WO2024061027A1 - Transducer and electronic device - Google Patents
Transducer and electronic device Download PDFInfo
- Publication number
- WO2024061027A1 WO2024061027A1 PCT/CN2023/117737 CN2023117737W WO2024061027A1 WO 2024061027 A1 WO2024061027 A1 WO 2024061027A1 CN 2023117737 W CN2023117737 W CN 2023117737W WO 2024061027 A1 WO2024061027 A1 WO 2024061027A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- hole
- transducer
- sound
- transducer according
- ring
- Prior art date
Links
- 239000000758 substrate Substances 0.000 claims abstract description 34
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 23
- 239000012528 membrane Substances 0.000 claims description 47
- 230000004308 accommodation Effects 0.000 claims description 36
- 238000003466 welding Methods 0.000 claims description 33
- 239000000463 material Substances 0.000 claims description 10
- 239000011358 absorbing material Substances 0.000 claims description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- 239000004734 Polyphenylene sulfide Substances 0.000 claims description 3
- 239000011889 copper foil Substances 0.000 claims description 3
- 229920001721 polyimide Polymers 0.000 claims description 3
- 229920000069 polyphenylene sulfide Polymers 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
- 239000011347 resin Substances 0.000 claims description 3
- 229920002379 silicone rubber Polymers 0.000 claims description 3
- 239000004945 silicone rubber Substances 0.000 claims description 3
- 229910000679 solder Inorganic materials 0.000 abstract 2
- 210000003454 tympanic membrane Anatomy 0.000 description 10
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 7
- 238000005192 partition Methods 0.000 description 6
- 238000010586 diagram Methods 0.000 description 5
- 238000004078 waterproofing Methods 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 4
- 230000008054 signal transmission Effects 0.000 description 4
- 239000010931 gold Substances 0.000 description 3
- 229910052737 gold Inorganic materials 0.000 description 3
- 230000005236 sound signal Effects 0.000 description 3
- 239000004642 Polyimide Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 229920000742 Cotton Polymers 0.000 description 1
- 229920000877 Melamine resin Polymers 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000008094 contradictory effect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- JDSHMPZPIAZGSV-UHFFFAOYSA-N melamine Chemical compound NC1=NC(N)=NC(N)=N1 JDSHMPZPIAZGSV-UHFFFAOYSA-N 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
- 238000000844 transformation Methods 0.000 description 1
- 238000013022 venting Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R9/00—Transducers of moving-coil, moving-strip, or moving-wire type
- H04R9/06—Loudspeakers
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R9/00—Transducers of moving-coil, moving-strip, or moving-wire type
- H04R9/02—Details
Definitions
- the present application relates to the field of transducer technology, and in particular, to a transducer and electronic equipment.
- the main purpose of this application is to provide a transducer and electronic equipment, aiming to solve the technical problem in the prior art that a transducer with a deep water waterproof function will produce an eardrum.
- the present application provides a transducer, which includes a base plate, a shell covering the base plate, and a welding ring connecting the base plate and the shell, and the shell is connected to the shell.
- the substrate cooperates to form an accommodation cavity, and a MEMS chip and an ASIC chip for signal connection are provided in the accommodation cavity.
- a sound hole is provided on the substrate, and a waterproof membrane is provided at the sound hole to prevent water from entering the sound hole.
- the accommodating cavity, the welding ring is formed with a vent passage, the vent passage includes a first through hole toward the accommodating cavity and a second through hole away from the accommodating cavity, so as to communicate with the accommodating cavity through the vent passage. cavity and the outside world.
- the vent passage bends and extends within the welding ring.
- the welding ring is in a zigzag shape, and the first through hole and the second through hole are arranged close to each other.
- the welding ring also includes an inner ring, an outer ring and a separator.
- the inner ring is provided with The vent passage is formed inside the outer ring, between the inner ring and the outer ring, and the two ends of the partition are respectively connected to the inner ring and the outer ring, and the partition Separate the first through hole and the second through hole.
- the first through hole and the second through hole are respectively located at both ends of the air release passage.
- the welding ring is in a zigzag shape, and the second through hole is disposed on a side away from the first through hole.
- the vent passage is filled with sound-absorbing material.
- the welding ring is made of copper foil.
- the waterproof membrane includes a membrane body and a base material connected to a side of the substrate away from the accommodation cavity, the membrane body is sealingly connected to the base material, and the waterproof membrane is connected to the base material. Sound hole spacing setting.
- the waterproof membrane is a silicone rubber membrane, a polyimide membrane, or a polyphenylene sulfide resin membrane.
- the transducer is a MEMS microphone.
- the present application also provides an electronic device, which includes a housing and the above-mentioned transducer disposed in the housing.
- the transducer includes a substrate, a shell covering the substrate, and a welding ring connecting the substrate and the shell, the shell and the substrate cooperate to form a housing cavity, a MEMS chip and an ASIC chip connected to the signal are arranged in the housing cavity, a sound hole is arranged on the substrate, a waterproof film is arranged at the sound hole to prevent water from entering the housing cavity from the sound hole, and an air leakage passage is formed in the welding ring, the air leakage passage includes a first through hole facing the housing cavity and a second through hole away from the housing cavity, so as to connect the housing cavity with the outside world through the air leakage passage.
- the transducer includes a substrate and a shell covering the substrate, the shell and the substrate cooperate to form a housing cavity, a MEMS chip and an ASIC chip connected to the signal are arranged in the housing cavity, a sound hole is arranged on the substrate, a waterproof film is arranged at the sound hole to prevent water from entering the housing cavity from the sound hole, and an air leakage passage is formed in the housing, the air leakage passage includes a first through hole facing the housing cavity and a second through hole away from the housing cavity, so as to connect the housing cavity with the outside world through the air leakage passage.
- the substrate plays the role of load support, circuit connection and signal transmission.
- the MEMS chip and the ASIC chip can be connected by gold wires.
- the ASIC chip is connected to the substrate by gold wires.
- the gold wires provide circuit connection and signal transmission functions.
- the MEMS chip and the ASIC chip provide sound-to-electric conversion functions.
- the waterproof membrane can prevent air and water from entering the accommodating cavity from the sound hole. At the same time, the waterproof membrane has good compliance and vibration characteristics, so that the sound can be smoothly transmitted to the MEMS chip through the waterproof membrane with less sound loss. In general, in order to prevent the eardrum, which may cause the diaphragm to rupture in severe cases, the air pressure inside the accommodating cavity cannot be too high. One way is to set an air release line on the diaphragm of the MEMS chip to balance the internal and external air pressure.
- an air leakage passage is provided on the welding ring, and the air leakage passage includes a first through hole facing the accommodating cavity and a second through hole away from the accommodating cavity, so as to connect the accommodating cavity with the outside world through the air leakage passage, so that the air in the accommodating cavity can enter the air leakage passage through the first through hole and be discharged through the second through hole. That is, the air pressure in the accommodating cavity and the outside world can be balanced, thereby avoiding the occurrence of rupture of the eardrum or even the diaphragm.
- This technical solution has the advantage of being able to prevent the transducer from causing the eardrum phenomenon due to excessive air pressure in the accommodating cavity.
- Figure 1 is a schematic cross-sectional structural diagram of a transducer according to an embodiment of the present application
- FIG. 2 is a schematic structural diagram of a welding ring and a vent channel according to an embodiment of the present application
- Figure 3 is a schematic cross-sectional structural view of the housing, welding ring and vent channel according to an embodiment of the present application
- Figure 4 is another cross-sectional structural schematic diagram of the housing, welding ring and vent channel according to an embodiment of the present application
- FIG. 5 is a schematic structural diagram of a welding ring and a vent channel according to another embodiment of the present application.
