CN211930817U - Bone voiceprint sensor and electronic device - Google Patents

Bone voiceprint sensor and electronic device Download PDF

Info

Publication number
CN211930817U
CN211930817U CN202020940634.6U CN202020940634U CN211930817U CN 211930817 U CN211930817 U CN 211930817U CN 202020940634 U CN202020940634 U CN 202020940634U CN 211930817 U CN211930817 U CN 211930817U
Authority
CN
China
Prior art keywords
vibration
sensor
adjusting
elastic membrane
vibration pickup
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN202020940634.6U
Other languages
Chinese (zh)
Inventor
方华斌
付博
端木鲁玉
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Weifang Goertek Microelectronics Co Ltd
Original Assignee
Weifang Goertek Microelectronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Weifang Goertek Microelectronics Co Ltd filed Critical Weifang Goertek Microelectronics Co Ltd
Priority to CN202020940634.6U priority Critical patent/CN211930817U/en
Application granted granted Critical
Publication of CN211930817U publication Critical patent/CN211930817U/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Landscapes

  • Electrostatic, Electromagnetic, Magneto- Strictive, And Variable-Resistance Transducers (AREA)

Abstract

The utility model discloses a bone voiceprint sensor and electronic equipment. The bone voiceprint sensor includes: the vibration pickup unit comprises a vibration pickup shell and an elastic membrane arranged in the vibration pickup shell; the sensor unit comprises a packaging shell and a sensor chip arranged in the packaging shell, wherein the packaging shell is provided with a sound hole and an air leakage hole, the vibration pickup shell is arranged on the packaging shell, and the sound hole is communicated with the vibration pickup shell and the packaging shell; the air leakage hole is used for releasing pressure when the vibration pickup unit and the sensor unit are assembled. Therefore, holes do not need to be formed in the vibration pickup shell, so that the vibration pickup area of the vibration pickup shell cannot be reduced, and the performance of the bone voiceprint sensor is improved.

