CN115002630A

CN115002630A - Microphone assembly and electronic equipment

Info

Publication number: CN115002630A
Application number: CN202210460757.3A
Authority: CN
Inventors: 杨月; 徐超
Original assignee: Qingdao Goertek Intelligent Sensor Co Ltd
Current assignee: Qingdao Goertek Intelligent Sensor Co Ltd
Priority date: 2022-04-28
Filing date: 2022-04-28
Publication date: 2022-09-02

Abstract

The present invention relates to a microphone assembly and an electronic device, the microphone assembly including: the sound inlet hole is formed in the substrate assembly; the shell is connected with the base plate assembly, and the shell and the base plate assembly define a rear cavity; the sound-electricity conversion device is arranged in the rear cavity and defines a front cavity with the substrate assembly, and at least comprises a vibrating diaphragm which separates the front cavity from the rear cavity; wherein, be equipped with the passageway of disappointing on the casing and/or on the base plate subassembly, the outside of chamber and casing behind the passageway intercommunication of disappointing. According to the microphone assembly provided by the invention, air in the rear cavity can be discharged through the air discharging channel or external air flows into the rear cavity through the air discharging channel so as to balance air pressure on two sides of the vibrating diaphragm, so that the probability of damage of the vibrating diaphragm is reduced, and the reliability of a product is favorably improved.

Description

Microphone assembly and electronic equipment

Technical Field

The present invention relates to the field of electronic devices, and in particular, to a microphone assembly and an electronic device.

Background

This section provides background information related to the present disclosure only and is not necessarily prior art.

Microphones are also known as microphones, microphones. A microphone is an energy conversion device that converts a sound signal into an electrical signal. The piezoelectric microphone or the capacitor microphone is provided with a diaphragm, and the piezoelectric microphone excites the diaphragm through a sound signal so as to vibrate the diaphragm, so that the pressure of the piezoelectric material changes, and a corresponding electric signal is output. The condenser microphone uses the charge-discharge principle of capacitance between conductors and uses ultrathin metal or gold-plated plastic film as vibration film to sense sound pressure so as to change the electrostatic voltage between conductors and directly convert it into electric energy signal.

Generally, the interior of the microphone is provided with a front cavity for collecting sound waves, and the microphone is further provided with a sound inlet hole communicated with the front cavity and externally connected with the front cavity, so that external sound waves are transmitted into the front cavity through the sound inlet hole and collected by the sound-electricity conversion device. For improving the pickup quality, the conventional apparatus generally forms a closed back cavity for accommodating the acoustoelectric conversion device between the housing and the substrate to prevent interference of external electromagnetic waves, and the diaphragm is disposed in the front cavity and separates the front cavity from the back cavity by the diaphragm, so that the diaphragm can respond to sound waves entering the front cavity and generate vibration. However, when the device is applied to a client, if the device is heated at a high temperature or falls and impacts, sound pressure on two sides of the vibrating diaphragm changes greatly in a short time, and the vibrating diaphragm is easily damaged.

Disclosure of Invention

The invention aims to at least solve the technical problems that sound pressure at two sides of a vibrating diaphragm is greatly changed in a short time, and the vibrating diaphragm is easily damaged. The purpose is realized by the following technical scheme:

in a first aspect of the present invention, a microphone assembly is provided, where the microphone assembly includes:

the sound inlet hole is formed in the substrate assembly; a housing coupled to the base plate assembly, the housing and the base plate assembly defining a rear cavity; the sound-electricity conversion device is arranged in the rear cavity and defines a front cavity with the substrate assembly, and the sound-electricity conversion device at least comprises a vibrating diaphragm which separates the front cavity from the rear cavity; the shell is provided with a rear cavity, the rear cavity is communicated with the outer portion of the shell, and the rear cavity is communicated with the outer portion of the shell.