- FIG. 6 is a schematic structural diagram of a welding ring and an air leakage channel according to another embodiment of the present application.
- Base plate 1. Base plate; 2. Shell; 3. Accommodating cavity; 4. Welding ring; 41. Inner ring; 42. Outer ring; 43. Separator; 5. Waterproof membrane; 51. Base material; 52. Membrane body; 6. MEMS chip; 7. ASIC chip; 8. Vent passage; 81. First through hole; 82. Second through hole; 9. Sound hole; 10. Gold wire; 11. Sound-absorbing material; 12. Waterproof and breathable membrane.
- the present application provides a transducer, including a substrate 1, a shell 2 covering the substrate 1, and a welding ring 4 connecting the substrate 1 and the shell 2.
- the shell 2 and The substrate 1 cooperates to form an accommodation cavity 3.
- a MEMS chip 6 and an ASIC chip 7 for signal connection are provided in the accommodation cavity 3.
- a sound hole 9 is provided on the substrate 1, and a waterproof membrane 5 is provided at the sound hole 9 to prevent water from entering through the sound hole 9.
- the accommodating cavity 3 and the welding ring 4 are formed with a vent passage 8.
- the vent passage 8 includes a first through hole 81 facing the accommodating cavity 3 and a second through hole 82 away from the accommodating cavity 3, so as to connect the accommodating cavity 3 and the outside world through the vent passage 8. .
- the transducer includes a substrate 1 and a shell 2 covering the substrate 1.
- the shell 2 cooperates with the substrate 1 to form an accommodation cavity 3.
- the accommodation cavity 3 is provided with a MEMS chip 6 and an ASIC chip 7 for signal connection.
- the substrate 1 A sound hole 9 is provided on the top, and a waterproof membrane 5 is provided at the sound hole 9 to prevent water from entering the accommodation cavity 3 from the sound hole 9.
- a vent passage 8 is formed in the housing 2, and the vent passage 8 includes a first through hole 81 facing the accommodation cavity 3. and a second through hole 82 facing away from the accommodation cavity 3 to communicate the accommodation cavity 3 and the outside world through the air release passage 8 .
- the shell 2 can be a metal shell, and the substrate 1 functions as load support, circuit connection and signal transmission.
- the MEMS chip 6 and the ASIC chip 7 can be connected through the gold wire 10, and the ASIC chip 7 can also be connected to the substrate 1 through the gold wire 10. connection, the gold wire 10 provides circuit connection and signal transmission functions, the MEMS chip 6 and the ASIC chip 7 provide the sound-to-electricity conversion function, the waterproof membrane 5 can prevent air and water from entering the accommodation cavity 3 from the sound hole 9, and the waterproof membrane 5 5 has good compliance and vibration characteristics, so that sound can be smoothly transmitted to the MEMS chip 6 through the waterproof membrane 5 with small sound loss. Under normal circumstances, in order to prevent the eardrum from rupturing the diaphragm in severe cases, the air pressure inside the accommodation cavity 3 cannot be too high.
- One way is to set a deflation line on the diaphragm to balance the internal and external air pressure.
- the water pressure reaches 5 atmospheres.
- a waterproof membrane 5 will be installed at the sound hole 9, so that , the air inside the accommodation cavity 3 is blocked by the waterproof membrane 5 after passing through the deflation line and cannot be discharged. It is possible that the air pressure in the accommodation cavity 3 is too high, causing a tympanic membrane phenomenon.
- a vent passage 8 is provided on the welding ring 4, and the vent passage 8 includes a first through hole 81 facing the accommodation cavity 3 and a second through hole 82 away from the accommodation cavity 3, so that the accommodation is connected through the vent passage 8.
- the air in the cavity 3 can enter the air release passage 8 through the first through hole 81 and be discharged through the second through hole 82 . That is to say, the accommodation cavity 3 and the external air pressure can be balanced to avoid the occurrence of tympanic membrane or even diaphragm rupture.
- This embodiment has the advantage of being able to prevent the transducer from causing a tympanic membrane phenomenon due to excessive air pressure in the accommodation cavity 3 , especially for transducers that are deep-water waterproof.
- the waterproof membrane 5 is a silicone rubber membrane, a polyimide membrane, or a polyphenylene sulfide resin membrane.
- the vent passage 8 is bent and extended within the welding ring 4 .
- Setting a vent passage 8 in the welding ring 4 can achieve venting and balance the air pressure inside and outside the accommodation cavity 3.
- the vent passage 8 can be set in a bend, thus increasing the size of the accommodation cavity 3.
- the passage between the outside world and the outside world increases the sound resistance. Even if the outside sound wave enters the vent passage 8 through the second through hole 82, the sound wave will be completely lost in the vent passage 8 with a certain length, thereby preventing the external sound wave from passing through the second through hole 82.
- the two through holes 82 enter the accommodating cavity 3 inside the transducer, which ensures air leakage and avoids the occurrence of acoustic short circuit.
- Acoustic short circuit means that sound waves enter the accommodating cavity 3 from the acoustic hole 9 and the second through hole 82 at the same time.
- the bending arrangement of the vent passage 8 also increases the difficulty for water to flow into the accommodation cavity 3 from the second through hole 82, thereby preventing external water from entering the accommodation cavity 3 of the transducer.
- the welding ring 4 is in a back shape, with the first through hole 81 and the second through hole 82 being disposed close to each other.
- the welding ring 4 also includes an inner ring 41 , an outer ring 42 and a separator 43 , the inner ring 41 is disposed inside the outer ring 42, a vent passage 8 is formed between the inner ring 41 and the outer ring 42, the two ends of the partition 43 are connected to the inner ring 41 and the outer ring 42 respectively, and the partition 43 separates the first through hole 81 and second through hole 82 .
- Both the inner ring 41 and the outer ring 42 are connected to the housing 2 and the substrate 1.
- the inner ring 41 and the outer ring 42 are both made of copper foil.
- the first through hole 81 and the second through hole 82 are arranged close to each other, they are separated by the partition 43.
- the first through hole 81 and the second through hole 82 are separated, so that external sound waves can only enter from the first through hole 81 after passing through the entire vent passage 8 from the second through hole 82, instead of without the partition 43.
- the welding ring 4 can be made in one piece.
- the first through hole 81 and the second through hole 82 are respectively located at both ends of the air release passage 8 .
- the length of the vent passage 8 can be lengthened, thereby increasing the acoustic resistance so that the sound waves entering from the second through hole 82 are lost in the vent passage 8 This further prevents external sound from entering the accommodation cavity 3 inside the transducer from the second through hole 82, thereby avoiding the occurrence of acoustic short circuit while ensuring air leakage.
- the welding ring 4 is in a back shape, and the second through hole 82 is provided on the side away from the first through hole 81 , which can increase the length of the vent passage 8 and increase the sound loss while saving time. Without the production of the separator 43, the production of the welding ring 4 is simpler and the production cost is lower.
- the vent passage 8 is filled with sound-absorbing material 11 .
- the sound-absorbing material 11 can be filled in the vent passage 8 to increase the sound loss and further prevent sound waves from entering the accommodation cavity 3 from the second through hole 82 through the vent passage 8 .
