CN213834527U

CN213834527U - Combined sensor and electronic device

Info

Publication number: CN213834527U
Application number: CN202022415371.XU
Authority: CN
Inventors: 孟晗; 刘兵
Original assignee: Qingdao Goertek Intelligent Sensor Co Ltd
Current assignee: Qingdao Goertek Intelligent Sensor Co Ltd
Priority date: 2020-10-26
Filing date: 2020-10-26
Publication date: 2021-07-30
Anticipated expiration: 2030-10-26

Abstract

The utility model discloses a combined sensor and electronic equipment, wherein, combined sensor includes base plate, gas sensor, inertial sensor and plastic envelope, the base plate has the first surface; the gas sensor comprises a gas sensor chip, and the gas sensor chip is arranged on the first surface and is electrically connected with the substrate; the inertial sensor comprises an inertial sensor chip, and the inertial sensor chip is arranged on the first surface and is arranged at intervals with the gas sensor chip; the plastic packaging layer covers the first surface and covers the gas sensor and the inertial sensor. The utility model discloses technical scheme's combination sensor can realize miniaturized design.

Description

Combined sensor and electronic device

Technical Field

The utility model relates to an encapsulation technology field, in particular to combination sensor and electronic equipment.

Background

Wearable equipment is as a big focus of consumer electronics, and its trend that can realize multiple sensing function simultaneously is also more practical novel display. The motion environment is monitored by the gas sensor while the outdoor motion state is recorded by the inertial sensor. However, due to the difference in the operating principle and structure between the gas sensor and the inertial device, the inertial sensor and the gas sensor can only be packaged separately at present, but such packaging method may result in increased product size and space, increased packaging cost, and reduced assembly efficiency.

SUMMERY OF THE UTILITY MODEL

The utility model aims at providing a combined sensor aims at solving the big, with high costs problem of size that gas sensor and inertial sensor discrete package brought.

In order to achieve the above object, the present invention provides a combination sensor including:

a substrate having a first surface;

the gas sensor comprises a gas sensor chip, and the gas sensor chip is arranged on the first surface and is electrically connected with the substrate;

the inertial sensor comprises an inertial sensor chip, and the inertial sensor chip is arranged on the first surface and is arranged at an interval with the gas sensor chip; and

and the plastic packaging layer covers the first surface and covers the gas sensor and the inertial sensor.

In an optional embodiment, a gas inlet hole is formed in the position, corresponding to the gas sensor, of the substrate, an avoiding groove is formed in the surface, facing the gas inlet hole, of the gas sensor chip, and a sensing piece is arranged in the avoiding groove.

In an optional embodiment, the sensing piece is arranged opposite to the air inlet hole, and the surface of the sensing piece is perpendicular to the axial direction of the air inlet hole.

In an optional embodiment, the gas sensor chip includes a gas MEMS chip and a gas ASIC chip electrically connected to each other, the gas MEMS chip is formed with the avoiding groove, and the gas ASIC chip is disposed on a surface of the gas MEMS chip away from the substrate.

In an optional embodiment, the inertial sensor chip includes an inertial MEMS chip and an inertial ASIC chip electrically connected to each other, the inertial MEMS chip is disposed on the first surface, and the inertial ASIC chip is disposed on a surface of the inertial MEMS chip facing away from the substrate.

In an optional embodiment, the inertial ASIC chip is electrically connected to the substrate and the inertial MEMS chip through metal wires, respectively; and/or the presence of a gas in the gas,

the gas ASIC chip is electrically connected with the substrate and the gas MEMS chip respectively through metal wires.

In an optional embodiment, the inertial MEMS chip is connected to the first surface by bonding, and the inertial ASIC chip is connected to the inertial MEMS chip by bonding; and/or the presence of a gas in the gas,

the gas MEMS chip is connected with the first surface in an adhesion mode, and the gas ASIC chip is connected with the gas MEMS chip in an adhesion mode.

In an optional embodiment, the combination sensor further includes a heat insulation plate, the heat insulation plate is disposed between the gas sensor and the inertial sensor, and two opposite sides of the heat insulation plate respectively abut against the first surface and the top of the molding layer.