According to the microphone assembly provided by the invention, the air release channel communicated with the back cavity is arranged on the shell and/or the substrate assembly, when the sound pressure on two sides of the vibrating diaphragm is greatly changed due to the influence of external factors such as sudden change of the external environment temperature of the microphone assembly or dropping of the microphone assembly, air in the back cavity can be released through the air release channel or external air flows into the back cavity through the air release channel to balance the air pressure on two sides of the vibrating diaphragm, so that the damage probability of the vibrating diaphragm is reduced, and the reliability of a product is favorably improved.

In addition, the microphone assembly according to the present invention may have the following additional technical features:

in some embodiments of the invention, the microphone assembly further comprises: and the waterproof membrane is connected with the base plate assembly in a sealing mode and is used for sealing the sound inlet hole.

In some embodiments of the invention, a substrate assembly comprises: the substrate assembly includes: the shell and the acoustic-electric conversion device are connected with the first substrate; the second substrate is connected with one side of the first substrate, which is far away from the shell, and an accommodating cavity is formed between the first substrate and the second substrate; the sound inlet hole includes: the first sub sound inlet hole is formed in the first substrate and communicated with the accommodating cavity; the second sub sound inlet hole is formed in the second substrate and communicated with the accommodating cavity; the first sound inlet sub-hole and the second sound inlet sub-hole are separated by the waterproof membrane.

In some embodiments of the present invention, the air escape passage is provided in the base plate assembly, and the air escape passage includes: the first air leakage through hole is formed in the first substrate and communicated with the rear cavity; the second air leakage through hole is formed in the first substrate and communicated with the outside; and the airflow channel is arranged on the second substrate, and the first air leakage through hole is communicated with the second air leakage through hole through the airflow channel.

In some embodiments of the present invention, the first substrate includes a first side and a second side opposite to each other, the first air-release through hole is disposed near the first side, and the second air-release through hole is disposed near the second side.

In some embodiments of the invention, at least a portion of the gas flow channel is annular and spaced from an outer edge of the second substrate.

In some embodiments of the invention, the microphone assembly further comprises: the sealing connecting piece is arranged on the outer edge of the waterproof membrane in a surrounding mode; the sealing connecting piece is connected with the first substrate or the second substrate in a sealing mode, so that gaps are formed between the waterproof film and the first substrate and between the waterproof film and the second substrate.

In some embodiments of the invention, the air escape passage is provided on the housing; the microphone assembly further comprises a dustproof filtering piece, and the dustproof filtering piece is arranged on the shell and covers the air leakage channel.

According to a second aspect of the present invention, there is provided an electronic device, comprising: the microphone assembly in the technical scheme of the first aspect; the whole machine shell, the microphone subassembly is located in the whole machine shell.

According to the electronic equipment provided by the invention, the waterproof function is realized, and when the sound pressure at two sides of the vibrating diaphragm is greatly changed due to environmental factors, air in the back cavity can be discharged through the air discharging channel or external air flows into the back cavity through the air discharging channel so as to balance the air pressure at two sides of the vibrating diaphragm, so that the damage probability of the vibrating diaphragm is reduced, and the reliability of the product is favorably improved.

In some embodiments of the present invention, the microphone assembly is bonded to the inner wall of the complete casing, and an annular sealing portion is formed between the microphone assembly and the inner wall of the complete casing, the complete casing has a sound collecting cavity communicating with the outside, the second sub sound inlet hole in the microphone assembly communicates with the sound collecting cavity, and the sealing portion separates the second air vent hole in the microphone assembly from the sound collecting cavity.