Description

Bone voiceprint sensor and electronic device
Technical Field
The utility model relates to a sensor technical field, in particular to bone voiceprint sensor and electronic equipment.
Background
The bone voiceprint sensor collects sound signals and converts the sound signals into electric signals by utilizing slight vibration of bones of the head and the neck caused by speaking of a person. Because the microphone collects sound through air conduction, the microphone can transmit sound clearly in a very noisy environment. In many situations, such as fire scenes, firefighters with gas guards cannot speak directly into the microphone using their mouths, so a bone voiceprint sensor can be used at this time. With the development of electronic products, the application of the bone voiceprint sensor is more and more extensive.
In the related art, the bone voiceprint sensor generally comprises a vibration pickup unit and a sensor unit, wherein the vibration pickup unit is used for picking up external bone vibration signals and transmitting the bone vibration signals to the sensor unit; the sensor unit is used for converting the vibration signal into an electric signal.
The vibration pickup unit generally includes a vibration pickup housing and an elastic membrane disposed in the vibration pickup housing, and in order to release pressure when assembling the vibration pickup unit and the sensor unit, an air release hole is generally formed in the vibration pickup housing. However, the air release hole is arranged on the vibration pickup shell, and the air release hole can affect the vibration pickup area of the vibration pickup shell and can also limit the size of the air release hole.
SUMMERY OF THE UTILITY MODEL
The utility model aims at providing a bone voiceprint sensor aims at solving the correlation technique, will lose heart the hole setting on picking up the casing that shakes of picking up of unit to the technical problem of the area that shakes is picked up in the influence of picking up the casing that shakes.
In order to achieve the above object, the utility model provides a bone acoustic line sensor, include:
the vibration pickup unit comprises a vibration pickup shell and an elastic membrane arranged in the vibration pickup shell; and
the sensor unit comprises a packaging shell and a sensor chip arranged in the packaging shell, wherein the packaging shell is provided with a sound hole and an air leakage hole, the vibration pickup shell is arranged on the packaging shell, and the sound hole is communicated with the vibration pickup shell and the packaging shell; the air leakage hole is used for releasing pressure when the vibration pickup unit and the sensor unit are assembled.
Optionally, the package housing includes a connecting plate, the connecting plate is configured to be mounted on a main control board of the electronic device, and the air release hole is disposed in the connecting plate.
Optionally, the package housing further includes a substrate, the substrate is disposed opposite to the connecting plate, and the acoustic hole and the sensor chip are disposed on the substrate; the vibration pickup shell is mounted on the substrate.
Optionally, the air escape hole is disposed away from the sensor chip.
Optionally, the cross-sectional area of the air-escape aperture is greater than or equal to 10 square microns.
Optionally, the air leakage holes are distributed in plurality at intervals.
Optionally, the vibration pickup unit further includes a vibration adjusting member disposed on the elastic membrane, the vibration adjusting member includes an adjusting base portion connected to the elastic membrane and an adjusting protrusion portion disposed on a surface of the adjusting base portion, and the adjusting protrusion portion extends into the sound hole.
Optionally, the sensor chip is disposed corresponding to the sound hole, and the adjusting protrusion extends into a front cavity of the sensor chip.
Optionally, the vibration pickup unit further includes a vibration adjusting member disposed on the elastic membrane, the vibration adjusting member includes an adjusting body connected to the elastic membrane, and a lateral protrusion portion disposed on a side surface of the adjusting body, and a clearance gap is formed between the lateral protrusion portion and the elastic membrane; or,
the vibration pickup unit further comprises a vibration adjusting piece arranged on the elastic membrane, the vibration adjusting piece comprises an adjusting base part connected with the elastic membrane and an adjusting convex part arranged on the surface of the adjusting base part, the adjusting base part comprises an adjusting main body connected with the elastic membrane and a lateral convex part arranged on the side surface of the adjusting main body, and a clearance interval is formed between the lateral convex part and the elastic membrane; the regulating bulge extends into the sound hole.
The utility model also provides an electronic equipment, include as above bone vocal print sensor.
Compare in setting up the hole that will lose heart on picking up the casing that shakes, the utility model discloses bone vocal print sensor will lose heart the hole setting on encapsulating the casing, can needn't be in picking up the trompil on the casing that shakes to can not reduce the area of picking up the area that shakes of picking up the casing, thereby be favorable to improving bone vocal print sensor's performance.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the structures shown in the drawings without creative efforts.
Fig. 1 is a schematic structural diagram of an embodiment of the bone voiceprint sensor of the present invention;
fig. 2 is a schematic structural diagram of another embodiment of the bone voiceprint sensor according to the present invention;
fig. 3 is a schematic structural diagram of another embodiment of the bone voiceprint sensor according to the present invention;
fig. 4 is a schematic structural diagram of another embodiment of the bone voiceprint sensor of the present invention.
The reference numbers illustrate:
reference numerals Name (R) Reference numerals Name (R)
100 Bone voiceprint sensor 21 Packaging shell
10 Vibration pickup unit 211 Sound hole
11 Vibration pick-up shell 212 Air release hole
12 Elastic film 213 Substrate
121 The first vent hole 214 Connecting plate
13 Vibration adjusting member 2141 Electrical connection part
131 Adjusting base 215 Boarding board
132 Regulating protrusion 22 Sensor chip
133 Adjusting body 221 Front cavity
1331 A first regulating part 222 Induction film
1332 Second regulating part 223 Second vent hole
134 Lateral projection 23 Electrical connector
20 Sensor unit 70 ASIC chip
The objects, features and advantages of the present invention will be further described with reference to the accompanying drawings.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.
