CN213280084U - Bone voiceprint sensor and electronic device - Google Patents

Bone voiceprint sensor and electronic device Download PDF

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Publication number
CN213280084U
CN213280084U CN202022416016.4U CN202022416016U CN213280084U CN 213280084 U CN213280084 U CN 213280084U CN 202022416016 U CN202022416016 U CN 202022416016U CN 213280084 U CN213280084 U CN 213280084U
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vibration
diaphragm
vibrating diaphragm
damper
sensor
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方华斌
端木鲁玉
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Goertek Microelectronics Inc
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Goertek Microelectronics Inc
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Abstract

The utility model discloses a bone vocal print sensor and electronic equipment, bone vocal print sensor is including picking up unit and the sensor unit that shakes, it shakes the unit to pick up: a vibration pick-up housing; the vibrating diaphragm is arranged in the vibration pick-up shell, and the periphery of the vibrating diaphragm is arranged on the side wall of the vibration pick-up shell; the vibration adjusting piece is arranged on the vibrating diaphragm; and the vibration damping is arranged on the vibrating diaphragm. So, through setting up vibration damping on the vibrating diaphragm, can utilize vibration damping's damping characteristic, the frequency response characteristic of adjustment vibrating diaphragm to can suppress peak sensitivity, improve bone vocal print sensor's frequency response characteristic, enlarge bone vocal print sensor's working bandwidth width, promote product property and produce the property.

Description

Bone voiceprint sensor and electronic device
Technical Field
The utility model relates to a sensor technical field, in particular to bone voiceprint sensor and electronic equipment.
Background
The bone voiceprint sensor collects sound signals and converts the sound signals into electric signals by utilizing slight vibration of bones of the head and the neck caused by speaking of a person. Because the microphone collects sound through air conduction, the microphone can transmit sound clearly in a very noisy environment. In many situations, such as fire scenes, firefighters with gas guards cannot speak directly into the microphone using their mouths, so a bone voiceprint sensor can be used at this time. With the development of electronic products, the application of the bone voiceprint sensor is more and more extensive.
In the related art, the bone voiceprint sensor generally comprises a vibration pickup unit and a sensor unit, wherein the vibration pickup unit is used for picking up external bone vibration signals and transmitting the bone vibration signals to the sensor unit; the sensor unit is used for converting the vibration signal into an electric signal.
The vibration pickup unit generally includes a vibration pickup housing, a diaphragm disposed in the vibration pickup housing, and a vibration adjusting member (i.e., a mass block) disposed on the diaphragm, such that the vibration of the diaphragm is used to pick up the bone vibration. However, the bone voiceprint sensor which vibrates by means of the diaphragm has the disadvantages that the frequency bandwidth is difficult to adjust and the application of products is not facilitated.
SUMMERY OF THE UTILITY MODEL
The utility model aims at providing a bone vocal print sensor to in solving the correlation technique, the difficult technical problem who adjusts of frequency bandwidth of bone vocal print sensor.
In order to achieve the above object, the utility model provides a bone vocal print sensor, bone vocal print sensor is including picking up the unit and the sensor unit that shakes, it shakes the unit to pick up:
a vibration pick-up housing;
the vibrating diaphragm is arranged in the vibration pick-up shell, and the periphery of the vibrating diaphragm is arranged on the side wall of the vibration pick-up shell;
the vibration adjusting piece is arranged on the vibrating diaphragm; and
and the vibration damping is arranged on the vibrating diaphragm.
Optionally, the vibration damping is provided between the vibration adjustment member and a side wall of the vibration pickup housing.
Optionally, the vibration damping and vibration adjusting member is disposed on the first surface of the diaphragm; alternatively, the first and second electrodes may be,
the vibration damping and the vibration adjusting member are arranged on the second surface of the vibrating diaphragm
Optionally, the vibration damping is an annular structure.
Optionally, the vibration damping is provided on a surface of the diaphragm to form a damping layer.
Optionally, the damping layer is disposed between the diaphragm and the vibration adjusting member.
