CN211930872U - Bone voiceprint sensor and electronic device - Google Patents

Bone voiceprint sensor and electronic device Download PDF

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Publication number
CN211930872U
CN211930872U CN202020940717.5U CN202020940717U CN211930872U CN 211930872 U CN211930872 U CN 211930872U CN 202020940717 U CN202020940717 U CN 202020940717U CN 211930872 U CN211930872 U CN 211930872U
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sensor
vibration
elastic membrane
adjusting
shell
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CN202020940717.5U
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Chinese (zh)
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方华斌
付博
端木鲁玉
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Weifang Goertek Microelectronics Co Ltd
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Weifang Goertek Microelectronics Co Ltd
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Abstract

The utility model discloses a bone voiceprint sensor and electronic equipment. The bone voiceprint sensor includes: the sensor unit comprises a packaging shell and a sensor chip arranged in the packaging shell, and the packaging shell is provided with a sound hole; the vibration pickup unit comprises a vibration pickup shell, an elastic membrane arranged in the vibration pickup shell and a vibration adjusting piece arranged on the elastic membrane, the vibration pickup shell is arranged on the packaging shell, and the sound hole is communicated with the vibration pickup shell and the packaging shell; the vibration adjusting piece comprises an adjusting base part connected with the elastic membrane and an adjusting protruding part arranged on the surface of the adjusting base part, and the adjusting protruding part extends into the sound hole. In this way, the mass of the vibration adjusting member can be increased. Thereby being beneficial to improving the sensitivity of the bone vocal print sensor and improving the performance of the bone vocal print sensor.

Description

Bone voiceprint sensor and electronic device
Technical Field
The utility model relates to a sensor technical field, in particular to bone voiceprint sensor and electronic equipment.
Background
The bone voiceprint sensor collects sound signals and converts the sound signals into electric signals by utilizing slight vibration of bones of the head and the neck caused by speaking of a person. Because the microphone collects sound through air conduction, the microphone can transmit sound clearly in a very noisy environment. In many situations, such as fire scenes, firefighters with gas guards cannot speak directly into the microphone using their mouths, so a bone voiceprint sensor can be used at this time. With the development of electronic products, the application of the bone voiceprint sensor is more and more extensive.
In the related art, the bone voiceprint sensor generally comprises a vibration pickup unit and a sensor unit, wherein the vibration pickup unit is used for picking up external bone vibration signals and transmitting the bone vibration signals to the sensor unit; the sensor unit is used for converting the vibration signal into an electric signal.
The vibration pickup unit generally comprises a vibration pickup shell, an elastic membrane arranged in the vibration pickup shell, and a vibration adjusting piece (mass block) arranged on the elastic membrane, wherein the size of the vibration adjusting piece (mass block) can greatly influence the sensitivity of the bone voiceprint sensor.
SUMMERY OF THE UTILITY MODEL
The utility model aims at providing a bone vocal print sensor aims at improving bone vocal print sensor's sensitivity.
In order to achieve the above object, the utility model provides a bone acoustic line sensor, include:
the sensor unit comprises a packaging shell and a sensor chip arranged in the packaging shell, and the packaging shell is provided with a sound hole; and
the vibration pickup unit comprises a vibration pickup shell, an elastic membrane arranged in the vibration pickup shell and a vibration adjusting piece arranged on the elastic membrane, the vibration pickup shell is arranged on the packaging shell, and the sound hole is communicated with the vibration pickup shell and the packaging shell; the vibration adjusting piece comprises an adjusting base part connected with the elastic membrane and an adjusting protruding part arranged on the surface of the adjusting base part, and the adjusting protruding part extends into the sound hole.
Optionally, the sensor chip is disposed corresponding to the sound hole, and the adjusting protrusion extends into a front cavity of the sensor chip.
Optionally, a periphery of the acoustic aperture is flush with a periphery of a front cavity of the sensor chip; alternatively, the periphery of the acoustic hole is provided outside the periphery of the front cavity of the sensor chip.