It should be noted that if the embodiments of the present invention are described with reference to "first", "second", etc., the description of "first", "second", etc. is only for descriptive purposes and is not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature.
In addition, the meaning of "and/or" appearing throughout is to include three juxtapositions, exemplified by "A and/or B" including either scheme A, or scheme B, or a scheme in which both A and B are satisfied.
The utility model provides a bone voiceprint sensor and electronic equipment. The bone voiceprint sensor is used in an electronic device, which may be, but is not limited to, a headset, an earphone, a smart watch, a smart bracelet, a vehicle noise reduction device, a vibration sensing device, and other electronic devices known to those skilled in the art.
In an embodiment of the present invention, as shown in fig. 1, the bone voiceprint sensor 100 includes a vibration pickup unit 10 and a sensor unit 20, the vibration pickup unit 10 is connected to the sensor unit 20, that is, the vibration pickup unit 10 is combined with the sensor unit 20, the vibration pickup unit 10 is configured to pick up a bone vibration signal from the outside (such as a wearer, or other vibration sources, hereinafter, the description is given by taking the wearer as an example) to generate a response vibration signal, and transmit the response vibration signal to the sensor unit 20, and the sensor unit 20 is configured to convert the received vibration signal into an electrical signal. It is understood that, without loss of generality, a sealed vibration transmission air channel is formed between the vibration pickup unit 10 and the sensor unit 20, so that the response vibration signal is transmitted to the sensor unit 20 through the sealed vibration transmission air channel.
Further, as shown in fig. 1, the vibration pickup unit 10 includes a vibration pickup housing 11 and an elastic membrane 12 disposed inside the vibration pickup housing 11.
Specifically, the elastic membrane 12 is installed in the vibration pickup housing 11, and the vibration pickup housing 11 can protect the elastic membrane 12. The vibration pickup shell 11 can transmit bone vibration of a wearer speaker to the elastic membrane 12, and the elastic membrane 12 is used for picking up the bone vibration of the wearer speaker to vibrate so as to form a response vibration signal; the elastic membrane 12 drives the gas in the sealed vibration transmission air channel to vibrate when vibrating, so as to transmit a response vibration signal to the sensor unit 20 through the sealed vibration transmission air channel.
The elastic membrane 12 may be a membrane having elastic deformation capability, including but not limited to a plastic membrane, a paper membrane, a metal membrane, a biological membrane, and the like. Further, the elastic film 12 may have a single-layer structure or may have a multi-layer composite film. The elastic membrane 12 may be made of a single material or a composite material of different materials. And will not be described in detail herein.
Further, as shown in fig. 1, the vibration pickup unit 10 further includes a vibration adjusting member 13 provided on the elastic membrane 12.
In this way, the vibration adjuster 13 is used to adjust the vibration of the elastic membrane 12, so that the vibration of the elastic membrane 12 is better matched with the bone vibration signal of the wearer, and the sensitivity of the bone voiceprint sensor 100 can be improved. Moreover, the vibration adjusting member 13 vibrates along with the elastic membrane 12, so that the mass of the elastic membrane 12 can be increased when vibrating, and the interference of external factors (such as sound waves) can be effectively avoided.
Without loss of generality, the projection of the vibration adjusting member 13 on the elastic membrane 12 should be smaller than the elastic membrane 12, as shown in fig. 1.
Alternatively, the vibration adjusting member 13 may be bonded to the elastic membrane 12 by glue.
Further, as shown in fig. 1, the sensor unit 20 includes a package housing 21 and a sensor chip 22 disposed in the package housing 21, the vibration pickup housing 11 is mounted on the package housing 21, a sound hole 211 is disposed on the package housing 21, and the sound hole 211 communicates the sensor unit 20 and the vibration pickup unit 10. Specifically, the sound hole 211 communicates the package housing 21 and the vibration pickup housing 11; it will be appreciated that the acoustic port 211 is used to form a sealed vibration-transmitting air path.
Specifically, the response vibration signal is transmitted into the package housing 21 through the sound hole 211 and transmitted to the sensor chip 22, and the sensor chip 22 is configured to convert the response vibration signal into an electrical signal.
Specifically, as shown in fig. 1, the elastic membrane 12 divides the space in the vibration pickup housing 11 into a first cavity and a second cavity, and the first cavity and the second cavity are respectively located at two sides of the elastic membrane 12 (in the state shown in fig. 1, the first cavity is located at the upper side of the elastic membrane 12, and the second cavity is located at the lower side of the elastic membrane 12); wherein the second cavity is in communication with the sound aperture 211.
Specifically, pick up the casing 11 that shakes for the open casing that sets up of one end, the open end of picking up the casing 11 that shakes is installed in encapsulation casing 21, and encapsulation casing 21 shutoff is picked up the uncovered of casing 11 that shakes, and encapsulation casing 21 communicates through sound hole 211 with picking up the casing 11 that shakes. Thus, the structure can be simplified.
Alternatively, the open end of the vibration pickup housing 11 may be glued to the package housing 21.
Alternatively, the vibration adjusting member 13 may be provided on either side of the elastic membrane 12; that is, the vibration adjusting member 13 may be disposed in the first cavity or the second cavity.
In a specific embodiment, the package housing 21 and/or the vibration pickup housing 11 are provided with air release holes 212, and the air release holes 212 are used for releasing air when assembling the vibration pickup unit 10 and the sensor unit 20. In particular, the bleed hole 212 communicates with the external environment. Thus, by providing the air release hole 212, when assembling the vibration pickup unit 10 and the sensor unit 20, the failure of the vibration pickup unit 10 or the sensor chip 22 due to the air pressure difference between the inner space and the outer space of the package housing 21 or the vibration pickup housing 11 can be avoided, so that the difficulty in assembling the bone-vocal print sensor 100 can be reduced.