Optionally, a mounting hole is formed in the middle of the diaphragm, the vibration adjusting part is arranged in the mounting hole, and the periphery of the mounting hole is connected to the peripheral wall of the vibration adjusting part; the vibration damper comprises a first damper, and the first damper is arranged on the first surface of the vibrating diaphragm and is positioned between the vibration adjusting piece and the side wall of the vibration pickup shell; and/or the vibration damper comprises a second damper, and the second damper is arranged on the second surface of the vibrating diaphragm and is positioned between the vibration adjusting piece and the side wall of the vibration pickup shell;
alternatively, the first and second electrodes may be,
the vibration adjusting piece comprises a first adjusting piece arranged on the first surface of the vibrating diaphragm and a second adjusting piece arranged on the second surface of the vibrating diaphragm; the vibration damper comprises a third damper, and the third damper is arranged on the first surface of the vibrating diaphragm and is positioned between the first adjusting piece and the side wall of the vibration pickup shell; and/or the vibration damper comprises a fourth damper, and the fourth damper is arranged on the second surface of the vibrating diaphragm and is positioned between the second adjusting piece and the side wall of the vibration pickup shell.
Optionally, the vibration damping material is silica gel or UV gel.
Optionally, the vibration damping is damping glue; and/or the presence of a gas in the gas,
the vibration damping has an elastic modulus of greater than or equal to 1 MPa and less than or equal to 1000 MPa.
Optionally, the sensor unit includes a package housing and a sensor chip disposed in the package housing, the vibration pickup housing is mounted in the package housing, and a vibration transmission hole communicating the vibration pickup housing with the package housing is formed in the package housing.
The utility model also provides an electronic equipment, a serial communication port, include as above bone vocal print sensor.
The utility model discloses in, through setting up vibration damping on the vibrating diaphragm, can utilize vibration damping's damping characteristic, the frequency response characteristic of adjustment vibrating diaphragm to can suppress peak sensitivity, improve bone voiceprint sensor's frequency response characteristic, enlarge bone voiceprint sensor's work bandwidth width, promote product property ability.
In addition, the working bandwidth, the peak sensitivity and the like of the bone voiceprint sensor can be adjusted by adjusting the volume (such as the length, the width, the height and the like) and/or the material, the elastic modulus and the like of the vibration damping, so that the adaptability of the bone voiceprint sensor is improved.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the structures shown in the drawings without creative efforts.
Fig. 1 is a schematic structural diagram of an embodiment of the bone voiceprint sensor of the present invention;
FIG. 2 is a graph of sensitivity versus vibration frequency for the bone voiceprint sensor of FIG. 1;
fig. 3 is a schematic structural diagram of another embodiment of the bone voiceprint sensor according to the present invention;
fig. 4 is a schematic structural diagram of another embodiment of the bone voiceprint sensor according to the present invention;
fig. 5 is a partial enlarged view of fig. 4 at D.
The reference numbers illustrate:
Figure BDA0002744686570000031
Figure BDA0002744686570000041
the objects, features and advantages of the present invention will be further described with reference to the accompanying drawings.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.
It should be noted that, if directional indications (such as upper, lower, left, right, front and rear … …) are involved in the embodiment of the present invention, the directional indications are only used to explain the relative position relationship between the components, the motion situation, etc. in a specific posture (as shown in the drawings), and if the specific posture is changed, the directional indications are changed accordingly.
In addition, if there is a description relating to "first", "second", etc. in the embodiments of the present invention, the description of "first", "second", etc. is for descriptive purposes only and is not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In addition, the meaning of "and/or" appearing throughout is to include three juxtapositions, exemplified by "A and/or B" including either scheme A, or scheme B, or a scheme in which both A and B are satisfied. In addition, the technical solutions in the embodiments may be combined with each other, but it must be based on the realization of those skilled in the art, and when the technical solutions are contradictory or cannot be realized, the combination of the technical solutions should not be considered to exist, and is not within the protection scope of the present invention.
The utility model provides a bone voiceprint sensor and electronic equipment. The bone voiceprint sensor is used in an electronic device, which may be, but is not limited to, a headset, an earphone, a smart watch, a smart bracelet, a vehicle noise reduction device, a vibration sensing device, and other electronic devices known to those skilled in the art.
In the embodiment of the present invention, as shown in fig. 1, 3 and 4, the bone voiceprint sensor 100 includes a vibration pickup unit 10 and a sensor unit 20, the vibration pickup unit 10 is connected to the sensor unit 20, that is, the vibration pickup unit 10 is combined with the sensor unit 20, the vibration pickup unit 10 is used for picking up bone vibration from the outside (such as a wearer or other vibration sources, hereinafter, explained by taking the wearer as an example) to generate a vibration signal and transmit the vibration signal to the sensor unit 20, and the sensor unit 20 is used for converting the received vibration signal into an electrical signal. It is understood that, without loss of generality, a sealed vibration transmission air channel is formed between the vibration pickup unit 10 and the sensor unit 20 to realize the transmission of vibration.
