CN207649640U - A kind of encapsulating structure of inertial sensor, environmental sensor - Google Patents
A kind of encapsulating structure of inertial sensor, environmental sensor Download PDFInfo
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- CN207649640U CN207649640U CN201721467509.2U CN201721467509U CN207649640U CN 207649640 U CN207649640 U CN 207649640U CN 201721467509 U CN201721467509 U CN 201721467509U CN 207649640 U CN207649640 U CN 207649640U
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- chip
- sensor chip
- ceramic cartridge
- inner chamber
- encapsulating structure
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- 230000007613 environmental effect Effects 0.000 title claims abstract description 41
- 239000000919 ceramic Substances 0.000 claims abstract description 33
- 238000005192 partition Methods 0.000 claims description 23
- 230000003287 optical effect Effects 0.000 claims description 3
- 239000003292 glue Substances 0.000 description 3
- 238000005538 encapsulation Methods 0.000 description 2
- 238000000605 extraction Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 230000001133 acceleration Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
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Abstract
The utility model is related to a kind of inertial sensor, the encapsulating structures of environmental sensor, the upper cover plate of first inner chamber, and closing ceramic cartridge lower ending opening and the lower cover that second inner chamber is surrounded with ceramic cartridge are surrounded including closing ceramic cartridge upper end opening and with ceramic cartridge；Further include the environmental sensor chip being located in first inner chamber, asic chip, and the inertial sensor chip in second inner chamber；Connection first inner chamber and extraneous opening are provided on upper cover plate.The encapsulating structure of the utility model, using ceramic cartridge by inertial sensor chip, environmental sensor chip package in two different chambers, it, can be to avoid the signal interference between inertial sensor chip, environmental sensor chip while reducing package dimension.
Description
Technical field
The utility model is related to the encapsulating structures of sensor chip, more specifically, the utility model is related to a kind of inertia biographies
The encapsulating structure of sensor and environmental sensor.
Background technology
In recent years, with the development of science and technology, the volume of the electronic products such as mobile phone, laptop is constantly reducing,
And people are also higher and higher to the performance requirement of these portable electronic products, and this requires matched electronic components
Volume must also reduce therewith.
Sensor has been commonly utilized in as measurement device on the electronic products such as mobile phone, laptop.Existing
In process structure, since the principle of detection is different, MEMS inertial sensor and MEMS environmental sensor chips are usually discrete；
When assembly, MEMS inertial sensor chip and MEMS environmental sensors chip are mounted on same by system manufacturer respectively
On mainboard, this makes the board area that chip occupies larger, is unfavorable for the miniaturization of modern electronic product.And tradition will
When microphone chip is together with other integrated chips, microphone chip is easy the electromagnetic interference by other chips.
Utility model content
There is provided a kind of inertial sensor, the encapsulating structures of environmental sensor for one purpose of the utility model.
One side according to the present utility model provides the encapsulating structure of a kind of inertial sensor, environmental sensor, including
Ceramic cartridge, the ceramic cartridge include surrounding the side of sidewall portion of hollow cavity, and be formed in ceramic cartridge inner cavity and by institute
State the partition portion that ceramic cartridge inner cavity is divided into upper and lower two chambers；Further include the closing ceramic cartridge upper end opening and with ceramics
Shell surrounds the upper cover plate of first inner chamber, and closes the ceramic cartridge lower ending opening and surround second inner chamber with ceramic cartridge
Lower cover；
Further include the environmental sensor chip being located in first inner chamber, asic chip, and used in second inner chamber
Property sensor chip；It is provided on the upper cover plate and is connected to the first inner chamber and extraneous opening.
Optionally, the environmental sensor chip, asic chip are arranged in the upper surface in partition portion.
Optionally, the asic chip is mounted on the upper surface in partition portion, and the environmental sensor chip attachment is in ASIC
The upper surface of chip.
Optionally, the asic chip, environmental sensor chip are mounted on the upper surface in partition portion respectively.
Optionally, the inertial sensor chip is arranged on lower cover.
Optionally, the inertial sensor chip is arranged in the lower face in partition portion.
Optionally, the environmental sensor chip is pressure, temperature, humidity, gas or optical sensor.
Optionally, the inertial sensor chip is accelerometer chip or gyroscope chip.
The encapsulating structure of the utility model, using ceramic cartridge by inertial sensor chip, environmental sensor chip package
It, can be to avoid inertial sensor chip, environmental sensor chip while reducing package dimension in two different chambers
Between signal interference.Moreover, when chip is arranged in partition portion, it is possible to reduce shadow of the encapsulation stress to each chip performance
It rings.In addition, the requirement according to product to lateral dimension or longitudinal size, environmental sensor chip can be adopted with the second asic chip
With the mode for stacking or mounting side by side, the diversity of attachment is improved.
By referring to the drawings to the detailed description of the exemplary embodiment of the utility model, the utility model it is other
Feature and its advantage will become apparent.
Description of the drawings
The attached drawing of a part for constitution instruction describes the embodiments of the present invention, and uses together with the description
In explanation the principles of the present invention.
