CN113555327A - Packaging structure and electronic equipment - Google Patents
Packaging structure and electronic equipment Download PDFInfo
- Publication number
- CN113555327A CN113555327A CN202110687706.XA CN202110687706A CN113555327A CN 113555327 A CN113555327 A CN 113555327A CN 202110687706 A CN202110687706 A CN 202110687706A CN 113555327 A CN113555327 A CN 113555327A
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- packaging
- package structure
- substrate
- packaging layer
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
- H01L23/3135—Double encapsulation or coating and encapsulation
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
- B81B7/0032—Packages or encapsulation
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Micromachines (AREA)
Abstract
The invention relates to a packaging structure and electronic equipment, the packaging structure includes: the substrate is provided with a first surface and a second surface which are opposite, and at least one functional device is arranged on each of the first surface and the second surface; and the packaging layer comprises a first packaging layer arranged on the first surface and a second packaging layer arranged on the second surface, the functional device positioned on the first surface is packaged in the first packaging layer, and the functional device positioned on the second surface is packaged in the second packaging layer. The invention has the technical effects that the functional devices to be integrated are arranged on the two opposite surfaces of the substrate and are packaged through the packaging layers, so that the packaging quantity of the functional devices on the substrate can be increased, more functional devices can be integrated on the limited area of the substrate, the integration level is improved, the substrate required by the same quantity of functional devices is smaller, and the space occupied by the packaging structure is smaller.
Description
Technical Field
The present invention relates to the field of semiconductor packaging technologies, and in particular, to a package structure and an electronic device.
Background
With the development and application of semiconductor technology, semiconductors have increasingly high influence on the miniaturization and integration of electronic products. The existing semiconductor packaging technology generally packages a part of devices on a single surface of a substrate, and the whole packaged structure is arranged in an electronic product. The current packaging structure occupies a larger space, which influences the further optimization and improvement of the miniaturization and integration of the electronic product by the packaging structure.
Disclosure of Invention
An object of the present invention is to provide a new technical solution for a package structure and an electronic device.
According to an aspect of the present invention, there is provided a package structure, including:
the substrate is provided with a first surface and a second surface which are opposite, and at least one functional device is arranged on each of the first surface and the second surface;
the packaging layer comprises a first packaging layer arranged on the first surface and a second packaging layer arranged on the second surface, the functional device on the first surface is packaged in the first packaging layer, and the functional device on the second surface is packaged in the second packaging layer.
Optionally, a metal casing is disposed on the first surface, the metal casing is encapsulated in the first encapsulation layer, and at least one of the functional devices on the first surface is located in the metal casing; and/or the presence of a gas in the gas,
and a metal shell is arranged on the second surface, the metal shell is packaged in the second packaging layer, and at least one of the functional devices on the second surface is positioned in the metal shell.
Optionally, the functional device on the first surface comprises an ASIC chip and a MEMS chip, the ASIC chip being electrically connected with the substrate and the MEMS chip;
the substrate is provided with an air hole for communicating the first surface with the second surface, the air hole is opposite to the MEMS chip, and the second packaging layer avoids the air hole;
the first surface is provided with a metal shell, the metal shell is packaged in the first packaging layer, and the ASIC chip and the MEMS chip are located in the metal shell.
Optionally, the second surface has a vacant region, the vacant region is evacuated from the second encapsulation layer, and the air hole is located in the vacant region at the position of the hole of the second surface.
Optionally, the vacant areas are located at edge positions of the second surface.
Optionally, a flexible circuit board is disposed on the vacant region.
Optionally, the second encapsulation layer covers the second surface.
Optionally, the first encapsulation layer covers the first surface.
Optionally, the encapsulation layer is an injection molded structure.
According to another aspect of the present invention, there is provided an electronic device including the package structure of any one of the above.
The invention has the technical effects that the functional devices to be integrated are arranged on the two opposite surfaces of the substrate and are packaged through the packaging layers, so that the packaging quantity of the functional devices on the substrate can be increased, more functional devices can be integrated on the limited area of the substrate, the integration level is improved, the substrate required by the same quantity of functional devices is smaller, and the space occupied by the packaging structure is smaller.
Other features of the present invention and advantages thereof will become apparent from the following detailed description of exemplary embodiments thereof, which proceeds with reference to the accompanying drawings.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description, serve to explain the principles of the invention.
Fig. 1 is a schematic structural diagram of a package structure in an embodiment of the present disclosure.
Reference numerals: 1-substrate, 21-first packaging layer, 22-second packaging layer, 3-functional device, 31-ASIC chip, 32-MEMS chip, 4-metal shell, 5-air hole, 6-flexible circuit board.
