JP2007007774A - Package for micro-electric machine apparatus and manufacturing method thereof - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a package for a micro-electric machine apparatus and a manufacturing method thereof, restraining thermal or mechanical external stress from being transmitted to a movable part of a micro-electric machine apparatus. <P>SOLUTION: An acceleration sensor 1, which is a micro-electric machine apparatus, is armored with a protective base plate 4a and a protective cap 5a having rigidity and formed of material having a small coefficient of thermal expansion, connected and mounted on an interposer substrate 7, and packaged with plastic mold resin 12 or the like, whereby the transmission of external stress to the movable part 2a of the acceleration sensor 2 can be restrained to reduce a change in characteristic due to distortion caused in the movable part 2a. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a microelectromechanical device, and more particularly to a package for a microelectromechanical device related to the packaging and a manufacturing method thereof.

In recent years, microelectromechanical devices capable of processing both electrical signals and mechanical signals have attracted attention. A micro electro mechanical device is characterized by having a movable part for processing a mechanical signal. These micro electromechanical devices are widely used in mobile electronic devices such as computers and mobile phones.

Here, the application of the micro electromechanical device will be described by giving a case where the micro electromechanical device is mounted on a computer or the like.

Computers, mobile phones, and the like have been introduced into a wide range of social systems, and have a lot of convenience and are widely used as mobile electronic devices. In these devices, a memory card or the like is usually used for exchanging or storing a lot of information. However, storing a large amount of information such as images and moving images has been impossible with the memory capacity of 1 GB level of the memory card.

Therefore, in recent years, electronic devices incorporating an HDD having a memory capacity of 160 GB or the like have been realized. Such a mobile electronic device with a built-in HDD is convenient to carry, but there is a problem that a built-in component such as a HDD may break down due to dropping or the like. That is, inside the HDD, the magnetic disk rotates at high speed, and a magnetic head for writing and reading data operates. The head and disk are non-contact, but the distance between them is very precise, in nanometers. If the head comes into contact with the disk due to external stress, there is a risk of data damage.

In order to prevent the HDD from crashing, it is necessary to retract the magnetic head in advance. For this reason, there is HDD protection technology that protects the HDD from external impact by installing an acceleration sensor, which is a micro electromechanical device, in a mobile electronic device. Has been developed.

This microelectromechanical device is composed of a movable part such as a sensor and a substrate on which the movable part is mounted, and is usually sealed in a plastic mold resin together with a control element of the system, and is incorporated in a mobile electronic device or the like. When the sensor of the movable part senses an abnormal movement such as dropping, the magnetic head of the HDD is retracted, and the risk of crashing the HDD can be reduced.

However, the microelectromechanical system mounted on such a mobile electronic device may be subjected to thermal and mechanical external stress from the outside, that is, other components inside the mobile electronic device. The sealed microelectromechanical system has a problem in that the above-described movable part is distorted and its characteristics change.

In order to solve this problem, a micro electromechanical device and a manufacturing method for forming a cap on a movable part of the micro electro mechanical system have been proposed. For example, in Japanese translations of PCT publication No. 2004-535938, an integrated circuit element is formed on a substrate of a micro electro mechanical device, a cap that covers the integrated circuit element is formed on the substrate of the micro electro mechanical device, and the entire device is made of plastic mold resin. A structure and a manufacturing method have been proposed. Further, it has been proposed to include the inside of the cap on the substrate of the microelectromechanical device with a vacuum or an inert gas.

Thus, by covering the integrated circuit element with the cap, the integrated circuit element is protected and isolated from external thermal or mechanical external stress, or assists the operation of other microelectromechanical systems or integrated circuit devices, or The effect that it can raise is acquired.
Special table 2004-535938

  In conventional micro electromechanical devices, although integrated circuit parts such as movable parts are protected by caps, the substrate on which the movable parts are mounted is directly sealed with plastic mold resin. When a thermal or mechanical external stress is generated, it passes through the plastic mold resin to the substrate and is transmitted to the substrate. The thermal or mechanical external stress transmitted to the substrate has a problem in that the movable part is distorted and its characteristics are changed.