- the sound-absorbing material 11 can be sound-absorbing cotton or sound-absorbing particles, and the sound-absorbing particles can be made of melamine.
- the second through hole 82 is covered with a waterproof and breathable film 12 .
- the waterproof and breathable film 12 has a waterproof function and can effectively prevent external liquid from flowing into the transducer from the second through hole 82 . inside the cavity 3; and the air can flow freely through the waterproof and breathable membrane 12, which can ensure that the accommodation cavity 3 is connected to the outside world, and plays a role in balancing the internal and external sound pressure.
- the waterproof membrane 5 includes a membrane body 52 and a base material 51 connected to the side of the substrate 1 away from the accommodation cavity 3 .
- the membrane body 52 is sealingly connected to the base material 51 , and the waterproof membrane 5 is connected to the sound hole. 9 interval settings.
- the base material 51 can be arranged around the periphery of the sound hole 9, and the waterproof membrane 5 is placed facing the sound hole 9, and then the sound hole 9 is isolated from the outside world through a sealing connection between the membrane body 52 and the base material 51.
- the waterproof membrane 5 here can simultaneously play the role of The function of preventing air and water from entering, but since the sound signal needs to be transmitted through the vibration of the waterproof membrane 5, the waterproof membrane 5 is spaced apart from the sound hole 9 so that the waterproof membrane 5 can vibrate freely and better transmit the sound signal.
- the transducer is a MEMS microphone.
- the MEMS chip 6 can be used not only to detect sound signals, but also to detect functions such as ultrasonic waves and environmental parameters.
- the MEMS microphone is just a form of transducer.
- the present application also provides an electronic device.
- the electronic device includes a housing and the above-mentioned transducer disposed in the housing. Since the electronic device includes all the technical solutions of all the embodiments of the above-mentioned transducer, it has at least all the beneficial effects brought by all the above-mentioned technical solutions, which will not be described again here.
- the above-mentioned electronic device may be a portable device or a wearable device, such as a smartphone, a smart watch, a smart bracelet, or an IPAD, etc.
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Acoustics & Sound (AREA)
- Signal Processing (AREA)
- Electrostatic, Electromagnetic, Magneto- Strictive, And Variable-Resistance Transducers (AREA)
Abstract
The present application provides a transducer and an electronic device. The transducer comprises a substrate, a housing covering the substrate, and a solder ring connecting the substrate and the shell. The housing is fitted to the substrate to form an accommodating cavity, and a MEMS chip and an ASIC chip which have a signal connection are disposed in the accommodating cavity. A sound hole is provided in the substrate, and a waterproof film is disposed at the sound hole so as to block water from entering the accommodating cavity via the sound hole. An air leakage path is formed in the solder ring, the air leakage path comprising a first through hole facing the accommodating cavity and a second through hole facing away from the accommodating cavity, so that the accommodating cavity and the outside are in communication via the air leakage path.
Description
本申请要求于2022年9月20日申请的、申请号为202211144960.6的中国专利申请的优先权,其全部内容通过引用结合在本申请中。This application claims priority to the Chinese patent application with application number 202211144960.6 filed on September 20, 2022, the entire content of which is incorporated into this application by reference.
本申请涉及换能器技术领域,尤其涉及一种换能器及电子设备。The present application relates to the field of transducer technology, and in particular, to a transducer and electronic equipment.
在制作对深水防水有要求的换能器时,需要在换能器的声孔处设置一层防水膜,以防止水从声孔进入换能器的内部;在深水级别的防水中,采用的防水膜往往同时具有防止空气透过的功能。When manufacturing a transducer that requires deep water waterproofing, it is necessary to set a waterproof membrane at the sound hole of the transducer to prevent water from entering the interior of the transducer through the sound hole; in deep water waterproofing, the waterproof membrane used often also has the function of preventing air from penetrating.
上述中,设置防水膜会导致换能器的内部封闭,当换能器内部气压过高(如高温等环境)时会产生鼓膜,严重时会导致振膜损坏。Among the above, setting up a waterproof membrane will cause the interior of the transducer to be closed. When the internal air pressure of the transducer is too high (such as high temperature and other environments), a tympanic membrane will be formed, and in severe cases, the diaphragm will be damaged.
鉴于此,有必要提供一种新的换能器及电子设备,以解决或至少缓解上述技术缺陷。In view of this, it is necessary to provide a new transducer and electronic device to solve or at least alleviate the above technical shortcomings.
本申请的主要目的是提供一种换能器及电子设备,旨在解决现有技术中具备深水防水功能的换能器会产生鼓膜的技术问题。The main purpose of this application is to provide a transducer and electronic equipment, aiming to solve the technical problem in the prior art that a transducer with a deep water waterproof function will produce an eardrum.
为实现上述目的,根据本申请的一个方面,本申请提供一种换能器,包括基板、罩设于所述基板的外壳以及连接所述基板和所述外壳的焊环,所述外壳与所述基板配合形成容纳腔,所述容纳腔内设置有信号连接的MEMS芯片和ASIC芯片,所述基板上设置有声孔,所述声孔处设置有防水膜以阻挡水从所述声孔进入所述容纳腔,所述焊环形成有泄气通路,所述泄气通路包括朝向所述容纳腔的第一通孔和背离所述容纳腔的第二通孔,以通过所述泄气通路连通所述容纳腔和外界。In order to achieve the above object, according to one aspect of the present application, the present application provides a transducer, which includes a base plate, a shell covering the base plate, and a welding ring connecting the base plate and the shell, and the shell is connected to the shell. The substrate cooperates to form an accommodation cavity, and a MEMS chip and an ASIC chip for signal connection are provided in the accommodation cavity. A sound hole is provided on the substrate, and a waterproof membrane is provided at the sound hole to prevent water from entering the sound hole. The accommodating cavity, the welding ring is formed with a vent passage, the vent passage includes a first through hole toward the accommodating cavity and a second through hole away from the accommodating cavity, so as to communicate with the accommodating cavity through the vent passage. cavity and the outside world.
在一实施例中,所述泄气通路在所述焊环内弯折延伸。In one embodiment, the vent passage bends and extends within the welding ring.
在一实施例中,所述焊环呈回字形,所述第一通孔和所述第二通孔靠近设置,所述焊环还包括内环、外环和分隔件,所述内环设置于所述外环的内侧,所述内环和所述外环之间形成有所述泄气通路,所述分隔件的两端分别连接所述内环和所述外环,且所述分隔件分隔所述第一通孔和所述第二通孔。In one embodiment, the welding ring is in a zigzag shape, and the first through hole and the second through hole are arranged close to each other. The welding ring also includes an inner ring, an outer ring and a separator. The inner ring is provided with The vent passage is formed inside the outer ring, between the inner ring and the outer ring, and the two ends of the partition are respectively connected to the inner ring and the outer ring, and the partition Separate the first through hole and the second through hole.
在一实施例中,所述第一通孔和所述第二通孔分别位于所述泄气通路的两端。In one embodiment, the first through hole and the second through hole are respectively located at both ends of the air release passage.
在一实施例中,所述焊环呈回字形,所述第二通孔设置于远离所述第一通孔的一侧。In one embodiment, the welding ring is in a zigzag shape, and the second through hole is disposed on a side away from the first through hole.
在一实施例中,所述泄气通路内填充有吸音材料。In one embodiment, the vent passage is filled with sound-absorbing material.
在一实施例中,所述焊环由铜箔制成。In one embodiment, the welding ring is made of copper foil.
