CN111510834A - Bone voiceprint sensor module and electronic equipment - Google Patents

Bone voiceprint sensor module and electronic equipment Download PDF

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Publication number
CN111510834A
CN111510834A CN202010466310.8A CN202010466310A CN111510834A CN 111510834 A CN111510834 A CN 111510834A CN 202010466310 A CN202010466310 A CN 202010466310A CN 111510834 A CN111510834 A CN 111510834A
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China
Prior art keywords
vibration
sensor module
bone
elastic membrane
sensor
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Chinese (zh)
Inventor
方华斌
付博
端木鲁玉
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Weifang Goertek Microelectronics Co Ltd
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Weifang Goertek Microelectronics Co Ltd
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Priority to CN202010466310.8A priority Critical patent/CN111510834A/en
Publication of CN111510834A publication Critical patent/CN111510834A/en
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    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00Electrostatic transducers

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Electrostatic, Electromagnetic, Magneto- Strictive, And Variable-Resistance Transducers (AREA)

Abstract

The invention discloses a bone voiceprint sensor module and electronic equipment. The bone voiceprint sensor module comprises: the electronic control board is provided with a first surface and a second surface, and vibration transmission holes are formed in the electronic control board; the vibration pickup unit is arranged on the first surface and is used for picking up an external bone vibration signal to generate a response vibration signal; and the sensor unit is arranged on the second surface, and the vibration transmission hole is communicated with the vibration pickup unit and the sensor unit so that the response vibration signal is transmitted to the sensor unit through the vibration transmission hole. So, through making pick up the both sides that shake unit and sensor unit distribute at automatically controlled board respectively, can be convenient for reduce the whole height of bone vocal print sensor module.

Description

Bone voiceprint sensor module and electronic equipment
Technical Field
The invention relates to the technical field of sensors, in particular to a bone voiceprint sensor module and electronic equipment.
Background
The bone voiceprint sensor collects sound signals and converts the sound signals into electric signals by utilizing slight vibration of bones of the head and the neck caused by speaking of a person. Because the microphone collects sound through air conduction, the microphone can transmit sound clearly in a very noisy environment. In many situations, such as fire scenes, firefighters with gas guards cannot speak directly into the microphone using their mouths, so a bone voiceprint sensor can be used at this time. With the development of electronic products, the application of the bone voiceprint sensor is more and more extensive.
In the related art, the bone voiceprint sensor generally comprises a vibration pickup unit and a sensor unit, wherein the vibration pickup unit is used for picking up external bone vibration signals and transmitting the bone vibration signals to the sensor unit; the sensor unit is used for converting the vibration signal into an electric signal.
When the bone voiceprint sensor is applied to an electronic device, the bone voiceprint sensor is usually mounted on a main control board as a single component for use. This causes the vibration pickup unit and the sensor unit to be sequentially stacked on the main control board, thereby greatly affecting the height of the electronic device.
Disclosure of Invention
The invention mainly aims to provide a bone voiceprint sensor module, and aims to solve the technical problem that in the related art, when a bone voiceprint sensor is applied to electronic equipment, the height of the electronic equipment is greatly influenced.
In order to achieve the above object, the present invention provides a bone voiceprint sensor module, including:
the electronic control board is provided with a first surface and a second surface, and vibration transmission holes are formed in the electronic control board;
the vibration pickup unit is arranged on the first surface and is used for picking up an external bone vibration signal to generate a response vibration signal; and
and the sensor unit is arranged on the second surface, and the vibration transmission hole is communicated with the vibration pickup unit and the sensor unit so that the response vibration signal is transmitted to the sensor unit through the vibration transmission hole.
Optionally, the sensor unit includes a package housing and a sensor chip disposed in the package housing, the package housing is mounted on the second surface, and the package housing is provided with a sound hole communicated with the vibration transmission hole.
Optionally, the package housing includes a housing body with an opening at one end and a substrate covering the opening of the housing body, the substrate is mounted on the second surface, the sound hole is formed in the substrate, and the sensor chip is mounted on the substrate and disposed corresponding to the sound hole.