Further, as shown in fig. 1, 3 and 4, the vibration pickup unit 10 picks up the vibration housing 11, the diaphragm 12, the vibration adjusting member 13 and the vibration damper 14.
Wherein, the vibrating diaphragm 12 is arranged in the vibration pickup shell 11, and the periphery of the vibrating diaphragm 12 is installed on the side wall of the vibration pickup shell 11, the vibrating diaphragm 12 separates the space in the vibration pickup shell 11 into a first cavity 15 and a second cavity 16, and the first cavity 15 and the second cavity 16 are respectively located on two sides of the vibrating diaphragm 12 (in the state shown in fig. 1, the first cavity 15 is located on the lower side of the vibrating diaphragm 12, and the second cavity 16 is located on the upper side of the vibrating diaphragm 12).
Specifically, the vibration pickup shell 11 can protect the vibrating diaphragm 12; the vibration pickup shell 11 can transmit bone vibration of a wearer when speaking to the vibrating diaphragm 12, and the vibrating diaphragm 12 is used for picking up the bone vibration of the wearer when speaking to vibrate so as to generate a response vibration signal; the vibrating diaphragm 12, when vibrating, drives the gas in the sealed vibration transmitting air channel to vibrate, so as to transmit the response vibration signal to the sensor unit 20 through the sealed vibration transmitting air channel.
In application, the diaphragm 12 may be a diaphragm having elastic deformation capability, including but not limited to a plastic diaphragm, a paper diaphragm, a metal diaphragm, a biological diaphragm, and the like. Moreover, the diaphragm 12 may have a single-layer structure, or may have a multi-layer composite diaphragm. The diaphragm 12 may be made of a single material or may be made of a composite material of different materials. And will not be described in detail herein.
Wherein the vibration adjusting member 13 is provided on the diaphragm 12.
Thus, the vibration adjusting part 13 can adjust the vibration of the vibrating diaphragm 12, so that the vibration of the vibrating diaphragm 12 is better matched with the bone vibration signal of the wearer, and the sensitivity of the bone voiceprint sensor 100 can be improved. Moreover, the vibration adjusting member 13 vibrates along with the diaphragm 12, so that the mass of the diaphragm 12 can be increased when vibrating, and the interference of external factors (such as sound waves) can be effectively avoided.
Wherein the vibration damper 14 is arranged on the diaphragm 12.
Therefore, by arranging the vibration damper 14 on the vibrating diaphragm 12, the frequency response characteristic of the vibrating diaphragm 12 can be adjusted by utilizing the damping characteristic of the vibration damper 14, so that the peak sensitivity can be suppressed, the frequency response characteristic of the bone voiceprint sensor 100 can be improved, the working bandwidth width of the bone voiceprint sensor 100 can be enlarged, and the product performance can be improved.
Moreover, the adjustment of the working bandwidth and the peak sensitivity of the bone voiceprint sensor 100 can be realized by adjusting the volume (such as the length, the width, the height, and the like) and/or the material, and/or the elastic modulus, and the like of the vibration damper 14, so as to improve the adaptability of the bone voiceprint sensor 100.
Specifically, as shown in fig. 1, the vibration pickup unit 10 further includes a mounting ring 17, the mounting ring 17 is mounted on a sidewall of the vibration pickup housing 11, and a periphery of the diaphragm 12 is connected to the mounting ring 17. Optionally, the side walls of the vibration pickup housing 11 include a first side wall and a second side wall, and the mounting ring 17 is mounted between the first side wall and the second side wall.
Optionally, the vibration adjusting member 13 is a mass.
Optionally, the sensor chip may be a microphone chip or a pressure sensor chip, that is, the sensor unit may employ a MEMS microphone or a MEMS pressure sensor, so that the design difficulty of the bone voiceprint sensor module 100 may be reduced.