  In addition, when a microelectromechanical device and a semiconductor element that controls it are mounted on a plastic mold resin in order to improve the integration efficiency, the thermal stress from the semiconductor element directly passes through the plastic mold resin. As a result, there is a problem that distortion is generated in the movable part.

The present invention has been made to solve the above problems, and provides a package for a micro electro mechanical device that suppresses transmission of thermal or mechanical external stress to a movable part of the micro electro mechanical device, and a method for manufacturing the same. For the purpose.

  In order to achieve the above object, a microelectromechanical device package for sealing a microelectromechanical device having a movable portion according to the first aspect of the present invention and a substrate on which the movable portion is mounted by molding means. It is installed between the mounting means for connecting and mounting the device, the micro electro mechanical device and the mounting means, and the size of the micro electro mechanical device is such that the substrate does not come into contact with the mounting means. A first protection means made of a material having a high rigidity and a thermal conductivity coefficient equal to or smaller than that of the substrate of the microelectromechanical device, and disposed on the first protection means, covering the microelectromechanical device, A second protective means made of a material having a rigidity higher than that of the mold means and having a thermal conductivity coefficient equivalent to or smaller than that of the substrate of the micro electro mechanical apparatus; Characterized by comprising an electrical connection means for electrically connecting the mounting means and.

  A micro electric machine having a movable part according to the second aspect of the present invention for achieving the above object and a substrate on which the movable part is mounted, and sealing a flip-chip micro electro mechanical device with a molding means. The package is installed between the mounting means for connecting and mounting the microelectromechanical device, and between the microelectromechanical device and the mounting means, so that the substrate of the microelectromechanical device is not in contact with the mounting means. A first protective means made of a material having a rigidity higher than that of the mold means and having a thermal conductivity coefficient equivalent to or smaller than that of the substrate of the micro electro mechanical device; Second protection means made of a material covering the electromechanical device and having a rigidity higher than that of the mold means and having a thermal conductivity coefficient equivalent to or smaller than that of the substrate of the microelectromechanical device , Characterized by comprising a first electrical connection means for electrically connecting the mounting means and the micro electromechanical device.

  Furthermore, a package for a microelectromechanical device according to a third aspect of the present invention for achieving the above object includes a microelectromechanical device having a movable portion and a substrate on which the movable portion is mounted, and the microelectromechanical device is connected and mounted. Installed between the mounting means and the microelectromechanical device and the mounting means, the size of the microelectromechanical device so that the substrate does not come into contact with the mounting means, and the thermal and mechanical external to the movable part A first protection means made of a material having rigidity for suppressing the transmission of stress and having a thermal conductivity coefficient; and a first protection means provided on the first protection means and covering the microelectromechanical device. The second protection means made of the same material as the above, and the electrical connection means for electrically connecting the microelectromechanical device and the mounting means.

Furthermore, in a method of manufacturing a package for a micro electro mechanical device, wherein a micro electro mechanical device having a movable part and a substrate on which the movable part is mounted according to the fourth aspect of the present invention for achieving the above object is sealed with molding means. The micro electro mechanical apparatus has a rigidity higher than that of the mold means and has a size that does not allow the substrate of the micro electro mechanical device and the mounting means to contact the mounting means in which the electric wiring is arranged on the surface layer or the inner layer. A step of bonding and mounting a first protection means made of a material having a thermal conductivity coefficient equal to or smaller than that of a substrate, a step of bonding and mounting a microelectromechanical device on the first protection means, and a microelectromechanical device; Electrically connecting the mounting means;
A second protection means made of a material that covers the microelectromechanical device on the first protection means, has a rigidity higher than that of the mold means, and has a thermal conductivity coefficient equal to or smaller than that of the substrate of the microelectromechanical apparatus; It is characterized by comprising the steps of bonding and mounting, and the step of sealing with the molding means to those mounted on the mounting means.

  According to the present invention, the microelectromechanical system is packaged after being packaged with a rigid and low thermal expansion coefficient material, thereby suppressing transmission of external stress to the movable part of the microelectromechanical system. Can do.

