CN205142470U - Intelligent wear device - Google Patents
Intelligent wear device Download PDFInfo
- Publication number
- CN205142470U CN205142470U CN201520977892.0U CN201520977892U CN205142470U CN 205142470 U CN205142470 U CN 205142470U CN 201520977892 U CN201520977892 U CN 201520977892U CN 205142470 U CN205142470 U CN 205142470U
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- encapsulating housing
- circuit board
- worn device
- intelligent worn
- chip
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- 230000007613 environmental effect Effects 0.000 claims abstract description 34
- 230000003287 optical effect Effects 0.000 claims abstract description 20
- 238000005538 encapsulation Methods 0.000 abstract 10
- 238000003556 assay Methods 0.000 abstract 1
- 230000008859 change Effects 0.000 description 5
- 238000001514 detection method Methods 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 3
- 238000012360 testing method Methods 0.000 description 3
- 230000008901 benefit Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 210000003477 cochlea Anatomy 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 230000004069 differentiation Effects 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 230000029058 respiratory gaseous exchange Effects 0.000 description 1
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Abstract
The utility model relates to an intelligent wear device, including fixing first encapsulation casing, the second encapsulation casing on the circuit board, first encapsulation casing has become the first outside encapsulation that is used for encapsulating the microphone chip with the circuit plate -type, and is provided with first conducting hole in first outside encapsulation, second encapsulation casing has become the outside encapsulation of second that is used for encapsulating the optical sensor environmental sensor chip with the circuit plate -type, and is provided with the second conducting hole in the outside encapsulation of second, and first conducting hole, second conducting hole lie in not homonymy. The utility model discloses an intelligent wear device, first conducting hole and second conducting hole distribute at homonymy not, that is to say, and the trompil setting of first outside encapsulation and the outside encapsulation of second from this can be with isolated division of the microphone chip and the applied environment of optical sensor environmental sensor chip in different orientations for each other noninterference of microphone chip and optical sensor environmental sensor's applied environment has improved each chip assay's precision.
Description
Technical field
The utility model relates to intelligent wearing field, and more specifically, the utility model relates to a kind of Intelligent worn device, particularly relates to the package application of a kind of human body physical sign transducer and environmental detection sensor.
Background technology
At present, Wearable is the focus of consumer electronics, its transducer usually adopting multiple environment measuring and sign to detect, to reach the object of environmental parameter and human body physical sign parameter being carried out to Real-Time Monitoring, except inertia device adopts integrated mode (accelerometer, gyroscope and magnetometer can realize 9 axles and merge), other senser element is often applied in discrete mode.
Be different from the application of traditional mobile phone, Wearable must fit with the body surface of human body, so, on the mainboard of Wearable, the parameter difference of various transducer owing to detecting, the position on mainboard and towards being not quite similar.Such as intelligent earphone, utilizes MEMS microphone to realize active noise reduction, and for realizing such object, need the noise picking up environment, therefore the pickup hole of MEMS microphone needs to communicate with external environment; Humidity sensor is utilized to realize wearing detection, because duct humidity is different from external environment humidity, utilize humidity sensor to realize the differentiation that two actions were worn/taken off to earphone, for realizing such testing goal, when wearing, humidity sensor must be placed in the enclosed environment in duct.
The intelligent earphone of said structure, make MEMS microphone, humidity sensor can not be integrated in the same side of circuit board, MEMS microphone and humidity sensor lay respectively at the two sides of pcb board, certainly will propose higher requirement to PCB, two-sided attachment can be realized, add cost; And two-sided attachment process step is complicated, reduces the efficiency of SMT.
In other some mobile phone application, such as humidity sensor and microphone are integrated, and when microphone and humidity sensor are simultaneously towards a direction perforate, when recording, call, the moisture of breathing out in mouth can affect the measurement of humidity sensor.With like microphone, humidity sensor composite class be, in the application of microphone, optical pickocff combined test heart rate, microphone sensor is towards outside duct, optical pickocff is inside duct, the skin of its must fit duct or cochlea, existing transducer can be blocked microphone acoustic aperture, thus cannot measure outside environmental noise simultaneously.
Utility model content
An object of the present utility model there is provided a kind of Intelligent worn device.
According to an aspect of the present utility model, a kind of Intelligent worn device is provided, comprises terminal shell, and be arranged on the circuit board in described terminal shell; Also comprise fixing microphone chip, optical pickocff/environmental sensor chip on circuit boards, also comprise fixing the first encapsulating housing, the second encapsulating housing on circuit boards, described first encapsulating housing and circuit board define the first outer enclosure for packaged microphone chip, and are provided with the first via in the first outer enclosure; Described second encapsulating housing and circuit board define the second outer enclosure for encapsulating optical transducer/environmental sensor chip, and are provided with the second via in the second outer enclosure, and wherein, described first via, the second via are positioned at not homonymy.
