used to measure the content of the interfering gas. In this embodiment, the second sensing chip 612 is sensitive to the interfering gas and may be sensitive to other gases. The sense chip submodule 61 further includes: and the fourth sensing chip is arranged on the first conductive base material 962 and is respectively separated from the first sensing chip 611 and the second sensing chip 612, and the fourth sensing chip is a micro-nano sensing chip and is used for sensing non-interfering gases, namely other gases, in the gas to which the second sensing chip 612 is sensitive. That is, the difference between the gas content measured by the second sensing chip 612 and the gas content measured by the fourth sensing chip is the content of the interfering gas.
After receiving the gas content detected by the first sensing chip 611, the gas content detected by the second sensing chip 612, and the gas content detected by the fourth sensing chip, the processing chip 81 firstly subtracts the gas content detected by the second sensing chip 612 from the gas content detected by the fourth sensing chip to obtain the interfering gas content, and then subtracts the gas content detected by the first sensing chip 611 from the interfering gas content to obtain the specific gas content.
A third embodiment of the present invention relates to a chip module, as shown in fig. 4, the chip module in the third embodiment is substantially the same as that in the first embodiment, and mainly differs therefrom in that the detection module 6 in the first embodiment includes a sensing chip submodule 61 and a first conductive substrate 962, the processing module 8 includes a processing chip 81 and a second conductive substrate 82, one end of the insulating isolation layer 3 abuts against the package cover 2, and the other end abuts against the base plate 1, and in the third embodiment of the present invention, the chip module further includes: lay electrically conductive substrate 9 on bottom plate 1, detection module 6 is for laying perception chip submodule piece 61 on electrically conductive substrate 9, and processing module 8 is for laying the processing chip 81 on electrically conductive substrate 9, and 3 one end of insulating isolation layer offsets with packaging cover 2, and the other end offsets with electrically conductive substrate 9, and insulating isolation layer 3 separates into first encapsulation district 4 and second encapsulation district 5 with the encapsulation space. The first sensing chip 611 submodule 61 is laid on the portion, located in the first packaging area 4, of the conductive base material 9, the processing chip 81 is laid on the portion, located in the second packaging area 5, of the conductive base material 9, and the first sensing chip 611 submodule 61 and the processing chip 81 communicate through the conductive base material 9.
Simultaneously, can also set up the fixed slot on the electrically conductive substrate 9, the width of fixed slot equals with insulating isolation layer 3's width, and insulating isolation layer 3 imbeds in the fixed slot, realizes the sealed between first encapsulation district 4 and the second encapsulation district 5.
It will be understood by those of ordinary skill in the art that the foregoing embodiments are specific examples for carrying out the invention, and that various changes in form and details may be made therein without departing from the spirit and scope of the invention in practice.
Claims (9)
1. A chip module, comprising: the bottom plate, set up in encapsulation cover on the bottom plate, the bottom plate with form the encapsulation space between the encapsulation cover, its characterized in that, the chip module still includes:
the insulating isolation layer is arranged in the packaging space and is respectively abutted against the bottom plate and the packaging cover; the insulating isolation layer divides the packaging space into a first packaging area and a second packaging area, and the packaging cover is provided with air holes corresponding to the first packaging area for the gas to be detected to enter the first packaging area;
the detection module is arranged in the first packaging area; the detection module is used for detecting the parameter information of the gas to be detected;
the processing module is arranged in the second packaging area;
the conducting circuit is embedded in the bottom plate and is respectively and electrically connected with the processing module and the detection module; the detection module is used for sending the detected parameter information of the gas to be detected to the processing module through the conducting circuit; the processing module is used for calculating the content of the specific gas in the gas to be detected according to the received parameter information of the gas to be detected;
a plurality of pins; and parts of the pins are positioned in the packaging cover and are electrically conducted with the processing module, and the other parts of the pins are positioned outside the packaging cover.