  Hereinafter, a package for a micro electro mechanical device according to an embodiment of the present invention and a manufacturing method thereof will be described in detail with reference to the drawings. The present embodiment is an example in which the present invention is applied to a package for a micro electro mechanical device in which an acceleration sensor and its control element are integrally sealed with a plastic mold resin.

First, with reference to FIG. 1, the outline | summary of a structure of the package for micro electromechanical devices is demonstrated. FIG. 1 is a schematic diagram showing the configuration of a package for a microelectromechanical device according to an embodiment of the present invention.

The acceleration sensor 1, the first LSI chip 8, and the second LSI chip 10 are mounted on an interposer substrate 7 as mounting means. Here, the first LSI chip 8 and the second LSI chip 10 are composed of an amplifier, a converter, an EEPROM, etc. as a control IC of the acceleration sensor 1. The interposer substrate 7 may be a BT resin substrate or a metal lead frame. A substrate or the like that meets the conditions of the mobile electronic device to be mounted may be employed.

Here, the acceleration sensor 1 includes a movable portion 2a and a substrate 2b that supports the acceleration sensor 1, and the movable portion 2a includes, for example, a comb-shaped fixed beam and a movable beam. With this configuration, when the acceleration is applied, the movable beam is displaced and the capacitance between the fixed beam and the movable beam is changed, so that an electrical output proportional to the magnitude of the acceleration can be detected.

The acceleration sensor 1 is mounted on the interposer substrate 7 via the protective substrate 4a. Furthermore, the acceleration sensor 1 is covered with a protective cap 5a. Here, the protection substrate 4a corresponds to the first protection means, and the protection cap 5a corresponds to the second protection means. Here, the protection substrate 4a and the protection cap 5a have high rigidity and a low thermal conductivity coefficient. A material is used, for example, a material containing silicon or aluminum is suitable.

This rigidity needs to be able to withstand the mechanical external stress that the acceleration sensor 1 receives. Furthermore, this rigidity needs to be higher than the rigidity of the plastic mold resin 12 that seals at least the acceleration sensor 1 and the like mounted on the interposer substrate 7. Further, this thermal expansion coefficient needs to be the same thermal expansion coefficient as that of the substrate 2b of the acceleration sensor 1. Specifically, about 6.8 ppm / ° C. or less is preferable.

Further, the substrate 2 b of the acceleration sensor 1 is electrically connected to the protective substrate 4 by a bonding wire 3. The protective substrate 4 is electrically connected to the interposer substrate 7 by bonding wires 6. Here, the structure of the protective substrate 4a is a double structure within the range that maintains the above-described rigidity and thermal expansion coefficient, and wire bonding is performed by inserting electric wiring or the like in the inner layer or arranging electric wiring in the outer layer. It is possible to make the connection between 3 and 6 easy, and the inside of the protective cap 5a may be filled with air or vacuum. Further, when the protective cap 5a is bonded and mounted on the protective substrate 4a, if there is an electrical wiring on the outer layer of the protective substrate 4a, a protective member (not shown) is disposed on the electrical wiring, and the protective cap is placed thereon. If 5a is mounted by adhesion, the protective cap 5a reduces the disconnection of the electrical wiring on the outer layer of the protective substrate 4a.

The acceleration sensor 1 and the first LSI chip 8 and the second LSI chip 10 thus electrically connected to the interposer substrate 7 are sealed with a plastic mold resin 12 to be protected from external stress, and are integrally molded. Is done. Furthermore, an electrode 13 for electrically connecting a system board (not shown) and the interposer board 7 is installed in a mobile electronic device or the like.

The electrode 13 may be a bump or a metal lead frame, and a connection form suitable for the system board may be adopted. On the other hand, the first LSI chip 8 is electrically connected to the interposer substrate 7 by wire bonding wires 9. The second LSI chip 10 is electrically connected to the interposer substrate 7 by electrodes (bumps or the like).