Fig. 1 is the schematic diagram of the utility model encapsulating structure.
Specific implementation mode
The various exemplary embodiments of the utility model are described in detail now with reference to attached drawing.It should be noted that：Unless another
It illustrates outside, the component and the positioned opposite of step, numerical expression and numerical value otherwise illustrated in these embodiments is unlimited
The scope of the utility model processed.
It is illustrative to the description only actually of at least one exemplary embodiment below, is never used as to this practicality
Novel and its application or any restrictions used.
Technology and equipment known to person of ordinary skill in the relevant may be not discussed in detail, but in appropriate situation
Under, the technology and equipment should be considered as part of specification.
In shown here and discussion all examples, any occurrence should be construed as merely illustrative, without
It is as limitation.Therefore, other examples of exemplary embodiment can have different values.
It should be noted that：Similar label and letter indicate similar terms in following attached drawing, therefore, once a certain Xiang Yi
It is defined, then it need not be further discussed in subsequent attached drawing in a attached drawing.
With reference to figure 1, the utility model provides the encapsulating structure of a kind of inertial sensor, environmental sensor, including ceramics
Shell, and with ceramic cartridge surround the upper cover plate 1 of first inner chamber, surround the lower cover 3 of second inner chamber with ceramic cartridge.
Specifically, the ceramic cartridge of the utility model can be integrally formed comprising surround the side wall of hollow cavity
Portion 20, and the partition portion 21 that is formed in ceramic cartridge inner cavity and the ceramic cartridge inner cavity is divided into two.Side of sidewall portion 20
Whole in the shape of an " I " with partition portion 21, partition portion 21 can be located at the medium position of side of sidewall portion 20, thus by 20 institute of side of sidewall portion
The hollow cavity surrounded is divided into two chambers up and down.
Upper cover plate 1 closes the upper end opening of ceramic cartridge, to surround first inner chamber；Lower cover 3 is by ceramic cartridge
Lower ending opening close, to surround second inner chamber.Wherein, further include be located at first inner chamber in environmental sensor chip 5,
Asic chip 6；And the inertial sensor chip 4 being arranged in second inner chamber.
It is provided on the upper cover plate 1 and is connected to the first inner chamber and extraneous opening 10 so that extraneous environment becomes
Changing can be acted on by opening 10 on the environmental sensor chip 5 in first inner chamber, and environmental sensor chip 5 is finally made
Export the electric signal of variation.
The ceramic cartridge of the utility model, inside can be provided with circuit layout and the pad of extraction so that can be with
It is connected with each chip.The upper cover plate 1 of the utility model, lower cover 3 are as needed, inside can also be provided with and ceramics
The circuit layout of shell conducting so that may be implemented, with the conducting of each chip, no longer to illustrate herein.
The environmental sensor chip 5 of the utility model can be pressure, temperature, humidity, gas or optical sensor, also may be used
To be other sensors of measuring environment parameter.According to the difference of environmental sensor, corresponding sensor chip is selected；Such as when
When the environmental sensor of the utility model is pressure sensor, then its chip is selected to pressure-sensitive chip, this belongs to ability
The common knowledge of field technique personnel, no longer illustrates herein.
The asic chip 6 of the utility model is used for the electric signal of processing environment sensor chip 5.Wherein, the environment passes
Sensor chip 5, asic chip 6 can be arranged on the upper surface in partition portion 21,
For example, in one specific embodiment of the utility model, the asic chip 6 can pass through overlay glue or sheet
Other glue materials known to field technology personnel are mounted on the upper surface in partition portion 21, and the environmental sensor chip 5 then passes through
The modes such as Heraeus are mounted on the upper surface of asic chip 6 so that environmental sensor chip 5 is stacked with asic chip 6.
The pin of environmental sensor chip 5 can be connected on asic chip 6 by lead, and the pin of asic chip 6 also may be used
To be connected in partition portion 21 by lead, to realize the extraction of environmental sensor chip 5,6 electric signal of asic chip.
In the utility model another specific embodiment, the asic chip 6, environmental sensor chip 5 also may be used
It is mounted on the upper surface in partition portion 21 respectively.That is, asic chip 6, environmental sensor chip 5 are arranged side by side, lead to respectively
The upper surface that Heraeus is bonded in partition portion 21 is crossed, is no longer illustrated herein.
In addition, asic chip 6 can also be by the way of upside-down mounting, pin is welded on partition portion by way of planting tin ball
On 21 pad, the mechanical connection of asic chip 6 and partition portion 21 not only may be implemented in this, can also realize being electrically connected for the two
It connects, no longer illustrates herein.
The inertial sensor chip 4 of the utility model is to measure the sensor of inertial signal, such as it can be acceleration
Meter chip or gyroscope chip, the structure and its operation principle of this inertial sensor chip belong to those skilled in the art
Common knowledge.