In an alternative embodiment, the heat insulation board is made of asbestos, glass fiber or foam.

The utility model discloses provide an electronic equipment again, include the casing and locate composite sensor in the casing, composite sensor is as above composite sensor.

The utility model discloses technical scheme's combination sensor includes gas sensor and inertial sensor, still includes the packaging structure that base plate and plastic envelope formed to can with gas sensor and inertial sensor package to same base plate on, for discrete packaging structure, can effectively reduce the encapsulation size, conveniently realize the miniaturization. Meanwhile, the same plastic packaging layer is used for packaging the gas sensor chip and the inertial sensor chip, so that the thickness of the packaging structure can be reduced, the packaging process can be simplified, and the manufacturing cost can be reduced.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the structures shown in the drawings without creative efforts.

FIG. 1 is a cross-sectional view of one embodiment of a combi-sensor of the present invention;

FIG. 2 is a cross-sectional view of the combination sensor of FIG. 1 shown without plastic encapsulation;

fig. 3 is a cross-sectional view of another embodiment of the present invention.

The reference numbers illustrate:

reference numerals	Name (R)	Reference numerals	Name (R)
				100	Combined sensor	313	Gas ASIC chip
10	Substrate	33	Induction part
				11	First surface	50	Inertial sensor
13	Second surface	51	Inertial sensor chip
				15	Air intake	511	Inertial MEMS chip
30	Gas sensor	513	Inertial ASIC chip
				31	Gas sensor chip	70	Plastic packaging layer
311	Gas MEMS chip	80	Metal wire
				3111	Dodging groove	90	Heat insulation board

The objects, features and advantages of the present invention will be further described with reference to the accompanying drawings.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.

It should be noted that all the directional indicators (such as upper, lower, left, right, front and rear … …) in the embodiment of the present invention are only used to explain the relative position relationship between the components, the motion situation, etc. in a specific posture (as shown in the drawings), and if the specific posture is changed, the directional indicator is changed accordingly.

In the present application, unless expressly stated or limited otherwise, the terms "connected" and "fixed" are to be construed broadly, e.g., "fixed" may be fixedly connected or detachably connected, or integrally formed; can be mechanically or electrically connected; they may be directly connected or indirectly connected through intervening media, or they may be connected internally or in any other suitable relationship, unless expressly stated otherwise. The specific meaning of the above terms in the present invention can be understood according to specific situations by those skilled in the art.

In addition, descriptions in the present application as to "first", "second", and the like are for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicit to the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In addition, the technical solutions in the embodiments may be combined with each other, but it must be based on the realization of those skilled in the art, and when the technical solutions are contradictory or cannot be realized, the combination of the technical solutions should not be considered to exist, and is not within the protection scope of the present invention.

The utility model provides a combined sensor 100.

Referring to fig. 1 and fig. 2, in an embodiment of the present invention, the combination sensor 100 includes:

a substrate 10, said substrate 10 having a first surface 11;

the gas sensor 30, the gas sensor 30 includes a gas sensor chip 31, the gas sensor chip 31 is disposed on the first surface 11 and electrically connected to the substrate 10;

an inertial sensor 50, wherein the inertial sensor 50 includes an inertial sensor chip 51, and the inertial sensor chip 51 is disposed on the first surface 11 and spaced apart from the gas sensor chip 31; and

and the plastic package layer 70 covers the first surface 11, and covers the gas sensor 30 and the inertial sensor 50.

Generally, the combo sensor 100100 is a sensor that integrates multiple functions into one package structure, and in this embodiment, the combo sensor 100 includes two sensors, one of which is the gas sensor 30 and the other of which is the inertial sensor 50. The gas sensor 30 is a sensor for detecting gas concentration and components, plays an important role in environmental protection and safety supervision, and can achieve the purposes of explosion detection and toxicity detection, wherein explosion detection is used for detecting the content of combustible gas in dangerous places and alarming in an overproof manner so as to avoid explosion accidents; the toxic gas detection is used for detecting the content of toxic gas in dangerous places and alarming in an overproof manner so as to avoid poisoning of workers. Of course, in daily life, the gas sensor 30 may also be disposed in the wearable device to detect the ambient air quality at any time, so as to achieve the purpose of healthy travel.