Drawings

Various other advantages and benefits will become apparent to those of ordinary skill in the art upon reading the following detailed description of the preferred embodiments. The drawings are only for purposes of illustrating the preferred embodiments and are not to be construed as limiting the invention. Also, like parts are designated by like reference numerals throughout the drawings. In the drawings:

fig. 1 shows a schematic structural diagram of a microphone assembly according to an embodiment of the invention;

fig. 2 shows a schematic structural diagram of a microphone assembly according to an embodiment of the invention;

fig. 3 shows a schematic structural diagram of a microphone assembly according to an embodiment of the invention;

FIG. 4 shows a schematic structural diagram of a first substrate according to an embodiment of the invention;

FIG. 5 shows a cross-sectional view of portion A-A of FIG. 4;

FIG. 6 shows a schematic structural diagram of a second substrate according to an embodiment of the invention;

FIG. 7 shows a cross-sectional view of portion B-B of FIG. 6;

FIG. 8 illustrates a schematic structural diagram of a first substrate according to one embodiment of the present invention;

FIG. 9 shows a cross-sectional view of section C-C of FIG. 8;

FIG. 10 shows a schematic structural diagram of a second substrate according to an embodiment of the invention;

FIG. 11 shows a cross-sectional view of section D-D of FIG. 10;

FIG. 12 shows a cross-sectional view of a second substrate according to one embodiment of the invention;

fig. 13 shows a cross-sectional view of a second substrate according to an embodiment of the invention.

The reference numbers are as follows:

10-substrate assembly, 11-first substrate, 111-first side, 112-second side, 12-second substrate, 13-sound inlet hole, 131-first sub sound inlet hole, 132-second sub sound inlet hole, 14-containing cavity;

20-shell, 21-rear cavity;

30-an acoustic-electric conversion device, 31-a substrate, 32-a diaphragm and 33-a front cavity;

40-air release channel, 41-first air release through hole, 42-second air release through hole and 43-airflow channel;

51-waterproof membrane, 52-sealing connecting piece and 53-dustproof filtering piece;

and 60, signal processing means.

Detailed Description

Exemplary embodiments of the present disclosure will be described in more detail below with reference to the accompanying drawings. While exemplary embodiments of the present disclosure are shown in the drawings, it should be understood that the present disclosure may be embodied in various forms and should not be limited by the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the disclosure to those skilled in the art.

It is to be understood that the terminology used herein is for the purpose of describing particular example embodiments only, and is not intended to be limiting. As used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. The terms "comprises," "comprising," "includes," "including," and "having" are inclusive and therefore specify the presence of stated features, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, steps, operations, elements, components, and/or groups thereof. The method steps, processes, and operations described herein are not to be construed as necessarily requiring their performance in the particular order described or illustrated, unless specifically identified as an order of performance. It should also be understood that additional or alternative steps may be used.

Although the terms first, second, third, etc. may be used herein to describe various elements, components, regions, layers and/or sections, these elements, components, regions, layers and/or sections should not be limited by these terms. These terms may be only used to distinguish one element, component, region, layer or section from another region, layer or section. Terms such as "first," "second," and other numerical terms when used herein do not imply a sequence or order unless clearly indicated by the context. Thus, a first element, component, region, layer or section discussed below could be termed a second element, component, region, layer or section without departing from the teachings of the example embodiments.

For convenience of description, spatially relative terms, such as "inner", "outer", "lower", "below", "upper", "above", and the like, may be used herein to describe one element or feature's relationship to another element or feature as illustrated in the figures. This spatially relative term is intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. For example, if the device in the figures is turned over, elements described as "below" or "beneath" other elements or features would then be oriented "above" or "over" the other elements or features. Thus, the example term "below … …" can include both an orientation of above and below. The device may be otherwise oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein interpreted accordingly.