Inertial sensor chip 4 is located in closed second inner chamber, can be mounted on the upper end in partition portion 21, can also
It is mounted on the upper surface of lower cover 3.Such as with reference to figure 1, the inertial sensor chip 4 can pass through Heraeus or this field
Other glue materials known to technical staff are bonded in the upper surface of lower cover 3.The pin of inertial sensor chip 4 can pass through lead
It is connected together with the circuit layout in lower cover 3.
The encapsulating structure of the utility model, using ceramic cartridge by inertial sensor chip, environmental sensor chip package
It, can be to avoid inertial sensor chip, environmental sensor chip while reducing package dimension in two different chambers
Between signal interference.Moreover, when chip is arranged in partition portion, it is possible to reduce shadow of the encapsulation stress to each chip performance
It rings.In addition, the requirement according to product to lateral dimension or longitudinal size, environmental sensor chip can be adopted with the second asic chip
With the mode for stacking or mounting side by side, the diversity of attachment is improved.
Although some specific embodiments of the utility model are described in detail by example, this field
It is to be understood by the skilled artisans that above example merely to illustrate, rather than in order to limit the scope of the utility model.This
Field it is to be understood by the skilled artisans that can not depart from the scope of the utility model and spirit in the case of, to above example
It modifies.The scope of the utility model is defined by the following claims.
Claims (8)
1. the encapsulating structure of a kind of inertial sensor, environmental sensor, it is characterised in that：Including ceramic cartridge, the ceramic tube
Shell includes surrounding the side of sidewall portion of hollow cavity, and be formed in ceramic cartridge inner cavity and be divided into the ceramic cartridge inner cavity
The partition portion of lower two chambers；Further include the closing ceramic cartridge upper end opening and surrounds the upper of first inner chamber with ceramic cartridge
Cover board, and the closing ceramic cartridge lower ending opening and the lower cover that second inner chamber is surrounded with ceramic cartridge；
Further include the environmental sensor chip being located in first inner chamber, asic chip, and the inertia biography in second inner chamber
Sensor chip；It is provided on the upper cover plate and is connected to the first inner chamber and extraneous opening.
2. encapsulating structure according to claim 1, it is characterised in that：The environmental sensor chip, asic chip setting
Upper surface in partition portion.
3. encapsulating structure according to claim 2, it is characterised in that：The asic chip is mounted on the upper end in partition portion
Face, the environmental sensor chip attachment is in the upper surface of asic chip.
4. encapsulating structure according to claim 2, it is characterised in that：The asic chip, environmental sensor chip difference
It is mounted on the upper surface in partition portion.
5. encapsulating structure according to claim 1, it is characterised in that：The inertial sensor chip is arranged in lower cover
On.
6. encapsulating structure according to claim 1, it is characterised in that：The inertial sensor chip is arranged in partition portion
Lower face.
7. encapsulating structure according to any one of claims 1 to 6, it is characterised in that：The environmental sensor chip is pressure
Power, temperature, humidity, gas or optical sensor.
8. encapsulating structure according to any one of claims 1 to 6, it is characterised in that：The inertial sensor chip is to add
Speedometer chip or gyroscope chip.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721467509.2U CN207649640U (en) | 2017-11-06 | 2017-11-06 | A kind of encapsulating structure of inertial sensor, environmental sensor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721467509.2U CN207649640U (en) | 2017-11-06 | 2017-11-06 | A kind of encapsulating structure of inertial sensor, environmental sensor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207649640U true CN207649640U (en) | 2018-07-24 |
Family
ID=62884743
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721467509.2U Active CN207649640U (en) | 2017-11-06 | 2017-11-06 | A kind of encapsulating structure of inertial sensor, environmental sensor |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207649640U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110849400A (en) * | 2019-12-04 | 2020-02-28 | 河北美泰电子科技有限公司 | Instability detection sensor and packaging method |
| CN112179409A (en) * | 2020-09-22 | 2021-01-05 | 青岛歌尔智能传感器有限公司 | Combined sensor, manufacturing method thereof and electronic device |
| CN117029908A (en) * | 2023-07-14 | 2023-11-10 | 武汉衡惯科技发展有限公司 | MEMS sensor and manufacturing method thereof |
-
2017
- 2017-11-06 CN CN201721467509.2U patent/CN207649640U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110849400A (en) * | 2019-12-04 | 2020-02-28 | 河北美泰电子科技有限公司 | Instability detection sensor and packaging method |
| CN112179409A (en) * | 2020-09-22 | 2021-01-05 | 青岛歌尔智能传感器有限公司 | Combined sensor, manufacturing method thereof and electronic device |
| CN117029908A (en) * | 2023-07-14 | 2023-11-10 | 武汉衡惯科技发展有限公司 | MEMS sensor and manufacturing method thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20200615 Address after: 266104 room 103, 396 Songling Road, Laoshan District, Qingdao, Shandong Province Patentee after: Goer Microelectronics Co.,Ltd. Address before: 266104 Laoshan Qingdao District North House Street investment service center room, Room 308, Shandong Patentee before: GOERTEK TECHNOLOGY Co.,Ltd. |