According to the present embodiment, the substrate 2b and the movable part 2a of the acceleration sensor 1 are surrounded by the protective substrate 4a and the protective cap 5a made of a material having rigidity and a small thermal expansion coefficient, so that the plastic mold resin 12 and the interposer The transmission of thermal and mechanical external stress from the substrate 7 can be suppressed, and the change in characteristics of the movable portion 2a of the acceleration sensor 1 can be reduced by the stress.

Further, by mounting the acceleration sensor 1, the first LSI chip 8 and the second LSI chip 10 in the same package, integration and miniaturization can be achieved.

Furthermore, in this embodiment, by inserting electrical wiring or the like into the inner layer of the protective substrate 4, when attaching the protective sheath 5, it can be bonded without considering the relationship with the wiring connecting the wire bonding 3 and 6, The production efficiency can be improved.

Next, the outline of the structure of the micro electro mechanical device package according to another embodiment of the present invention will be described in detail with reference to FIG. The present embodiment is an example in which the present invention is applied to a package for a micro electro mechanical device in which an acceleration sensor and its control element are integrally sealed with a plastic mold resin. FIG. 2 is a schematic diagram showing a configuration of a package for a microelectromechanical device according to another embodiment of the present invention.

The same components as those in FIG. 1 are denoted by the same reference numerals, and description of the components having the same numbers is omitted. In the present embodiment, the acceleration sensor 1 is flip-chip and mounted inside a protective substrate 4b and a protective cap 5b for protecting the acceleration sensor 1. The movable portion 2a of the acceleration sensor 1 is electrically connected to the substrate substrate 4b by an electrode 14 toward the protective substrate 4b. Further, the protective substrate 4b is configured such that a portion corresponding to the substrate 2b of the acceleration sensor 1 is wider than a portion where the electrode 14 is electrically connected.

In the present embodiment, as in the first embodiment, the substrate 2b and the movable portion 2a of the acceleration sensor 1 are surrounded by the protective substrate 4b and the protective cap 5b made of a material having rigidity and a small thermal expansion coefficient. Transmission of thermal and mechanical external stresses from the plastic mold resin 12 and the interposer substrate 7 can be suppressed, and changes in the characteristics of the movable portion 2a of the acceleration sensor 1 due to the stress can be reduced.

Further, by making the acceleration sensor 1 into a flip chip, the volume of the protective cap 5b and the interposer substrate 7 can be reduced, and the size can be further reduced as compared with the first embodiment.

Furthermore, with reference to FIG. 3, the outline | summary of the other structure of the package for micro electromechanical devices is demonstrated. FIG. 3 is a schematic view showing a configuration of a micro electro mechanical package according to another embodiment of the present invention.

The same components as those in FIGS. 1 and 2 are denoted by the same reference numerals, and the description of the same components is omitted. In the present embodiment, the acceleration sensor 1 is flip-chip, and the first LSI chip 8 and the second LSI chip 10 are vertically stacked on the protective cap 5b of the acceleration sensor 1.

In the case of stacking vertically in this way, it is necessary to electrically connect the first LSI chip 8 and the protective cap 5b by wire bonding and further to be electrically connected to the interposer substrate 7, so that the protective substrate 4b In the protective cap 5b, it is necessary to dispose electric wiring or the like on the outer layer or the inner layer of the protective substrate 4b and the protective cap 5b as long as the characteristics of the material having a small rigidity and thermal conductivity coefficient required in the present invention are maintained. is there.

By adopting such a configuration, the area of the interposer substrate 7 is further reduced as compared with FIG. 2, and the overall volume is reduced, so that the size can be reduced. Therefore, it can be effectively used when there are limited places where mobile electronic devices and the like are mounted.

Next, the manufacturing method of the package for micro electro mechanical devices of the present invention will be described. This embodiment is an example in which the present invention is applied to a method of manufacturing a micro electro mechanical package in which an acceleration sensor and its control element are integrally sealed with a plastic mold resin.

With reference to FIG. 4, the outline of the manufacturing method of the micro electric machine package will be described. FIG. 4 is a flowchart showing an outline of a method for manufacturing a microelectromechanical package according to an embodiment of the present invention.

