CN112565995B

CN112565995B - Sensor chip, bone voiceprint sensor and electronic device

Info

Publication number: CN112565995B
Application number: CN202011282647.XA
Authority: CN
Inventors: 方华斌; 田峻瑜; 端木鲁玉
Original assignee: Goertek Microelectronics Inc
Current assignee: Goertek Microelectronics Inc
Priority date: 2020-11-16
Filing date: 2020-11-16
Publication date: 2022-09-20
Anticipated expiration: 2040-11-16
Also published as: CN112565995A

Abstract

The invention discloses a sensor chip, a bone voiceprint sensor and an electronic device, wherein the sensor chip comprises: a substrate; and a sensing component mounted to the substrate; the sensing assembly comprises a vibrating diaphragm, a polar plate and a vibration damper, wherein the vibrating diaphragm and the polar plate are arranged at intervals, and the vibration damper is arranged between the vibrating diaphragm and the polar plate. Therefore, the peak value sensitivity of the sensor chip can be suppressed by utilizing the damping characteristic of vibration damping, so that the frequency response characteristics of the bone sensor chip and the voiceprint sensor can be improved, the working bandwidth width of the sensor chip and the voiceprint sensor can be enlarged, and the product performance can be improved.

Description

Sensor chip, bone voiceprint sensor and electronic device

Technical Field

The invention relates to the technical field of sensors, in particular to a sensor chip, a bone voiceprint sensor and electronic equipment.

Background

The bone voiceprint sensor collects sound signals and converts the sound signals into electric signals by utilizing slight vibration of bones of the head and the neck caused by speaking of a person. Because the microphone collects sound through air conduction, the microphone can transmit sound clearly in a very noisy environment. In many situations, such as fire scenes, firefighters with gas guards cannot speak directly into the microphone using their mouths, so a bone voiceprint sensor can be used at this time. With the development of electronic products, the application of the bone voiceprint sensor is more and more extensive.

In the related art, the bone voiceprint sensor generally comprises a vibration pickup unit and a sensor unit, wherein the vibration pickup unit is used for picking up external bone vibration signals and transmitting the bone vibration signals to the sensor unit; the sensor unit is used for converting the vibration signal into an electric signal. However, the frequency bandwidth of the above bone voiceprint sensor is not easily adjustable.

Disclosure of Invention

The invention mainly aims to provide a sensor chip and a bone vocal print sensor, and aims to solve the technical problem that the frequency bandwidth of the bone vocal print sensor is not easy to adjust in the related technology.

In order to achieve the above object, the present invention provides a sensor chip for a bone voiceprint sensor, the sensor chip including:

a substrate; and

a sensing assembly mounted to the substrate; the sensing assembly comprises a vibrating diaphragm and a polar plate which are arranged at intervals, and vibration damping arranged between the vibrating diaphragm and the polar plate.

Optionally, the vibration damper connects the diaphragm and the pole plate.

Optionally, the vibration damping is provided in a middle region of the diaphragm.

Optionally, the vibration damping comprises a plurality of damping points distributed at intervals; alternatively, the first and second electrodes may be,

the vibration damping is of an integrated structure.

Optionally, the vibration damping is a damping glue.

Optionally, the vibration damping material is silica gel or UV gel.

Optionally, the vibration damping has a modulus of elasticity greater than or equal to 1 mpa and less than or equal to 1000 mpa.

Optionally, the sensor chip is a MEMS chip.

The invention also provides a bone voiceprint sensor, comprising:

the vibration isolator comprises a shell, wherein the shell comprises a partition board, the partition board divides the space in the shell into a vibration pickup cavity and an encapsulation cavity, and a vibration transmission hole for communicating the vibration pickup cavity with the encapsulation cavity is formed in the partition board;

the vibration pickup assembly is arranged in the vibration pickup cavity; and

the sensor chip is arranged in the packaging cavity.

The invention also provides electronic equipment comprising the bone voiceprint sensor.