Optionally, a projection of the adjusting protrusion on the elastic membrane has a first area, a projection of a peripheral wall of the front cavity of the sensor chip on the elastic membrane has a second area, and a ratio of the first area to the second area is greater than or equal to 0.1 and less than or equal to 0.99.
Optionally, a distance between the adjustment protrusion and the sensing film of the sensor chip is greater than or equal to 10 micrometers.
Optionally, the adjustment projection is provided in a middle of the adjustment base.
Optionally, the package housing includes a substrate, and the sound hole and the sensor chip are disposed on the substrate; the vibration pickup shell is mounted on the substrate.
Optionally, the sensor unit further includes an ASIC chip embedded in the substrate, the ASIC chip being electrically connected to the sensor chip.
Optionally, the vibration adjusting member is connected to the elastic membrane through a gel.
The utility model also provides an electronic equipment, include as above bone vocal print sensor.
The utility model discloses bone vocal print sensor has the regulation bulge that stretches into in the vocal hole through making the vibration regulating part, can promote space utilization to the quality (weight promptly) of increase vibration regulating part, thereby be favorable to improving bone vocal print sensor's sensitivity, with the performance that promotes bone vocal print sensor.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the structures shown in the drawings without creative efforts.
Fig. 1 is a schematic structural diagram of an embodiment of the bone voiceprint sensor of the present invention;
fig. 2 is a schematic structural diagram of another embodiment of the bone voiceprint sensor of the present invention.
The reference numbers illustrate:
reference numerals Name (R) Reference numerals Name (R)
100 Bone voiceprint sensor 211 Sound hole
10 Vibration pickup unit 212 Air release hole
11 Vibration pick-up shell 213 Substrate
12 Elastic film 214 Connecting plate
121 The first vent hole 2141 Electrical connection part
13 Vibration adjusting member 215 Boarding board
131 Adjusting base 22 Sensor chip
132 Regulating protrusion 221 Front cavity
133 Adjusting body 222 Induction film
134 Lateral projection 223 Second vent hole
20 Sensor unit 23 Electrical connector
21 Packaging shell 70 ASIC chip
The objects, features and advantages of the present invention will be further described with reference to the accompanying drawings.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.
It should be noted that if the embodiments of the present invention are described with reference to "first", "second", etc., the description of "first", "second", etc. is only for descriptive purposes and is not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature.
In addition, the meaning of "and/or" appearing throughout is to include three juxtapositions, exemplified by "A and/or B" including either scheme A, or scheme B, or a scheme in which both A and B are satisfied.
The utility model provides a bone voiceprint sensor and electronic equipment. The bone voiceprint sensor is used in an electronic device, which may be, but is not limited to, a headset, an earphone, a smart watch, a smart bracelet, a vehicle noise reduction device, a vibration sensing device, and other electronic devices known to those skilled in the art.
In an embodiment of the present invention, as shown in fig. 1, the bone voiceprint sensor 100 includes a vibration pickup unit 10 and a sensor unit 20, the vibration pickup unit 10 is connected to the sensor unit 20, that is, the vibration pickup unit 10 is combined with the sensor unit 20, the vibration pickup unit 10 is configured to pick up a bone vibration signal from the outside (such as a wearer, or other vibration sources, hereinafter, the description is given by taking the wearer as an example) to generate a response vibration signal, and transmit the response vibration signal to the sensor unit 20, and the sensor unit 20 is configured to convert the received vibration signal into an electrical signal. It is understood that, without loss of generality, a sealed vibration transmission air channel is formed between the vibration pickup unit 10 and the sensor unit 20, so that the response vibration signal is transmitted to the sensor unit 20 through the sealed vibration transmission air channel.
Further, as shown in fig. 1, the vibration pickup unit 10 includes a vibration pickup housing 11 and an elastic membrane 12 disposed inside the vibration pickup housing 11.