First, the protective substrate 4 with the electrical wiring previously formed on the surface layer or the inner layer is bonded and mounted on the interposer substrate 7 on which the electrical wiring is previously formed on the surface layer and the inner layer (step S1). The second LSI chip 10 is mounted on the interposer substrate 7 in which electrical wiring is previously formed on the surface layer and the inner layer (step S2). At this time, an underfill may be filled to ensure bonding reliability with respect to the electrode 11 of the second LSI chip 10.

Next, the first LSIS chip 9 is bonded and mounted on the second LSI chip 10 mounted on the interposer substrate 7 (step S3). On the other hand, the first LSI chip 9 and the second LSI chip 10 may be mounted on the interposer substrate 7 with both bonded in advance. The acceleration sensor 1 is bonded and mounted on the protective substrate 4 bonded and mounted on the interposer substrate 7 in step S1 described above (step S4).

Next, the adhesive or the like that has been adhesively mounted in steps S1 to S4 or underfilled is cured (step S5). However, when the curing conditions are different due to differences in the material properties of the adhesive and underfill used in steps S1 to S4, curing may be performed after each step of steps S1 to S4.

Further, in order to electrically connect the protective substrate 4, the first LSI chip 9, and the acceleration sensor 1 that are bonded and mounted on the interposer substrate 7 or the protective substrate 4 in the steps S1 to S4, wire bonding is performed. Perform (step S6). However, wire bonding may be performed after each of the steps S1 to S4.

Next, a protective cap 5a is adhesively mounted on the protective substrate 4a so as to cover the periphery of the acceleration sensor 1 which is a microelectromechanical device, and then the adhesive is cured (step S7). When the protective cap 5a is mounted by bonding, impurities inside the protective cap 5a may be mixed in the clean room, but a vacuum is preferable. By evacuating the inside of the protective cap 5a, it is possible to suppress distortion of the micro electro mechanical chip 1 due to more thermal external stress.

When metal wiring is arranged on the outer layer of the protective substrate 4a, when the micro electro mechanical chip 1 is covered with the protective cap 5a, a protective member (not shown) is attached on the metal wiring and the protective cap is attached. By attaching 5a, it becomes possible to prevent disconnection of the metal wiring.

The resin mounted on the interposer substrate 7 in steps S1 to S7 described above is sealed with a plastic mold resin 12 or the like in order to protect it from external stress (step S8).

Next, solder balls as electrodes 13 are attached to the back surface of the interposer substrate 7. The electrode 13 may be an LGA (Land Grid Array) type without a solder ball, or may be a metal lead frame type.

Here, for the purpose of improving productivity, the interposer substrate 7 may be not a single piece but a strip-like multiple. In the case of selecting a multi-strip strip, step S8 for sealing the resin or attaching the electrode 13 and then singulation (division) as a package is performed (step 9). When the electrode 13 is a solder ball type, after the solder ball is attached, when it is a metal lead frame type, after the step S8, the package is separated (divided) and the lead frame is formed.

The micro electro mechanical device package of the acceleration sensor 1 and the first and second LSI chips 8 and 10 is completed through the above steps.

In this way, in this embodiment, since the shape of the protective cap 5a is prepared in advance according to the size of the micro electro mechanical chip 1 and the protective substrate 4, the protective cap 5a is covered with the acceleration chip 1, The effect of this invention can be acquired only by mounting by adhesion.

Further, when the metal wiring is formed on the protective substrate 4, the protective sheath 5 can be covered with the micro electromechanical chip 1 without worrying about the location of the metal wiring, and the package can be easily and easily made. Compared with the case where the metal wiring is formed as an outer layer, the process of bonding the protective member on the wiring is reduced, and the manufacturing cost is reduced.

On the other hand, when the acceleration sensor 1 is flip-chiped as shown in FIGS. 2 and 3, the acceleration sensor 1 is connected to the protective substrate 4b and the protective cap 5b in advance via the electrodes 14 before being mounted on the interposer substrate 7. Installed. Then, it becomes possible to connect and mount the acceleration sensor 1 mounted on the protective substrate 4 b and the protective cap 5 b to the interposer substrate 7.

