CN210670557U

CN210670557U - Multifunctional sensor and electronic equipment comprising same

Info

Publication number: CN210670557U
Application number: CN201922357653.6U
Authority: CN
Inventors: 王新江; 孙延娥; 付博; 方华斌
Original assignee: Goertek Techology Co Ltd
Current assignee: Goertek Microelectronics Inc
Priority date: 2019-12-25
Filing date: 2019-12-25
Publication date: 2020-06-02
Anticipated expiration: 2029-12-25

Abstract

The utility model discloses a multifunctional sensor and an electronic device comprising the same, wherein the multifunctional sensor comprises a substrate; the MEMS acoustic chip comprises a first shell and a second shell, wherein the first shell and the substrate form a first packaging inner cavity, and the MEMS acoustic chip is accommodated in the first packaging inner cavity; the MEMS environment chip is accommodated in the second packaging inner cavity; the first shell comprises a pickup hole corresponding to the MEMS acoustic chip; the second shell comprises a through hole corresponding to the MEMS environment chip; the first package cavity and the second package cavity are isolated from each other. The utility model discloses a mutual interference between multi-functional sensor can effectively avoid MEMS environment chip and the MEMS environment chip, strengthens the performance and the sensitivity of MEMS environment chip, and then improves multi-functional sensor's efficiency and wholeness ability.

Description

Multifunctional sensor and electronic equipment comprising same

Technical Field

The utility model relates to an electronic product technical field, more specifically, the utility model relates to a multifunctional sensor reaches electronic equipment including it.

Background

As a measuring device, a sensor has been widely used in a mobile phone, a notebook computer, and various wearable electronic products. In recent years, with the development of technology, the volume of electronic products is continuously reduced, and in order to save cost and reduce volume, sensors with different functions are generally integrated in the same package, such as an environmental sensor and an acoustic sensor, to form a multifunctional sensor. With the development of industrial digitization and intelligence, multifunctional sensors are no longer limited to the applications of mobile phones, earphones and speakers, and are widely applied to the fields of wearable equipment, smart homes, smart transportation, industrial manufacturing and the like.

In recent years, along with the development of scientific technology, the volume of electronic products is continuously reduced, and the performance requirements of portable electronic products are higher and higher, which means that the volume of electronic parts such as multifunctional sensors matched with the portable electronic products must be reduced. However, in the conventional multi-functional sensor structure, a plurality of MEMS chips with different functions are generally arranged side by side on a substrate, as shown in fig. 1. The multifunctional sensor structure is often large in size, and the requirement of the existing multifunctional sensor packaged in an extremely small size is difficult to meet; meanwhile, in the multifunctional sensor in the prior art, as shown in fig. 1, a through hole corresponding to the MEMS acoustic chip is formed in the substrate, when the multifunctional sensor works, external air enters the MEMS acoustic chip through the through hole, the MEMS acoustic chip receives external sound, and then external environment data is transmitted to the MEMS environment chip through a diaphragm on the MEMS acoustic chip, because the MEMS environment chip acquires the external environment data transmitted by the diaphragm of the MEMS acoustic chip, the sensitivity of the MEMS environment chip is low, and mutual interference easily occurs between the MEMS acoustic chip and the MEMS environment chip in the structure, thereby the efficiency and performance of the multifunctional sensor are affected.

Therefore, in order to overcome the defects of the prior art, a novel multifunctional sensor and an electronic device comprising the same are needed.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a multifunctional sensor can effectively avoid the mutual interference between MEMS acoustics chip and the MEMS environment chip, improves multifunctional sensor's efficiency and wholeness ability.

In order to solve the above technical problem, the utility model provides a multifunctional sensor, multifunctional sensor includes: a substrate; the MEMS acoustic chip comprises a first shell and a second shell, wherein the first shell and the substrate form a first packaging inner cavity, and the MEMS acoustic chip is accommodated in the first packaging inner cavity; the MEMS environment chip is accommodated in the second packaging inner cavity; the first shell comprises a pickup hole corresponding to the MEMS acoustic chip; the second shell comprises a through hole corresponding to the MEMS environment chip; the first packaging inner cavity and the second packaging inner cavity are isolated from each other.