Optionally, the sensor unit includes a housing with an open end, and a sensor chip disposed in the housing, the open end of the housing is mounted on the second surface, and the sensor chip is mounted on the second surface and disposed corresponding to the vibration transmission hole.
Optionally, the pick up unit that shakes includes that one end is open picks up the casing that shakes, and locates pick up the elastic membrane in the casing that shakes, pick up the open end of the casing that shakes install in the first surface, just the biography is shaken the hole and is located pick up the open inboard of the casing that shakes.
Optionally, the vibration pickup unit further comprises a vibration adjusting member disposed on the elastic membrane.
Optionally, the vibration adjusting member includes an adjusting base connected to the elastic membrane, and an adjusting protrusion disposed on a surface of the adjusting base, and the adjusting protrusion extends into the vibration transmission hole.
Optionally, the vibration adjusting member includes an adjusting body connected to the elastic membrane, and a lateral protrusion portion disposed on a side surface of the adjusting body, and a clearance is formed between the lateral protrusion portion and the elastic membrane; alternatively, the first and second electrodes may be,
the vibration adjusting piece comprises an adjusting base part connected with the elastic membrane and an adjusting convex part arranged on the surface of the adjusting base part, the adjusting base part comprises an adjusting main body connected with the elastic membrane and a lateral convex part arranged on the side surface of the adjusting main body, and a clearance interval is formed between the lateral convex part and the elastic membrane; the adjusting bulge extends into the vibration transmission hole.
Optionally, be equipped with the snuffle hole on picking up the casing and/or the shell body that shakes, the snuffle hole is used for when the assembly pick up the unit that shakes with the sensor unit pressure release.
The invention also provides an electronic device comprising the bone voiceprint sensor.
The bone voiceprint sensor module is characterized in that a vibration pickup unit and a sensor unit are detached and respectively arranged on two surfaces of an electric control board; meanwhile, the electric control board is provided with a vibration transmission hole to communicate the vibration pickup unit and the sensor unit, so that a response vibration signal generated by the vibration pickup unit picking up external vibration can be transmitted to the sensor unit through the vibration transmission hole. So, through making pick up the both sides that shake unit and sensor unit distribute at automatically controlled board respectively, can be convenient for reduce the whole height of bone vocal print sensor module. Moreover, the vibration pickup unit and the sensor unit are separated, so that the requirement on the sensor unit can be reduced, the type selection of the sensor unit can be wider, and the cost can be reduced.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the structures shown in the drawings without creative efforts.
FIG. 1 is a schematic structural diagram of a bone voiceprint sensor module according to an embodiment of the present invention;
FIG. 2 is a schematic structural diagram of another embodiment of the bone voiceprint sensor module according to the invention;
FIG. 3 is a schematic structural diagram of a bone voiceprint sensor module according to another embodiment of the invention;
FIG. 4 is a schematic structural diagram of a bone voiceprint sensor module according to yet another embodiment of the present invention;
FIG. 5 is a schematic structural diagram of a fifth embodiment of a bone voiceprint sensor module according to the invention.
The reference numbers illustrate:
Figure BDA0002511578270000031
Figure BDA0002511578270000041
the implementation, functional features and advantages of the objects of the present invention will be further explained with reference to the accompanying drawings.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
It should be noted that if the description of "first", "second", etc. is provided in the embodiment of the present invention, the description of "first", "second", etc. is only for descriptive purposes and is not to be construed as indicating or implying relative importance or implicitly indicating the number of indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature.
In addition, the meaning of "and/or" appearing throughout is to include three juxtapositions, exemplified by "A and/or B" including either scheme A, or scheme B, or a scheme in which both A and B are satisfied.
The invention provides a bone voiceprint sensor module and electronic equipment. The bone voiceprint sensor module is used for an electronic device, which may be, but is not limited to, a head-mounted device, an earphone, a smart watch, a smart bracelet, a vehicle-mounted noise reduction device, a vibration sensing device, and other electronic devices known to those skilled in the art.
In an embodiment of the present invention, as shown in fig. 1, the bone voiceprint sensor module 100 includes an electronic control board 30, a vibration pickup unit 10 and a sensor unit 20.