In the invention, the vibration damping is arranged between the vibrating diaphragm and the polar plate of the sensing assembly of the sensor chip, so that the peak sensitivity of the sensor chip can be suppressed by utilizing the damping characteristic of the vibration damping, the frequency response characteristics of the sensor chip and the bone voiceprint sensor are improved, the working bandwidth width of the sensor chip and the bone voiceprint sensor is expanded, and the product performance is improved.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the structures shown in the drawings without creative efforts.

FIG. 1 is a schematic structural diagram of an embodiment of a bone voiceprint sensor according to the invention;

FIG. 2 is an enlarged view of a portion of FIG. 1 at A;

FIG. 3 is a schematic view of a projection of a first embodiment of vibration damping according to the present invention in the direction of the diaphragm surface of the sensing assembly towards the sensor chip;

fig. 4 is a schematic projection of a second embodiment of vibration damping according to the invention in the direction of the diaphragm surface of the sensor assembly of the sensor chip.

The reference numbers illustrate:

reference numerals	Name (R)	Reference numerals	Name (R)
				100	Bone voiceprint sensor	20	Vibration pickup assembly
10	Shell body	21	Elastic vibration pick-up piece
				11	Partition board	22	Vibration adjusting member
111	Vibration transmission hole	30	Vibration damping
				12	Vibration pickup cavity	31	Damping point
13	Packaging chamber	40	Sensor chip
				14	Vibration pick-up shell	41	Cavity body
15	Packaging shell	42	Sensing assembly
				151	Boarding board	421	Vibrating diaphragm
152	Connecting plate	422	Polar plate
				153	Electrical connection part	43	Substrate
154	Electrical connector	50	ASIC chip

The implementation, functional features and advantages of the objects of the present invention will be further explained with reference to the accompanying drawings.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

It should be noted that, if directional indications (such as up, down, left, right, front, and back … …) are involved in the embodiment of the present invention, the directional indications are only used to explain the relative positional relationship between the components, the movement situation, and the like in a specific posture (as shown in the drawing), and if the specific posture is changed, the directional indications are changed accordingly.

In addition, if there is a description of "first", "second", etc. in an embodiment of the present invention, the description of "first", "second", etc. is for descriptive purposes only and is not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In addition, the meaning of "and/or" appearing throughout is to include three juxtapositions, exemplified by "A and/or B" including either scheme A, or scheme B, or a scheme in which both A and B are satisfied. In addition, technical solutions between various embodiments may be combined with each other, but must be realized by a person skilled in the art, and when the technical solutions are contradictory or cannot be realized, such a combination should not be considered to exist, and is not within the protection scope of the present invention.

The invention provides a sensor chip, a bone voiceprint sensor and an electronic device. The sensor chip is used for a bone voiceprint sensor, the bone voiceprint sensor is used for an electronic device, and the electronic device may be, but is not limited to, a headset, an earphone, a smart watch, a smart bracelet, a vehicle-mounted noise reduction device, a vibration sensing device, and other electronic devices known to those skilled in the art.

In one embodiment of the present invention, as shown in FIG. 1, the bone voiceprint sensor 100 includes a housing 10, a vibration pickup assembly 20, and a sensor chip 40.

The shell 10 comprises a partition plate 11, the partition plate 11 divides the space in the shell 10 into a vibration pickup cavity 12 and an encapsulation cavity 13, and the partition plate 11 is provided with a vibration transmission hole 111 for communicating the vibration pickup cavity 12 with the encapsulation cavity 13;

the vibration pickup assembly 20 is disposed in the vibration pickup cavity 12, the vibration pickup assembly 20 divides the vibration pickup cavity 12 into a first cavity and a second cavity, and the first cavity is communicated with the vibration transmission hole 111.

Wherein the sensor chip 40 is disposed in the package cavity 13.