Preferably, described environmental sensor chip is humidity sensor chip, pressure sensor chip or temperature sensor chip.
Preferably, described first via is arranged on the front of the first encapsulating housing, and described second via is arranged on the back side of the second encapsulating housing.
Preferably, described first via is arranged on the left side of the first encapsulating housing, and described second via is arranged on the right side of the second encapsulating housing.
Preferably, described microphone chip, optical pickocff/environmental sensor chip are arranged on the same side of circuit board.
Preferably, described first via is arranged on circuit boards, and described second via is arranged on the one end away from circuit board on the second encapsulating housing.
Preferably, described first encapsulating housing and the second encapsulating housing are close to and distribute, and the two shares a sidewall.
Preferably, the inner chamber of terminal shell is divided into mutually isolated the first cavity volume, the second cavity volume by described circuit board; Wherein, the first via of described first outer enclosure is communicated with the first cavity volume; Second via of described second outer enclosure is communicated with the second cavity volume; Described terminal shell is provided with connection first cavity volume and the first extraneous through hole, and is communicated with the second cavity volume and the second extraneous through hole.
Preferably, described Intelligent worn device is earphone.
Preferably, the duct of the described terminal shell shape and human body that are positioned at the second cavity volume position matches.
Intelligent worn device of the present utility model, first outer enclosure of microphone chip and the second outer enclosure of environmental sensor chip are integrated, and the first via and the second via distribute at not homonymy, that is, the perforate of the first outer enclosure and the second outer enclosure is arranged in a different direction, can open isolated for the applied environment of microphone chip and optical pickocff/environmental sensor chip thus, the applied environment of microphone chip and optical pickocff/environmental sensor is not interfere with each other, improves the precision of each chip detection.
By referring to the detailed description of accompanying drawing to exemplary embodiment of the present utility model, further feature of the present utility model and advantage thereof will become clear.
Accompanying drawing explanation
What form a part for specification drawings describes embodiment of the present utility model, and together with the description for explaining principle of the present utility model.
Fig. 1 is the structural representation of the utility model Intelligent worn device.
Embodiment
Various exemplary embodiment of the present utility model is described in detail now with reference to accompanying drawing.It should be noted that: unless specifically stated otherwise, otherwise positioned opposite, the numerical expression of the parts of setting forth in these embodiments and step and numerical value do not limit scope of the present utility model.
Illustrative to the description only actually of at least one exemplary embodiment below, never as any restriction to the utility model and application or use.
The technology and equipment known for person of ordinary skill in the relevant may not discuss in detail, but in the appropriate case, described technology and equipment should be regarded as a part for specification.
In all examples with discussing shown here, any occurrence should be construed as merely exemplary, instead of as restriction.Therefore, other example of exemplary embodiment can have different values.
It should be noted that: represent similar terms in similar label and letter accompanying drawing below, therefore, once be defined in an a certain Xiang Yi accompanying drawing, then do not need to be further discussed it in accompanying drawing subsequently.
With reference to figure 1, the utility model provides a kind of Intelligent worn device, comprises the terminal shell 2 with inner chamber, and is arranged on the circuit board 1 in described terminal shell 2; Also comprise fixing microphone chip 6, optical pickocff/environmental sensor chip 5 on the circuit card 1, microphone chip 6, optical pickocff/environmental sensor chip 5 can arrange one respectively, also can arrange multiple respectively, it is fixing on the circuit card 1 by mode well-known to those skilled in the art.
Microphone chip 6 of the present utility model can be MEMS microphone chip, for voice signal is converted to the signal of telecommunication; Environmental sensor chip 5 can be the sensor for detecting surrounding environment such as pressure sensor, temperature sensor, humidity sensor, and its sensitive electrode is the sensitive membrane that corresponding deformation occurs with external environment change; Optical pickocff can be used for measuring the heart rate of human body.The concrete structure of these transducers and the principle of work and power all belong to the common practise of those skilled in the art, no longer illustrate at this.
Intelligent worn device of the present utility model, also comprises fixing the first encapsulating housing 4, second encapsulating housing 3 on the circuit card 1.Described first encapsulating housing 4 is fixed together with circuit board 1, and defines the first outer enclosure encapsulated by microphone chip 6 within it; In order to make microphone chip 6 can respond to the extraneous sound flowed into, described first outer enclosure is also provided with the first via 8, extraneous sound flows into the inner chamber of the first outer enclosure through this first via 8, and acts on the vibrating diaphragm of microphone chip 6.Described second encapsulating housing 3 is fixed together with circuit board 1; And define the second outer enclosure encapsulated by environmental sensor chip 5 within it; In order to the change making environmental sensor chip 5 can respond to external environment, described second outer enclosure is also provided with the second via 7, makes this environmental sensor chip 5 can respond to extraneous environmental change, and export the corresponding signal of telecommunication.