2. The chip module according to claim 1, wherein the detection module comprises:
the first conductive substrate is arranged in the first packaging area, laid on the bottom plate and electrically conducted with the conductive circuit;
the sensing chip submodule is positioned in the first packaging area, arranged on the first conductive base material and electrically conducted with the first conductive base material; the sensing chip submodule is used for detecting the parameter information of the gas to be detected;
the processing module comprises:
the second conductive substrate is arranged in the second packaging area, laid on the bottom plate and electrically conducted with the conductive circuit;
and the processing chip is positioned in the second packaging area, arranged on the second conductive base material and electrically conducted with the second conductive base material.
3. The chip module according to claim 2, wherein the sense-chip submodule comprises at least: the first sensing chip and the second sensing chip are arranged on the first conductive substrate;
the first sensing chip is used for detecting the content of the gas to be detected and sending the total content of the gas to be detected to the processing chip, and the gas to be detected comprises specific gas and non-specific gas;
the second sensing chip is used for detecting the content of the non-specific gas and sending the content of the non-specific gas to the processing chip;
and the processing chip is used for calculating the content of the specific gas according to the received total content of the gas to be detected and the content of the nonspecific gas.
4. The chip module according to claim 1, wherein the package cover comprises: the protective plate is arranged on the packaging cover body, and air holes are formed in the protective plate and used for allowing gas to be detected to enter the first packaging area.
5. The chip module according to claim 4, wherein the protection plate is a metal plate.
6. The chip module according to claim 4, wherein the package cover body has an installation groove for installing the protection plate, and the protection plate has a locking portion for engaging with the installation groove.
7. The chip module according to claim 1, wherein the first package region is filled with a shielding gas.
8. A chip module, comprising: the bottom plate, set up in encapsulation cover on the bottom plate, the bottom plate with form the encapsulation space between the encapsulation cover, its characterized in that, the chip module still includes:
a conductive substrate laid on the bottom plate;
the insulating isolation layer is arranged in the packaging space and is respectively abutted against the conductive base material and the packaging cover; the insulating isolation layer divides the packaging space into a first packaging area and a second packaging area, and the packaging cover is provided with air holes corresponding to the first packaging area for the gas to be detected to enter the first packaging area;
the detection module is laid on the part of the conductive substrate, which is positioned in the first packaging area; the detection module is used for detecting the parameter information of the gas to be detected;
the processing module is laid on the part of the conductive substrate, which is positioned in the second packaging area; the detection module is used for sending the detected parameter information of the gas to be detected to the processing module through the conductive base material; the processing module is used for calculating the content of the specific gas in the gas to be detected according to the received parameter information of the gas to be detected;
a plurality of pins; and parts of the pins are positioned in the packaging cover and are electrically conducted with the processing module, and the other parts of the pins are positioned outside the packaging cover.