As shown in fig. 1 and 2, according to an embodiment of the present invention, there is provided a microphone assembly including: a substrate assembly 10, a housing 20, and an acoustic-electric conversion device 30. Specifically, the substrate assembly 10 is provided with sound inlet holes 13 penetrating through two opposite sides thereof, so as to realize the sound receiving function of the microphone assembly, and external sound waves can enter the space on the other side from one side of the substrate assembly 10 through the sound inlet holes 13. The housing 20 is connected to the substrate assembly 10, the housing 20 may be a metal shell formed integrally or a non-metal shell coated with a metal material, and one end of the housing 20 in an opening direction is hermetically connected to the substrate assembly 10 to enclose a closed rear cavity 21. The rear cavity 21 is used for accommodating the sound-electricity conversion device 30, and the casing 20 can block external electromagnetic wave interference by arranging the sound-electricity conversion device 30 in the rear cavity 21, so that the sound pickup quality of the microphone assembly is improved. The acoustic-electric conversion device 30 is disposed in the rear cavity 21 and defines a front cavity 33 with the substrate assembly 10, the acoustic-electric conversion device 30 at least includes a diaphragm 32, the diaphragm 32 separates the front cavity 33 from the rear cavity 21, so that the diaphragm 32 can vibrate in response to the acoustic wave entering the front cavity 33 through the sound inlet hole 13, when the diaphragm 32 vibrates, the capacitance or voltage of the acoustic-electric conversion device 30 can be changed, and then the changed capacitance or voltage signal is processed, so as to convert the acoustic wave into an electric signal. It should be noted that, the microphone assembly further includes an air release channel 40, the air release channel 40 is disposed on the housing 20 or the substrate assembly 10, or the housing 20 and the substrate assembly 10 are both provided with the air release channel 40, so that the back cavity 21 can be communicated with the external space through the air release channel 40, when the external ambient temperature of the microphone assembly suddenly changes or the microphone assembly drops, and the like, and the sound pressure on both sides of the diaphragm 32 is greatly changed, the air inside the back cavity 21 can be released through the air release channel 40 or the external air flows into the back cavity 21 through the air release channel 40 to balance the air pressure on both sides of the diaphragm 32, thereby reducing the damage probability of the diaphragm 32, and being beneficial to improving the reliability of the product.

In an exemplary embodiment, the acousto-electric conversion device 30 includes a substrate 31 and a diaphragm assembly connected to convert acoustic waves into electrical signals. One side of substrate 31 links to each other with base plate subassembly 10, form the antechamber 33 that communicates sound inlet 13 and back chamber 21 on the substrate 31, the vibrating diaphragm subassembly includes vibrating diaphragm 32, vibrating diaphragm 32 links to each other with one side that substrate 31 kept away from base plate subassembly 10, make vibrating diaphragm 32 separate antechamber 33 and back chamber 21, outside sound wave enters into antechamber 33 back through sound inlet 13, the sound wave in the antechamber 33 produces the disturbance to vibrating diaphragm 32 and makes it take place vibrations, vibrating diaphragm 32 responds to the sound pressure and can changes the voltage of vibrating diaphragm subassembly, thereby generate the electric signal.

In this embodiment, the substrate assembly 10 is a PCB board, and a circuit is printed on the PCB board to realize a corresponding electrical function, and the design can be selected according to actual needs. The diaphragm assembly may be a piezoelectric diaphragm assembly or a capacitive diaphragm assembly, which is not limited herein. The shape of the housing 20 may be an inverted U-shaped bowl, a cube, a cylinder, a sphere, or the like, and is not limited herein. The housing 20 and the substrate assembly 10 can be connected by conductive adhesive or solder paste, so that the housing 20 and the substrate assembly 10 can be electrically connected, thereby forming a conductive shielding cavity.