However, when the bone voiceprint sensor 100 is applied, i.e., applied to an electronic device, the air release hole 212 needs to be blocked so as not to affect the performance of the bone voiceprint sensor 100. Alternatively, the air release hole 212 may be blocked by a sealant, an adhesive tape, or a sealing plug.
It should be noted that, if the air release hole 212 is disposed in the vibration pickup housing 11, optionally, the air release hole 212 is communicated with the first cavity, for example, the air release hole 212 is disposed on the top of the vibration pickup housing 11; optionally, the air relief hole 212 is an annular hole.
In the present embodiment, as shown in fig. 1-4, the air release hole 212 is disposed on the package housing 21.
It should be noted that, compared to disposing the air release hole 212 on the vibration pickup housing 11, disposing the air release hole 212 on the package housing 21 does not require a hole on the vibration pickup housing 11, so that the vibration pickup area of the vibration pickup housing 11 is not reduced, thereby facilitating the performance improvement of the bone voiceprint sensor 100.
Further, as shown in fig. 1, the package housing 21 includes a connecting plate 214, the connecting plate 214 is used for being mounted on a main control board of an electronic device, and the air release hole 212 is disposed on the connecting plate 214.
Specifically, the electronic device includes an electronic control board on which the bone voiceprint sensor 100 can be mounted when the bone voiceprint sensor 100 is applied to the electronic device. Specifically, the connection board 214 of the package housing 21 is mounted on the main control board, and optionally, the connection board 214 is attached to the surface of the main control board.
Thus, by arranging the air release hole 212 on the connecting plate 214, when the bone voiceprint sensor 100 is mounted (e.g., mounted) on the main control plate, the air release hole 212 can be blocked by the original procedure of filling glue, so that the field application procedure can be simplified, and the production cost can be reduced.
Further, the cross-sectional area of the air-escape hole 212 is greater than or equal to 10 square microns.
It can be understood that since the air release hole 212 is provided on the package housing 21, the vibration pickup area of the vibration pickup housing 11 is not affected; meanwhile, in order to improve the pressure relief effect, the size of the air release hole 212 can be increased, and the larger the air release hole 212 is, the more processing is facilitated.
Optionally, the cross-sectional area of the air escape holes 212 is greater than or equal to 40 square microns; the cross-sectional area of the air-escape hole 212 can be made even larger than or equal to 100 square micrometers; and even larger, such as 150, 200, 300 square microns, and the like.
Further, a plurality of (i.e. two or more) air-release holes 212 are distributed at intervals. It can be understood that since the air release hole 212 is provided on the package housing 21, the vibration pickup area of the vibration pickup housing 11 is not affected; therefore, in order to increase the pressure relief effect, a plurality of the air release holes 212 may be provided. Of course, it is also possible to provide only one relief hole 212.
Further, as shown in fig. 1, the air escape hole 212 is disposed away from the sensor chip 22. In this way, the air escape hole 212 can be prevented from affecting the sensor chip 22.
Further, as shown in fig. 1, the package housing 21 further includes a substrate 213, the substrate 213 is disposed opposite to the connection plate 214, and the sound hole 211 and the sensor chip 22 are disposed on the substrate 213; the vibration pickup housing 11 is mounted on the substrate 213. In this manner, when the bone voiceprint sensor 100 is mounted to the main control board, the vibration pickup unit 10 can be facilitated to pick up a bone vibration signal. Of course, in other embodiments, the substrate 213 and the connection plate 214 may be disposed adjacent to each other.
Specifically, the package housing 21 further includes a surrounding plate 215 disposed on the periphery of the substrate 213, the surrounding plate 215 forms an opening at an end away from the substrate 213, and the connecting plate 214 is connected to the opening.
Further, as shown in fig. 1, the sensor chip 22 is disposed corresponding to the sound hole 211. In detail, the front cavity 221 of the sensor chip 22 is disposed corresponding to the sound hole 211 and communicates with the sound hole 211.
Without loss of generality, as shown in fig. 1, the sensor unit 20 further includes an ASIC (application Specific Integrated circuit) chip 70 disposed in the package housing 21, and the ASIC chip 70 is electrically connected to the sensor chip 22 to process an electrical signal generated by the sensor chip 22.
Specifically, the ASIC chip 70 may be provided on the surface of the substrate 213, or the ASIC chip 70 may be embedded in the substrate 213. It is noted that embedding the ASIC chip 70 in the substrate 213 facilitates assembly of the bone voiceprint sensor 100.
Specifically, the substrate 213 is a circuit board, such as a PCB, and the ASIC chip 70 and the sensor chip 22 are electrically connected to the substrate 213.
Optionally, as shown in fig. 1, an electrical connection portion 2141 for electrically connecting with an external circuit (i.e., a circuit of the electronic device) is disposed on the connection board 214, and the electrical connection portion 2141 is electrically connected with the substrate 213 to electrically connect with the ASIC chip 70 and the sensor chip 22.
As such, when the connection board 214 is mounted on the electronic control board, the electrical connection portions 2141 may be electrically connected with the electronic control board to electrically connect the sensor chip 22 with an external circuit (i.e., a circuit of the electronic device).
Wherein, the sensor unit 20 further comprises an electrical connector 23, and the electrical connector 23 electrically connects the substrate 213 and the electrical connector 2141. Optionally, the electrical connector 23 is embedded in the enclosure 215.
Alternatively, as shown in fig. 1, the elastic membrane 12 and the vibration adjusting member 13 are provided with a first vent hole 121.
Optionally, as shown in fig. 1, a second vent hole 223 is formed on the sensing film 222 of the sensor chip 22.
Alternatively, the sensor chip 22 may be a microphone chip or a pressure sensor chip 22. That is, the sensor unit 20 may employ a MEMS microphone or a MEMS pressure sensor, so that the difficulty of designing the bone voiceprint sensor 100 can be reduced.
In another embodiment of the present invention, as shown in fig. 3, the vibration adjusting member 13 includes an adjusting base 131 connected to the elastic membrane 12, and an adjusting protrusion 132 disposed on a surface of the adjusting base 131, wherein the adjusting protrusion 132 extends into the sound hole 211. Specifically, the adjusting protrusion 132 further extends into the package housing 21. Thus, the space utilization rate can be improved to increase the quality of the vibration adjusting piece 13, thereby being beneficial to improving the sensitivity of the bone voiceprint sensor 100 module.