Detailed Description
Various exemplary embodiments of the present invention will now be described in detail with reference to the accompanying drawings. It should be noted that: the relative arrangement of the components and steps, the numerical expressions and numerical values set forth in these embodiments do not limit the scope of the present invention unless specifically stated otherwise.
The following description of at least one exemplary embodiment is merely illustrative in nature and is in no way intended to limit the invention, its application, or uses.
Techniques and apparatus known to those of ordinary skill in the relevant art may not be discussed in detail, but are intended to be considered a part of the specification where appropriate.
In all examples shown and discussed herein, any particular value should be construed as merely illustrative, and not limiting. Thus, other examples of the exemplary embodiments may have different values.
It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, further discussion thereof is not required in subsequent figures.
According to an embodiment of the present disclosure, there is provided a package structure, as shown in fig. 1, including:
the substrate comprises a substrate 1, wherein the substrate 1 is provided with a first surface and a second surface which are opposite, and at least one functional device 3 is arranged on each of the first surface and the second surface.
And the packaging layer comprises a first packaging layer 21 arranged on the first surface and a second packaging layer 22 arranged on the second surface, the functional device 3 positioned on the first surface is packaged in the first packaging layer 21, and the functional device 3 positioned on the second surface is packaged in the second packaging layer 22.
In this embodiment, the functional devices 3 to be integrated are arranged on two opposite surfaces of the substrate 1 and encapsulated by the encapsulation layer. Therefore, the packaging number of the functional devices 3 on the substrate 1 can be increased, more functional devices 3 are integrated on the limited area of the substrate 1, the integration level is improved, the substrate required by the same number of functional devices 3 is smaller, and the occupied space of the packaging structure is smaller.
The first encapsulation layer 21 forms an encapsulation for the functional device 3 located on the first surface, protects the functional device 3 and forms an integration of the first surface. The second encapsulation layer 22 forms an encapsulation for the functional device 3 located on the second surface and forms an integration of the second surface. By using the first surface and the second surface of the substrate 1 for integration, more functional devices 3 can be integrated on the substrate 1 to improve the integration of the product. Integrating more functional devices 3 enables the use of a package structure with more functions in the product.
Under the predetermined number of functional devices 3, packaging is performed by the packaging structure. The functional devices 3 can be distributed on the first surface and the second surface for packaging, and the volume of the substrate 1 is smaller, so that the volume of the packaging structure is reduced. Therefore, the space occupied by the packaging structure in the product can be reduced, and the miniaturization degree of the product is improved.
For example, in the process of setting the package structure, the functional device 3 is first attached to the corresponding surface. And then the surface provided with the functional device 3 is encapsulated by an encapsulating material to form an encapsulation layer.
Optionally, the encapsulation layer is an injection molded structure.
In this embodiment, the structure of the encapsulation layer is formed by performing an injection molding process outside the mounted functional device 3. This enables better filling of the gaps between the functional devices 3, enabling the encapsulation layer to better protect the functional devices 3.
In order to meet the requirement for the external shape structure of the packaging structure, the packaging layer can be injection molded according to the required shape structure during injection molding.
In one embodiment, as shown in fig. 1, a metal casing 4 is disposed on the first surface, the metal casing 4 is encapsulated in the first encapsulation layer 21, and at least one of the functional devices 3 on the first surface is located in the metal casing 4; and/or the presence of a gas in the gas,
the second surface is provided with a metal shell 4, the metal shell 4 is encapsulated in the second encapsulation layer 22, and at least one of the functional devices 3 on the second surface is located in the metal shell 4.
In this embodiment, the functional component 3 can be protected by the metal housing 4, in order to further reduce the influence of external influences on the functional component 3 located in the metal housing 4. For example, the functional device 3 is prevented from absorbing moisture, colliding with the outside, and shielding signal interference.
The skilled person can choose which functional devices 3 are arranged in the metal housing 4 depending on the actual function of the functional devices 3, so that the functional devices 3 are protected. The metal housing 4 may be disposed on the first surface, may be disposed on the second surface, and may be disposed on both the first surface and the second surface. The number and position of the metal housings 4 are selected according to the position of the protected functional component 3.
In one embodiment, as shown in fig. 1, the functional device 3 on the first surface includes an ASIC chip 31 and a MEMS chip 32, and the ASIC chip 31 is electrically connected to the substrate 1 and the MEMS chip 32.
The substrate 1 is provided with an air hole 5 for communicating the first surface with the second surface, the air hole 5 is opposite to the MEMS chip 32, and the second packaging layer 22 is free from the air hole 5.