In some embodiments of the present invention, as shown in fig. 2, the microphone assembly further includes a waterproof membrane 51, the waterproof membrane 51 is hermetically connected to the substrate assembly 10, and the waterproof membrane 51 is used for sealing the sound inlet hole 13, so as to prevent external liquid (such as water) from entering the front cavity 33 through the sound inlet hole 13, and achieve a waterproof function of the microphone assembly. Specifically, as shown in fig. 1 to 3, the substrate assembly 10 includes a first substrate 11 and a second substrate 12, the first substrate 11 and the second substrate 12 are stacked and connected, the first substrate 11 is disposed between the second substrate 12 and the housing 20, and the housing 20 and the substrate 31 are connected to the first substrate 11. An accommodating cavity 14 is formed between the first substrate 11 and the second substrate 12, the sound inlet 13 is communicated with the accommodating cavity 14, and the accommodating cavity 14 crosses the sound inlet 13 to divide the sound inlet 13 into a first sub sound inlet 131 formed on the first substrate 11 and a second sub sound inlet 132 formed on the second substrate 12. The waterproof membrane 51 is disposed in the accommodating chamber 14, and an edge of the waterproof membrane 51 is in sealing connection with an inner wall of the accommodating chamber 14, so that the waterproof membrane 51 completely separates the first sub sound inlet hole 131 and the second sub sound inlet hole 132, thereby sealing the sound inlet hole 13 and achieving a waterproof function. In this embodiment, the waterproof film 51 is disposed in the accommodating cavity 14, so that the first substrate 11 and the second substrate 12 can serve as the housing 20 for protecting the waterproof film 51, and the probability of contact between an external object and the waterproof film 51 is reduced, thereby reducing damage or abrasion caused by the waterproof film 51 receiving impact of the external object, and effectively increasing the service life of the waterproof film 51.

In an exemplary embodiment, a plurality of sunken grooves are formed on opposite sides of the first substrate 11 and the second substrate 12, and the sunken grooves are engaged to form the receiving cavity 14.

In other embodiments, the sinking groove may be provided only on one of the first substrate and the second substrate, and the sinking groove may be covered by the other substrate to form the receiving cavity.

In a particular embodiment, the material of the water repellent membrane may be PPS (polyphenylene sulfide) or PI (polyimide).

In an exemplary embodiment, as shown in fig. 2, the microphone assembly further includes a sealing connector 52, the sealing connector 52 is disposed around an outer edge of the waterproof membrane 51, and the sealing connector 52 is connected to the first substrate 11 or the second substrate 12 in a sealing manner, so that gaps are formed between the waterproof membrane 51 and the first substrate 11 and between the waterproof membrane 51 and the second substrate 12, so that the waterproof membrane 51 can vibrate in the accommodating cavity 14 when receiving sound vibration, the sensitivity of the waterproof membrane 51 to generate vibration is improved, sound transmitted from the second sub sound inlet 132 can be better reduced, and the sound pickup quality of the microphone assembly is improved.

In one particular embodiment, the seal connection 52 is annular and the cross-section of the seal connection 52 is circular in cross-section. The sealing connecting piece 52 is made of silica gel, and a silica gel sealing piece is corrosion-resistant, long in service life, good in elasticity and good in sealing effect. The cross section of the sealing connector 52 is a circular cross section, so that the sealing connector 52 can be better attached to the first substrate 11 or the second substrate 12, and the sealing effect can be better.

In some embodiments of the present invention, the bleed channels 40 are provided in the base plate assembly 10, as shown in fig. 2 and 3. Specifically, the air release passage 40 includes a first air release through hole 41, a second air release through hole 42, and an air flow passage 43. The first run-flat through hole 41 and the second run-flat through hole 42 are both disposed on the first substrate 11, and the first run-flat through hole 41 and the second run-flat through hole 42 are through holes penetrating through the first substrate 11. Wherein the first relief through hole 41 communicates with the rear cavity 21, and the second relief through hole 42 communicates with the outside. The air flow channel 43 is disposed on the second substrate 12, and the first air-release through hole 41 is communicated with the second air-release through hole 42 through the air flow channel 43, so that the air in the rear cavity 21 can flow into the air flow channel 43 through the first air-release through hole 41 and be discharged through the second air-release through hole 42, or the external air can flow into the air flow channel 43 through the second air-release through hole 42 and flow into the rear cavity 21 through the first air-release through hole 41. It should be emphasized that, in this embodiment, the microphone assembly is pasted in the whole casing in the client application, and only the second sub sound inlet 132 on the client application side (i.e. the side of the second substrate 12 away from the first substrate 11) is communicated with the sound cavity structure of the whole casing and extends to the outside, so that the waterproof function of the microphone assembly can be achieved after the waterproof film 51 seals the sound inlet 13. And extend to the one side that deviates from the second base plate 12 with the second through-hole 42 end of disappointing to first base plate 11, in the space that the second through-hole 42 led to the complete machine structure of disappointing promptly, during external water can not flow into the second through-hole 42 of disappointing through the sound cavity structure of complete machine, outside liquid can not enter into back chamber 21 through disappointing passageway 40 promptly, consequently, the microphone subassembly need not consider when using the waterproof function of disappointing passageway 40.