在一实施例中,所述防水膜包括膜体和连接于所述基板背离所述容纳腔一侧的基材,所述膜体与所述基材密封连接,且所述防水膜与所述声孔间隔设置。In one embodiment, the waterproof membrane includes a membrane body and a base material connected to a side of the substrate away from the accommodation cavity, the membrane body is sealingly connected to the base material, and the waterproof membrane is connected to the base material. Sound hole spacing setting.
在一实施例中,所述防水膜为硅橡胶膜或聚酰亚胺膜或聚苯硫醚树脂膜。In one embodiment, the waterproof membrane is a silicone rubber membrane, a polyimide membrane, or a polyphenylene sulfide resin membrane.
在一实施例中,所述换能器为MEMS麦克风。In one embodiment, the transducer is a MEMS microphone.
根据本申请的另一方面,本申请还提供一种电子设备,所述电子设备包括壳体和设置于所述壳体内的上述所述的换能器。According to another aspect of the present application, the present application also provides an electronic device, which includes a housing and the above-mentioned transducer disposed in the housing.
上述方案中,换能器包括基板、罩设于基板的外壳以及连接基板和外壳的焊环,外壳与基板配合形成容纳腔,容纳腔内设置有信号连接的MEMS芯片和ASIC芯片,基板上设置有声孔,声孔处设置有防水膜以阻挡水从声孔进入容纳腔,焊环形成有泄气通路,泄气通路包括朝向容纳腔的第一通孔和背离容纳腔的第二通孔,以通过泄气通路连通容纳腔和外界。上述方案中,换能器包括基板和罩设于基板的外壳,外壳与基板配合形成容纳腔,容纳腔内设置有信号连接的MEMS芯片和ASIC芯片,基板上设置有声孔,声孔处设置有防水膜以阻挡水从声孔进入容纳腔,外壳内形成有泄气通路,泄气通路包括朝向容纳腔的第一通孔和背离容纳腔的第二通孔,以通过泄气通路连通容纳腔和外界。上述方案中,基板起负载支撑及电路连接和信号传输功能,MEMS芯片和ASIC芯片可以通过金线连接,ASIC芯片通过金线与基板连接,金线提供电路连接及信号传输功能,MEMS芯片、ASIC芯片提供声电转换功能,防水膜可以起到防止空气和水从声孔进入容纳腔的作用,同时防水膜具有较好的顺性和振动特性,使声音能顺利通过防水膜传递到MEMS芯片且有较小的声损。一般情况下,为防止鼓膜,严重时可能导致振膜破裂的现象,容纳腔内部气压不能过高,一种方式可以在MEMS芯片的振膜上设置泄气线,以平衡内外部气压。但对于对防水要求比较高的场景下,如深水级别防水,水压达到了5个大气压,为防止水从声孔处进入换能器,会在声孔处设置一防水膜,这样,容纳腔内部空气通过泄气线后受到防水膜的阻挡而不能排出,有可能因为容纳腔内气压过高而造成鼓膜现象。本申请技术方案中,通过在焊环上设置泄气通路,并且泄气通路包括朝向容纳腔的第一通孔和背离容纳腔的第二通孔,以通过泄气通路连通容纳腔和外界,使得容纳腔的空气可以通过第一通孔进入泄气通路,并经第二通孔排出。也即可以平衡容纳腔和外界气压,避免了鼓膜甚至振膜破裂现象的发生。该技术方案具有能够防止换能器因容纳腔内气压过高造成鼓膜现象的优点。In the above scheme, the transducer includes a substrate, a shell covering the substrate, and a welding ring connecting the substrate and the shell, the shell and the substrate cooperate to form a housing cavity, a MEMS chip and an ASIC chip connected to the signal are arranged in the housing cavity, a sound hole is arranged on the substrate, a waterproof film is arranged at the sound hole to prevent water from entering the housing cavity from the sound hole, and an air leakage passage is formed in the welding ring, the air leakage passage includes a first through hole facing the housing cavity and a second through hole away from the housing cavity, so as to connect the housing cavity with the outside world through the air leakage passage. In the above scheme, the transducer includes a substrate and a shell covering the substrate, the shell and the substrate cooperate to form a housing cavity, a MEMS chip and an ASIC chip connected to the signal are arranged in the housing cavity, a sound hole is arranged on the substrate, a waterproof film is arranged at the sound hole to prevent water from entering the housing cavity from the sound hole, and an air leakage passage is formed in the housing, the air leakage passage includes a first through hole facing the housing cavity and a second through hole away from the housing cavity, so as to connect the housing cavity with the outside world through the air leakage passage. In the above scheme, the substrate plays the role of load support, circuit connection and signal transmission. The MEMS chip and the ASIC chip can be connected by gold wires. The ASIC chip is connected to the substrate by gold wires. The gold wires provide circuit connection and signal transmission functions. The MEMS chip and the ASIC chip provide sound-to-electric conversion functions. The waterproof membrane can prevent air and water from entering the accommodating cavity from the sound hole. At the same time, the waterproof membrane has good compliance and vibration characteristics, so that the sound can be smoothly transmitted to the MEMS chip through the waterproof membrane with less sound loss. In general, in order to prevent the eardrum, which may cause the diaphragm to rupture in severe cases, the air pressure inside the accommodating cavity cannot be too high. One way is to set an air release line on the diaphragm of the MEMS chip to balance the internal and external air pressure. However, for scenarios with relatively high waterproof requirements, such as deep water waterproofing, the water pressure reaches 5 atmospheres. In order to prevent water from entering the transducer from the sound hole, a waterproof membrane will be set at the sound hole. In this way, the air inside the accommodating cavity is blocked by the waterproof membrane after passing through the air release line and cannot be discharged. It is possible that the eardrum phenomenon is caused by excessive air pressure in the accommodating cavity. In the technical solution of the present application, an air leakage passage is provided on the welding ring, and the air leakage passage includes a first through hole facing the accommodating cavity and a second through hole away from the accommodating cavity, so as to connect the accommodating cavity with the outside world through the air leakage passage, so that the air in the accommodating cavity can enter the air leakage passage through the first through hole and be discharged through the second through hole. That is, the air pressure in the accommodating cavity and the outside world can be balanced, thereby avoiding the occurrence of rupture of the eardrum or even the diaphragm. This technical solution has the advantage of being able to prevent the transducer from causing the eardrum phenomenon due to excessive air pressure in the accommodating cavity.
为了更清楚地说明本申请实施方式或现有技术中的技术方案,下面将对实施方式或现有技术描述中所需要使用的附图作简单地介绍,显而易见地,下面描述中的附图仅仅是本申请的一些实施方式,对于本领域普通技术人员来讲,在不付出创造性劳动的前提下,还可以根据这些附图示出的结构获得其他的附图。In order to more clearly explain the embodiments of the present application or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings in the following description are only These are some embodiments of the present application. For those of ordinary skill in the art, other drawings can be obtained based on the structures shown in these drawings without exerting creative efforts.