The inertial sensor 50 is a sensor for detecting and measuring acceleration and rotational motion, and is called the inertial sensor 50 because its principle is implemented by using the law of inertia. Here, the inertial sensor 50 may be an accelerometer sensor, a gyroscope, a geomagnetic sensor, or the like, and is not limited thereto. Here, the inertial sensor 50 may be an accelerometer sensor chip, for example, which can detect the acceleration or rotation of the electronic device to which the inertial sensor is applied, so as to realize the functions of automatic image flipping, compass calibration, hand shaking prevention, pedometer, etc., and combine with the gas sensor 30, so as to achieve the purpose of performing step-counting exercise based on a good environment, thereby improving user experience.

Specifically, the substrate 10 is a PCB, the substrate 10 is made of a common circuit board, and a plurality of functional circuits are disposed inside the substrate, so as to facilitate connection of chips or components and achieve respective functions, which is not described herein again. The substrate 10 includes two opposite surfaces, namely a first surface 11 and a second surface 13, and the first surface 11 is provided with external circuits, which can be manufactured by printing or the like, for connecting various electrical components. The second surface 13 may be provided with a plurality of solder fillets for soldered connection to the product to be applied for stable fixation. The inertial sensor 50 includes an inertial sensor chip 51, the gas sensor 30 includes a gas sensor chip 31, and the inertial sensor chip 51 and the gas sensor chip 31 are spaced apart from each other on the first surface 11, so as to reduce direct interference therebetween. The mounting method of the two components on the substrate 10 may be a mounting process, or may be a fixed connection with the substrate 10 by a solder ball implanting process, which is not limited herein.

In order to ensure the structural stability of the combination sensor 100, the combination sensor 100 further includes a plastic package layer 70, which can provide physical protection for the inertial sensor chip 51 and the gas sensor chip 31, and ensure good air tightness between the inertial sensor chip 51 and the gas sensor chip 31, thereby preventing foreign matter contamination and corrosion and improving the usability. The plastic package layer 70 can be made of epoxy resin, the adhesive drying temperature can be reduced, and the phenomenon that the prior plastic package material generates large internal stress with the inertial sensor chip 51 due to different thermal expansion coefficients after being cured can be avoided, so that the inertial sensor chip 51 is prevented from generating zero offset, and the measurement accuracy of the inertial sensor chip 51 can be greatly improved.

The utility model discloses technical scheme's combined sensor 100 includes gas sensor 30 and inertial sensor 50, still includes the packaging structure that base plate 10 and plastic-sealed layer 70 formed to can encapsulate gas sensor 30 and inertial sensor 50 on same base plate 10, for discrete packaging structure, can effectively reduce the encapsulation size, conveniently realize the miniaturization. Meanwhile, the same plastic package layer 70 is used for packaging the gas sensor chip 31 and the inertial sensor chip 51, so that the thickness of the packaging structure can be reduced, the packaging process can be simplified, and the manufacturing cost can be reduced.

Referring to fig. 1, in an alternative embodiment, a gas inlet 15 is formed in a position of the substrate 10 corresponding to the gas sensor 30, an avoiding groove 3111 is formed on a surface of the gas sensor chip 31 facing the gas inlet 15, and a sensing element 33 is disposed in the avoiding groove 3111.