In an exemplary embodiment, as shown in fig. 8 to 12, the first substrate 11 includes a first side 111 and a second side 112 opposite to each other, the first air-release through hole 41 is disposed near the first side 111, and the second air-release through hole 42 is disposed near the second side 112, so that the first air-release through hole 41 and the second air-release through hole 42 are separated by a longer distance, and the length of the air flow channel 43 is increased, thereby increasing the total length of the air-release channel 40, which is equivalent to increasing the overall space of the rear cavity 21, and increasing the acoustic resistance, which is beneficial to improving the acoustic performance of the product. In a specific embodiment, the air flow channel 43 is annular, and the air flow channel 43 is disposed near the edge of the second substrate 12, so that the overall volume of the air escape channel 40 can be further increased by disposing the annular air flow channel 43, thereby further improving the acoustic performance of the product.

In other embodiments, as shown in fig. 4 to 7, the first air-release through hole 41 and the second air-release through hole 42 are both disposed near the second side 112, so that the total length of the airflow channel 43 is short, when the external environment temperature of the microphone assembly suddenly changes or the microphone assembly drops, and the like, so that the sound pressure on both sides of the diaphragm 32 changes greatly, the air inside the back cavity 21 can be quickly discharged through the first air-release through hole 41, the airflow channel 43 and the second air-release through hole 42, so as to realize the pressure release inside the back cavity 21, and quickly realize the air pressure balance on both sides of the diaphragm 32, thereby reducing the damage probability of the diaphragm 32, and facilitating the improvement of the reliability of the product.

In one specific embodiment, as shown in fig. 7, the air flow channel 43 on the second substrate 12 includes two counter bores disposed perpendicular to the second substrate 12 and communicating with the first and second bleed holes 41 and 42, respectively, and a through hole disposed parallel to the second substrate 12 communicating the two counter bores.

In another specific embodiment, as shown in fig. 13, the air flow channel 43 is a groove formed on the second substrate 12, the opening of the groove faces the first substrate 11, the first air-release through hole 41 and the second air-release through hole 42 directly communicate with the groove, and the air flow channel 43 is defined by a side wall of the first substrate 11 facing the second substrate 12 and the groove.

In some embodiments of the present invention, the air release channel 40 is disposed on the casing 20, and when the external environment temperature of the microphone assembly suddenly changes or the microphone assembly drops, and the like, causes the sound pressure on the two sides of the diaphragm 32 to change greatly, the air inside the back cavity 21 can directly release the pressure inside the back cavity 21 through the air release channel 40 on the casing 20, so as to quickly achieve the air pressure balance on the two sides of the diaphragm 32, thereby reducing the damage probability of the diaphragm 32, and being beneficial to improving the reliability of the product. In this embodiment, in order to prevent dust or foreign matters from entering the rear cavity 21 through the air release channel 40 and affecting the sound pickup quality of the microphone assembly, a dust-proof filter 53 is further disposed on the housing 20, and the dust-proof filter 53 is used for sealing the air release channel 40. Specifically, the dustproof filter 53 may be made of a material such as a nonwoven fabric.