Specifically, the elastic membrane 12 is installed in the vibration pickup housing 11, and the vibration pickup housing 11 can protect the elastic membrane 12. The vibration pickup shell 11 can transmit bone vibration of a wearer speaker to the elastic membrane 12, and the elastic membrane 12 is used for picking up the bone vibration of the wearer speaker to vibrate so as to form a response vibration signal; the elastic membrane 12 drives the gas in the sealed vibration transmission air channel to vibrate when vibrating, so as to transmit a response vibration signal to the sensor unit 20 through the sealed vibration transmission air channel.
The elastic membrane 12 may be a membrane having elastic deformation capability, including but not limited to a plastic membrane, a paper membrane, a metal membrane, a biological membrane, and the like. Further, the elastic film 12 may have a single-layer structure or may have a multi-layer composite film. The elastic membrane 12 may be made of a single material or a composite material of different materials. And will not be described in detail herein.
Further, as shown in fig. 1, the vibration pickup unit 10 further includes a vibration adjusting member 13 provided on the elastic membrane 12.
In this way, the vibration adjuster 13 is used to adjust the vibration of the elastic membrane 12, so that the vibration of the elastic membrane 12 is better matched with the bone vibration signal of the wearer, and the sensitivity of the bone voiceprint sensor 100 can be improved. Moreover, the vibration adjusting member 13 vibrates along with the elastic membrane 12, so that the mass of the elastic membrane 12 can be increased when vibrating, and the interference of external factors (such as sound waves) can be effectively avoided.
Without loss of generality, the projection of the vibration adjusting member 13 on the elastic membrane 12 should be smaller than the elastic membrane 12, as shown in fig. 1.
Alternatively, the vibration adjusting member 13 may be bonded to the elastic membrane 12 by glue. Thus, the installation of the vibration adjusting member 13 can be made simple, convenient and firm.
Further, as shown in fig. 1, the sensor unit 20 includes a package housing 21 and a sensor chip 22 disposed in the package housing 21, the vibration pickup housing 11 is mounted on the package housing 21, a sound hole 211 is disposed on the package housing 21, and the sound hole 211 communicates the sensor unit 20 and the vibration pickup unit 10. Specifically, the sound hole 211 communicates the package housing 21 and the vibration pickup housing 11; it will be appreciated that the acoustic port 211 is used to form a sealed vibration-transmitting air path.
Specifically, the response vibration signal is transmitted into the package housing 21 through the sound hole 211, and is transmitted to the sensor chip 22, and the sensor chip 22 is configured to convert the received vibration signal into an electrical signal.
Specifically, as shown in fig. 1, the elastic membrane 12 divides the space in the vibration pickup housing 11 into a first cavity and a second cavity, and the first cavity and the second cavity are respectively located at two sides of the elastic membrane 12 (in the state shown in fig. 1, the first cavity is located at the upper side of the elastic membrane 12, and the second cavity is located at the lower side of the elastic membrane 12); wherein the second cavity is in communication with the sound aperture 211.
Specifically, pick up the casing 11 that shakes for the open casing that sets up of one end, the open end of picking up the casing 11 that shakes is installed in encapsulation casing 21, and encapsulation casing 21 shutoff is picked up the uncovered of casing 11 that shakes, and encapsulation casing 21 communicates through sound hole 211 with picking up the casing 11 that shakes. Thus, the structure can be simplified. Alternatively, the open end of the vibration pickup housing 11 may be glued to the package housing 21. Of course, the vibration pickup housing 11 may be provided in other structural forms, and need not be described in detail herein.
Further, as shown in fig. 1, the vibration adjusting member 13 includes an adjusting base 131 connected to the elastic membrane 12, and an adjusting protrusion 132 provided on a surface of the adjusting base 131, and the adjusting protrusion 132 protrudes into the sound hole 211. In this way, the mass of the vibration adjusting member 13 can be increased without changing or substantially changing the size of the bone voiceprint sensor 100, thereby facilitating the improvement of the sensitivity of the bone voiceprint sensor 100; and simultaneously, the space utilization rate can be improved.
It is understood that the vibration adjusting member 13 is provided on the side of the elastic membrane 12 facing the sound hole 211.
Specifically, the adjusting protrusion 132 further extends into the package housing 21. In this way, the mass of the vibration adjusting member 13 can be further increased.