The electronic control board 30 is a circuit board (e.g., a PCB) of an electronic device, and the sensor unit 20 is mounted on the electronic control board 30.
Wherein the vibration pickup unit 10 is mounted on the first surface 31, and the vibration pickup unit 10 is configured to pick up a bone vibration signal from the outside (such as a wearer, or other vibration source, hereinafter, the wearer is taken as an example) to generate a response vibration signal.
Wherein the sensor unit 20 is mounted on the second surface 32, the vibration transmission hole 33 communicates the vibration pickup unit 10 with the sensor unit 20, so that the response vibration signal is transmitted to the sensor unit 20 through the vibration transmission hole 33, and the sensor unit 20 is configured to generate an electrical signal according to the received vibration signal.
It is understood that a sealed vibration transmission air channel including a vibration transmission hole 33 is formed among the vibration pickup unit 10, the sensor unit 20 and the electronic control board 30, so that the response vibration signal is transmitted to the sensor unit 20 through the sealed vibration transmission air channel.
The bone voiceprint sensor module 100 of the invention separates the vibration pickup unit 10 and the sensor unit 20, and respectively installs them on two sides of the electric control board 30; meanwhile, a vibration transmission hole 33 is provided on the electronic control board 30 to communicate the vibration pickup unit 10 and the sensor unit 20, so that a response vibration signal generated by the vibration pickup unit 10 picking up an external vibration can be transmitted to the sensor unit 20 through the vibration transmission hole 33. In this way, by distributing the vibration pickup unit 10 and the sensor unit 20 on both sides of the electric control board 30, the overall height of the bone voiceprint sensor module 100 can be reduced. Moreover, since the vibration pickup unit 10 and the sensor unit 20 are separated, the requirement on the sensor unit 20 can be reduced, the model selection of the sensor unit 20 can be wider, and the cost can be reduced and the practicability of the bone voiceprint sensor module 100 can be improved.
In addition, the vibration pickup unit 10 and the sensor unit 20 can be arranged in a staggered manner, that is, the vibration pickup unit 10 and the sensor unit 20 are respectively distributed on two sides of the electric control board 30, so that the assembly requirement (such as precision) of the loudspeaker module can be reduced, and the assembly efficiency can be improved.
Further, as shown in fig. 1, the sensor unit 20 includes a package housing 21 and a sensor chip 22 disposed in the package housing 21, the package housing 21 is mounted on the second surface 32, and the package housing 21 is provided with a sound hole 211 communicated with the vibration transmission hole 33.
In this manner, the response vibration signal can be transmitted into the package housing 21 through the sound hole 211 and the vibration transmission hole 33, and transmitted to the sensor chip 22, and the sensor chip 22 converts the received vibration signal into an electrical signal.
In the embodiment, the structure of the package housing 21 and the sensor unit 20 is various, and will be described below by way of example.
Further, as shown in fig. 1, the package housing 21 includes a housing body 217 with an open end, and a substrate 216 covering the open end of the housing body 217, the substrate 216 is mounted on the second surface 32, the sound hole 211 is disposed on the substrate 216, and the sensor chip 22 is mounted on the substrate 216 and disposed corresponding to the sound hole 211. Specifically, the front cavity 221 of the sensor chip 22 is disposed corresponding to the sound hole 211 and is communicated with the sound hole 211.
Without loss of generality, as shown in fig. 1, the sensor unit 20 further includes an ASIC (application Specific Integrated circuit) chip 70 disposed in the package housing 21, and the ASIC chip 70 is electrically connected to the sensor chip 22 to process an electrical signal generated by the sensor chip 22.
Specifically, the ASIC chip 70 may be disposed on the surface of the substrate 216, or the ASIC chip 70 may be embedded in the substrate 216. It should be noted that embedding the ASIC chip 70 within the substrate 216 facilitates assembly of the bone voiceprint sensor module 100.
Specifically, the substrate 216 is a circuit board, such as a PCB, and the ASIC chip 70 is electrically connected to the substrate 216.