图1为本申请一实施例的换能器的剖面结构示意图;Figure 1 is a schematic cross-sectional structural diagram of a transducer according to an embodiment of the present application;
图2为本申请一实施例的焊环和泄气通道的结构示意图;Figure 2 is a schematic structural diagram of a welding ring and a vent channel according to an embodiment of the present application;
图3为本申请一实施例的外壳、焊环和泄气通道的一剖面结构示意图;Figure 3 is a schematic cross-sectional structural view of the housing, welding ring and vent channel according to an embodiment of the present application;
图4为本申请一实施例的外壳、焊环和泄气通道的另一剖面结构示意图;Figure 4 is another cross-sectional structural schematic diagram of the housing, welding ring and vent channel according to an embodiment of the present application;
图5为本申请另一实施例焊环和泄气通道的结构示意图;Figure 5 is a schematic structural diagram of a welding ring and a vent channel according to another embodiment of the present application;
图6为本申请又一实施例焊环和泄气通道的结构示意图。FIG. 6 is a schematic structural diagram of a welding ring and an air leakage channel according to another embodiment of the present application.
附图标号说明:Explanation of reference numbers:
1、基板;2、外壳;3、容纳腔;4、焊环;41、内环;42、外环;43、分隔件;5、防水膜;51、基材;52、膜体;6、MEMS芯片;7、ASIC芯片;8、泄气通路;81、第一通孔;82、第二通孔;9、声孔;10、金线;11、吸音材料;12、防水透气膜。1. Base plate; 2. Shell; 3. Accommodating cavity; 4. Welding ring; 41. Inner ring; 42. Outer ring; 43. Separator; 5. Waterproof membrane; 51. Base material; 52. Membrane body; 6. MEMS chip; 7. ASIC chip; 8. Vent passage; 81. First through hole; 82. Second through hole; 9. Sound hole; 10. Gold wire; 11. Sound-absorbing material; 12. Waterproof and breathable membrane.
本申请目的的实现、功能特点及优点将结合实施方式,参照附图做进一步说明。The realization of the purpose, functional features and advantages of the present application will be further explained in combination with the implementation mode and with reference to the accompanying drawings.
本申请的实施方式Implementation Mode of this Application
下面将结合本申请实施方式中的附图,对本申请实施方式中的技术方案进行清楚、完整地描述,显然,所描述的实施方式仅仅是本申请的一部分实施方式,而不是全部的实施方式。基于本申请中的实施方式,本领域普通技术人员在没有作出创造性劳动前提下所获得的所有其他实施方式,都属于本申请保护的范围。The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only some of the embodiments of the present application, not all of them. Based on the embodiments in this application, all other embodiments obtained by those of ordinary skill in the art without creative efforts fall within the scope of protection of this application.
需要说明,本申请实施方式中所有方向性指示(诸如上、下……)仅用于解释在某一特定姿态(如附图所示)下各部件之间的相对位置关系、运动情况等,如果该特定姿态发生改变时,则该方向性指示也相应地随之改变。It should be noted that all directional indications (such as up, down...) in the embodiments of this application are only used to explain the relative positional relationship, movement, etc. between the components in a specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indication changes accordingly.
另外,在本申请中如涉及“第一”、“第二”等的描述仅用于描述目的,而不能理解为指示或暗示其相对重要性或者隐含指明所指示的技术特征的数量。由此,限定有“第一”、“第二”的特征可以明示或者隐含地包括至少一个该特征。In addition, descriptions such as "first", "second", etc. in this application are for descriptive purposes only and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of indicated technical features. Therefore, features defined as "first" and "second" may explicitly or implicitly include at least one of these features.
并且,本申请各个实施方式之间的技术方案可以相互结合,但是必须是以本领域普通技术人员能够实现为基础,当技术方案的结合出现相互矛盾或无法实现时应当认为这种技术方案的结合不存在,也不在本申请要求的保护范围之内。In addition, the technical solutions in the various embodiments of the present application can be combined with each other, but it must be based on the realization by those of ordinary skill in the art. When the combination of technical solutions is contradictory or cannot be realized, it should be considered that such a combination of technical solutions is possible. It does not exist and is not within the protection scope required by this application.
参见图1至图6,根据本申请的一个方面,本申请提供一种换能器,包括基板1、罩设于基板1的外壳2以及连接基板1和外壳2的焊环4,外壳2与基板1配合形成容纳腔3,容纳腔3内设置有信号连接的MEMS芯片6和ASIC芯片7,基板1上设置有声孔9,声孔9处设置有防水膜5以阻挡水从声孔9进入容纳腔3,焊环4形成有泄气通路8,泄气通路8包括朝向容纳腔3的第一通孔81和背离容纳腔3的第二通孔82,以通过泄气通路8连通容纳腔3和外界。Referring to Figures 1 to 6, according to one aspect of the present application, the present application provides a transducer, including a substrate 1, a shell 2 covering the substrate 1, and a welding ring 4 connecting the substrate 1 and the shell 2. The shell 2 and The substrate 1 cooperates to form an accommodation cavity 3. A MEMS chip 6 and an ASIC chip 7 for signal connection are provided in the accommodation cavity 3. A sound hole 9 is provided on the substrate 1, and a waterproof membrane 5 is provided at the sound hole 9 to prevent water from entering through the sound hole 9. The accommodating cavity 3 and the welding ring 4 are formed with a vent passage 8. The vent passage 8 includes a first through hole 81 facing the accommodating cavity 3 and a second through hole 82 away from the accommodating cavity 3, so as to connect the accommodating cavity 3 and the outside world through the vent passage 8. .
上述方案中,换能器包括基板1和罩设于基板1的外壳2,外壳2与基板1配合形成容纳腔3,容纳腔3内设置有信号连接的MEMS芯片6和ASIC芯片7,基板1上设置有声孔9,声孔9处设置有防水膜5以阻挡水从声孔9进入容纳腔3,外壳2内形成有泄气通路8,泄气通路8包括朝向容纳腔3的第一通孔81和背离容纳腔3的第二通孔82,以通过泄气通路8连通容纳腔3和外界。上述方案中,外壳2可以为金属外壳,基板1起负载支撑及电路连接和信号传输功能,MEMS芯片6和ASIC芯片7可以通过金线10连接,ASIC芯片7也可通过金线10与基板1连接,金线10提供电路连接及信号传输功能,MEMS芯片6、ASIC芯片7提供声电转换功能,防水膜5可以起到防止空气和水从声孔9进入容纳腔3的作用,同时防水膜5具有较好的顺性和振动特性,使声音能顺利通过防水膜5传递到MEMS芯片6且有较小的声损。一般情况下,为防止鼓膜,严重时可能导致振膜破裂的现象,容纳腔3内部气压不能过高,一种方式可以在振膜上设置泄气线,以平衡内外部气压。但对于对防水要求比较高的场景下,如深水级别防水,水压达到了5个大气压,为防止水从声孔9处进入换能器,会在声孔9处设置一防水膜5,这样,容纳腔3内部空气通过泄气线后受到防水膜5的阻挡而不能排出,有可能因为容纳腔3内气压过高而造成鼓膜现象。本实施例中,通过在焊环4上设置泄气通路8,并且泄气通路8包括朝向容纳腔3的第一通孔81和背离容纳腔3的第二通孔82,以通过泄气通路8连通容纳腔3和外界,使得容纳腔3的空气可以通过第一通孔81进入泄气通路8,并经第二通孔82排出。也即可以平衡容纳腔3和外界气压,避免了鼓膜甚至振膜破裂现象的发生。该实施例具有能够防止换能器因容纳腔3内气压过高造成鼓膜现象的优点,尤其是具备深水防水的换能器。具体地,防水膜5为硅橡胶膜或聚酰亚胺膜或聚苯硫醚树脂膜。