Further, as shown in fig. 1, the sensor chip 22 is disposed corresponding to the sound hole 211, and the adjustment protrusion 132 protrudes into the front cavity 221 of the sensor chip 22. Specifically, the front cavity 221 of the sensor chip 22 is arranged corresponding to the sound hole 211 and is communicated with the sound hole 211; the adjustment projection 132 projects through the sound opening 211 into the front space 221 of the sensor chip 22.
In this way, the accuracy of the sensor chip 22 can be improved.
Further, it is understood that in order to further increase the mass of the vibration adjusting member 13, the size of the adjusting protrusion 132 may be increased, and thus, the sound hole 211 needs to be enlarged. That is, by enlarging the sound hole 211, it is possible to accommodate the larger-sized regulating protrusion 132 so as to further increase the mass of the vibration adjusting member 13; meanwhile, since the acoustic hole 211 is enlarged, the influence of the front cavity 221 of the sensor chip 22 on the high frequency can be reduced, so that the high frequency is flatter, and the reliability of the bone voiceprint sensor 100 can be improved. In other words, the present invention can enlarge the acoustic hole 211 to reduce the influence of the front cavity 221 of the sensor chip 22 on the high frequency, so that the high frequency is flatter, thereby improving the reliability of the bone voiceprint sensor 100.
Specifically, as shown in fig. 1, the periphery of the sound hole 211 may be flush with the periphery of the front cavity 221 of the sensor chip 22; alternatively, the periphery of the acoustic hole 211 is provided outside the periphery of the front cavity 221 of the sensor chip 22. In this way, the sound hole 211 can be prevented from interfering with the adjustment protrusion 132, so as to further increase the size of the adjustment protrusion 132 to increase the mass of the vibration adjuster 13, thereby reducing the influence of the front cavity 221 of the sensor chip 22 on the high frequency, making the high frequency flatter, and improving the reliability of the bone voiceprint sensor 100.
Further, the projection of the adjusting protrusion 132 on the elastic membrane 12 has a first area, and the projection of the peripheral wall of the front cavity 221 of the sensor chip 22 on the elastic membrane 12 has a second area, and the ratio of the first area to the second area is greater than or equal to 0.1 and less than or equal to 0.99.
Optionally, a ratio of the first area to the second area is greater than or equal to 0.5 and less than or equal to 0.9.
Optionally, a ratio of the first area to the second area is greater than or equal to 0.6 and less than or equal to 0.8.
Optionally, a ratio of the first area to the second area is greater than or equal to 0.65 and less than or equal to 0.75.
It is understood that the specification of the sensor chip 22 is generally constant, and the larger the ratio of the first area to the second area is, the more beneficial the mass of the vibration adjusting member 13 is; however, if the ratio is too large, the adjustment protrusion 132 may interfere with the peripheral wall of the front cavity 221 of the sensor chip 22 during vibration, thereby affecting the performance of the bone voiceprint sensor 100. Of course, the magnitude of the ratio will also affect the performance of the sensor chip 22 by the amount of gas in the front cavity 221 of the sensor chip 22; therefore, in practical applications, the ratio of the first area to the second area can be designed according to practical situations.
Further, the distance between the adjustment protrusion 132 and the sensing film 222 of the sensor chip 22 is greater than or equal to 10 micrometers.
Alternatively, the distance between the adjusting protrusion 132 and the sensing film 222 of the sensor chip 22 may be 12 microns, 15 microns, 17 microns, 20 microns, 23 microns, 25 microns, or the like, or even larger.
It is understood that the specification of the sensor chip 22 is generally certain, and the smaller the distance between the adjusting protrusion 132 and the sensing film 222 of the sensor chip 22 is, the more beneficial the mass of the vibration adjuster 13 is; however, if the distance is too small, the adjustment protrusion 132 may interfere with the sensing film 222 of the sensor chip 22 during vibration, thereby affecting the performance of the bone voiceprint sensor 100. Of course, the size of the gap also affects the amount of gas in the front cavity 221 of the sensor chip 22, thereby affecting the performance of the sensor chip 22; therefore, in practical applications, the distance between the adjusting protrusion 132 and the sensing film 222 can be designed according to practical situations.