Optionally, the surface of the substrate 216 facing the second surface 32 is provided with an electrical connection portion 2161, and the electrical connection portion 2161 is electrically connected to the main control board to electrically connect the main control board to the ASIC chip 70 and the sensor chip 22. Specifically, the substrate 216 is attached to the second surface 32 of the main control board, and when the substrate 216 is attached to the second surface 32 of the main control board, the electrical connection portions 2161 may be electrically connected with the electronic control board 30 to electrically connect the sensor chip 22 with an external circuit (i.e., a circuit of an electronic device).
It should be noted that the structure of the housing body 217 in this embodiment is not particularly limited, and may be an integral structure or a separate connection structure. And when it is an integrated structure, the shell body 217 can be selected as a metal shell, so that the sensor unit 20 can be selected more widely, and a common structure of the substrate 216+ a metal shell can be used, which is beneficial to reducing the cost.
Further, as shown in fig. 1, the vibration pickup unit 10 includes a vibration pickup housing 11 and an elastic membrane 12 disposed inside the vibration pickup housing 11.
Specifically, the elastic membrane 12 is installed in the vibration pickup housing 11, and the vibration pickup housing 11 can protect the elastic membrane 12. The vibration pickup shell 11 can transmit bone vibration of a wearer speaker to the elastic membrane 12, and the elastic membrane 12 is used for picking up the bone vibration of the wearer speaker to vibrate so as to form a response vibration signal; the elastic membrane 12 drives the gas in the sealed vibration transmission air channel to vibrate when vibrating, so as to transmit a response vibration signal to the sensor unit 20 through the sealed vibration transmission air channel.
The elastic membrane 12 may be a membrane having elastic deformation capability, including but not limited to a plastic membrane, a paper membrane, a metal membrane, a biological membrane, and the like. Further, the elastic film 12 may have a single-layer structure or may have a multi-layer composite film. The elastic membrane 12 may be made of a single material or a composite material of different materials. And will not be described in detail herein.
Specifically, it is uncovered setting to pick up 11 one ends of casing that shakes, promptly it shakes casing 11 for the uncovered casing that sets up of one end to pick up, the open end of picking up casing 11 that shakes is installed in first surface 31, the main control board closing cap is picked up the uncovered of casing 11 that shakes, just the transmission shakes hole 33 and locates the uncovered inboard of picking up casing 11 that shakes. Thus, the structure of the vibration pickup unit 10 can be simplified, and the mounting can be facilitated.
Specifically, as shown in fig. 1, the elastic membrane 12 divides the space in the vibration pickup housing 11 into a first cavity and a second cavity, and the first cavity and the second cavity are respectively located at two sides of the elastic membrane 12 (in the state shown in the figure, the first cavity is located at the lower side of the elastic membrane 12, and the second cavity is located at the upper side of the elastic membrane 12); wherein the second cavity is in communication with the vibration transfer aperture 33.
Alternatively, the open end of the vibration pick-up housing 11 may be glued to the first surface 31.
Further, as shown in fig. 1, the vibration pickup unit 10 further includes a vibration adjusting member 13 provided on the elastic membrane 12.
The vibration adjusting part 13 is used for adjusting the vibration of the elastic membrane 12, so that the matching between the vibration of the elastic membrane 12 and the bone vibration signal of the wearer is better, and the sensitivity of the bone voiceprint sensor module 100 can be improved. Moreover, the vibration adjusting member 13 vibrates along with the elastic membrane 12, so that the mass of the elastic membrane 12 can be increased when vibrating, and the interference of external factors (such as sound waves) can be effectively avoided.
Without loss of generality, the projection of the vibration adjusting member 13 on the elastic membrane 12 should be smaller than the elastic membrane 12, as shown in fig. 1.
Alternatively, the vibration adjusting member 13 may be bonded to the elastic membrane 12 by glue.
Alternatively, the vibration adjusting member 13 may be provided on either side of the elastic membrane 12; that is, the vibration adjusting member 13 may be disposed in the first cavity or the second cavity.