In the above solution, the transducer includes a substrate 1 and a shell 2 covering the substrate 1. The shell 2 cooperates with the substrate 1 to form an accommodation cavity 3. The accommodation cavity 3 is provided with a MEMS chip 6 and an ASIC chip 7 for signal connection. The substrate 1 A sound hole 9 is provided on the top, and a waterproof membrane 5 is provided at the sound hole 9 to prevent water from entering the accommodation cavity 3 from the sound hole 9. A vent passage 8 is formed in the housing 2, and the vent passage 8 includes a first through hole 81 facing the accommodation cavity 3. and a second through hole 82 facing away from the accommodation cavity 3 to communicate the accommodation cavity 3 and the outside world through the air release passage 8 . In the above solution, the shell 2 can be a metal shell, and the substrate 1 functions as load support, circuit connection and signal transmission. The MEMS chip 6 and the ASIC chip 7 can be connected through the gold wire 10, and the ASIC chip 7 can also be connected to the substrate 1 through the gold wire 10. connection, the gold wire 10 provides circuit connection and signal transmission functions, the MEMS chip 6 and the ASIC chip 7 provide the sound-to-electricity conversion function, the waterproof membrane 5 can prevent air and water from entering the accommodation cavity 3 from the sound hole 9, and the waterproof membrane 5 5 has good compliance and vibration characteristics, so that sound can be smoothly transmitted to the MEMS chip 6 through the waterproof membrane 5 with small sound loss. Under normal circumstances, in order to prevent the eardrum from rupturing the diaphragm in severe cases, the air pressure inside the accommodation cavity 3 cannot be too high. One way is to set a deflation line on the diaphragm to balance the internal and external air pressure. However, for scenarios with relatively high waterproofing requirements, such as deep water level waterproofing, the water pressure reaches 5 atmospheres. In order to prevent water from entering the transducer from the sound hole 9, a waterproof membrane 5 will be installed at the sound hole 9, so that , the air inside the accommodation cavity 3 is blocked by the waterproof membrane 5 after passing through the deflation line and cannot be discharged. It is possible that the air pressure in the accommodation cavity 3 is too high, causing a tympanic membrane phenomenon. In this embodiment, a vent passage 8 is provided on the welding ring 4, and the vent passage 8 includes a first through hole 81 facing the accommodation cavity 3 and a second through hole 82 away from the accommodation cavity 3, so that the accommodation is connected through the vent passage 8. The air in the cavity 3 can enter the air release passage 8 through the first through hole 81 and be discharged through the second through hole 82 . That is to say, the accommodation cavity 3 and the external air pressure can be balanced to avoid the occurrence of tympanic membrane or even diaphragm rupture. This embodiment has the advantage of being able to prevent the transducer from causing a tympanic membrane phenomenon due to excessive air pressure in the accommodation cavity 3 , especially for transducers that are deep-water waterproof. Specifically, the waterproof membrane 5 is a silicone rubber membrane, a polyimide membrane, or a polyphenylene sulfide resin membrane.
参照图2,在一实施例中,泄气通路8在焊环4内弯折延伸。在焊环4内设置泄气通路8通过可以实现泄气,平衡容纳腔3内外气压,同时为了避免外界声音从第二通孔82进入,可以将泄气通路8成弯折设置,这样增长了容纳腔3与外界之间的通路,增大了声阻,即使外界的声波通过第二通孔82进入泄气通路8,声波也会在具有一定长度的泄气通路8内损耗殆尽,从而避免外界声波从第二通孔82进入换能器内部的容纳腔3,在保证泄气的同时避免了声短路现象的发生,声短路指声波同时从声孔9和第二通孔82进入容纳腔3内。同时,将泄气通路8弯折设置也增加了水从第二通孔82流入容纳腔3内的难度,避免了外界的水进入换能器的容纳腔3。Referring to FIG. 2 , in one embodiment, the vent passage 8 is bent and extended within the welding ring 4 . Setting a vent passage 8 in the welding ring 4 can achieve venting and balance the air pressure inside and outside the accommodation cavity 3. At the same time, in order to prevent external sounds from entering through the second through hole 82, the vent passage 8 can be set in a bend, thus increasing the size of the accommodation cavity 3. The passage between the outside world and the outside world increases the sound resistance. Even if the outside sound wave enters the vent passage 8 through the second through hole 82, the sound wave will be completely lost in the vent passage 8 with a certain length, thereby preventing the external sound wave from passing through the second through hole 82. The two through holes 82 enter the accommodating cavity 3 inside the transducer, which ensures air leakage and avoids the occurrence of acoustic short circuit. Acoustic short circuit means that sound waves enter the accommodating cavity 3 from the acoustic hole 9 and the second through hole 82 at the same time. At the same time, the bending arrangement of the vent passage 8 also increases the difficulty for water to flow into the accommodation cavity 3 from the second through hole 82, thereby preventing external water from entering the accommodation cavity 3 of the transducer.
参照图2至图5,在一实施例中,焊环4呈回字形,第一通孔81和第二通孔82靠近设置,焊环4还包括内环41、外环42和分隔件43,内环41设置于外环42的内侧,内环41和外环42之间形成有泄气通路8,分隔件43的两端分别连接内环41和外环42,且分隔件43分隔第一通孔81和第二通孔82。内环41和外环42均连接外壳2和基板1,内环41和外环42均由铜箔制成,当第一通孔81和第二通孔82靠近设置时,通过分隔件43将第一通孔81和第二通孔82分隔开,使得外界声波只能从第二通孔82途经整个泄气通路8后才能从第一通孔81进入,而不是在没有分隔件43的情况下,从第二通孔82进入后直接从第一通孔81进入容纳腔3内,这样就增长了外界声波进入容纳腔3的传播长度,进而增大声阻使从第二通孔82进入的声波在泄气通路8内损耗殆尽,从而避免外界声音从第二通孔82进入换能器内部的容纳腔3,在保证泄气的同时避免了声短路现象的发生。焊环4可以一体成型制作。Referring to FIGS. 2 to 5 , in one embodiment, the welding ring 4 is in a back shape, with the first through hole 81 and the second through hole 82 being disposed close to each other. The welding ring 4 also includes an inner ring 41 , an outer ring 42 and a separator 43 , the inner ring 41 is disposed inside the outer ring 42, a vent passage 8 is formed between the inner ring 41 and the outer ring 42, the two ends of the partition 43 are connected to the inner ring 41 and the outer ring 42 respectively, and the partition 43 separates the first through hole 81 and second through hole 82 . Both the inner ring 41 and the outer ring 42 are connected to the housing 2 and the substrate 1. The inner ring 41 and the outer ring 42 are both made of copper foil. When the first through hole 81 and the second through hole 82 are arranged close to each other, they are separated by the partition 43. The first through hole 81 and the second through hole 82 are separated, so that external sound waves can only enter from the first through hole 81 after passing through the entire vent passage 8 from the second through hole 82, instead of without the partition 43. Next, after entering from the second through hole 82, it directly enters the accommodating cavity 3 from the first through hole 81, thus increasing the propagation length of the external sound wave entering the accommodating cavity 3, thereby increasing the acoustic resistance so that the sound waves entering from the second through hole 82 The sound waves are completely lost in the deflation passage 8, thereby preventing external sound from entering the accommodation cavity 3 inside the transducer from the second through hole 82, thereby ensuring deflation while avoiding the occurrence of acoustic short circuit. The welding ring 4 can be made in one piece.