It should be noted that, in practical applications, the ratio of the first area to the second area and the distance between the adjusting protrusion 132 and the sensing film 222 of the sensor chip 22 can be designed according to practical situations, so as to not only increase the mass of the vibration adjusting member 13 to a greater extent, but also ensure/improve the performance of the sensor chip 22, and avoid the interference of the vibration of the adjusting protrusion 132 in the front cavity 221.
Further, as shown in fig. 2, the regulating protrusion 132 is provided at the middle of the regulating base 131. In this way, the elastic membrane 12 can be stressed more uniformly during the vibration process, so as to reduce the risk of cracking; at the same time, the stability of the vibration of the elastic membrane 12 can be improved to improve the performance of the bone voiceprint sensor 100. For example, such as: the adjusting base 131 is cylindrical, the adjusting protrusion 132 is cylindrical, and the projections of the adjusting base 131 and the adjusting protrusion 132 on the elastic membrane 12 are concentrically arranged; alternatively, the adjusting base 131 is in an elliptic cylinder shape, the adjusting protrusion 132 is in an elliptic cylinder shape, and the projections of the adjusting base 131 and the adjusting protrusion 132 on the elastic membrane 12 are concentrically arranged; or, the cross section of the adjusting base 131 is square, the cross section of the adjusting protrusion 132 is square, and the adjusting base 131 and the projection of the adjusting protrusion 132 on the elastic membrane 12 are concentrically arranged; and so on.
In order to further increase the mass of the vibration adjusting member 13, in another embodiment of the present invention, as shown in fig. 2, it is possible to make: the vibration adjusting piece 13 comprises an adjusting base 131 connected with the elastic membrane 12 and an adjusting protrusion 132 arranged on the surface of the adjusting base 131, the adjusting base 131 comprises an adjusting body 133 connected with the elastic membrane 12 and a lateral protrusion 134 arranged on the side surface of the adjusting body 133, and a clearance is formed between the lateral protrusion 134 and the elastic membrane 12; the regulating projection 132 projects from the sound hole 211 into the package housing 21. Specifically, the lateral protrusion 134 faces the side of the elastic membrane 12, and forms a clearance with the surface of the elastic membrane 12. When the elastic membrane vibrates, the magnitude of the avoiding interval can change along with the vibration of the elastic membrane.
In this way, by providing the adjustment base 131 with the adjustment body 133 connected to the elastic membrane 12 and the lateral protrusion 134 provided on the side surface of the adjustment body 133, the space inside the vibration pickup housing 11 can be effectively utilized to increase the mass of the vibration adjusting piece 13 without increasing the connection area of the vibration adjusting piece 13 and the elastic membrane 12, so that the sensitivity of the bone voiceprint sensor 100 can be improved to improve the performance of the bone voiceprint sensor 100; and facilitates a compact design of the bone voiceprint sensor 100.
Further, as shown in fig. 1, the package housing 21 and/or the vibration pickup housing 11 are provided with air release holes 212, and the air release holes 212 are used for releasing air when assembling the vibration pickup unit 10 and the sensor unit 20. In particular, the bleed hole 212 communicates with the external environment. Thus, by providing the air release hole 212, when assembling the vibration pickup unit 10 and the sensor unit 20, the failure of the vibration pickup unit 10 or the sensor chip 22 due to the air pressure difference between the inner space and the outer space of the package housing 21 or the vibration pickup housing 11 can be avoided, so that the difficulty in assembling the bone-vocal print sensor 100 can be reduced.
However, when the bone voiceprint sensor 100 is applied, i.e., applied to an electronic device, the air release hole 212 needs to be blocked so as not to affect the performance of the bone voiceprint sensor 100. Alternatively, the air release hole 212 may be blocked by a sealant, an adhesive tape, or a sealing plug.