Alternatively, the sensor chip 22 may be a microphone chip or a pressure sensor chip 22. That is, the sensor unit 20 may adopt a MEMS microphone or a MEMS pressure sensor, so that the design difficulty of the bone voiceprint sensor module 100 can be reduced.
In another embodiment of the present invention, the substrate 216 may be eliminated and the sensor chip 22 and other components may be mounted directly on the main control board. Specifically, as shown in fig. 2, the sensor unit 20 includes a housing body 217 with an open end, and a sensor chip 22 disposed in the housing body 217, the open end of the housing body 217 is connected to the second surface 32, the electronic control board 30 covers the open end of the housing body 217, and the sensor chip 22 is mounted on the second surface 32 and disposed corresponding to the vibration transmission hole 33. Specifically, the front cavity 221 of the sensor chip 22 is disposed corresponding to the vibration transmission hole 33 and is communicated with the vibration transmission hole 33.
In this manner, the response vibration signal can be transmitted into the package housing 21 through the opening of the housing body 217 and the vibration transmission hole 33, and transmitted to the sensor chip 22, and the sensor chip 22 is used for converting the received vibration signal into an electrical signal.
Moreover, in this embodiment, the substrate 216 of the package housing 21 is removed, the sensor chip 22 is directly mounted on the main control board, and the main control board is used to cover the opening of the housing body 217, so that the substrate 216 can be omitted, the product cost can be reduced, the corresponding assembly steps can be reduced, and the production efficiency can be improved; in addition, the overall height of the bone-vocal print sensor module 100 can be reduced, which is advantageous for the miniaturization of electronic devices (especially small electronic devices such as earphones).
In this embodiment, without loss of generality, as shown in fig. 2, the sensor unit 20 further includes an ASIC (application Specific Integrated circuit) chip 70 disposed in the housing body 217, and the ASIC chip 70 is electrically connected to the sensor chip 22 to process an electrical signal generated by the sensor chip 22. Specifically, the ASIC chip 70 may be disposed on the second surface 32, or the ASIC chip 70 may be embedded in the main control board.
In this embodiment, optionally, the open periphery of the housing body 217 and the electronic control board 30 may be connected by glue, so that the housing body 217 is mounted on the electronic control board 30.
In a specific embodiment, the vibration adjusting member 13 may be further designed, as will be exemplified below.
In another embodiment of the present invention, as shown in fig. 3, the vibration adjusting member 13 includes an adjusting base 131 connected to the elastic membrane 12, and an adjusting protrusion 132 provided on a surface of the adjusting base 131, wherein the adjusting protrusion 132 protrudes into the vibration transmitting hole 33. Thus, the space utilization rate can be improved to increase the quality of the vibration adjusting piece 13, thereby being beneficial to improving the sensitivity of the bone voiceprint sensor module 100.
In this embodiment, it is understood that the vibration adjusting member 13 is provided on the side of the elastic membrane 12 facing the vibration transmission hole 33.
In this embodiment, as shown in fig. 3, the sensor chip 22 is disposed corresponding to the vibration transmission hole 33.
It is understood that in order to further increase the mass of the vibration adjusting member 13, the size of the adjusting projection 132 may be increased, and thus, the vibration transmission hole 33 needs to be enlarged. That is, by enlarging the vibration transmission hole 33, it is possible to accommodate the larger-sized adjustment protrusion 132 in order to further increase the mass of the vibration adjusting member 13.
In this embodiment, the adjusting protrusion 132 may optionally protrude into the package housing 21 (or may not protrude into the package housing 21), and specifically, the adjusting protrusion 132 may protrude into the front cavity 221 of the sensor chip 22 through the vibration transmission hole 33. In this way, the influence of the front cavity 221 of the sensor chip 22 on the high frequency can be reduced, so that the high frequency is flatter, and the reliability of the bone voiceprint sensor module 100 can be improved.
In this embodiment, as shown in fig. 3, the circumference of the vibration transmission hole 33 may be made flush with the circumference of the front cavity 221 of the sensor chip 22; alternatively, the periphery of the vibration transmission hole 33 is provided outside the periphery of the front cavity 221 of the sensor chip 22. In this way, the vibration transmission hole 33 can be prevented from interfering with the adjustment projection 132, so that the size of the adjustment projection 132 can be further increased to increase the mass of the vibration adjusting member 13.