参照图2至图4,在一实施例中,第一通孔81和第二通孔82分别位于泄气通路8的两端。将第一通孔81和第二通孔82设置于泄气通路8的两端,可以增长泄气通路8的长度,进而增大声阻使从第二通孔82进入的声波在泄气通路8内损耗殆尽,进一步避免外界声音从第二通孔82进入换能器内部的容纳腔3,在保证泄气的同时避免了声短路现象的发生。Referring to FIGS. 2 to 4 , in one embodiment, the first through hole 81 and the second through hole 82 are respectively located at both ends of the air release passage 8 . By arranging the first through hole 81 and the second through hole 82 at both ends of the vent passage 8 , the length of the vent passage 8 can be lengthened, thereby increasing the acoustic resistance so that the sound waves entering from the second through hole 82 are lost in the vent passage 8 This further prevents external sound from entering the accommodation cavity 3 inside the transducer from the second through hole 82, thereby avoiding the occurrence of acoustic short circuit while ensuring air leakage.
参照图6,在一实施例中,焊环4呈回字形,第二通孔82设置于远离第一通孔81的一侧,可以在增长泄气通路8的长度,增大声损的同时,省去了分隔件43的制作,焊环4制作更加简单,制作成本更低。Referring to FIG. 6 , in one embodiment, the welding ring 4 is in a back shape, and the second through hole 82 is provided on the side away from the first through hole 81 , which can increase the length of the vent passage 8 and increase the sound loss while saving time. Without the production of the separator 43, the production of the welding ring 4 is simpler and the production cost is lower.
参照图5,在一实施例中,泄气通路8内填充有吸音材料11。可以在泄气通路8内填充吸音材料11来增大声损,进一步避免声波从第二通孔82经泄气通路8进入容纳腔3内。具体地,吸音材料11可以为吸音棉或吸音颗粒,吸音颗粒可以由三聚氢氨制成。Referring to FIG. 5 , in one embodiment, the vent passage 8 is filled with sound-absorbing material 11 . The sound-absorbing material 11 can be filled in the vent passage 8 to increase the sound loss and further prevent sound waves from entering the accommodation cavity 3 from the second through hole 82 through the vent passage 8 . Specifically, the sound-absorbing material 11 can be sound-absorbing cotton or sound-absorbing particles, and the sound-absorbing particles can be made of melamine.
参照图5,在一实施例中,第二通孔82上覆盖有防水透气膜12,防水透气膜12具有防水功能,能够有效地防止外界的液体从第二通孔82流入换能器的容纳腔3内;且空气能够通过防水透气膜12自由流动,能够保证容纳腔3与外界连通,起到平衡内外声压的作用。Referring to FIG. 5 , in one embodiment, the second through hole 82 is covered with a waterproof and breathable film 12 . The waterproof and breathable film 12 has a waterproof function and can effectively prevent external liquid from flowing into the transducer from the second through hole 82 . inside the cavity 3; and the air can flow freely through the waterproof and breathable membrane 12, which can ensure that the accommodation cavity 3 is connected to the outside world, and plays a role in balancing the internal and external sound pressure.
参照图1,在一实施例中,防水膜5包括膜体52和连接于基板1背离容纳腔3一侧的基材51,膜体52与基材51密封连接,且防水膜5与声孔9间隔设置。基材51可以围绕声孔9的外周设置,防水膜5面对声孔9设置,然后通过膜体52与基材51密封连接将声孔9与外界隔离,这里的防水膜5能够同时起到防止空气和水进入的作用,但由于要通过防水膜5的振动传递声音信号,因此将防水膜5与声孔9间隔设置,使得防水膜5能够自由振动而更好的传递声音信号。Referring to FIG. 1 , in one embodiment, the waterproof membrane 5 includes a membrane body 52 and a base material 51 connected to the side of the substrate 1 away from the accommodation cavity 3 . The membrane body 52 is sealingly connected to the base material 51 , and the waterproof membrane 5 is connected to the sound hole. 9 interval settings. The base material 51 can be arranged around the periphery of the sound hole 9, and the waterproof membrane 5 is placed facing the sound hole 9, and then the sound hole 9 is isolated from the outside world through a sealing connection between the membrane body 52 and the base material 51. The waterproof membrane 5 here can simultaneously play the role of The function of preventing air and water from entering, but since the sound signal needs to be transmitted through the vibration of the waterproof membrane 5, the waterproof membrane 5 is spaced apart from the sound hole 9 so that the waterproof membrane 5 can vibrate freely and better transmit the sound signal.
在一实施例中,换能器为MEMS麦克风。MEMS芯片6不仅可以用于检测声音信号,还能检测超声波和环境参数等功能,MEMS麦克风只是换能器的一种形式。In one embodiment, the transducer is a MEMS microphone. The MEMS chip 6 can be used not only to detect sound signals, but also to detect functions such as ultrasonic waves and environmental parameters. The MEMS microphone is just a form of transducer.
根据本申请的另一方面,本申请还提供一种电子设备,电子设备包括壳体和设置于壳体内的上述的换能器。由于电子设备包括了上述换能器的所有实施例的全部技术方案,因此,至少具有上述全部技术方案带来的所有有益效果,在此不再一一赘述。上述电子设备可以是便携设备或可穿戴设备,如智能手机、智能手表、智能手环或IPAD等。According to another aspect of the present application, the present application also provides an electronic device. The electronic device includes a housing and the above-mentioned transducer disposed in the housing. Since the electronic device includes all the technical solutions of all the embodiments of the above-mentioned transducer, it has at least all the beneficial effects brought by all the above-mentioned technical solutions, which will not be described again here. The above-mentioned electronic device may be a portable device or a wearable device, such as a smartphone, a smart watch, a smart bracelet, or an IPAD, etc.
以上仅为本申请的可选实施例,并非因此限制本申请的专利范围,凡是在本申请的技术构思下,利用本申请说明书及附图内容所作的等效结构变换,或直接/间接运用在其他相关的技术领域均包括在本申请的专利保护范围。The above are only optional embodiments of the present application, and do not limit the patent scope of the present application. Under the technical concept of the present application, equivalent structural transformations made by using the contents of the description and drawings of the present application, or directly/indirectly applied in Other related technical fields are included in the patent protection scope of this application.
Claims (11)
- 一种换能器,其中,所述换能器包括基板、罩设于所述基板的外壳以及连接所述基板和所述外壳的焊环,所述外壳与所述基板配合形成容纳腔,所述容纳腔内设置有信号连接的MEMS芯片和ASIC芯片,所述基板上设置有声孔,所述声孔处设置有防水膜以阻挡水从所述声孔进入所述容纳腔,所述焊环形成有泄气通路,所述泄气通路包括朝向所述容纳腔的第一通孔和背离所述容纳腔的第二通孔,以通过所述泄气通路连通所述容纳腔和外界。A transducer, wherein the transducer includes a base plate, a shell covering the base plate, and a welding ring connecting the base plate and the shell, the shell cooperates with the base plate to form an accommodation cavity, so A MEMS chip and an ASIC chip for signal connection are provided in the accommodation cavity, a sound hole is provided on the substrate, and a waterproof membrane is provided at the sound hole to prevent water from entering the accommodation cavity from the sound hole, and the welding ring An air leakage passage is formed, and the air leakage passage includes a first through hole toward the accommodation cavity and a second through hole away from the accommodation cavity, so as to communicate the accommodation cavity and the outside world through the air leakage passage.
- 根据权利要求1所述的换能器,其中,所述泄气通路在所述焊环内弯折延伸。The transducer according to claim 1, wherein the vent passage bends and extends within the welding ring.