It should be noted that, if the air release hole 212 is disposed in the vibration pickup housing 11, optionally, the air release hole 212 is communicated with the first cavity, for example, the air release hole 212 is disposed on the top of the vibration pickup housing 11; optionally, the air relief hole 212 is an annular hole.
If the air release hole 212 is disposed on the package housing 21, it should be noted that, compared to disposing the air release hole 212 on the vibration pickup housing 11, the air release hole 212 disposed on the package housing 21 does not need to form a hole on the vibration pickup housing 11, so that the vibration pickup area of the vibration pickup housing 11 is not reduced, thereby being beneficial to improving the performance of the bone acoustic streak sensor 100.
Further, as shown in fig. 1, the package housing 21 further includes a substrate 213, and the sound hole 211 and the sensor chip 22 are disposed on the substrate 213; the vibration pickup housing 11 is mounted on the substrate 213. Specifically, the open end of the vibration pickup housing 11 is mounted on the substrate 213. Thus, the structure can be simplified.
Without loss of generality, as shown in fig. 1, the sensor unit 20 further includes an ASIC (application Specific Integrated circuit) chip 70 disposed in the package housing 21, and the ASIC chip 70 is electrically connected to the sensor chip 22 to process an electrical signal generated by the sensor chip 22.
Specifically, the ASIC chip 70 may be provided on the surface of the substrate 213, or the ASIC chip 70 may be embedded in the substrate 213. It is noted that embedding the ASIC chip 70 in the substrate 213 facilitates assembly of the bone voiceprint sensor 100.
Specifically, the substrate 213 is a circuit board, such as a PCB, and the ASIC chip 70 is electrically connected to the substrate 213.
Further, as shown in fig. 1, the package housing 21 includes a connection board 214, the connection board 214 is disposed opposite to the substrate 213, and the connection board 214 is configured to be mounted on a main control board of the electronic device.
Specifically, the electronic device includes an electronic control board on which the bone voiceprint sensor 100 can be mounted when the bone voiceprint sensor 100 is applied to the electronic device. Specifically, the connection board 214 of the package housing 21 is mounted on the main control board, and optionally, the connection board 214 is attached to the surface of the main control board.
Optionally, as shown in fig. 1, an electrical connection portion 2141 for electrically connecting with an external circuit (i.e., a circuit of the electronic device) is disposed on the connection board 214, and the electrical connection portion 2141 is electrically connected with the substrate 213 to electrically connect with the ASIC chip 70 and the sensor chip 22.
As such, when the connection board 214 is mounted on the electronic control board, the electrical connection portions 2141 may be electrically connected with the electronic control board to electrically connect the sensor chip 22 with an external circuit (i.e., a circuit of the electronic device).
Optionally, as shown in fig. 1, the package housing 21 further includes a surrounding plate 215 disposed on the periphery of the base plate 213, the surrounding plate 215 forms an opening at an end far from the base plate 213, and the connecting plate 214 is connected to the opening.
Optionally, the sensor unit 20 further includes an electrical connector 23, and the electrical connector 23 electrically connects the substrate 213 and the electrical connector 2141. Optionally, the electrical connector 23 is embedded in the enclosure 215.
It should be noted that, if the air release hole 212 is provided on the package housing 21, optionally, the air release hole 212 is provided on the connecting plate 214. Thus, by arranging the air release hole 212 on the connecting plate 214, when the bone voiceprint sensor 100 is mounted (e.g., mounted) on the main control plate, the air release hole 212 can be blocked by the original procedure of filling glue, so that the field application procedure can be simplified, and the production cost can be reduced.
Alternatively, as shown in fig. 1, the elastic membrane 12 and the vibration adjusting member 13 are provided with a first vent hole 121.
Optionally, as shown in fig. 1, a second vent hole 223 is formed on the sensing film 222 of the sensor chip 22.
Alternatively, the sensor chip 22 may be a microphone chip or a pressure sensor chip 22. That is, the sensor unit 20 may employ a MEMS microphone or a MEMS pressure sensor, so that the difficulty of designing the bone voiceprint sensor 100 can be reduced.