In this embodiment, the regulating protrusion 132 is provided at the middle of the regulating base 131. In this way, the elastic membrane 12 can be stressed more uniformly during the vibration process, so as to reduce the risk of cracking; meanwhile, the stability of the vibration of the elastic membrane 12 can be improved, so as to improve the performance of the bone voiceprint sensor module 100.
In another embodiment of the present invention, as shown in fig. 4, the vibration adjusting member 13 includes an adjusting body 133 connected to the elastic membrane 12, and a lateral protrusion 134 disposed on a side surface of the adjusting body 133, wherein a clearance is formed between the lateral protrusion 134 and the elastic membrane 12. Specifically, the lateral protrusion 134 faces the side of the elastic membrane 12, and forms a clearance with the surface of the elastic membrane 12. When the elastic membrane vibrates, the magnitude of the avoiding interval can change along with the vibration of the elastic membrane.
Thus, the space in the vibration pickup shell 11 can be effectively utilized to increase the mass of the vibration adjusting piece 13 without increasing the connecting area between the vibration adjusting piece 13 and the elastic membrane 12, so that the sensitivity of the bone voiceprint sensor module 100 can be improved, and the performance of the bone voiceprint sensor module 100 can be improved; and is advantageous for implementing a miniaturized design of the bone voiceprint sensor module 100.
That is to say, the bone voiceprint sensor module 100 in this embodiment improves the space utilization rate, is favorable to reducing the product size, and improves the product performance.
Alternatively, the connection area of the vibration adjusting member 13 and the elastic membrane 12 may be reduced without reducing the mass of the vibration adjusting member 13, so as to improve the performance of the bone voiceprint sensor module 100.
In this embodiment, further, as shown in fig. 4, the lateral projection 134 is an annular structure. Thus, on the one hand, the difficulty of manufacturing the vibration adjusting piece 13 can be reduced, and on the other hand, the mass of the vibration adjusting piece 13 can be increased to a large extent. Of course, in the parallel embodiment of this embodiment, it is also possible to make: the lateral protrusions 134 are provided in plural, and the plural lateral protrusions 134 are spaced apart in the circumferential direction of the adjustment body 133.
In this embodiment, as shown in fig. 4, the adjusting body 133 includes a first adjusting portion 1331 connected to the elastic membrane 12, and a second adjusting portion 1332 connected to a side of the first adjusting portion 1331 away from the elastic membrane 12, and the lateral protrusion 134 is disposed at a side of the second adjusting portion 1332. In this way, a clearance is formed between the lateral protrusion 134 and the elastic membrane 12.
In this embodiment, three of the lateral protrusion 134, the first regulating portion 1331 and the second regulating portion 1332 may be integrally provided; it is also possible to provide the lateral protrusion 134 integrally with the second regulation part 1332 and separately fittingly connect with the first regulation part 1331.
In this embodiment, further, as shown in fig. 4, the thickness of the lateral protrusion 134 is equal to the thickness of the second regulation part 1332. In this way, the vibration adjusting member 13 is formed in a stepped structure, so that the mass of the vibration adjusting member 13 can be increased to a large extent.
In this embodiment, further, as shown in fig. 4, the outer contour shape of the lateral protrusion 134 is the same as that of the first regulation part 1331.
In this embodiment, further, the ratio of the thickness of the second regulating portion 1332 to the thickness of the first regulating portion 1331 is greater than or equal to 0.1 and less than or equal to 100. It will be appreciated that if this ratio is too large, it is easy for the lateral projections 134 to interfere with the elastic membrane 12 during vibration; if the ratio is too small, it is not favorable to increase the mass of the vibration control member 13. Optionally, the ratio of the thickness of the second adjusting part 1332 to the thickness of the first adjusting part 1331 is greater than or equal to 0.2 and less than or equal to 10; alternatively, the ratio of the thickness of the second regulating part 1332 to the thickness of the first regulating part 1331 is greater than or equal to 0.3 and less than or equal to 6.