Optionally, the MEMS environmental chip is one or more of a MEMS air pressure sensor chip, a MEMS temperature chip, a MEMS humidity sensor chip, or a MEMS optical sensor chip.

Optionally, the first package inner cavity is located on a side surface of the substrate, and the second package inner cavity is located on a side surface of the substrate away from the first package inner cavity.

Optionally, the first package cavity and the second package cavity are located on the same side surface of the substrate.

Optionally, the multifunctional sensor further comprises: a first ASIC chip disposed corresponding to the MEMS acoustic chip; and the second ASIC chip is arranged corresponding to the MEMS environment chip.

Optionally, the first ASIC chip and the second ASIC chip are respectively located within the substrate.

Optionally, the substrate includes a connecting portion exposed to the outside of the first and second housings; the connecting part is provided with a conductive golden finger interface, and the multifunctional sensor is electrically connected with an external circuit through the golden finger interface.

Optionally, the multifunctional sensor further comprises a vibrating diaphragm fixed to the first housing, and the vibrating diaphragm covers the sound pickup hole.

Optionally, the multifunctional sensor further comprises a waterproof membrane fixed to the second housing, and the waterproof membrane covers the through hole.

According to another object of the present invention, there is provided an electronic device including the multifunctional sensor as described above.

The utility model has the advantages as follows:

1. the utility model provides a multifunctional sensor makes MEMS acoustics chip directly pick up external sound data through the pickup hole through setting up first encapsulation inner chamber, second encapsulation inner chamber, pickup hole and through-hole, and external environmental data is directly gathered through the through-hole to MEMS environment chip, strengthens MEMS environment chip's performance and sensitivity; and the MEMS acoustic chip and the MEMS environment chip are not interfered with each other, so that the performance and the sensitivity of the MEMS acoustic chip and the MEMS environment chip are improved, and the efficiency and the overall performance of the multifunctional sensor are further improved.

2. The utility model provides a multi-functional sensor's first encapsulation inner chamber and second encapsulation inner chamber are located the both sides surface that the base plate corresponds respectively, can further reduce multi-functional sensor's structure volume.

3. The multifunctional sensor provided by the utility model can be used in a plug-and-play manner through the configured gold finger interface, is convenient to operate, saves the process of connecting with an external circuit gold wire, reduces the process difficulty, and improves the assembly efficiency of the multifunctional sensor; meanwhile, when the multifunctional sensor is repaired, the multifunctional sensor is convenient to disassemble and assemble.

4. The utility model provides a multi-function sensor's first ASIC chip and second ASIC chip are located respectively in the base plate, can further reduce occuping of multi-function sensor inner space, do benefit to the volume that reduces multi-function sensor, and the encapsulation of the sensor of still being convenient for.

5. The utility model provides a multifunctional sensor is provided with vibrating diaphragm and waterproof membrane, can realize multifunctional sensor's waterproof dustproof performance, effectively keeps apart outside pollutant and gets into inside multifunctional sensor, prolongs multifunctional sensor's life, strengthens multifunctional sensor's reliability.

Drawings

The following describes embodiments of the present invention in further detail with reference to the accompanying drawings.

Fig. 1 shows a schematic structural diagram of a conventional multifunctional sensor.

Fig. 2 shows a schematic structural diagram of a multifunctional sensor according to an embodiment of the present invention.

Fig. 3 shows a schematic structural diagram of a multifunctional sensor according to another embodiment of the present invention.

Detailed Description

In the following description, for purposes of explanation, numerous specific details are set forth in order to provide a thorough understanding of one or more embodiments. It may be evident, however, that such embodiment(s) may be practiced without these specific details.

In order to explain the present invention more clearly, the present invention will be further described with reference to the preferred embodiments and the accompanying drawings. Similar parts in the figures are denoted by the same reference numerals. It is to be understood by persons skilled in the art that the following detailed description is illustrative and not restrictive, and is not to be taken as limiting the scope of the invention.