In some embodiments of the present invention, as shown in fig. 3, the microphone assembly further comprises a signal processing device 60, the signal processing device 60 is located in the rear cavity 21 and connected to the first substrate 11, and the signal processing device 60 is electrically connected to the acoustic-electric conversion device 30. Specifically, when the sound wave enters the front cavity 33 to change the air pressure inside the front cavity 33, the diaphragm 32 will bend along with the air pressure change, the capacitance or voltage signal of the diaphragm assembly will change, and the signal processing device 60 can convert the signal into an electrical signal and transmit the electrical signal to an external processor through the substrate.

In an exemplary embodiment, the acousto-electric conversion device 30 includes a MEMS chip, the signal processing device 60 includes an ASIC chip, and the MEMS chip and the ASIC chip are electrically connected through a conducting wire, which may be a gold wire or a copper wire, etc., so as to effectively improve the stability of the electrical connection. In this embodiment, the MEMS is a (Micro-Electro-Mechanical System, MEMS) MEMS, and the ASIC chip is an Application Specific Integrated Circuit (ASIC) chip, specifically, in this embodiment, the MEMS chip and the ASIC chip are disposed on the first substrate 11, the ASIC chip is electrically connected to the MEMS chip through a wire, and the MEMS chip is used for sensing and detecting a sound signal flowing from the sound inlet 13, converting the sound signal into an electrical signal, and transmitting the electrical signal to the ASIC chip; the ASIC chip is used for providing voltage for the MEMS chip and processing and amplifying signals output by the MEMS chip, so that the microphone assembly provides a sound receiving function for the electronic equipment. In this embodiment, the MEMS chip includes a substrate 31 and a diaphragm assembly, the substrate 31 is connected to the first substrate 11, specifically, the substrate 31 may be connected to a solder mask on the first substrate 11 through an MEMS die attach adhesive, and the solder mask can prevent solder from overflowing, thereby avoiding a short circuit; and the performance of the circuit board can be effectively protected by moisture. The substrate 31 is provided with a through hole through the substrate 31, the through hole forming a front cavity 33, the substrate 31, and a diaphragm 32 in the diaphragm assembly connected to a side of the substrate 31 remote from the first base plate 11 for separating the front cavity 33 from the back cavity 21. The substrate 31 is made on a wafer by a semiconductor deposition process, and the diaphragm assembly may be a piezoelectric structure or a capacitive structure, which is not limited herein. For example, when the diaphragm assembly is a piezoelectric structure, it includes a diaphragm 32 and piezoelectric materials disposed on two sides of the diaphragm 32, and the diaphragm 32 is excited by a sound signal to vibrate the diaphragm 32, so that the pressure of the piezoelectric materials changes, and a corresponding electrical signal is output. When the diaphragm assembly is in a capacitive structure, the diaphragm assembly includes a diaphragm 32 and a pole plate connected to one end of the substrate 31 far away from the first substrate 11, the diaphragm 32 and the pole plate are arranged at an interval, when the air pressure changes, the diaphragm 32 can bend along with the air pressure change, and when the diaphragm 32 bends, the distance between the diaphragm and the pole plate changes, so that the capacitance C changes, and thus the signal ASIC chip can convert the capacitance signal into an electrical signal, and the electrical signal is transmitted to an external processor through the substrate assembly 10.

According to an embodiment of the present invention, there is also provided an electronic device, including a microphone assembly and a complete machine housing, where the microphone assembly is disposed in the complete machine housing, the electronic device has a waterproof function, and when sound pressures at two sides of a diaphragm are greatly changed due to environmental factors, air inside a back cavity may be discharged through a discharge channel or external air may flow into the back cavity through the discharge channel to balance air pressures at two sides of the diaphragm, so as to reduce a probability of damage to the diaphragm, and to facilitate improvement of reliability of a product.

The electronic device may be a wearable electronic device, such as a microphone, a smart watch or a bracelet, or may be a mobile terminal, such as a mobile phone or a notebook computer, or other devices that need to have an audio-electrical conversion function, which is not limited herein.