In a specific embodiment, the vibration adjusting part 13 may be disposed on a surface (e.g., an upper surface or a lower surface in fig. 1) of the diaphragm 12; or a mounting hole may be formed in the middle of the diaphragm 12, so that the vibration adjusting member 13 is disposed in the mounting hole, and the periphery of the mounting hole is connected to the peripheral wall of the vibration adjusting member 13; it is also possible to provide the vibration adjusting member 13 in two and on both surfaces of the diaphragm 12, respectively. The position of the vibration damper 14 can be designed according to the position of the vibration adjuster 13, and will be described below by way of example.
Without loss of generality, the projection of the vibration adjusting member 13 on the diaphragm 12 should be smaller than the diaphragm 12, as shown in fig. 1.
Specifically, the vibration adjusting member 13 is disposed on the surface of the diaphragm 12 to simplify the structure. Alternatively, the vibration adjusting member 13 may be bonded to the diaphragm 12 (i.e., the surface of the diaphragm 12) by glue. Thus, the installation of the vibration adjusting member 13 can be made simple, convenient and firm.
Further, as shown in fig. 1, the vibration damper 14 is provided between the vibration adjusting member 13 and the side wall of the vibration pickup housing 11. In this way, the vibration damping 14 can be made to perform a better damping function.
Further, as shown in fig. 1, the vibration damper 14 and the vibration adjusting member 13 are provided on a first surface (i.e., an upper surface in fig. 1) of the diaphragm 12. Optionally, the vibration damper 14 connects the vibration adjusting member 13 to the side wall of the vibration pickup housing 11.
Further, the vibration damper 14 is of an annular configuration. In this way, the uniformity of the distribution of the vibration damping 14 can be improved to improve the vibration stability of the diaphragm 12. Of course, the vibration dampers 14 may be distributed at intervals (uniformly) in the circumferential direction of the vibration adjusting member 13.
Further, the vibration damper 14 is a damping glue. The damping rubber has the advantages of convenient material selection, low cost and good damping characteristic. Specifically, the vibration damper 14 may be made of silica gel or UV gel.
Specifically, a glue may be applied (e.g., spot-coated, etc.) to a first surface of diaphragm 12 to form vibration damper 14.
Further, the elastic modulus of the vibration damper 14 is greater than or equal to 1 mpa and less than or equal to 1000 mpa. Thus, the working bandwidth and the peak sensitivity of the bone voiceprint sensor 100 can be adjusted by selecting the elastic modulus of the vibration damper 14, so as to improve the applicability of the bone voiceprint sensor 100. Alternatively, the elastic modulus of the vibration damper 14 may be made greater than or equal to 5 mpa and less than or equal to 800 mpa. More alternatively, the elastic modulus of the vibration damper 14 may be made greater than or equal to 10 mpa and less than or equal to 500 mpa. More alternatively, the elastic modulus of the vibration damper 14 may be made greater than or equal to 80 mpa and less than or equal to 300 mpa. And so on.
Further, as shown in fig. 1, the sensor unit 20 includes a package housing 21 and a sensor chip 22 disposed in the package housing 21, the vibration pickup housing 11 is mounted on the package housing 21, and a vibration transmission hole 211 communicating the vibration pickup housing 11 and the package housing 21 is formed on the package housing 21.
Specifically, as shown in fig. 1, the package housing 21 includes a surrounding plate 215 with two open ends, and a substrate 213 and a connecting plate 214 respectively disposed at two ends of the surrounding plate 215, the sensor chip 22 is disposed on the substrate 213, the vibration transmission hole 211 is disposed on the substrate 213, and the vibration transmission hole 211 is communicated with the back cavity 221 of the sensor chip 22.
The connection board 214 is disposed opposite to the substrate 213, and the connection board 214 is used for being mounted on an electronic control board of an electronic device. Specifically, the electronic device includes an electronic control board, and when the bone voiceprint sensor 100 is applied to the electronic device, the connecting board 214 of the package housing 21 is mounted (e.g., attached) to the electronic control board, so that the bone voiceprint sensor 100 is mounted on the electronic control board.
Specifically, the vibration pickup shell 11 is a shell with an open end, the open end of the vibration pickup shell 11 is installed on the other surface of the substrate 213, and the vibration transmission hole 211 is communicated with the first cavity 15. The first cavity 15, the vibration transmission hole 211, the back cavity 221 of the sensor chip 22, and the like form a sealed vibration transmission channel.