In this embodiment, it is understood that the vibration adjusting member 13 is provided on the side of the elastic membrane 12 facing the sound hole 211.
In this embodiment, as shown in fig. 3, the sensor chip 22 is disposed corresponding to the sound hole 211, and the adjustment protrusion 132 protrudes into the front cavity 221 of the sensor chip 22 through the sound hole 211. In this way, the accuracy of the sensor chip 22 can be improved.
Further, it is understood that in order to further increase the mass of the vibration adjusting member 13, the size of the adjusting protrusion 132 may be increased, and thus, the sound hole 211 needs to be enlarged. That is, by enlarging the sound hole 211, it is possible to accommodate the larger-sized regulating protrusion 132 so as to further increase the mass of the vibration adjusting member 13; meanwhile, since the acoustic hole 211 is enlarged, the influence of the front cavity 221 of the sensor chip 22 on the high frequency can be reduced, so that the high frequency is flatter, and the reliability of the bone voiceprint sensor 100 can be improved. In other words, the present invention can enlarge the acoustic hole 211 to reduce the influence of the front cavity 221 of the sensor chip 22 on the high frequency, so that the high frequency is flatter, thereby improving the reliability of the bone voiceprint sensor 100.
In this embodiment, as shown in fig. 3, the periphery of the acoustic hole 211 may be made flush with the periphery of the front cavity 221 of the sensor chip 22; alternatively, the periphery of the acoustic hole 211 is provided outside the periphery of the front cavity 221 of the sensor chip 22. In this way, the sound hole 211 can be prevented from interfering with the adjustment protrusion 132, so as to further increase the size of the adjustment protrusion 132 to increase the mass of the vibration adjuster 13, thereby reducing the influence of the front cavity 221 of the sensor chip 22 on the high frequency, making the high frequency flatter, and improving the reliability of the bone voiceprint sensor 100.
In this embodiment, as shown in fig. 3, the projection of the adjusting protrusion 132 on the elastic membrane 12 has a first area, and the projection of the peripheral wall of the front cavity 221 of the sensor chip 22 on the elastic membrane 12 has a second area, and the ratio of the first area to the second area is greater than or equal to 0.1 and less than or equal to 0.99.
Optionally, a ratio of the first area to the second area is greater than or equal to 0.5 and less than or equal to 0.9.
Optionally, a ratio of the first area to the second area is greater than or equal to 0.6 and less than or equal to 0.8.
Optionally, a ratio of the first area to the second area is greater than or equal to 0.65 and less than or equal to 0.75.
It is understood that the specification of the sensor chip 22 is generally constant, and the larger the ratio of the first area to the second area is, the more beneficial the mass of the vibration adjusting member 13 is; however, if the ratio is too large, the adjustment protrusion 132 may interfere with the peripheral wall of the front cavity 221 of the sensor chip 22 during vibration, thereby affecting the performance of the bone voiceprint sensor 100. Of course, the magnitude of the ratio will also affect the performance of the sensor chip 22 by the amount of gas in the front cavity 221 of the sensor chip 22; therefore, in practical applications, the ratio of the first area to the second area can be designed according to practical situations.
In this embodiment, as shown in fig. 3, the distance between the adjustment projection 132 and the sensing film 222 of the sensor chip 22 is greater than or equal to 10 micrometers.
Alternatively, the distance between the adjusting protrusion 132 and the sensing film 222 of the sensor chip 22 may be 12 microns, 15 microns, 17 microns, 20 microns, 23 microns, 25 microns, or the like, or even larger.
It is understood that the specification of the sensor chip 22 is generally certain, and the smaller the distance between the adjusting protrusion 132 and the sensing film 222 of the sensor chip 22 is, the more beneficial the mass of the vibration adjuster 13 is; however, if the distance is too small, the adjustment protrusion 132 may interfere with the sensing film 222 of the sensor chip 22 during vibration, thereby affecting the performance of the bone voiceprint sensor 100. Of course, the size of the gap also affects the amount of gas in the front cavity 221 of the sensor chip 22, thereby affecting the performance of the sensor chip 22; therefore, in practical applications, the distance between the adjusting protrusion 132 and the sensing film 222 can be designed according to practical situations.
It should be noted that, in practical applications, the ratio of the first area to the second area and the distance between the adjusting protrusion 132 and the sensing film 222 of the sensor chip 22 can be designed according to practical situations, so as to not only increase the mass of the vibration adjusting member 13 to a greater extent, but also ensure/improve the performance of the sensor chip 22, and avoid the interference of the vibration of the adjusting protrusion 132 in the front cavity 221.
In this embodiment, the regulating protrusion 132 is provided at the middle of the regulating base 131. In this way, the elastic membrane 12 can be stressed more uniformly during the vibration process, so as to reduce the risk of cracking; at the same time, the stability of the vibration of the elastic membrane 12 can be improved to improve the performance of the bone voiceprint sensor 100.
In another embodiment of the present invention, as shown in fig. 2, the vibration adjusting member 13 includes an adjusting body 133 connected to the elastic membrane 12, and a lateral protrusion 134 disposed on a side of the adjusting body 133, wherein a clearance is formed between the lateral protrusion 134 and the elastic membrane 12. Specifically, the lateral protrusion 134 faces the side of the elastic membrane 12, and forms a clearance with the surface of the elastic membrane 12. When the elastic membrane vibrates, the magnitude of the avoiding interval can change along with the vibration of the elastic membrane.
In this way, the space in the vibration pickup housing 11 can be effectively utilized to increase the mass of the vibration adjusting piece 13 without increasing the connecting area of the vibration adjusting piece 13 and the elastic membrane 12, so that the sensitivity of the bone voiceprint sensor 100 can be improved, and the performance of the bone voiceprint sensor 100 can be improved; and facilitates a compact design of the bone voiceprint sensor 100.