The first surface is provided with a metal shell 4, the metal shell 4 is packaged in the first packaging layer 21, and the ASIC chip 31 and the MEMS chip 32 are located in the metal shell 4.
In this embodiment, the ASIC chip 31 and the MEMS chip 32 mounted on the substrate 1 are located inside the metal casing 4. The metal shell 4 protects the ASIC chip 31 and the MEMS chip 32 from interference from the external environment.
The functional role of the sensor is achieved by integrating the ASIC chip 31 and the MEMS chip 32. For example, the air holes 5 are used for the entrance and exit of air flow so that the MEMS chip 32 can feel the effect of the air flow for a vibration sensor or an air pressure sensor.
For example, the air hole 5 communicates the first surface and the second surface, and the external temperature can be sensed by the MEMS chip 32 for the temperature sensor.
In one embodiment, as shown in fig. 1, the second surface has a vacant area thereon, the vacant area is located away from the second encapsulation layer 22, and the air hole 5 is located in the vacant area at the position of the opening of the second surface.
In this embodiment, the vacant areas are kept away from the second packaging layer 22, so that the air holes 5 in the vacant areas can be ensured to communicate the two side spaces where the first surface and the second surface are located. This enables the MEMS chip 32 to work normally, and prevents the structure of the second encapsulation layer 22 from blocking the air holes 5.
The vacant areas can provide space for connection of the package structure to the product when the package structure is arranged in the product. The assembly difficulty of the packaging structure is reduced.
In one embodiment, the vacant areas are located at edge positions of the second surface.
In this embodiment, the vacant areas are disposed at the edge positions of the surface, so that the edge positions of the package structure have vacant positions. When the package structure is attached to an external device, the vacant areas can be located close to the connection locations and the structure not requiring connection bypasses the second package layer 22. Thus, the connection with devices outside the packaging structure is more convenient. And facilitates the interaction of the functional device 3 with the outside through the air hole 5.
In one embodiment, as shown in fig. 1, a flexible wiring board 6 is disposed on the vacant region.
In this embodiment, the flexible wiring board 6 facilitates connection of the package structure to an external device. For example, the flexible circuit board 6 is convenient to bend, can adapt to different structures of external devices, and is convenient to connect.
The flexible circuit board 6 is used as a connecting part of the packaging structure and the outside, so that the packaging structure is more convenient to store when the packaging structure exists independently, and the problem that the rigid connecting structure is easily damaged due to collision can be avoided.
In one embodiment, the second encapsulation layer 22 covers the second surface.
The second encapsulation layer 22 covers the second surface and can protect the second surface of the substrate 1. And, make the structure of second surface one side simpler, more make things convenient for second surface one side and external structure to adapt to. For example, when the space of the device where the package structure is located is set, the mounting position is set to satisfy the external structure of the first package layer 21, so that the package structure can be better mounted with the external device. And simultaneously, the waste of space is also avoided.
In one embodiment, the first encapsulation layer 21 covers the first surface.
The first encapsulation layer 21 covers the first surface and can protect the first surface of the substrate 1. And, make the structure of first surface simpler, more make things convenient for second surface one side to adapt to with outside structure.
For example, when the space of the device where the package structure is located is set, the mounting position is set to satisfy the external structure of the second package layer 22, so that the package structure can be better mounted with the external device. And simultaneously, the waste of space is also avoided.
According to an embodiment of the present disclosure, there is provided an electronic device including the package structure according to any one of the above embodiments.
The electronic equipment is provided with the packaging structure, so that more functional devices 3 can be integrated. This may be combined by different functional devices 3 to increase the functionality of the electronic apparatus. The packaging structure can distribute the functional devices 3 on the first surface and the second surface of the substrate 1 under the condition of satisfying the functions of the electronic equipment, so as to reduce the required size of the substrate 1, and further reduce the space of the electronic equipment occupied by the packaging structure. The degree of miniaturization of the electronic apparatus is further improved.
In the above embodiments, the differences between the embodiments are described in emphasis, and different optimization features between the embodiments can be combined to form a better embodiment as long as the differences are not contradictory, and further description is omitted here in consideration of brevity of the text.
Although some specific embodiments of the present invention have been described in detail by way of illustration, it should be understood by those skilled in the art that the above illustration is only for the purpose of illustration and is not intended to limit the scope of the invention. It will be appreciated by those skilled in the art that modifications may be made to the above embodiments without departing from the scope and spirit of the invention. The scope of the invention is defined by the appended claims.