Further, as shown in fig. 1, the sensor unit 20 further includes an ASIC (application Specific Integrated circuit) chip disposed in the package housing 21, and the ASIC chip 23 is electrically connected to the sensor chip 22 to process an electrical signal generated by the sensor chip 22.
Specifically, in operation, external bone vibration is transmitted to the diaphragm 12 through the vibration pickup housing 11, so that the diaphragm 12 vibrates, and thus the gas in the first cavity 15, the vibration hole 211 and the back cavity 221 of the sensor chip 22 is driven to vibrate, so that vibration is transmitted to the sensor chip 22 (i.e. the sensing film 222 of the sensor chip 22 is vibrated), and thus the sensor chip 22 generates an electrical signal, and the ASIC chip 23 processes the electrical signal generated by the sensor chip 22.
Specifically, the ASIC chip 23 may be provided on the surface of the substrate 213, or may be embedded in the substrate 213.
Specifically, the substrate 213 is a circuit board, such as a PCB, and the ASIC chip 23 is electrically connected to the substrate 213.
Optionally, as shown in fig. 1, the connection board 214 is provided with an electrical connection portion 212 for electrically connecting with an external circuit (i.e., an electronic control board of an electronic device), the sensor unit 20 further includes an electrical connection member 24 embedded in the enclosure 215, and the electrical connection member 24 electrically connects the substrate 213 and the electrical connection portion 212 to achieve connection with the external circuit.
Of course, in other embodiments, the sensor unit 20 may be designed in other structural forms, for example, the substrate 213 in the above embodiment may be directly configured as an electronic control board of an electronic device, the surrounding board 215 and the connecting board 214 in the above embodiment are configured as an integrally configured shell body, the ASIC chip 23, the sensor chip 22, the vibration transmission hole 211, and the like are configured on the substrate 213, and the open end of the vibration pickup shell 11 is mounted on the other surface of the substrate 213.
In another embodiment of the present invention, the difference is mainly that, as shown in fig. 2, the vibration damper 14 and the vibration adjuster 13 are disposed on the second surface (i.e., the lower surface in fig. 2) of the diaphragm 12.
In a further embodiment of the present invention, the difference is mainly that, as shown in fig. 3 and 4, the vibration damper 14 is provided on the surface of the diaphragm 12 to form a damping layer.
As described above, by providing the damping layer on the surface of the diaphragm 12 to form the composite film, the damping characteristic of the vibration damper 14 is exhibited, and the vibration stability of the diaphragm 12 can be improved.
In this embodiment, a liquid glue may be sprayed onto the diaphragm 12 to form the damping layer.
In this embodiment, it is possible to provide a damping layer between the diaphragm 12 and the vibration adjusting member 13; it is also possible to provide a damping layer on the surface of the diaphragm 12 facing away from the vibration adjusting member 13; it is even possible to provide the damping layer with two layers, one on each surface of the diaphragm 12.
In another embodiment of the present invention, the difference is mainly that a mounting hole is formed in the middle of the diaphragm, the vibration adjusting member is disposed in the mounting hole, and the periphery of the mounting hole is connected to the peripheral wall of the vibration adjusting member; the vibration damper comprises a first damper, and the first damper is arranged on the first surface of the vibrating diaphragm and is positioned between the vibration adjusting piece and the side wall of the vibration pickup shell; and/or the vibration damping comprises a second damping, and the second damping is arranged on the second surface of the vibrating diaphragm and is positioned between the vibration adjusting piece and the side wall of the vibration pickup shell.
In a fifth embodiment of the present invention, the vibration adjusting member mainly includes a first adjusting member disposed on the first surface of the vibrating diaphragm and a second adjusting member disposed on the second surface of the vibrating diaphragm. The vibration damper comprises a third damper, and the third damper is arranged on the first surface of the vibrating diaphragm and is positioned between the first adjusting piece and the side wall of the vibration pickup shell; and/or the vibration damper comprises a fourth damper, and the fourth damper is arranged on the second surface of the vibrating diaphragm and is positioned between the second adjusting piece and the side wall of the vibration pickup shell.
The above is only the optional embodiment of the present invention, and not the scope of the present invention is limited thereby, all the equivalent structure changes made by the contents of the specification and the drawings are utilized under the inventive concept of the present invention, or the direct/indirect application in other related technical fields is included in the patent protection scope of the present invention.