In this embodiment, in order to realize the detection function of the gas sensor 30, an air inlet hole 15 is formed in the substrate 10 at a position corresponding to the gas sensor 30, so that the external gas can enter, a avoiding groove 3111 is formed on the surface of the gas sensor chip 31 facing the air inlet hole 15, the avoiding groove 3111 is communicated with the air inlet hole 15, a sensor 33 is arranged in the avoiding groove 3111, and the sensor 33 can be a gas-sensitive material, for example, a gas-sensitive semiconductor, which is used as a device for detecting the components and the concentration of gas, and is widely used for detecting various flammable and explosive or harmful gases in factories, workshops, and mines, detecting household combustible gas leakage, and the like. The gas sensitive material is a functional material of which the resistivity changes after the material adsorbs a certain gas, and the changed resistivity is transmitted to the control device after the sensing piece 33 contacts the external gas through the gas inlet 15, so that the type and the concentration of the gas are obtained. The commonly used gas-sensitive ceramic materials include SnO2, ZnO, ZrO2 and the like. Of course, the sensor 33 may be other gas-sensitive materials, such as graphene gas-sensitive materials. Meanwhile, the arrangement of the avoiding groove 3111 can also enable outside air to surround the inside, so that the contact time with the induction part 33 is increased, and the detection result is more accurate; the area for fixing the induction part 33 can be increased, the induction part 33 is convenient to fix, and here, the induction part 33 can be fixed in a bonding mode, so that the structure is more stable; furthermore, the sensing element 33 is located in the avoiding groove 3111, so that the probability that the sensing element 33 is damaged by external touch can be reduced, the service performance of the combination sensor 100 can be improved, and the service life of the combination sensor can be prolonged.

In an alternative embodiment, the sensing member 33 is disposed opposite to the air inlet hole 15, and the surface of the sensing member 33 is perpendicular to the axial direction of the air inlet hole 15.

In this embodiment, in order to increase the contact area between the sensing element 33 and the external air, the surface of the sensing element 33 is perpendicular to the axial direction of the air inlet 15, and here, the sensing element 33 is in a planar plate shape, that is, the sensing element faces the air inlet 15 with the largest surface, so that the contact area with the air is effectively increased, and the detection sensitivity and the detection accuracy can be improved. Meanwhile, the sensing part 33 is arranged opposite to the air inlet hole 15, so that the sensing part can be directly contacted with the outside air, and the detection efficiency is further improved. Here, the shape of the air inlet holes 15 may be the same as the shape of the sensing element 33, for example, all the air inlet holes are rectangular or square, and the opening size of the air inlet holes 15 may be slightly smaller than the surface area of the sensing element 33, so as to protect the sensing element 33 on one hand, and avoid the large impact force of the air on the other hand, so that the sensing element 33 is easy to wear.

In an optional embodiment, the gas sensor chip 31 includes a gas MEMS chip 311 and a gas ASIC chip 313 electrically connected to each other, the evasion groove 3111 is formed on the gas MEMS chip 311, and the gas ASIC chip 313 is disposed on a surface of the gas MEMS chip 311 away from the substrate 10.

It is understood that, in order to realize the function of the gas sensor 30, the gas sensor chip 31 includes a gas MEMS chip 311 and a gas ASIC chip 313, and a bypass groove 3111 is formed on the surface of the gas MEMS chip 311, so that the sensing element 33 becomes a part of the gas MEMS chip 311 for sensing the external gas; the gas ASIC chip 313 can provide electrical power to the gas MEMS chip 311 and process and amplify the electrical signals sensed thereby for transmission to the product for gas analysis. Here, the gas ASIC chip 313 is disposed on the surface of the gas MEMS chip 311 away from the substrate 10, so that the two chips are disposed in an overlapping manner in a direction perpendicular to the substrate 10, and compared with a structure that is laid on the substrate 10, the occupied area can be greatly reduced, so that the size of the combination sensor 100 is further reduced, which is more beneficial to the miniaturization design.

Specifically, the gas ASIC chip 313 and the gas MEMS chip 311 are connected by bonding. Here, the material used for bonding the two may be an adhesive, which improves the stability of the connection between the two. Of course, in other embodiments, the gas sensor chip 31 may be connected by soldering or the like. Meanwhile, the gas ASIC chip 313 is small in size, and when the gas ASIC chip 313 is superposed on the surface of the gas MEMS chip 311, there is an extra space on the surface of the gas MEMS chip 311 for electrical connection between the gas ASIC chip and the gas MEMS chip, so in an embodiment, the gas ASIC chip 313 is electrically connected to the gas MEMS chip 311 through the metal wire 80, and the gas ASIC chip 313 is also electrically connected to the substrate 10 through the metal wire 80, thereby further simplifying the processing process. The metal wire 80 is specifically a gold wire, which has good conductivity and performance stability, and can ensure the electrical connection stability of the gas sensor chip 31 and the functional stability thereof.