In operation, the vibration pick-up assembly 20 is configured to pick up bone vibrations from an external environment (e.g., a wearer, or other vibration source, as described below by way of example for the wearer) to vibrate, and transmit the vibrations to the sensor chip 40 through the vibration transmission hole 111, and the sensor chip 40 generates an electrical signal accordingly.

Further, as shown in fig. 1 and 2, the sensor chip 40 includes:

a substrate 43; and

a sensing component 42, wherein the sensing component 42 is mounted on the substrate 43, and forms a cavity 41 with the substrate 43; the sensing assembly 42 includes a diaphragm 421 and a pole plate 422 arranged at intervals, and a vibration damper 30 arranged between the diaphragm 421 and the pole plate 422.

Specifically, the substrate 43 is mounted on the partition 11, and the cavity 41 communicates with the vibration transmission hole 111.

In operation, when vibration is transmitted to the sensing assembly 42 through the cavity 41, the diaphragm 421 vibrates, and since the vibration damper 30 is disposed between the diaphragm 421 and the pole plate 422, the damping characteristic of the vibration damper 30 changes the frequency response characteristic of the diaphragm 421.

In this way, the vibration damper 30 is disposed between the vibrating diaphragm 421 and the polar plate 422 of the sensing assembly 42 of the sensor chip 40, so that the damping characteristic of the vibration damper 30 can be utilized to suppress the peak sensitivity of the sensor chip 40, improve the frequency response characteristics of the sensor chip 40 and the bone voiceprint sensor 100, expand the working bandwidth width of the sensor chip 40 and the bone voiceprint sensor 100, and improve the product performance.

In particular embodiments, the vibration damper 30 can be coupled to the diaphragm 421, the vibration damper 30 can be coupled to the pole plate 422, and so on.

In this embodiment, as shown in fig. 1 and 2, the vibration damper 30 connects the diaphragm 421 and the pole plate 422. Thus, the production difficulty can be reduced.

Optionally, the vibration damper 30 is disposed in a middle region of the diaphragm 421.

It can be understood that, when the vibrating diaphragm 421 vibrates, the vibration amplitude of the middle area of the vibrating diaphragm 421 is large, and the vibration damping 30 is arranged in the area, so that the performance of the product can be improved.

In a specific application, the structural form of the vibration damper 30 is various, for example, in the first embodiment of the vibration damper 30, as shown in fig. 3, the vibration damper 30 may be a connected and shaped structure (i.e., an integrated structure), such as a layered structure, a ring structure, a spiral structure, or the like.

As also in the second embodiment of the vibration damper 30, as shown in fig. 4, it is possible to make said vibration damper 30 comprise a plurality of damping points 31 distributed at intervals; alternatively, the plurality of damping points 31 are regularly arranged, such as uniformly arranged, etc., such as in a linear array, or in a ring, etc.

Further, the vibration damper 30 is a damping paste. The damping rubber has the advantages of convenient material selection, low cost and good damping characteristic. Specifically, the vibration damper 30 may be made of silica gel or UV gel.

Specifically, a glue may be applied to the surface of the diaphragm 421 to form the vibration damper 30.

Further, the elastic modulus of the vibration damper 30 is greater than or equal to 1 mpa and less than or equal to 1000 mpa. Thus, the working bandwidth and the peak sensitivity of the bone voiceprint sensor 100 can be adjusted by selecting the elastic modulus of the vibration damper 30, so as to improve the applicability of the bone voiceprint sensor 100.

Alternatively, the elastic modulus of the vibration damper 30 may be made greater than or equal to 5 mpa and less than or equal to 800 mpa.

Further alternatively, the elastic modulus of the vibration damper 30 may be made greater than or equal to 10 mpa and less than or equal to 600 mpa.

Further alternatively, the elastic modulus of the vibration damper 30 may be made greater than or equal to 50 mpa and less than or equal to 500 mpa.

Further alternatively, the elastic modulus of the vibration damper 30 may be made greater than or equal to 80 mpa and less than or equal to 300 mpa.