In the multi-functional sensor structure of the prior art, a plurality of MEMS chips with different functions, such as a MEMS acoustic chip 13 and a MEMS environmental chip 12, are generally arranged side by side on a substrate 10, as shown in fig. 1. Substrates of such structures tend to be long, resulting in a bulky multifunctional sensor, which in one particular example is 2.65mm by 3.5mm by 1mm, and it can be seen that the volume of the multifunctional sensor of this particular example is difficult to meet the current demand for a multifunctional sensor in a very small-sized package; meanwhile, as shown in fig. 1, in the multifunctional sensor in the prior art, a through hole 14 corresponding to the MEMS acoustic chip 13 is formed in the substrate 10, when the multifunctional sensor works, external air enters the MEMS acoustic chip 13 through the through hole 14, the MEMS acoustic chip 13 receives external sound and transmits external environmental data to the MEMS environmental chip 12 through a diaphragm 131 on the MEMS acoustic chip 13, and the MEMS environmental chip 12 indirectly collects the external environmental data transmitted by the diaphragm 131 of the MEMS acoustic chip 13, so that the sensitivity of the MEMS environmental chip is low, and in the multifunctional sensor structure, mutual interference easily occurs between the MEMS acoustic chip 13 and the MEMS environmental chip 12, so that the efficiency and performance of the multifunctional sensor are affected.

In order to solve the above technical problem, the present invention provides a multifunctional sensor, as shown in fig. 2 and 3, the multifunctional sensor includes a substrate 1; a first case 2 forming a first package cavity 21 with the substrate 1, and a MEMS acoustic chip 3 housed in the first package cavity 21; the MEMS acoustic chip 3 can receive sound from the outside and convert the sound into an electrical signal; the multifunctional sensor also comprises a second shell 4 forming a second packaging inner cavity 41 with the substrate 1, and a MEMS environment chip 5 accommodated in the second packaging inner cavity 41; the MEMS environmental chip 5 is used to sense the change of various parameters of the external environment and convert the change into an electrical signal. The first shell 2 comprises a pickup hole 22 corresponding to the MEMS acoustic chip 3; the second shell 4 comprises a through hole 42 corresponding to the MEMS environment chip 5; the first package cavity 21 and the second package cavity 41 are isolated from each other. As shown in fig. 2 and fig. 3, in the multifunctional sensor structure provided by the present invention, the first package inner cavity 21 and the second package inner cavity 41 are independent inner cavities. When the multifunctional sensor works, the MEMS acoustic chip acquires external sound data through the pickup hole; compared with the prior art that the MEMS environmental chip needs to indirectly acquire the external environmental data through the vibrating diaphragm of the MEMS acoustic chip, the MEMS environmental chip of the multifunctional sensor in the embodiment can directly acquire the external environmental data, and the performance and the sensitivity of the MEMS environmental chip are favorably improved; in addition, the MEMS acoustic chip and the MEMS environment chip are accommodated in two independent inner cavities, so that the MEMS acoustic chip and the MEMS environment chip are prevented from mutual interference, the performance and the sensitivity of the MEMS acoustic chip and the MEMS environment chip can be improved, and the efficiency and the overall performance of the multifunctional sensor are improved.

In one specific embodiment, the substrate 1 may be a silicon glass plate, a metal plate or a PCB, the MEMS acoustic chip is fixed on the substrate by conductive adhesive or solder paste, and the MEMS environmental chip is fixed on the substrate by conductive adhesive or solder paste, as well known in the art.

In a specific embodiment, the MEMS environmental chip 5 is one or more of a MEMS air pressure sensor chip, a MEMS temperature chip, a MEMS humidity sensor chip, or a MEMS optical sensor chip. Taking the specific implementation mode that the MEMS environmental chip is the MEMS pressure sensor chip as an example, the MEMS pressure sensor chip can sense the height of the human body according to the pressure change of the gas. Because the MEMS acoustic chip and the MEMS air pressure sensor chip can both sense the air pressure, the MEMS acoustic chip and the MEMS air pressure sensor chip are packaged, and the obtained multifunctional sensor can be more convenient to use. It can be understood that MEMS environment chips with different functions can be integrated into the same MEMS environment chip to realize more functions.