In an alternative embodiment, the inertial sensor chip 51 includes an inertial MEMS chip 511 and an inertial ASIC chip 513 electrically connected, where the inertial MEMS chip 511 is disposed on the first surface 11, and the inertial ASIC chip 513 is disposed on a surface of the inertial MEMS chip 511 facing away from the substrate 10.

In this embodiment, it can be understood that, in order to realize the function of the inertial sensor chip 51, the inertial MEMS chip 511 and the inertial ASIC chip 513 are electrically connected, and the inertial ASIC chip 513 supplies electric power to the inertial MEMS chip 511, and simultaneously amplifies the electric signal detected by the inertial ASIC chip 513 and transmits the amplified electric signal to the substrate 10. Because the surface area of the inertial ASIC chip 513 is relatively large, the inertial ASIC chip is disposed on the surface of the inertial MEMS chip 511 away from the substrate 10, so that the inertial ASIC chip and the inertial MEMS chip are disposed in an overlapping manner in a direction perpendicular to the substrate 10, and compared with a structure that is laid on the substrate 10, the occupied surface area can be greatly reduced, so that the surface size of the combinational sensor 100 is further reduced, which is more beneficial to miniaturization design. Here, the inertia ASIC chip 513 is also electrically connected to the substrate 10 through the metal wire 80, the inertia MEMS chip 511 is also electrically connected through the metal wire 80, and the inertia ASIC chip 513 and the MEMS chip are also bonded by an adhesive, thereby realizing a stable connection structure.

Based on the above embodiment, the inertial MEMS chip 511 and the first surface 11 are connected by bonding, and the gas MEMS chip 311 and the first surface 11 are connected by bonding, so that the processing process can be simplified. Here, the material to be bonded is also an adhesive. Of course, the inertial sensor chip 51 and the first surface 11 may be connected by means of a paste-bonding method, and the gas sensor chip 31 and the first surface 11 may be connected by means of a paste-bonding method.

Referring to fig. 3, it can be appreciated that, in order to improve the functional stability of the combi-sensor 100, in an alternative embodiment, the combi-sensor 100 further comprises a heat insulation board 90, the heat insulation board 90 is disposed between the gas sensor 30 and the inertial sensor 50, and two opposite sides of the heat insulation board 90 abut against the first surface 11 and the top of the molding layer 70, respectively.

In this embodiment, since the sensing element 33 in the gas sensor 30 generally needs to detect at a relatively high temperature, the gas sensor chip 31 emits relatively high heat, and in order not to affect the inertial sensor 50, a heat insulation board 90 is disposed between the gas sensor 30 and the inertial sensor 50, the heat insulation board 90 may be made of one of asbestos, glass fiber, and foam, or of course, may be another board having a heat insulation effect, and can effectively insulate the heat emitted from the gas sensor 30, thereby improving the detection accuracy of the inertial sensor 50. Specifically, the shape of the thermal insulation board 90 is the same as the shape of the longitudinal surface of the plastic package layer 70 perpendicular to the connecting line of the two sensors, that is, the shape of the thermal insulation board 90 is rectangular, and the upper end and the lower end of the thermal insulation board 90 are respectively abutted against the top of the substrate 10 and the top of the plastic package layer 70, so that the gas sensor 30 and the inertial sensor 50 are completely isolated, and the interference is further reduced.

Meanwhile, the heat insulation plate 90 is arranged to be perpendicular to the substrate 10, at this time, the material of the heat insulation plate 90 is used the least, and the gas sensor 30 and the inertial sensor 50 can be completely isolated, so that the cost is effectively saved, the heat insulation plate 90 is conveniently fixed, and the efficiency of the packaging process is improved.