Specifically, the sensor chip 40 is a microphone chip, such as a MEMS microphone chip. Of course, the sensor chip 40 may be another detection chip for detecting the air pressure change, such as the pressure sensor chip 40, for example, the MEMS pressure sensor chip 40.

Further, as shown in fig. 1, the housing 10 includes a vibration pickup shell 14 with one open end, the open end of the vibration pickup shell 14 is mounted on (a surface of) the partition 11, the vibration pickup shell 14 and the partition 11 enclose to form a vibration pickup cavity 12, and the vibration pickup assembly 20 is mounted on a side wall of the vibration pickup shell 14 to separate a space in the vibration pickup cavity 12 into a first cavity and a second cavity.

Specifically, as shown in fig. 1, the first cavity is located below vibration pickup assembly 20, and the second cavity is located above vibration pickup assembly 20.

Further, as shown in fig. 1, the vibration pickup assembly 20 includes an elastic vibration pickup member 21 and a vibration adjusting member 22 provided to the elastic vibration pickup member 21.

Specifically, the periphery of the elastic vibration-pickup member 21 is mounted on the side wall of the vibration-pickup housing 14.

Optionally, the vibration adjusting member 22 is a mass.

Without loss of generality, the projection of the vibration control member 22 on the elastic vibration pick-up member 21 should be smaller than the elastic vibration pick-up member 21, as shown in FIG. 1.

The elastic vibration pickup element 21 is used for picking up external bone vibration to vibrate, and the vibration adjusting element 22 can adjust the vibration of the elastic vibration pickup element 21, so that the vibration of the elastic vibration pickup element 21 is better matched with the external bone vibration, and the sensitivity of the bone voiceprint sensor 100 can be improved; moreover, the vibration adjusting member 22 vibrates along with the elastic vibration pick-up member 21, so that the mass of the vibration pick-up assembly 20 can be increased, and the interference of external factors (such as sound waves) on the vibration of the elastic vibration pick-up member 21 can be effectively avoided.

Specifically, as shown in fig. 1, the elastic vibration-pickup element 21 is an elastic film, and the elastic film may be a film having elastic deformation capability, including but not limited to a plastic film, a paper film, a metal film, a biological film, and the like. Moreover, the elastic membrane can adopt a single-layer structure or a multi-layer composite membrane; the elastic membrane can be made of a single material or made of different materials in a compounding mode. And will not be described in detail herein.

Of course, in other embodiments, the elastic vibration pickup element 21 may be configured in other structural forms, for example, the elastic vibration pickup element 21 may include a mounting ring mounted on the side wall of the vibration pickup housing 14, a vibration pickup sheet located in the mounting ring and spaced from the mounting ring, a connecting arm connecting the mounting ring and the vibration pickup sheet, and an elastic sealing film located in the gap between the mounting ring and the vibration pickup sheet, and the vibration adjusting element 22 is disposed on one surface of the vibration pickup sheet; and so on.

Further, as shown in fig. 1, the housing 10 includes an enclosure 15 with one end open, the open end of the enclosure 15 is mounted on (the other surface of) the partition 11, and the enclosure 15 and the partition 11 enclose to form the enclosure cavity 13.

Further, as shown in fig. 1, the bone voiceprint sensor 100 further includes an ASIC (application Specific Integrated circuit) chip disposed in the package 15, and the ASIC chip 50 is electrically connected to the sensor chip 40 to process an electrical signal generated by the sensor chip 40.

Specifically, the ASIC chip 50 is provided on the partition 11.

In operation, the external bone vibration is transmitted to the elastic vibration pick-up member 21 through the vibration pick-up housing 14, so that the elastic vibration pick-up member 21 and the vibration adjusting member 22 vibrate, thereby driving the first cavity, the vibration hole 111 and the gas vibration in the cavity 41 of the sensor chip 40, so as to transmit the vibration to the sensor chip 40 (i.e. vibrating the diaphragm 421 of the sensing assembly 42 of the sensor chip 40), thereby the sensor chip 40 generates an electrical signal, and the ASIC chip 50 processes the electrical signal generated by the sensor chip 40.