In some embodiments of the present invention, the microphone assembly is adhered to the inner wall of the complete casing, an annular sealing portion is formed between the microphone assembly and the inner wall of the complete casing, the complete casing has a sound collecting cavity communicated with the outside, the second sub sound inlet in the microphone assembly is communicated with the sound collecting cavity, and the sealing portion separates the second air release through hole in the microphone assembly from the sound collecting cavity. In some embodiments, in order to fix the microphone assembly to the applied electronic device and to transmit the electrical signal, the surface of the second substrate facing away from the receiving cavity is provided with solder feet or pads. The solder leg or the solder pad can be conveniently welded on a main board circuit of the electronic equipment through the SMT and other processes, and a plurality of solder legs can be arranged to improve the stability of structural connection and data transmission.

While the invention has been described with reference to specific preferred embodiments, it will be understood by those skilled in the art that various changes and modifications may be made without departing from the spirit and scope of the invention as defined in the following claims. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.

Claims

1. A microphone assembly, comprising:

the substrate assembly is provided with a sound inlet hole;

a housing coupled to the base plate assembly, the housing and the base plate assembly defining a rear cavity;

the acoustic-electric conversion device is arranged in the rear cavity and limits a front cavity with the substrate assembly, and at least comprises a vibrating diaphragm which separates the front cavity from the rear cavity;

the shell is provided with a rear cavity, the rear cavity is communicated with the outer portion of the shell, and the rear cavity is communicated with the outer portion of the shell.

2. The microphone assembly of claim 1, further comprising:

and the waterproof membrane is connected with the base plate assembly in a sealing mode and is used for sealing the sound inlet hole.

3. The microphone assembly of claim 2,

the substrate assembly includes:

the shell and the acoustic-electric conversion device are connected with the first substrate;

the second substrate is connected with one side of the first substrate, which is far away from the shell, and an accommodating cavity is formed between the first substrate and the second substrate;

the sound inlet hole includes:

the first sub sound inlet hole is formed in the first substrate and communicated with the accommodating cavity;

the second sub sound inlet hole is formed in the second substrate and communicated with the accommodating cavity;

the first sound inlet sub-hole and the second sound inlet sub-hole are separated by the waterproof membrane.

4. The microphone assembly of claim 3 wherein the vent channel is disposed in the base plate assembly, the vent channel comprising:

the first air leakage through hole is formed in the first substrate and communicated with the rear cavity;

the second air leakage through hole is formed in the first substrate and communicated with the outside;

and the airflow channel is arranged on the second substrate, and the first air leakage through hole is communicated with the second air leakage through hole through the airflow channel.

5. The microphone assembly of claim 4,

the first substrate comprises a first side edge and a second side edge which are opposite to each other, the first air leakage through hole is close to the first side edge, and the second air leakage through hole is close to the second side edge.

6. The microphone assembly of claim 5,

at least part of the gas flow channel is annular and is arranged at a distance from the outer edge of the second substrate.

7. The microphone assembly of any one of claims 3 to 6, further comprising:

the sealing connecting piece is arranged on the outer edge of the waterproof membrane in a surrounding mode;

the sealing connecting piece is connected with the first substrate or the second substrate in a sealing mode, so that gaps are formed between the waterproof film and the first substrate and between the waterproof film and the second substrate.

8. The microphone assembly of claim 1,

the air leakage channel is arranged on the shell;

the microphone assembly further comprises a dustproof filtering piece, and the dustproof filtering piece is arranged on the shell and covers the air leakage channel.

9. An electronic device, characterized in that the electronic device comprises:

the microphone assembly of any one of claims 1-8;

the microphone assembly is arranged in the whole machine shell.

10. The electronic device of claim 9,

microphone subassembly with the inner wall bonding of complete machine shell microphone subassembly with form annular sealing between the inner wall of complete machine shell, complete machine shell has the sound collection chamber with outside intercommunication, the sub-sound inlet of second in the microphone subassembly with sound collection chamber intercommunication, sealing will the second in the microphone subassembly run flat the through-hole with sound collection chamber separates.