Claims (11)

1. A bone voiceprint sensor, the bone voiceprint sensor comprising a vibration pickup unit and a sensor unit, the vibration pickup unit:
a vibration pick-up housing;
the vibrating diaphragm is arranged in the vibration pick-up shell, and the periphery of the vibrating diaphragm is arranged on the side wall of the vibration pick-up shell;
the vibration adjusting piece is arranged on the vibrating diaphragm; and
and the vibration damping is arranged on the vibrating diaphragm.
2. The bone voiceprint sensor of claim 1 wherein said vibration damping is provided between said vibration adjustment member and a side wall of said vibration pickup housing.
3. The bone voiceprint sensor of claim 2 wherein said vibration damping and said vibration modifying element are disposed on a first surface of said diaphragm; alternatively, the first and second electrodes may be,
the vibration damping and the vibration adjusting member are disposed on the second surface of the diaphragm.
4. The bone voiceprint sensor of claim 2 wherein said vibration damping is an annular structure.
5. The bone voiceprint sensor of claim 1 wherein the vibration damping is provided on a surface of the diaphragm to form a damping layer.
6. The bone voiceprint sensor of claim 5 wherein said damping layer is disposed between said diaphragm and said vibration adjustment member.
7. The bone voiceprint sensor according to claim 1, wherein a mounting hole is provided in a middle portion of the diaphragm, the vibration adjusting member is provided in the mounting hole, and a peripheral edge of the mounting hole is connected to a peripheral wall of the vibration adjusting member; the vibration damper comprises a first damper, and the first damper is arranged on the first surface of the vibrating diaphragm and is positioned between the vibration adjusting piece and the side wall of the vibration pickup shell; and/or the vibration damper comprises a second damper, and the second damper is arranged on the second surface of the vibrating diaphragm and is positioned between the vibration adjusting piece and the side wall of the vibration pickup shell;
alternatively, the first and second electrodes may be,
the vibration adjusting piece comprises a first adjusting piece arranged on the first surface of the vibrating diaphragm and a second adjusting piece arranged on the second surface of the vibrating diaphragm; the vibration damper comprises a third damper, and the third damper is arranged on the first surface of the vibrating diaphragm and is positioned between the first adjusting piece and the side wall of the vibration pickup shell; and/or the vibration damper comprises a fourth damper, and the fourth damper is arranged on the second surface of the vibrating diaphragm and is positioned between the second adjusting piece and the side wall of the vibration pickup shell.
8. The bone voiceprint sensor of any one of claims 1 to 7 wherein the vibration damping material is silica gel or UV gel.
9. The bone voiceprint sensor of any one of claims 1 to 7 wherein the vibration damping is a damping gel; and/or the presence of a gas in the gas,
the vibration damping has an elastic modulus of greater than or equal to 1 MPa and less than or equal to 1000 MPa.
10. The bone voiceprint sensor according to any one of claims 1 to 7, wherein the sensor unit comprises a package housing and a sensor chip arranged in the package housing, the vibration pickup housing is mounted on the package housing, and a vibration transmission hole communicating the vibration pickup housing and the package housing is formed on the package housing.
11. An electronic device characterized by comprising a bone voiceprint sensor according to any one of claims 1 to 10.
CN202022416016.4U 2020-10-27 2020-10-27 Bone voiceprint sensor and electronic device Active CN213280084U (en)

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20210364346A1 (en) * 2020-03-25 2021-11-25 Merry Electronics Co., Ltd. Vibration sensor
US11561129B2 (en) * 2021-06-18 2023-01-24 Merry Electronics(Shenzhen) Co., Ltd. Vibration sensing assembly for bone conduction microphone
WO2024002322A1 (en) * 2022-06-30 2024-01-04 华为技术有限公司 Piezoelectric vibration sensing unit and electronic device

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20210364346A1 (en) * 2020-03-25 2021-11-25 Merry Electronics Co., Ltd. Vibration sensor
US11619544B2 (en) * 2020-03-25 2023-04-04 Merry Electronics Co., Ltd. Vibration sensor having vent for pressure enhancing member
US11561129B2 (en) * 2021-06-18 2023-01-24 Merry Electronics(Shenzhen) Co., Ltd. Vibration sensing assembly for bone conduction microphone
WO2024002322A1 (en) * 2022-06-30 2024-01-04 华为技术有限公司 Piezoelectric vibration sensing unit and electronic device

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