Further, as shown in fig. 1, the partition 11 is a circuit board, such as a PCB, and the ASIC chip 50 is electrically connected to the partition 11.

Specifically, the ASIC chip 50 may be provided on the surface of the partition plate 11, or may be embedded in the partition plate 11.

Further, as shown in fig. 1, the package housing 15 includes a surrounding plate 151 with two open ends, and a connecting plate 152 disposed at one end of the surrounding plate 151.

The connection board 152 is disposed opposite to the partition 11, and the connection board 152 is used for being mounted on an electronic control board of an electronic device. Specifically, the electronic device includes an electronic control board, and when the bone voiceprint sensor 100 is applied to the electronic device, the connection board 152 of the package housing 15 is mounted (e.g., attached) to the electronic control board, so that the bone voiceprint sensor 100 is mounted on the electronic control board.

Specifically, the connection board 152 is provided with an electrical connection portion 153 for electrically connecting with an external circuit (i.e., an electronic control board of an electronic device), the package housing 15 further includes an electrical connection member 154 embedded in the enclosure 151, and the electrical connection member 154 is electrically connected with the substrate and the electrical connection portion 153 to achieve connection with the external circuit.

Of course, in other embodiments, the partition 11 may be directly configured as an electronic control board of the electronic device, and the package housing 15 may be configured as an integrally configured metal housing.

The above description is only an alternative embodiment of the present invention, and not intended to limit the scope of the present invention, and all modifications and equivalents of the present invention, which are made by the contents of the present specification and the accompanying drawings, or directly/indirectly applied to other related technical fields, are included in the scope of the present invention.

Claims

1. A bone voiceprint sensor, comprising:

the space in the shell is divided into a vibration pickup cavity and an encapsulation cavity;

the vibration pickup assembly is arranged in the vibration pickup cavity; and

the sensor chip is arranged in the packaging cavity and comprises a substrate and a sensing assembly arranged on the substrate; the sensing assembly comprises vibrating diaphragms and polar plates which are arranged at intervals and vibration damping arranged between the vibrating diaphragms and the polar plates, the vibration damping is connected with the vibrating diaphragms and the polar plates, the elastic modulus of the vibration damping is greater than or equal to 1 MPa and smaller than or equal to 1000 MPa, and the vibration damping is made of silica gel or UV (ultraviolet) glue.

2. The bone voiceprint sensor of claim 1 wherein the vibration damped modulus of elasticity is greater than or equal to 5 mpa and less than or equal to 800 mpa.

3. The bone voiceprint sensor of claim 2 wherein the vibration damped modulus of elasticity is greater than or equal to 10 mpa and less than or equal to 600 mpa.

4. The bone voiceprint sensor of claim 3 wherein the vibration damped modulus of elasticity is greater than or equal to 50 mpa and less than or equal to 500 mpa.

5. The bone voiceprint sensor of claim 4 wherein the vibration damped modulus of elasticity is greater than or equal to 80 megapascals and less than or equal to 300 megapascals.

6. The bone voiceprint sensor of claim 1 wherein the vibration damping is provided in a central region of the diaphragm.

7. The bone voiceprint sensor of claim 1 wherein said vibration damping comprises a plurality of damping points spaced apart; alternatively, the first and second electrodes may be,

the vibration damping is of an integrated structure.

8. The bone voiceprint sensor of any one of claims 1 to 7 wherein the sensor chip is a MEMS chip.

9. The bone voiceprint sensor according to any one of claims 1 to 7, wherein the housing comprises a partition board, the partition board divides the space in the housing into a vibration pickup cavity and an encapsulation cavity, and the partition board is provided with a vibration transmission hole communicating the vibration pickup cavity and the encapsulation cavity.

10. An electronic device characterized by comprising a bone voiceprint sensor according to any one of claims 1 to 9.