- 根据权利要求1所述的换能器,其中,所述焊环呈回字形,所述第一通孔和所述第二通孔靠近设置,所述焊环还包括内环、外环和分隔件,所述内环设置于所述外环的内侧,所述内环和所述外环之间形成有所述泄气通路,所述分隔件的两端分别连接所述内环和所述外环,且所述分隔件分隔所述第一通孔和所述第二通孔。The transducer according to claim 1, wherein the welding ring is in a U-shape, the first through hole and the second through hole are arranged close to each other, the welding ring further comprises an inner ring, an outer ring and a separator, the inner ring is arranged on the inner side of the outer ring, the air leakage passage is formed between the inner ring and the outer ring, the two ends of the separator are respectively connected to the inner ring and the outer ring, and the separator separates the first through hole and the second through hole.
- 根据权利要求3所述的换能器,其中,所述第一通孔和所述第二通孔分别位于所述泄气通路的两端。The transducer according to claim 3, wherein the first through hole and the second through hole are respectively located at both ends of the vent passage.
- 根据权利要求1所述的换能器,其中,所述焊环呈回字形,所述第二通孔设置于远离所述第一通孔的一侧。The transducer according to claim 1, wherein the welding ring is in a U-shape, and the second through hole is arranged on a side away from the first through hole.
- 根据权利要求1所述的换能器,其中,所述泄气通路内填充有吸音材料。The transducer according to claim 1, wherein the vent passage is filled with sound-absorbing material.
- 根据权利要求1至6中任一项所述的换能器,其中,所述焊环由铜箔制成。The transducer according to any one of claims 1 to 6, wherein the welding ring is made of copper foil.
- 根据权利要求1至6中任一项所述的换能器,其中,所述防水膜包括膜体和连接于所述基板背离所述容纳腔一侧的基材,所述膜体与所述基材密封连接,且所述防水膜与所述声孔间隔设置。The transducer according to any one of claims 1 to 6, wherein the waterproof membrane includes a membrane body and a base material connected to a side of the substrate away from the accommodation cavity, the membrane body and the The base material is sealed and connected, and the waterproof membrane is spaced apart from the sound hole.
- 根据权利要求1至6中任一项所述的换能器,其中,所述防水膜为硅橡胶膜或聚酰亚胺膜或聚苯硫醚树脂膜。The transducer according to any one of claims 1 to 6, wherein the waterproof film is a silicone rubber film, a polyimide film, or a polyphenylene sulfide resin film.
- 根据权利要求1至6中任一项所述的换能器,其中,所述换能器为MEMS麦克风。The transducer according to any one of claims 1 to 6, wherein the transducer is a MEMS microphone.
- 一种电子设备,其中,所述电子设备包括壳体和设置于所述壳体内的如权利要求1至10中任一项所述的换能器。An electronic device, wherein the electronic device includes a housing and the transducer according to any one of claims 1 to 10 provided in the housing.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202211144960.6A CN115426596A (en) | 2022-09-20 | 2022-09-20 | Transducer and electronic device |
CN202211144960.6 | 2022-09-20 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2024061027A1 true WO2024061027A1 (en) | 2024-03-28 |
Family
ID=84204027
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/CN2023/117737 WO2024061027A1 (en) | 2022-09-20 | 2023-09-08 | Transducer and electronic device |
Country Status (2)
Country | Link |
---|---|
CN (1) | CN115426596A (en) |
WO (1) | WO2024061027A1 (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN115426596A (en) * | 2022-09-20 | 2022-12-02 | 歌尔微电子股份有限公司 | Transducer and electronic device |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20150264463A1 (en) * | 2014-03-14 | 2015-09-17 | Omron Corporation | Microphone |
CN106851509A (en) * | 2017-03-06 | 2017-06-13 | 瑞声声学科技(深圳)有限公司 | Mems microphone |
CN214070155U (en) * | 2020-12-25 | 2021-08-27 | 歌尔微电子有限公司 | Microphone and electronic device |
CN114900764A (en) * | 2022-03-28 | 2022-08-12 | 青岛歌尔微电子研究院有限公司 | MEMS microphone and electronic equipment |
CN115002630A (en) * | 2022-04-28 | 2022-09-02 | 青岛歌尔智能传感器有限公司 | Microphone assembly and electronic equipment |
CN115426596A (en) * | 2022-09-20 | 2022-12-02 | 歌尔微电子股份有限公司 | Transducer and electronic device |
-
2022
- 2022-09-20 CN CN202211144960.6A patent/CN115426596A/en active Pending
-
2023
- 2023-09-08 WO PCT/CN2023/117737 patent/WO2024061027A1/en unknown
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20150264463A1 (en) * | 2014-03-14 | 2015-09-17 | Omron Corporation | Microphone |
CN106851509A (en) * | 2017-03-06 | 2017-06-13 | 瑞声声学科技(深圳)有限公司 | Mems microphone |
CN214070155U (en) * | 2020-12-25 | 2021-08-27 | 歌尔微电子有限公司 | Microphone and electronic device |
CN114900764A (en) * | 2022-03-28 | 2022-08-12 | 青岛歌尔微电子研究院有限公司 | MEMS microphone and electronic equipment |
CN115002630A (en) * | 2022-04-28 | 2022-09-02 | 青岛歌尔智能传感器有限公司 | Microphone assembly and electronic equipment |
CN115426596A (en) * | 2022-09-20 | 2022-12-02 | 歌尔微电子股份有限公司 | Transducer and electronic device |
Also Published As
Publication number | Publication date |
---|---|
CN115426596A (en) | 2022-12-02 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
WO2024061027A1 (en) | Transducer and electronic device | |
CN209017322U (en) | Encapsulating structure, microphone and the electronic equipment of chip | |
CN104185100B (en) | The electronic installation of microphone array shell and application microarray microphone | |
CN111556419A (en) | Bone voiceprint sensor and electronic device | |
CN110868682B (en) | MEMS microphone | |
CN109413554A (en) | A kind of directive property MEMS microphone | |
CN211930871U (en) | Bone voiceprint sensor and electronic device | |
CN113709643B (en) | Vibration pickup unit, bone voiceprint sensor and electronic equipment | |
US20200045477A1 (en) | Mems microphone | |
CN211930872U (en) | Bone voiceprint sensor and electronic device | |
CN112333618A (en) | Bone voiceprint sensor module and electronic equipment | |
CN209072736U (en) | A kind of directive property MEMS microphone | |
CN112714388B (en) | Directional microphone and electronic device | |
WO2024067023A1 (en) | Combined sensor and portable wearable device | |
CN213694143U (en) | Sensor packaging structure, MEMS sensor and wearable equipment | |
CN209017321U (en) | MEMS microphone and electronic equipment | |
US10863283B2 (en) | MEMS microphone for frame-free device | |
CN217693712U (en) | Microphone and electronic equipment | |
CN213403503U (en) | MEMS microphone and electronic equipment | |
CN216775026U (en) | MEMS chip, microphone and electronic equipment | |
CN114900764A (en) | MEMS microphone and electronic equipment | |
CN112714389B (en) | Microphone and electronic device | |
CN218124928U (en) | Transducer and electronic equipment | |
CN210986416U (en) | Single-directional MEMS microphone | |
CN212486781U (en) | Bone voiceprint sensor module and electronic equipment |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
121 | Ep: the epo has been informed by wipo that ep was designated in this application |
Ref document number: 23867317 Country of ref document: EP Kind code of ref document: A1 |