That is to say, the bone voiceprint sensor 100 in this embodiment improves the space utilization rate, is beneficial to reducing the product size, and improves the product performance.
Alternatively, the connection area of the vibration adjusting member 13 and the elastic membrane 12 may be reduced without reducing the mass of the vibration adjusting member 13 to improve the performance of the bone voiceprint sensor 100.
In this embodiment, further, as shown in fig. 2, the lateral projection 134 is an annular structure. Thus, on the one hand, the difficulty of manufacturing the vibration adjusting piece 13 can be reduced, and on the other hand, the mass of the vibration adjusting piece 13 can be increased to a large extent. Of course, in the parallel embodiment of this embodiment, it is also possible to make: the lateral protrusions 134 are provided in plural, and the plural lateral protrusions 134 are spaced apart in the circumferential direction of the adjustment body 133.
In this embodiment, as shown in fig. 2, the adjusting body 133 includes a first adjusting portion 1331 connected to the elastic membrane 12, and a second adjusting portion connected to a side of the first adjusting portion 1331 away from the elastic membrane 12, and the lateral protrusion 134 is disposed at a side of the second adjusting portion. In this way, a clearance is formed between the lateral protrusion 134 and the elastic membrane 12.
In this embodiment, the lateral protrusion 134, the first adjusting portion 1331 and the second adjusting portion may be integrally provided; it is also possible to provide the lateral protrusion 134 integrally with the second regulating portion and separately fittingly coupled with the first regulating portion 1331.
In this embodiment, further, as shown in fig. 2, the thickness of the lateral projection 134 is equal to that of the second regulating portion. In this way, the vibration adjusting member 13 is formed in a stepped structure, so that the mass of the vibration adjusting member 13 can be increased to a large extent.
In this embodiment, further, the outer contour shape of the lateral protrusion 134 is the same as that of the first regulation part 1331.
In this embodiment, further, the ratio of the thickness of the second regulating portion to the thickness of the first regulating portion 1331 is greater than or equal to 0.1 and less than or equal to 100. It will be appreciated that if this ratio is too large, it is easy for the lateral projections 134 to interfere with the elastic membrane 12 during vibration; if the ratio is too small, it is not favorable to increase the mass of the vibration control member 13. Optionally, the ratio of the thickness of the second regulating part to the thickness of the first regulating part 1331 is greater than or equal to 0.2 and less than or equal to 10; alternatively, the ratio of the thickness of the second regulation part to the thickness of the first regulation part 1331 is greater than or equal to 0.3 and less than or equal to 6.
In this embodiment, further, the projection of the lateral protrusion 134 and the second adjusting portion on the elastic membrane 12 has a first area, and the projection of the first adjusting portion 1331 on the elastic membrane 12 has a second area, and the ratio of the second area to the first area is greater than 1 and less than or equal to 100. It is understood that if the ratio is too small, it is not favorable to increase the mass of the vibration adjusting member 13; if the ratio is too large, the "head heavy" and the foot light "are easily caused. Optionally, a ratio of the second area to the first area is greater than or equal to 1.1 and less than or equal to 10; or the ratio of the second area to the first area is greater than or equal to 1.2 and less than or equal to 6.
In this embodiment, the vibration adjusting member 13 may be provided on either side of the elastic membrane 12.
Of course, in this embodiment, by designing the lateral protrusion 134, the vibration adjusting member 13 may be made to have a three-step, or four-step, or more-step stepped structure.
Of course, in this embodiment, by designing the lateral protrusion 134, the longitudinal section of the vibration adjusting member 13 (i.e., the section passing through the center line of the vibration adjusting member 13) may be made trapezoidal or kidney-shaped.
In addition, it should be noted that the technical solutions in the above embodiments may be combined with each other, but it must be based on the realization of those skilled in the art, and when the technical solutions are contradictory or can not be realized, such a combination of technical solutions should not be considered to exist, and is not within the protection scope of the present invention. As shown in fig. 4, in another embodiment of the present invention, the vibration adjusting member 13 includes an adjusting base 131 connected to the elastic membrane 12, and an adjusting protrusion 132 disposed on a surface of the adjusting base 131, the adjusting base 131 includes an adjusting body 133 connected to the elastic membrane 12, and a lateral protrusion 134 disposed on a side of the adjusting body 133, and a clearance is formed between the lateral protrusion 134 and the elastic membrane 12; the regulating protrusion 132 protrudes into the sound hole 211. Specifically, the lateral protrusion 134 faces the side of the elastic membrane 12, and forms a clearance with the surface of the elastic membrane 12. When the elastic membrane vibrates, the magnitude of the avoiding interval can change along with the vibration of the elastic membrane.
Therefore, the space utilization rate can be improved to a greater extent so as to increase the quality of the vibration adjusting piece 13, and further the sensitivity of the bone vocal print sensor 100 module can be improved so as to improve the performance of the bone vocal print sensor 100 module; and facilitates the implementation of a miniaturized design of the bone voiceprint sensor 100 module.
When the bone voiceprint sensor is applied to an electronic device, in an embodiment, the electronic device comprises a bone voiceprint sensor as described above.
Specifically, the electronic equipment further comprises an electric control board, wherein the connecting plate of the bone voiceprint sensor is attached to the electric control board, and the air leakage hole in the connecting plate is plugged through colloid.
The above is only the optional embodiment of the present invention, and not the scope of the present invention is limited thereby, all the equivalent structure changes made by the contents of the specification and the drawings are utilized under the inventive concept of the present invention, or the direct/indirect application in other related technical fields is included in the patent protection scope of the present invention.