Intelligent worn device of the present utility model, first encapsulating housing 4, second encapsulating housing 3 can be separate housing, such as, first encapsulating housing 4, second encapsulating housing 3 can be the cylindrical shape in one end open, one end of its opening is fixing on the circuit card 1, respectively the openend of the first encapsulating housing 4, second encapsulating housing 3 is encapsulated by circuit board 1, defines the first outer enclosure of microphone chip 6 and the second outer enclosure of environmental sensor chip 5.Wherein, the utility model one preferred embodiment in, the first encapsulating housing 4, second encapsulating housing 3 abuts against together, and share a sidewall 13, by this sidewall 13, first outer enclosure, the second outer enclosure are separated.
Intelligent worn device of the present utility model, wherein, described first via 8, second via 7 is positioned at not homonymy.Such as described first via 8 can be arranged on the front of the first encapsulating housing 4, and the second via 7 can be arranged on the back side, right side etc. of the second encapsulating housing 3, only otherwise be arranged on the front of the second encapsulating housing 3.When described first via 8 is arranged on the left side of the first encapsulating housing 4, the positions such as described second via 7 is arranged on the right side of the second encapsulating housing 3, top, only otherwise be arranged on the left side of the second encapsulating housing 3.Such as in the combination of microphone chip and optical pickocff, microphone chip needs toward the outer side, and optical pickocff needs down and user oriented skin, so both open-cellular forms are: a side direction perforate, and another top or bottom opening etc.
Intelligent worn device of the present utility model, first outer enclosure of microphone chip and the second outer enclosure of environmental sensor chip are integrated, and the first via and the second via distribute at not homonymy, that is, the perforate of the first outer enclosure and the second outer enclosure is arranged in a different direction, can open isolated for the applied environment of microphone chip and optical pickocff/environmental sensor chip thus, the applied environment of microphone chip and optical pickocff/environmental sensor is not interfere with each other, improves the precision of each chip detection.
Intelligent worn device of the present utility model, described microphone chip 6, environmental sensor chip 5 can be arranged on the not homonymy of circuit board 1; Certainly, also can be arranged on the same side of circuit board 1, the efficiency of SMT attachment can be improved thus, reduce the cost manufactured.
In the execution mode that the utility model one is concrete, with reference to figure 1, described first via 8 arranges on the circuit card 1, and described second via 7 is arranged on the one end away from circuit board 1 on the second encapsulating housing 3.The inner chamber of terminal shell 2 is divided into the first mutually isolated cavity volume 9, second cavity volume 10 by described circuit board 1; Wherein, the first via 8 of described first outer enclosure is communicated with the first cavity volume 9; Second via 7 of described second outer enclosure is communicated with the second cavity volume 10; Described terminal shell 2 is provided with connection first cavity volume 9 and the first extraneous through hole 11, and is communicated with the second cavity volume 10 and the second extraneous through hole 12.
Extraneous sound enters in the inner chamber of the first outer enclosure through the first through hole 11, first via 8, and acts on the vibrating diaphragm of microphone chip 6; The environmental sensor chip 5 being positioned at the second outer enclosure is in communication with the outside by the second via 7, second cavity volume 10, second through hole 12, thus can respond to extraneous environmental change, thus exports the corresponding signal of telecommunication.With reference to figure 1, microphone chip 6 is positioned at the both sides of Intelligent worn device with the opening of environmental sensor chip 5, can avoid the interference between different testing environment thus.
It should be noted that at this, circuit board 1 comprises the circuit board of exterior terminal and the circuit board for the formation of the first outer enclosure, the second outer enclosure, after each chip forms respective outer enclosure, can the mode of SMT be mounted on the circuit board of exterior terminal.
Intelligent worn device of the present utility model can be earphone, terminal shell 2 can adopt earphone shape well-known to those skilled in the art, after user wears, terminal shell 2 is positioned at the side of the second through hole 12 can by the sealed ear of human body, makes environmental sensor chip 5 can environmental change in human body duct thus.Preferably, the duct of shape and human body that described terminal shell 2 is positioned at the second cavity volume 10 position matches, and this side of terminal shell 2 can be contacted better with the duct of human body.
Although be described in detail specific embodiments more of the present utility model by example, it should be appreciated by those skilled in the art, above example is only to be described, instead of in order to limit scope of the present utility model.It should be appreciated by those skilled in the art, when not departing from scope and spirit of the present utility model, above embodiment can be modified.Scope of the present utility model is limited by claims.