In addition, in order to improve the shielding performance of the combination sensor 100, a shielding film layer (not shown) is disposed on the surface of the plastic package layer 70 away from the substrate 10, and the shielding film layer may be a copper film, and is processed to the surface of the plastic package layer 70 through a process such as plating or sputtering, so that the gas sensor 30 and the inertial sensor 50 can be prevented from being interfered by external signals, and the functional stability of the chip in the plastic package layer 70 can be improved.

It will be appreciated that the packaging process for the combi-sensor 100 provided with the thermal shield 90 described above comprises the following steps:

firstly, the substrate 10 is subjected to circuit layout, the gas sensor chip 31 and the inertial sensor chip 51 are attached to the first surface 11 of the substrate 10, the gas ASIC chip 313 is electrically connected to the substrate 10 and the gas MEMS chip 311 through the metal wire 80, and the inertial ASIC chip 513 is electrically connected to the substrate 10 and the inertial MEMS chip 511 through the metal wire 80;

next, the heat insulating plate 90 is bonded to the first surface 11 and is located between the gas sensor chip 31 and the inertial sensor chip 51;

finally, the first surface 11 is subjected to full-scale plastic packaging.

The utility model discloses provide an electronic equipment (not shown) again, include the casing and locate combo sensor 100 in the casing, combo sensor 100's specific structure refers to above-mentioned embodiment, because this electronic equipment's combo sensor 100 has adopted the whole technical scheme of above-mentioned all embodiments, consequently has all beneficial effects that the technical scheme of above-mentioned embodiment brought at least, and the repeated description is no longer given here.

The electronic device may be a wearable electronic product, such as a smart watch or a bracelet, or an electronic product such as a mobile terminal, such as a mobile phone, which is not limited herein.

The above only is the preferred embodiment of the present invention, not limiting the scope of the present invention, all the equivalent structure changes made by the contents of the specification and the drawings under the inventive concept of the present invention, or the direct/indirect application in other related technical fields are included in the patent protection scope of the present invention.

Claims

1. A combination sensor, comprising:

a substrate having a first surface;

2. The combination sensor of claim 1, wherein the substrate has an air inlet hole at a position corresponding to the gas sensor, and an avoiding groove is formed on a surface of the gas sensor chip facing the air inlet hole, and a sensing element is disposed in the avoiding groove.

3. The combination sensor of claim 2, wherein the sensing member is disposed opposite to the air intake hole, and a surface of the sensing member is perpendicular to an axial direction of the air intake hole.

4. The combination sensor of claim 2, wherein the gas sensor die comprises a gas MEMS die and a gas ASIC die electrically connected, the gas MEMS die being formed with the evasion groove, the gas ASIC die being disposed on a surface of the gas MEMS die facing away from the substrate.

5. The combination sensor of claim 4, wherein the inertial sensor chip comprises an inertial MEMS chip and an inertial ASIC chip electrically connected, the inertial MEMS chip being disposed on the first surface, the inertial ASIC chip being disposed on a surface of the inertial MEMS chip facing away from the substrate.

6. The combinational sensor of claim 5, wherein the inertial ASIC chip electrically connects the substrate and the inertial MEMS chip, respectively, by metal wires; and/or the presence of a gas in the gas,

7. The combinational sensor of claim 5, wherein the inertial MEMS chip is connected to the first surface by bonding and the inertial ASIC chip is connected to the inertial MEMS chip by bonding; and/or the presence of a gas in the gas,

8. The combination sensor of any one of claims 1 to 7, further comprising a thermal shield disposed between the gas sensor and the inertial sensor, opposite sides of the thermal shield abutting the first surface and a top of the molding layer, respectively.

9. The combinational sensor of claim 8, wherein the thermal insulation board is made of asbestos, glass fiber or foam.

10. An electronic device comprising a housing and a combination sensor disposed in the housing, wherein the combination sensor is the combination sensor according to any one of claims 1 to 9.