In this embodiment, further, the projection of the lateral protrusion 134 and the second adjusting part 1332 on the elastic membrane 12 has a first area, and the projection of the first adjusting part 1331 on the elastic membrane 12 has a second area, and the ratio of the second area to the first area is greater than 1 and less than or equal to 100. It is understood that if the ratio is too small, it is not favorable to increase the mass of the vibration adjusting member 13; if the ratio is too large, the "head heavy" and the foot light "are easily caused. Optionally, a ratio of the second area to the first area is greater than or equal to 1.1 and less than or equal to 10; or the ratio of the second area to the first area is greater than or equal to 1.2 and less than or equal to 6.
In this embodiment, the vibration adjusting member 13 may be provided on either side of the elastic membrane 12.
Of course, in this embodiment, by designing the lateral protrusion 134, the vibration adjusting member 13 may be made to have a three-step, or four-step, or more-step stepped structure.
Of course, in this embodiment, by designing the lateral protrusion 134, the longitudinal section of the vibration adjusting member 13 (i.e., the section passing through the center line of the vibration adjusting member 13) may be made trapezoidal or kidney-shaped.
In addition, it should be noted that the technical solutions in the above embodiments may be combined with each other, but must be based on the realization of the technical solutions by those skilled in the art, and when the technical solutions are contradictory or can not be realized, the combination of the technical solutions should be considered to be absent and not to be within the protection scope of the present invention.
As shown in fig. 5, in the fifth embodiment of the present invention, the vibration adjusting member 13 may include an adjusting base 131 connected to the elastic membrane 12, and an adjusting protrusion 132 disposed on a surface of the adjusting base 131, the adjusting base 131 includes an adjusting body 133 connected to the elastic membrane 12, and a lateral protrusion 134 disposed on a side surface of the adjusting body 133, and a clearance is formed between the lateral protrusion 134 and the elastic membrane 12; the adjustment projection 132 protrudes into the vibration transmission hole 33. Specifically, the lateral protrusion 134 faces the side of the elastic membrane 12, and forms a clearance with the surface of the elastic membrane 12. When the elastic membrane vibrates, the magnitude of the avoiding interval can change along with the vibration of the elastic membrane.
Thus, the space utilization rate can be improved to a greater extent to increase the quality of the vibration adjusting piece 13, so that the sensitivity of the bone vocal print sensor module 100 can be improved to improve the performance of the bone vocal print sensor module 100; and is advantageous for implementing a miniaturized design of the bone voiceprint sensor module 100.
In the above embodiment, further, as shown in fig. 1-5, the vibration pickup housing 11 and/or the housing body 217 is provided with the air release hole 212, and the air release hole 212 is used for releasing air when assembling the vibration pickup unit 10, the sensor unit 20 and the electronic control board 30. In particular, the bleed hole 212 communicates with the external environment. Thus, by providing the air release hole 212, when assembling the vibration pickup unit 10, the sensor unit 20 and the electronic control board 30, the failure of the vibration pickup unit 10 or the sensor chip 22 due to the air pressure difference between the inner space and the outer space of the housing body 217 or the vibration pickup housing 11 can be avoided, so that the assembly difficulty of the bone voiceprint sensor module 100 can be reduced.
However, when the bone voiceprint sensor module 100 is applied, i.e., applied to an electronic device, the air release hole 212 needs to be blocked so as not to affect the performance of the bone voiceprint sensor module 100. Alternatively, the air release hole 212 may be blocked by a sealant, an adhesive tape, or a sealing plug.
It should be noted that, as shown in fig. 1, if the air release hole 212 is provided in the vibration pickup housing 11, optionally, the air release hole 212 is communicated with the first cavity, for example, the air release hole 212 is provided at the top of the vibration pickup housing 11; optionally, the air relief hole 212 is an annular hole. As shown in fig. 3, if the air release hole 212 is provided on the housing body 217, optionally, the air release hole 212 is provided away from the sensor chip 22.
The number and size of the air release holes 212 are not limited herein, and may be set according to actual conditions during design.