Claims (10)
1. an Intelligent worn device, is characterized in that: comprise terminal shell (2), and is arranged on the circuit board (1) in described terminal shell (2); Also comprise the microphone chip (6) be fixed on circuit board (1), optical pickocff/environmental sensor chip (5), also comprise the first encapsulating housing (4) be fixed on circuit board (1), the second encapsulating housing (3), described first encapsulating housing (4) and circuit board (1) define the first outer enclosure for packaged microphone chip (6), and in the first outer enclosure, be provided with the first via (8); Described second encapsulating housing (3) and circuit board (1) define the second outer enclosure for encapsulating optical transducer/environmental sensor chip (5), and in the second outer enclosure, be provided with the second via (7), wherein, described first via (8), the second via (7) are positioned at not homonymy.
2. Intelligent worn device according to claim 1, is characterized in that: described environmental sensor chip (5) is humidity sensor chip, pressure sensor chip or temperature sensor chip.
3. Intelligent worn device according to claim 1, it is characterized in that: described first via (8) is arranged on the front of the first encapsulating housing (4), described second via (7) is arranged on the back side of the second encapsulating housing (3).
4. Intelligent worn device according to claim 1, it is characterized in that: described first via (8) is arranged on the left side of the first encapsulating housing (4), described second via (7) is arranged on the right side of the second encapsulating housing (3).
5. Intelligent worn device according to claim 1, is characterized in that: described microphone chip (6), optical pickocff/environmental sensor chip (5) is arranged on the same side of circuit board (1).
6. Intelligent worn device according to claim 5, it is characterized in that: described first via (8) is arranged on circuit board (1), described second via (7) is arranged on the one end away from circuit board (1) on the second encapsulating housing (3).
7. Intelligent worn device according to claim 1, is characterized in that: described first encapsulating housing (4) and the second encapsulating housing (3) are close to and distribute, and the two shares a sidewall (13).
8. Intelligent worn device according to claim 1, is characterized in that: the inner chamber of terminal shell (2) is divided into mutually isolated the first cavity volume (9), the second cavity volume (10) by described circuit board (1); Wherein, first via (8) of described first outer enclosure is communicated with the first cavity volume (9); Second via (7) of described second outer enclosure is communicated with the second cavity volume (10); Described terminal shell (2) is provided with connection first cavity volume (9) and extraneous the first through hole (11), and is communicated with the second cavity volume (10) and extraneous the second through hole (12).
9. Intelligent worn device according to claim 8, is characterized in that: described Intelligent worn device is earphone.
10. Intelligent worn device according to claim 9, is characterized in that: the duct of shape and human body that described terminal shell (2) is positioned at the second cavity volume (10) position matches.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520977892.0U CN205142470U (en) | 2015-11-30 | 2015-11-30 | Intelligent wear device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520977892.0U CN205142470U (en) | 2015-11-30 | 2015-11-30 | Intelligent wear device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205142470U true CN205142470U (en) | 2016-04-06 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520977892.0U Active CN205142470U (en) | 2015-11-30 | 2015-11-30 | Intelligent wear device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205142470U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105721998A (en) * | 2016-04-27 | 2016-06-29 | 歌尔声学股份有限公司 | Separated cavity packaging structure of integrated sensor |
| CN106547361A (en) * | 2016-12-07 | 2017-03-29 | 歌尔科技有限公司 | A kind of multisensor part module and wearable device |
-
2015
- 2015-11-30 CN CN201520977892.0U patent/CN205142470U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105721998A (en) * | 2016-04-27 | 2016-06-29 | 歌尔声学股份有限公司 | Separated cavity packaging structure of integrated sensor |
| CN106547361A (en) * | 2016-12-07 | 2017-03-29 | 歌尔科技有限公司 | A kind of multisensor part module and wearable device |
| CN106547361B (en) * | 2016-12-07 | 2023-11-24 | 歌尔科技有限公司 | Multi-sensor module and wearable device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C56 | Change in the name or address of the patentee | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 261031 Dongfang Road, Weifang high tech Development Zone, Shandong, China, No. 268 Patentee after: Goertek Inc. Address before: 261031 Dongfang Road, Weifang high tech Development Zone, Shandong, China, No. 268 Patentee before: Goertek Inc. |
|
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20200616 Address after: 266104 room 103, 396 Songling Road, Laoshan District, Qingdao, Shandong Province Patentee after: Goer Microelectronics Co.,Ltd. Address before: 261031 Dongfang Road, Weifang high tech Development Zone, Shandong, China, No. 268 Patentee before: GOERTEK Inc. |