Claims (10)

1. A bone voiceprint sensor, comprising:
the vibration pickup unit comprises a vibration pickup shell and an elastic membrane arranged in the vibration pickup shell; and
the sensor unit comprises a packaging shell and a sensor chip arranged in the packaging shell, wherein the packaging shell is provided with a sound hole and an air leakage hole, the vibration pickup shell is arranged on the packaging shell, and the sound hole is communicated with the vibration pickup shell and the packaging shell; the air leakage hole is used for releasing pressure when the vibration pickup unit and the sensor unit are assembled.
2. The bone voiceprint sensor of claim 1 wherein said package housing includes a connection plate for mounting to a master control board of an electronic device, said relief hole being provided in said connection plate.
3. The bone voiceprint sensor of claim 2 wherein said package housing further comprises a base plate disposed opposite said connection plate, said sound aperture and said sensor chip being disposed on said base plate; the vibration pickup shell is mounted on the substrate.
4. The bone voiceprint sensor of claim 1 wherein said relief hole is located remotely from said sensor chip.
5. The bone voiceprint sensor of any one of claims 1 to 4 wherein the cross-sectional area of the relief hole is greater than or equal to 10 square microns.
6. The bone voiceprint sensor of any one of claims 1 to 4 wherein a plurality of said venting holes are spaced apart.
7. The bone voiceprint sensor of any one of claims 1 to 4 wherein the vibration pickup unit further comprises a vibration adjusting member disposed on the elastic membrane, the vibration adjusting member comprising an adjusting base portion connected to the elastic membrane and an adjusting protrusion portion disposed on a surface of the adjusting base portion, the adjusting protrusion portion protruding into the sound hole.
8. The bone voiceprint sensor of claim 7 wherein said sensor chip is disposed in correspondence with said vocal hole, said adjustment protrusion extending into an anterior cavity of said sensor chip.
9. The bone voiceprint sensor according to any one of claims 1 to 4, wherein the vibration pickup unit further comprises a vibration adjusting member disposed on the elastic membrane, the vibration adjusting member comprises an adjusting body connected with the elastic membrane, and a lateral protrusion portion disposed on a side surface of the adjusting body, and a spacing interval is formed between the lateral protrusion portion and the elastic membrane; or,
the vibration pickup unit further comprises a vibration adjusting piece arranged on the elastic membrane, the vibration adjusting piece comprises an adjusting base part connected with the elastic membrane and an adjusting convex part arranged on the surface of the adjusting base part, the adjusting base part comprises an adjusting main body connected with the elastic membrane and a lateral convex part arranged on the side surface of the adjusting main body, and a clearance interval is formed between the lateral convex part and the elastic membrane; the regulating bulge extends into the sound hole.
10. An electronic device characterized by comprising a bone voiceprint sensor according to any one of claims 1 to 9.
CN202020940634.6U 2020-05-27 2020-05-27 Bone voiceprint sensor and electronic device Active CN211930817U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202020940634.6U CN211930817U (en) 2020-05-27 2020-05-27 Bone voiceprint sensor and electronic device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202020940634.6U CN211930817U (en) 2020-05-27 2020-05-27 Bone voiceprint sensor and electronic device