As shown in fig. 2, in a specific embodiment, the first package cavity 21 and the second package cavity 41 are located on the same side surface of the substrate 1, that is, the first package cavity 21 and the second package cavity 41 are disposed side by side on a side surface of the substrate 1. In another specific embodiment, as shown in fig. 3, the first package cavity 21 is located on a side surface of the substrate 1, and the second package cavity 41 is located on a side surface of the substrate 1 facing away from the first package cavity 21. Namely, the MEMS acoustic chip 3 and the MEMS environment chip 5 are positioned on two sides of the same substrate 1, and the first packaging inner cavity 21 and the second packaging inner cavity 41 are isolated from each other through the substrate 1. In the specific embodiment shown in fig. 3, the size of the multifunctional sensor is 2.2mm by 2mm by 1.5mm, which is significantly reduced compared to the size of the prior art multifunctional sensor of the above-mentioned embodiment of 2.65mm by 3.5mm by 1mm, thereby reducing the volume of the multifunctional sensor as a whole, so that the multifunctional sensor of this embodiment can satisfy the demand for a multifunctional sensor of an extremely small size package.

In a particular embodiment, the multifunction sensor further comprises a first ASIC chip 6 arranged in correspondence with said MEMS acoustic chip 3 and a second ASIC chip 7 arranged in correspondence with said MEMS environmental chip 5. The MEMS acoustic chip 3 and the first ASIC chip 6 form an acoustic sensor, the MEMS acoustic chip is used for sensing and detecting a sound source and converting a sound signal into an electric signal for transmission, and the first ASIC chip is used for processing the signal output by the MEMS acoustic chip and providing voltage for the MEMS acoustic chip, so that the acoustic sensor provides a sound receiving function for electronic equipment; the MEMS environment chip 5 and the second ASIC chip 7 form an environment sensor, the MEMS environment chip is used for sensing the change of various parameters of the external environment, and the second ASIC chip is used for processing the signals output by the MEMS environment chip, so that the environment sensor has the function of monitoring the change of the external environment.

In one embodiment, the MEMS acoustic chip, the first ASIC chip, the MEMS environmental chip and the second ASIC chip are juxtaposed on one side surface of the substrate, wherein the ASIC chips are attached to the substrate in a manner known to those skilled in the art, for example, by gluing with glue (silicone) or by attaching with a patch glue. The MEMS chip is electrically connected with the ASIC chip through a gold wire, so that signals output by the MEMS chip can be processed through the ASIC chip; the ASIC chip is electrically connected with the substrate through a gold wire, so that the electrical signals output by the MEMS chip are processed by the ASIC chip and then are output to the outside.

It will be appreciated that, in order to further reduce the occupation of the internal space of the multifunction sensor and to reduce the volume of the multifunction sensor, in a preferred embodiment, the first ASIC chip 6 and the second ASIC chip 7 are respectively located within the substrate 1. Specifically, as shown in fig. 2 to 3, a first cavity and a second cavity (not shown) are provided at an interval inside the substrate 1, and the first ASIC chip 6 and the second ASIC chip 7 are respectively accommodated in the first cavity and the second cavity, so that electromagnetic interference between the first ASIC chip 6 and the second ASIC chip 7 can be reduced to a certain extent. When the first ASIC chip 6 and the second ASIC chip 7 are respectively accommodated in the first cavity and the second cavity, the end part of the first ASIC chip for accessing/outputting signals extends out of the surface exposed on the substrate and is electrically connected with the MEMS acoustic chip; similarly, the end part of the second ASIC chip for inputting/outputting signals also extends out of the cavity and is exposed on the surface of the substrate to be electrically connected with the MEMS environment chip. The MEMS environment chip and the MEMS microphone chip are respectively connected with the end part of the first ASIC chip for accessing/outputting signals and the end part of the second ASIC chip for accessing/outputting signals through metal wires, and the metal wires can be wires of gold, copper or other conductive metals.

In the structure shown in fig. 2 or fig. 3, the substrate 1 of the multifunctional sensor provided by the present invention comprises a connecting portion 8 exposed outside the first casing 2 and the second casing 4; the connecting part 8 is provided with a conductive golden finger interface 9, and the multifunctional sensor is electrically connected with the outside through the golden finger interface. In the embodiment shown in fig. 2, the gold finger interface 9 may be located on one side or both sides of the substrate 1, and in the embodiment shown in fig. 3, the gold finger interface 9 is located at the bottom of the substrate 1, so as to facilitate electrical connection between the sensor and an external circuit. Compared with the prior art that the multifunctional sensor is connected with an external circuit by adopting a gold wire connection mode, the specific embodiment adopts a gold finger interface, is plug-and-play, is convenient to operate, omits the process of connecting the multifunctional sensor with the external circuit by the gold wire, reduces the process difficulty and improves the assembly efficiency of the multifunctional sensor; meanwhile, when the multifunctional sensor is repaired, the multifunctional sensor is convenient to disassemble and assemble.