9. The chip module according to claim 8, wherein the conductive substrate is formed with a fixing groove, and the insulating isolation layer is embedded in the fixing groove.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910169351.8A CN111665323A (en) | 2019-03-06 | 2019-03-06 | Chip module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910169351.8A CN111665323A (en) | 2019-03-06 | 2019-03-06 | Chip module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN111665323A true CN111665323A (en) | 2020-09-15 |
Family
ID=72381369
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910169351.8A Pending CN111665323A (en) | 2019-03-06 | 2019-03-06 | Chip module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN111665323A (en) |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104409428A (en) * | 2014-09-30 | 2015-03-11 | 广东合微集成电路技术有限公司 | Integrated sensor and packaging method thereof |
| CN204464257U (en) * | 2015-04-16 | 2015-07-08 | 歌尔声学股份有限公司 | The encapsulating structure of integrated sensor |
| CN105679685A (en) * | 2016-03-23 | 2016-06-15 | 广东合微集成电路技术有限公司 | Sensor module and manufacturing method thereof |
| CN105796114A (en) * | 2016-04-25 | 2016-07-27 | 深圳信炜科技有限公司 | Packaging structure of biosensor and electronic equipment |
| CN107546194A (en) * | 2016-06-29 | 2018-01-05 | 马克西姆综合产品公司 | Structures and methods for the hybrid optical encapsulation with glass roof |
| CN108088955A (en) * | 2017-11-30 | 2018-05-29 | 苏州慧闻纳米科技有限公司 | A kind of anti-interference gas sensor |
| CN108828012A (en) * | 2018-04-24 | 2018-11-16 | 佛山市澄澜点寸科技有限公司 | A kind of gas sensor encapsulating structure |
-
2019
- 2019-03-06 CN CN201910169351.8A patent/CN111665323A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104409428A (en) * | 2014-09-30 | 2015-03-11 | 广东合微集成电路技术有限公司 | Integrated sensor and packaging method thereof |
| CN204464257U (en) * | 2015-04-16 | 2015-07-08 | 歌尔声学股份有限公司 | The encapsulating structure of integrated sensor |
| CN105679685A (en) * | 2016-03-23 | 2016-06-15 | 广东合微集成电路技术有限公司 | Sensor module and manufacturing method thereof |
| CN105796114A (en) * | 2016-04-25 | 2016-07-27 | 深圳信炜科技有限公司 | Packaging structure of biosensor and electronic equipment |
| CN107546194A (en) * | 2016-06-29 | 2018-01-05 | 马克西姆综合产品公司 | Structures and methods for the hybrid optical encapsulation with glass roof |
| CN108088955A (en) * | 2017-11-30 | 2018-05-29 | 苏州慧闻纳米科技有限公司 | A kind of anti-interference gas sensor |
| CN108828012A (en) * | 2018-04-24 | 2018-11-16 | 佛山市澄澜点寸科技有限公司 | A kind of gas sensor encapsulating structure |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US7024937B2 (en) | Isolated pressure transducer | |
| US7516667B2 (en) | Differential pressure sensor having symmetrically-provided sensor chips and pressure introduction passages | |
| EP3062077B1 (en) | Multi-sensor assembly | |
| US6997043B2 (en) | Integration of atmospheric intrusion sensors in electronic component packages | |
| US6365424B1 (en) | Sensor device and method of producing a sensor device | |
| AU7627801A (en) | Piezoelectric sensor | |
| CN101586970A (en) | Integrated mechanical package design for combi sensor apparatus | |
| US20050269654A1 (en) | Pressure sensor | |
| CN102879435B (en) | Small-size explosion-proof sensor for inflammable gas | |
| CN105928641A (en) | Microfused Silicon Strain Gauge (msg) Pressure Sensor Package | |
| CN214621575U (en) | Waterproof pressure transmitter | |
| CN109696273B (en) | Automobile brake boosting vacuum pressure sensor device | |
| CN104251748A (en) | Module for integration into a mobile terminal to measure the ambient temperature | |
| CN111665323A (en) | Chip module | |
| CN212133969U (en) | Sensor | |
| CN207649640U (en) | A kind of encapsulating structure of inertial sensor, environmental sensor | |
| CN212931698U (en) | Packaging assembly and electronic device | |
| CN108275648A (en) | A kind of pressure sensor packaging structure based on silicon piezoresistance type | |
| CN111668167B (en) | Packaging method of chip module | |
| CN110657913A (en) | Catch pressure sensor device for detecting automobile exhaust particles | |
| US20020033050A1 (en) | Pressure sensor | |
| CN108155179B (en) | Semiconductor device with gas detection function | |
| CN211504505U (en) | Sensor packaging structure | |
| KR102264214B1 (en) | Capacitive Sensing Apparatus with Temperature Sensing, Sensor Package and Bidet Sheet Having the Same | |
| EP4042121A1 (en) | Strain sensor and a strain measuring assembly comprising the sensor |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WD01 | Invention patent application deemed withdrawn after publication | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20200915 |