Optionally, the elastic membrane 12 and the vibration adjusting member 13 are provided with a first vent hole 121.
Optionally, a second vent hole 223 is disposed on the sensing film 222 of the sensor chip 22.
Optionally, as shown in fig. 1, the electronic device further includes a first component 80 and a second component 90, where the first component 80 and the second component 90 are respectively disposed on two sides of the main control board, that is, the first component 80 is disposed on the first surface 31, and the second component 90 is disposed on the second surface 32. The first component 80 may be a functional device such as a resistor or a capacitor, and the second component 90 may be a functional device such as a resistor or a capacitor.
The above description is only an alternative embodiment of the present invention, and not intended to limit the scope of the present invention, and all modifications and equivalents of the present invention, which are made by the contents of the present specification and the accompanying drawings, or directly/indirectly applied to other related technical fields, are included in the scope of the present invention.

Claims (10)

1. The utility model provides a bone vocal print sensor module which characterized in that, bone vocal print sensor module includes:
the electronic control board is provided with a first surface and a second surface, and vibration transmission holes are formed in the electronic control board;
the vibration pickup unit is arranged on the first surface and is used for picking up an external bone vibration signal to generate a response vibration signal; and
and the sensor unit is arranged on the second surface, and the vibration transmission hole is communicated with the vibration pickup unit and the sensor unit so that the response vibration signal is transmitted to the sensor unit through the vibration transmission hole.
2. The bone voiceprint sensor module of claim 1 wherein said sensor unit comprises a package housing and a sensor chip disposed in said package housing, said package housing being mounted to said second surface, said package housing having a sound hole in communication with said vibration transmission hole.
3. The bone voiceprint sensor module of claim 2 wherein said package housing comprises a housing body having an opening at one end and a substrate covering said opening, said substrate is mounted on said second surface, said sound hole is formed in said substrate, and said sensor chip is mounted on said substrate and disposed corresponding to said sound hole.
4. The bone voiceprint sensor module of claim 1 wherein said sensor unit comprises a housing body with an open end, and a sensor chip disposed in said housing body, wherein said open end of said housing body is mounted on said second surface, and said sensor chip is mounted on said second surface and disposed in correspondence to said vibration transmission hole.
5. The bone voiceprint sensor module of any one of claims 1 to 4 wherein the vibration pickup unit comprises a vibration pickup housing having an open end, and an elastic membrane disposed in the vibration pickup housing, the open end of the vibration pickup housing being mounted to the first surface, and the vibration transmission hole being disposed inside the open end of the vibration pickup housing.
6. The bone voiceprint sensor module of claim 5 wherein said vibration pickup unit further comprises a vibration adjustment member disposed on said elastic membrane.
7. The bone voiceprint sensor module of claim 6 wherein said vibration adjustment member includes an adjustment base connected to said elastic membrane, and an adjustment projection provided on a surface of said adjustment base, said adjustment projection extending into said vibration transmission aperture.
8. The bone voiceprint sensor module of claim 6 wherein said vibration adjustment member comprises an adjustment body connected to said elastic membrane, and a lateral protrusion disposed on a side of said adjustment body, wherein a clearance is formed between said lateral protrusion and said elastic membrane; alternatively, the first and second electrodes may be,
the vibration adjusting piece comprises an adjusting base part connected with the elastic membrane and an adjusting convex part arranged on the surface of the adjusting base part, the adjusting base part comprises an adjusting main body connected with the elastic membrane and a lateral convex part arranged on the side surface of the adjusting main body, and a clearance interval is formed between the lateral convex part and the elastic membrane; the adjusting bulge extends into the vibration transmission hole.
9. The bone vocal print sensor module according to claim 5, wherein the vibration pickup housing and/or the housing body is provided with a relief hole for relieving pressure when assembling the vibration pickup unit and the sensor unit.
10. An electronic device characterized by comprising a bone voiceprint sensor according to any one of claims 1 to 9.
CN202010466310.8A 2020-05-27 2020-05-27 Bone voiceprint sensor module and electronic equipment Pending CN111510834A (en)

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