The above is only the optional embodiment of the present invention, and not therefore the limit to the patent scope of the present invention, all the concepts of the present invention utilize the equivalent structure transformation of the content of the specification and the attached drawings, or the direct/indirect application in other related technical fields is included in the patent protection scope of the present invention.

Claims (10)

1. A bone voiceprint sensor, the bone voiceprint sensor comprising:
the sensor unit comprises a packaging shell and a sensor chip arranged in the packaging shell, and the packaging shell is provided with a sound hole; and
the vibration pickup unit comprises a vibration pickup shell, an elastic membrane arranged in the vibration pickup shell and a vibration adjusting piece arranged on the elastic membrane, the vibration pickup shell is arranged on the packaging shell, and the sound hole is communicated with the vibration pickup shell and the packaging shell; the vibration adjusting piece comprises an adjusting base part connected with the elastic membrane and an adjusting protruding part arranged on the surface of the adjusting base part, and the adjusting protruding part extends into the sound hole.
2. The bone voiceprint sensor of claim 1 wherein said sensor chip is disposed in correspondence with said vocal hole, said adjustment protrusion extending into an anterior cavity of said sensor chip.
3. The bone voiceprint sensor of claim 2 wherein a periphery of the vocal hole is flush with a periphery of the anterior chamber of the sensor chip; alternatively, the periphery of the acoustic hole is provided outside the periphery of the front cavity of the sensor chip.
4. The bone voiceprint sensor of claim 2 wherein a projection of the adjustment protrusion on the elastic membrane has a first area, a projection of a peripheral wall of the front cavity of the sensor chip on the elastic membrane has a second area, and a ratio of the first area to the second area is greater than or equal to 0.1 and less than or equal to 0.99.
5. The bone voiceprint sensor of claim 2 wherein the spacing between the adjustment tab and the sensing membrane of the sensor chip is greater than or equal to 10 microns.
6. The bone voiceprint sensor of any one of claims 1 to 5 wherein said adjustment projection is provided in the middle of said adjustment base.
7. The bone voiceprint sensor of any one of claims 1 to 5 wherein said package housing comprises a substrate, said sound aperture and said sensor chip being provided on said substrate; the vibration pickup shell is mounted on the substrate.
8. The bone voiceprint sensor of claim 7 wherein said sensor unit further comprises an ASIC chip embedded within a substrate, said ASIC chip being electrically connected to said sensor chip.
9. The bone voiceprint sensor of any one of claims 1 to 5 wherein the vibration modulation member is connected to the elastic membrane by a gel.
10. An electronic device characterized by comprising a bone voiceprint sensor according to any one of claims 1 to 9.
CN202020940717.5U 2020-05-27 2020-05-27 Bone voiceprint sensor and electronic device Active CN211930872U (en)

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Application Number Priority Date Filing Date Title
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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113259795A (en) * 2021-04-26 2021-08-13 歌尔微电子股份有限公司 Bone voiceprint sensor, manufacturing method thereof and electronic device
US20210364346A1 (en) * 2020-03-25 2021-11-25 Merry Electronics Co., Ltd. Vibration sensor
RU2818792C1 (en) * 2020-12-28 2024-05-06 Шэньчжэнь Шокз Ко., Лтд. Vibration sensors

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20210364346A1 (en) * 2020-03-25 2021-11-25 Merry Electronics Co., Ltd. Vibration sensor
US11619544B2 (en) * 2020-03-25 2023-04-04 Merry Electronics Co., Ltd. Vibration sensor having vent for pressure enhancing member
RU2818792C1 (en) * 2020-12-28 2024-05-06 Шэньчжэнь Шокз Ко., Лтд. Vibration sensors
CN113259795A (en) * 2021-04-26 2021-08-13 歌尔微电子股份有限公司 Bone voiceprint sensor, manufacturing method thereof and electronic device
CN113259795B (en) * 2021-04-26 2022-11-29 歌尔微电子股份有限公司 Bone voiceprint sensor, manufacturing method thereof and electronic device

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