Publications (1)

Publication Number Publication Date
CN211930817U true CN211930817U (en) 2020-11-13

Family

ID=73321007

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202020940634.6U Active CN211930817U (en) 2020-05-27 2020-05-27 Bone voiceprint sensor and electronic device

Country Status (1)

Country Link
CN (1) CN211930817U (en)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112565993A (en) * 2020-11-16 2021-03-26 歌尔微电子有限公司 Bone voiceprint sensor and electronic device
CN113259818A (en) * 2021-04-26 2021-08-13 歌尔微电子股份有限公司 Bone voiceprint sensor, manufacturing method thereof and electronic device
US20210364346A1 (en) * 2020-03-25 2021-11-25 Merry Electronics Co., Ltd. Vibration sensor
CN113709643A (en) * 2021-08-27 2021-11-26 歌尔微电子股份有限公司 Vibration pickup unit, bone voiceprint sensor and electronic equipment
CN114136426A (en) * 2021-11-25 2022-03-04 歌尔微电子股份有限公司 Sensor and wearable equipment
WO2022227672A1 (en) * 2021-04-26 2022-11-03 歌尔微电子股份有限公司 Bone voiceprint sensor and manufacturing method therefor, and electronic device
WO2023000999A1 (en) * 2021-07-20 2023-01-26 歌尔微电子股份有限公司 Vibration sensor and electronic device

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20210364346A1 (en) * 2020-03-25 2021-11-25 Merry Electronics Co., Ltd. Vibration sensor
US11619544B2 (en) * 2020-03-25 2023-04-04 Merry Electronics Co., Ltd. Vibration sensor having vent for pressure enhancing member
CN112565993A (en) * 2020-11-16 2021-03-26 歌尔微电子有限公司 Bone voiceprint sensor and electronic device
CN113259818A (en) * 2021-04-26 2021-08-13 歌尔微电子股份有限公司 Bone voiceprint sensor, manufacturing method thereof and electronic device
WO2022227672A1 (en) * 2021-04-26 2022-11-03 歌尔微电子股份有限公司 Bone voiceprint sensor and manufacturing method therefor, and electronic device
WO2023000999A1 (en) * 2021-07-20 2023-01-26 歌尔微电子股份有限公司 Vibration sensor and electronic device
CN113709643A (en) * 2021-08-27 2021-11-26 歌尔微电子股份有限公司 Vibration pickup unit, bone voiceprint sensor and electronic equipment
CN113709643B (en) * 2021-08-27 2024-04-26 歌尔微电子股份有限公司 Vibration pickup unit, bone voiceprint sensor and electronic equipment
CN114136426A (en) * 2021-11-25 2022-03-04 歌尔微电子股份有限公司 Sensor and wearable equipment

Similar Documents

Publication Publication Date Title
CN211930817U (en) Bone voiceprint sensor and electronic device
CN111556419A (en) Bone voiceprint sensor and electronic device
CN211930871U (en) Bone voiceprint sensor and electronic device
CN111510834B (en) Bone voiceprint sensor module and electronic equipment
CN213694145U (en) Bone voiceprint sensor module and electronic equipment
CN211930872U (en) Bone voiceprint sensor and electronic device
CN211930818U (en) Vibration assembly, bone voiceprint sensor and electronic equipment
US11895452B2 (en) Bone conduction microphone
CN112333618A (en) Bone voiceprint sensor module and electronic equipment
CN213280084U (en) Bone voiceprint sensor and electronic device
CN113709643B (en) Vibration pickup unit, bone voiceprint sensor and electronic equipment
US10631100B2 (en) Micro-electrical mechanical system sensor package and method of manufacture thereof
CN112565995B (en) Sensor chip, bone voiceprint sensor and electronic device
WO2020258172A1 (en) Vibration sensor, audio apparatus, and method for assembling vibration sensor
CN209945545U (en) Bone voiceprint recognition sensor
JP2007060389A (en) Silicon microphone package
CN212110308U (en) Vibration detection structure, bone voiceprint sensor and electronic device
CN113259818A (en) Bone voiceprint sensor, manufacturing method thereof and electronic device
CN213403413U (en) Bone voiceprint sensor and electronic device
CN212486781U (en) Bone voiceprint sensor module and electronic equipment
CN212486782U (en) Bone voiceprint sensor module and electronic equipment
CN112565993A (en) Bone voiceprint sensor and electronic device
US11561129B2 (en) Vibration sensing assembly for bone conduction microphone
CN211930826U (en) Novel microphone packaging structure
CN213834528U (en) Sensor packaging structure, MEMS sensor and wearable equipment

Legal Events

Date Code Title Description
GR01 Patent grant
GR01 Patent grant