In a specific embodiment, the multifunctional sensor may further include a vibrating diaphragm fixed to the first housing, the vibrating diaphragm covering the sound pickup hole, and the vibrating diaphragm may be located on a sound pickup hole edge inside the first housing or on a sound pickup hole edge outside the first housing. It will also be appreciated that in one embodiment, the multifunctional sensor further comprises a waterproof membrane fixed in combination with the second housing, the waterproof membrane covering the through hole, and the waterproof membrane may be located on the edge of the through hole on the inner side of the second housing or on the edge of the through hole on the outer side of the second housing. The multifunctional sensor has the advantages that the waterproof and dustproof performance of the multifunctional sensor can be realized, external pollutants are effectively isolated from the multifunctional sensor, the service life of the multifunctional sensor is prolonged, and the reliability of the multifunctional sensor is enhanced.

According to another object of the present invention, the present invention also provides an electronic device, which includes the multifunctional sensor as described above. Since the electronic device adopts all technical solutions of all the embodiments, at least all the beneficial effects brought by the technical solutions of the embodiments are achieved, and no further description is given here. The electronic device may be a wearable electronic device, such as a smart watch or a bracelet, or may be a mobile terminal, such as a mobile phone or a notebook computer, which is not limited herein.

Obviously, the above embodiments of the present invention are only examples for clearly illustrating the present invention, and are not intended to limit the embodiments of the present invention, and it is obvious for those skilled in the art to make other variations or changes based on the above descriptions, and all the embodiments cannot be exhausted here, and all the obvious variations or changes that belong to the technical solutions of the present invention are still in the protection scope of the present invention.

Claims

1. A multifunctional sensor, characterized in that the multifunctional sensor comprises:

a substrate;

the MEMS acoustic chip comprises a first shell and a second shell, wherein the first shell and the substrate form a first packaging inner cavity, and the MEMS acoustic chip is accommodated in the first packaging inner cavity;

the MEMS environment chip is accommodated in the second packaging inner cavity;

the first shell comprises a pickup hole corresponding to the MEMS acoustic chip;

the second shell comprises a through hole corresponding to the MEMS environment chip;

the first packaging inner cavity and the second packaging inner cavity are isolated from each other.

2. The multifunctional sensor of claim 1, wherein the MEMS environmental chip is one or more of a MEMS barometric sensor chip, a MEMS temperature chip, a MEMS humidity sensor chip, or a MEMS optical sensor chip.

3. The multi-functional sensor of claim 1, wherein the first package cavity is located on a side surface of the substrate and the second package cavity is located on a side surface of the substrate facing away from the first package cavity.

4. The multi-functional sensor of claim 1, wherein the first and second package cavities are located on the same side surface of the substrate.

5. The multifunctional sensor of claim 1, further comprising:

a first ASIC chip disposed corresponding to the MEMS acoustic chip;

and the second ASIC chip is arranged corresponding to the MEMS environment chip.

6. The multi-functional sensor of claim 5, in which the first and second ASIC chips are located within the substrate, respectively.

7. The multifunctional sensor according to claim 3, wherein said substrate includes a connection portion exposed to the outside of said first and second housings;

the connecting part comprises a conductive golden finger interface;

the multifunctional sensor is electrically connected with an external circuit through a golden finger interface.

8. The multi-function sensor of claim 1, further comprising a vibrating diaphragm coupled to the first housing, the vibrating diaphragm covering the sound pickup aperture.

9. The multifunctional sensor according to claim 1, further comprising a waterproof membrane fixed to the second housing, wherein the waterproof membrane covers the through hole.

10. An electronic device, characterized in that it comprises a multifunction sensor according to any one of claims 1 to 9.