Claims (10)
1. A package structure, comprising:
the substrate is provided with a first surface and a second surface which are opposite, and at least one functional device is arranged on each of the first surface and the second surface;
the packaging layer comprises a first packaging layer arranged on the first surface and a second packaging layer arranged on the second surface, the functional device on the first surface is packaged in the first packaging layer, and the functional device on the second surface is packaged in the second packaging layer.
2. The package structure according to claim 1, wherein a metal housing is disposed on the first surface, the metal housing is encapsulated in the first encapsulation layer, and at least one of the functional devices on the first surface is located in the metal housing; and/or the presence of a gas in the gas,
and a metal shell is arranged on the second surface, the metal shell is packaged in the second packaging layer, and at least one of the functional devices on the second surface is positioned in the metal shell.
3. The package structure of claim 2, wherein the functional devices on the first surface comprise an ASIC chip and a MEMS chip, the ASIC chip being electrically connected with the substrate and the MEMS chip;
the substrate is provided with an air hole for communicating the first surface with the second surface, the air hole is opposite to the MEMS chip, and the second packaging layer avoids the air hole;
the first surface is provided with a metal shell, the metal shell is packaged in the first packaging layer, and the ASIC chip and the MEMS chip are located in the metal shell.
4. The package structure of claim 3, wherein the second surface has a void region thereon, the void region being free of the second encapsulation layer, the air hole being located in the void region at an aperture location of the second surface.
5. The package structure of claim 4, wherein the vacant areas are located at edge positions of the second surface.
6. The package structure of claim 4, wherein a flexible circuit board is disposed on the vacant areas.
7. The package structure of claim 1, wherein the second encapsulation layer covers the second surface.
8. The package structure of claim 1, wherein the first encapsulation layer covers the first surface.
9. The package structure of claim 1, wherein the encapsulation layer is an injection molded structure.
10. An electronic device, characterized in that it comprises a package structure according to any one of claims 1 to 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110687706.XA CN113555327A (en) | 2021-06-21 | 2021-06-21 | Packaging structure and electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110687706.XA CN113555327A (en) | 2021-06-21 | 2021-06-21 | Packaging structure and electronic equipment |
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| CN113555327A true CN113555327A (en) | 2021-10-26 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202110687706.XA Pending CN113555327A (en) | 2021-06-21 | 2021-06-21 | Packaging structure and electronic equipment |
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Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104900599A (en) * | 2015-04-16 | 2015-09-09 | 歌尔声学股份有限公司 | Packaging structure and method of integrated sensor |
| CN210670557U (en) * | 2019-12-25 | 2020-06-02 | 歌尔科技有限公司 | Multifunctional sensor and electronic equipment comprising same |
| CN111293092A (en) * | 2020-03-04 | 2020-06-16 | 立讯电子科技（昆山）有限公司 | Ultra-miniaturized SIP (Session initiation protocol) packaging product integrating multiple plastic packaging technologies and packaging process |
| CN111977609A (en) * | 2020-08-28 | 2020-11-24 | 青岛歌尔智能传感器有限公司 | Sensor packaging structure and sensor packaging process |
| CN112117248A (en) * | 2019-06-20 | 2020-12-22 | 矽品精密工业股份有限公司 | Electronic package and manufacturing method thereof |
| CN112786541A (en) * | 2019-11-11 | 2021-05-11 | 江苏长电科技股份有限公司 | Packaging structure and packaging method of cavity device group |
-
2021
- 2021-06-21 CN CN202110687706.XA patent/CN113555327A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104900599A (en) * | 2015-04-16 | 2015-09-09 | 歌尔声学股份有限公司 | Packaging structure and method of integrated sensor |
| CN112117248A (en) * | 2019-06-20 | 2020-12-22 | 矽品精密工业股份有限公司 | Electronic package and manufacturing method thereof |
| CN112786541A (en) * | 2019-11-11 | 2021-05-11 | 江苏长电科技股份有限公司 | Packaging structure and packaging method of cavity device group |
| CN210670557U (en) * | 2019-12-25 | 2020-06-02 | 歌尔科技有限公司 | Multifunctional sensor and electronic equipment comprising same |
| CN111293092A (en) * | 2020-03-04 | 2020-06-16 | 立讯电子科技（昆山）有限公司 | Ultra-miniaturized SIP (Session initiation protocol) packaging product integrating multiple plastic packaging technologies and packaging process |
| CN111977609A (en) * | 2020-08-28 | 2020-11-24 | 青岛歌尔智能传感器有限公司 | Sensor packaging structure and sensor packaging process |
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