Therefore, after the acceleration sensor 1 is connected and mounted after the protective substrate 4a is connected and mounted to the interposer substrate 7 as shown in FIG. The work process for the interposer substrate 7 such as covering with the protective cap 5b can be reduced, and the acceleration sensor 1 covered with the protective substrate 4b and the protective cap 5b is prepared in advance, so that the package for the micro electro mechanical device of the present invention can be more efficient. Can be realized.

Further, by preparing the acceleration sensor 1 covered with the protective substrate 4b and the protective cap 5b in advance, the semiconductor elements controlled by the acceleration sensor and the acceleration sensor are arranged side by side on the interposer substrate 7 as shown in FIGS. There is an advantage in that it can be connected immediately, stacked vertically, and can be immediately handled according to the space of the electronic equipment used.

In the above-described embodiment, the case where the acceleration sensor 1 is used as a micro electro mechanical device has been described. However, the acceleration sensor 1 is a micro electro mechanical device package provided on a substrate or a wiring lead frame and sealed with a molding material. The sensor is not limited to the acceleration sensor 1 as long as it is incorporated in a mobile electronic device or the like and receives a thermal or mechanical external stress.

Further, in the above-described embodiment, the acceleration sensor 1 and the first and second LSI chips 8 and 10 which are semiconductor elements for controlling the acceleration sensor 1 are connected and mounted as the same package. Good. Further, the elements mounted on the same package may not be semiconductor elements that control them, and the first and second LSI chips 8 and 10 may not have a laminated structure.

Further, the above-described embodiments include inventions at various stages, and inventions at various stages can be extracted by appropriately combining a plurality of disclosed constituent elements or a plurality of processes. For example, even if some constituent requirements or some steps are deleted from all constituent requirements shown in the embodiment, the problem described in the column of the problem to be solved by the invention can be solved, and the effect of the invention When the effect described in the column is obtained, a configuration in which this configuration requirement or process is deleted can be extracted as an invention.

The schematic diagram which shows the structure of the package for microelectromechanical devices in the form of one Example of this invention. The schematic diagram which shows the structure of the package for microelectromechanical devices in the form of the other Example of this invention. The schematic diagram which shows the structure of the package for microelectromechanical devices in the form of another Example of this invention. The flowchart which shows the manufacturing method of the package for microelectromechanical devices in the form of one Example of this invention.

Explanation of symbols

1 Accelerometer
2a Movable part 2b Substrate
3 Bonding wire 4a, 4b Protective substrate 5a, 5b Protective cap 6 Bonding wire 7 Interposer substrate 8 First LSI chip 9 Bonding wire 10 Second LSI chip 11 Electrode 12 Plastic mold resin 13 Electrode 14 Electrode

Claims (16)

In a package for a microelectromechanical device that seals a microelectromechanical device having a movable part and a substrate on which the movable part is mounted with a mold means,
Mounting means for connecting and mounting the microelectromechanical device;
Installed between the microelectromechanical device and the mounting means, the substrate of the microelectromechanical device has a rigidity that is higher than the rigidity of the mold means in such a size that the substrate does not contact the mounting means; First protective means made of a material having a thermal conductivity coefficient equivalent to or smaller than that of the substrate of the microelectromechanical device;
A material that is installed on the first protection means, covers the micro electro mechanical device, has a rigidity higher than that of the mold means, and has a thermal conductivity coefficient equal to or smaller than that of the substrate of the micro electro mechanical device. A second protection means,
A package for a micro electro mechanical device, comprising: electrical connection means for electrically connecting the micro electro mechanical device and the mounting means. The package for a micro electro mechanical device according to claim 1, further comprising a semiconductor element connected to and mounted on the mounting means and controlling the micro electro mechanical device. 3. The package for a micro electro mechanical device according to claim 1, wherein the first protection means and the second protection means are made of a material containing silicon or aluminum. 4. The package for a micro electro mechanical device according to claim 1, wherein an electrical wiring is arranged in an inner layer of the first protection means. 5. The package for a micro electro mechanical device according to claim 1, wherein the mounting means has electric wiring arranged on a surface layer or an inner layer. In a micro electro mechanical package having a movable part and a substrate on which the movable part is mounted, and sealing a flip chip micro electro mechanical device with a molding means,
Mounting means for connecting and mounting the microelectromechanical device;
Installed between the microelectromechanical device and the mounting means, the substrate of the microelectromechanical device has a rigidity that is higher than the rigidity of the mold means in such a size that the substrate does not contact the mounting means; First protective means made of a material having a thermal conductivity coefficient equivalent to or smaller than that of the substrate of the microelectromechanical device;
A material that is installed on the first protection means, covers the micro electro mechanical device, has a rigidity higher than that of the mold means, and has a thermal conductivity coefficient equal to or smaller than that of the substrate of the micro electro mechanical device. A second protection means,
A package for a microelectromechanical device, comprising: first electrical connection means for electrically connecting the microelectromechanical device and the mounting means. 7. The micro electro mechanical package according to claim 6, further comprising a semiconductor element connected to and mounted on the mounting means and controlling the micro electro mechanical device. 8. The micro electro mechanical package according to claim 6, wherein the first protection means and the second protection means are made of a material containing silicon or aluminum. 9. The package for a micro electro mechanical device according to claim 6, wherein electrical wiring is arranged in an inner layer of the first protection means and the second protection means. The semiconductor element is further mounted on the second protection means, and further comprises a second electrical connection means for electrically connecting the semiconductor element and the second protection means. Item 15. The package for a microelectromechanical device according to Item 9. 11. The package for a micro electro mechanical device according to claim 6, wherein electrical wiring is arranged on a surface layer or an inner layer of the mounting means. A microelectromechanical device having a movable portion and a substrate on which the movable portion is mounted, and mounting means for connecting and mounting the microelectromechanical device;
It is installed between the microelectromechanical device and the mounting means, and has a size such that the substrate of the microelectromechanical device is not in contact with the mounting means, and is thermally and mechanically external to the movable part. A first protective means made of a material having rigidity for suppressing the transmission of stress and having a thermal conductivity coefficient;
A second protective means provided on the first protective means, covering the microelectromechanical device and made of a material equivalent to the first protective means;
A package for a micro electro mechanical device, comprising: electrical connection means for electrically connecting the micro electro mechanical device and the mounting means. The package for a micro electro mechanical device according to claim 12, further comprising a semiconductor element connected to and mounted on the mounting means and controlling the micro electro mechanical device. 14. The package for a micro electro mechanical device according to claim 12, wherein the mounting means has electric wiring arranged on a surface layer or an inner layer. In a method of manufacturing a package for a micro electro mechanical device, which seals a micro electro mechanical device having a movable portion and a substrate on which the movable portion is mounted with a molding means.
The micro electric machine has a rigidity higher than that of the mold means and has a rigidity that does not contact the substrate of the micro electromechanical device with the mounting means in which electric wiring is arranged on the surface layer or the inner layer. Bonding and mounting a first protection means made of a material having a thermal conductivity coefficient equal to or smaller than that of the substrate of the mechanical device;
Bonding and mounting the microelectromechanical device on the first protection means;
Electrically connecting the microelectromechanical device and the mounting means;
A second material made of a material that covers the micro electro mechanical device on the first protection means, has a rigidity higher than that of the mold means, and has a thermal conductivity coefficient equal to or smaller than that of the substrate of the micro electro mechanical device; Bonding and mounting the protection means of
A method of manufacturing a package for a micro-mechanical machine device, comprising: a step of sealing with a molding means on what is mounted on the mounting means. Before the sealing step, further comprising a step of bonding and mounting the semiconductor element for controlling the micro electro mechanical device to the mounting means, and a step of electrically connecting the semiconductor element and the mounting means in the previous period. The method for manufacturing a package for a micro-mechanical machine device according to claim 15,

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